iC-HG 3 A LASER SWITCH Rev B1, Page 1/20 FEATURES APPLICATIONS ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Six channel laser switch from CW up to 200 MHz CW operation with up to 500 mA per channel Pulsed operation with up to 1.5 A per channel Spike-free switching of the laser current 6 x 1 channels with TTL inputs 3 x 2 channels with LVDS inputs Operates as six independent voltage-controlled current sinks Outputs (LDKx) are 12 V capable for blue/green laser diodes Fast and slow switching mode Simple current control at pins CIx CIx voltage < 3 V for full CW current Wide supply voltage range from 3 to 5.5 V All channels can be paralleled for up to 3 A CW and 9 A pulsed operation ♦ Multiple iC-HG can be connected in parallel for higher currents ♦ Open drain error output ♦ Thermal shutdown Pump lasers Laser projection Laser TV Data transmission TOF camera ligthing PACKAGES QFN28 5 mm x 5 mm BLOCK DIAGRAM VDD iC-HG LDK1 CI1 EN1 & AGND1 + LDK2 - CI2 EN2 & AGND2 CI3 LDK3 EN3 AGND3 CI4 LDK4 EN4 AGND4 CI5 LDK5 EN5 AGND5 CI6 LDK6 EN6 AGND6 VDD NER ELVDS 60% & 80% 40% Power & Temperature Monitor 20% GND Copyright © 2013 iC-Haus http://www.ichaus.com iC-HG 3 A LASER SWITCH Rev B1, Page 2/20 DESCRIPTION Six channel Laser Switch iC-HG enables the spikefree switching of laser diodes with well-defined current pulses at frequencies ranging from DC to 200 MHz. The diode current is determined by the voltages at pins CIx. The six fast switches are controlled independently via TTL inputs. Input ELVDS = hi selects LVDS type inputs and three channel mode. TTL slow switch mode is selected with 30% VDD and LVDS slow switch mode with 70% VDD at input ELVDS. The laser diode can thus be turned on and off or switched between different current levels (LDKx connected) defined by the voltages at CIx. Each channel can be operated up to 500 mA CW and 1500 mA pulsed current depending on the frequency, duty cycle and heat dissipation. The integrated thermal shutdown feature protects the iC-HG from damage by excessive temperature. iC-HG 3 A LASER SWITCH Rev B1, Page 3/20 PACKAGING INFORMATION QFN28 5 mm x 5 mm to JEDEC PIN CONFIGURATION QFN28 5 mm x 5 mm 28 27 26 25 24 23 PIN FUNCTIONS No. Name Function 22 1 21 2 20 3 19 HG code... ... 4 5 6 18 17 16 15 7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CI1 CI2 CI3 GND CI4 CI5 CI6 AGND6 LDK6 AGND5 LDK5 AGND4 LDK4 EN6 15 EN5 8 9 10 11 12 13 14 16 EN4 17 EN3 18 VDD 19 ELVDS 20 EN2 21 EN1 22 23 24 25 26 27 28 NER LDK3 AGND3 LDK2 AGND2 LDK1 AGND1 Current control voltage channel 1 Current control voltage channel 2 Current control voltage channel 3 Ground Current control voltage channel 4 Current control voltage channel 5 Current control voltage channel 6 Analog ground channel 6 Laser diode cathode channel 6 Analog ground channel 5 Laser diode cathode channel 5 Analog ground channel 4 Laser diode cathode channel 4 TTL switching input channel 6 Negative LVDS Input channel 5 and 6 TTL switching input channel 5 Positive LVDS Input channel 5 and 6 TTL switching input channel 4 Negative LVDS Input channel 3 and 4 TTL switching input channel 3 Positive LVDS Input channel 3 and 4 Supply voltage TTL/LVDS Fast/Slow Input selector TTL switching input channel 2 Negative LVDS Input channel 1 and 2 TTL switching input channel 1 Positive LVDS Input channel 1 and 2 Error monitor output Laser diode cathode channel 3 Analog ground channel 3 Laser diode cathode channel 2 Analog ground channel 2 Laser diode cathode channel 1 Analog ground channel 1 The Thermal Pad is to be connected to a Ground Plane (GND, AGND1. . . 6) on the PCB. Only pin 1 marking on top or bottom defines the package orientation ( HG label and coding is subject to change). iC-HG 3 A LASER SWITCH Rev B1, Page 4/20 PACKAGE DIMENSIONS QFN28-5x5 All dimensions given in mm. This package falls within JEDEC MO-220-VHHD-1. RECOMMENDED PCB-FOOTPRINT 4.70 3.15 15 R0. 0.50 0.30 BOTTOM 5 3.15 0.50 0.25 0.55 5 3.15 TOP 0.90 0.90 3.15 4.70 SIDE drb_qfn28-2_pack_1, 10:1 iC-HG 3 A LASER SWITCH Rev B1, Page 5/20 ABSOLUTE MAXIMUM RATINGS Beyond these values damage may occur; device operation is not guaranteed. Item No. Symbol Parameter Conditions Unit Min. Max. G001 VDD Voltage at VDD -0.3 6 V G002 I(VDD) Current in VDD -10 750 mA G003 V(CI) Voltage at CI1. . . 6 -0.3 6 V G004 V() Voltage at EN1. . . 6, AGND1. . . 6, ELVDS, NER -0.3 6 V G005 V(LDK) Voltage at LDK1. . . 6 -0.3 12 V G006 I(LDK) Current in LDK1. . . 6 DC current -10 600 mA G007 I(AGND) Current in AGND1. . . 6 DC current -600 10 mA G008 I() Current in CI1. . . 6, EN1. . . 6, ELVDS -10 10 mA G009 I(NER) Current in NER -10 20 mA G010 Vd() ESD Susceptibility at all pins 2 kV G011 Tj Operating Junction Temperature -40 125 °C G012 Ts Storage Temperature Range -40 150 °C HBM 100 pF discharged through 1.5 kΩ THERMAL DATA Item No. Symbol Parameter Conditions Unit Min. T01 Ta Operating Ambient Temperature Range (extended range on request) T02 Rthja Thermal Resistance Chip/Ambient T03 RthjTP Thermal Resistance Chip/Thermal Pad Typ. -25 Mounted onto the Evaluation Board HG1D All voltages are referenced to ground unless otherwise stated. All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative. Max. 85 °C 25 K/W 4 K/W iC-HG 3 A LASER SWITCH Rev B1, Page 6/20 ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 3.0...5.5 V, AGND1. . . 6 = GND, Tj = -40...125 °C unless otherwise stated Item No. Symbol Parameter Conditions Unit Min. Typ. Max. Total Device (x = 1. . . 6) 001 VDD Permissible Supply Voltage 5.5 V 002 I(VDD) Supply Current in VDD CW operation 3 10 mA 003 I(VDD) Supply Current in VDD pulsed operation, f(ENx) = 200 MHz 700 mA 004 V(LDKx) Permissible Voltage at LDKx -0.3 12 V 005 V(NER) Permissible Voltage at NER -0.3 5.5 V 006 Vc()hi Clamp Voltage hi at LDKx I(LDK) = 10 mA 12.1 18 V 007 Vc(NER) Clamp Voltage hi at NER I(NER) = 1 mA 7 18 V 008 Vc(CIx)hi Clamp Voltage hi at CIx Vc(CIx) = V(CIx) − VDD; I(CI) = 10 mA, other pins open 0.3 1.6 V 009 Vc()hi Clamp Voltage hi at ENx, ELVDS Vc() = V() − VDD; I() = 1 mA, other pins open 0.8 3 V 010 Vc()lo Clamp Voltage lo at VDD, LDKx, I() = -10 mA, other pins open CIx, ENx, AGNDx, ELVDS, NER -1.6 -0.3 V 500 mA 15 Laser Control LDK1. . . 6, CI1. . . 6 (x = 1. . . 6) 101 Icw(LDKx) Permissible CW Current in LDKx (per channel) 102 Vs(LDKx) Saturation Voltage at LDKx I(LDKx) = 450 mA, V(CIx) = V(CIx)@I(LDKx) = 500 mA 1.5 V 103 I0(LDKx) Leakage Current in LDKx ENx = lo, V(LDKx) = 12 V 100 µA 104 tr() LDKx Current Rise Time Fast Iop(LDKx) = 500 mA, I(LDKx): 10% → 90% Iop, V(ELVDS) = 0 V or VDD 1 ns 105 tf() LDKx Current Fall Time Fast Iop(LDKx) = 500 mA, I(LDKx): 90% → 10% Iop, V(ELVDS) = 0 V or VDD 1 ns 106 tr() LDKx Current Rise Time Slow Iop(LDKx) = 500 mA, I(LDKx): 10% → 90% Iop, V(ELVDS) = 30% VDD or 70% VDD, VDD = 5 V 5 10 40 ns 107 tf() LDKx Current Fall Time Slow Iop(LDKx) = 500 mA, I(LDKx): 90% → 10% Iop, V(ELVDS) = 30% VDD or 70% VDD, VDD = 5 V 5 10 40 ns 108 tr() LDKx Current Rise Time Slow Iop(LDKx) = 500 mA, I(LDKx): 10% → 90% Iop, V(ELVDS) = 30% VDD or 70% VDD, VDD = 3.3 V 10 30 90 ns 109 tf() LDKx Current Fall Time Slow Iop(LDKx) = 500 mA, I(LDKx): 90% → 10% Iop, V(ELVDS) = 30% VDD or 70% VDD, VDD = 3.3 V 10 30 90 ns 110 tp() Propagation Delay Fast V(ENx) → I(LDKx) V(ELVDS) = 0 V or VDD, Differential LVDS Rise and Fall Time < 0.5 ns 3 5 14 ns 111 CR() Current Matching all Channels 0.9 1.1 112 V(CIx) Permissible Voltage at CIx -0.3 VDD V 113 Vt(CIx) Threshold Voltage at CIx I(LDKx) < 5 mA 0.5 1.2 V 114 V(CIx) Operating Voltage at CIx I(LDKx) = 500 mA, V(LDKx) > 1.8 V 115 Ipd(CIx) Pull-Down Current at CIx V(CIx) = 0.5. . . 5.5 V 116 C(CIx) Capacity at CIx 117 Vc(LDKx) Clamp Voltage at LDKx 118 tskc() Channel to Channel Skew 119 tskp() Part to Part Skew 2 2.9 V 1 2.5 5 µA V(CIx) = 2 V 500 635 760 pF I(LDKx) = 100 mA, tclamp < 1 ms, tclamp/T < 1:100 12.5 20 V 160∗ ps 4∗ ns 2 V best to worst Input EN1. . . 6 (x = 1. . . 6) 201 Vt(TTL)hi Input Threshold Voltage hi V(ELVDS) < 35% VDD, TTL 202 Vt(TTL)lo Input Threshold Voltage lo V(ELVDS) < 35% VDD, TTL 0.8 V 203 Vhys(TTL) Hysteresis Vhys() = Vt()hi − Vt()lo; V(ELVDS) < 35% VDD, TTL 50 mV 204 I(ENx) V(ELVDS) < 35% VDD, V() = 0.8 V. . . VDD, TTL 4 ∗ Pulldown Current Projected values by simulation 30 80 µA iC-HG 3 A LASER SWITCH Rev B1, Page 7/20 ELECTRICAL CHARACTERISTICS Operating Conditions: VDD = 3.0...5.5 V, AGND1. . . 6 = GND, Tj = -40...125 °C unless otherwise stated Item No. Symbol Parameter Conditions Unit Min. 205 R(ENx) Differential Input Impedance at ENx V(ELVDS) > 65% VDD, V(ENx) < VDD − 1.4 V, LVDS 14 206 Vdiff Differential Voltage Vdiff = |V(EN1,3,5) − V(EN2,4,6)|; V(ELVDS) > 65% VDD, LVDS 200 207 V() Input Voltage Range V(ELVDS) > 65% VDD, LVDS 0.6 ELVDS open Typ. Max. 28 kΩ mV VDD − 1.4 V %VDD Input ELVDS 301 V(ELVDS) Voltage at ELVDS 48 50 52 302 Ri(ELVDS) 35 50 70 kΩ 303 Vt(ELVDS) Threshold Voltage TTL Fast to TTL Slow 16 20 24 %VDD 304 Vt(ELVDS) Threshold Voltage TTL Slow to Error 36 40 44 %VDD 305 Vt(ELVDS) Threshold Voltage Error to LVDS Slow 56 60 64 %VDD 306 Vt(ELVDS) Threshold Voltage LVDS Slow to LVDS Fast 74 80 84 %VDD 307 Vhys() 10 25 50 mV 3 9 Hysteresis Ouput NER 401 Vsat(NER) Saturation Voltage at NER ELVDS open, I(NER) = 2 mA 402 I(NER) Current in NER ELVDS open, V(NER) > 0.6 V 0.6 V 20 mA Overtemperature 501 Toff Overtemperature Shutdown rising temperature 130 170 °C 502 Ton Overtemperature Release falling temperature 120 160 °C 503 Thys Hysteresis Toff − Ton 5 °C Power On 601 VON Power On Voltage VDD rising voltage 602 VOFF Power Down Voltage VDD falling voltage 603 Vhys Hysteresis 2.9 V 500 mV 1.5 50 V iC-HG 3 A LASER SWITCH Rev B1, Page 8/20 CONFIGURATION INPUT ELVDS Pin ELVDS selects between 6 channel TTL mode or 3 channel LVDS mode and chooses slow or fast switching speed. The unconnected pin ELVDS is an error condition signaled at pin NER with the laser current disabled. Pin ELVDS connected to GND selects the six channel fast TTL mode. Pin ELVDS connected to 30% VDD selects the six channel slow TTL mode. Pin ELVDS Figure 1: TTL Slow connected to 70% VDD selects the three channel slow LVDS mode. Pin ELVDS connected to VDD selects the three channel fast LVDS mode. An easy way to set the slow operation mode for TTL and LVDS mode is to connect a voltage divider at pin ELVDS. Figure 1 shows the recommended voltage divider for slow TTL mode and Figure 2 shows the recommended voltage divider for slow LVDS mode. Figure 2: LVDS Slow DIGITAL INPUTS EN1...6 EN1...6 are the digital switching inputs. With pin ELVDS set to 6 channel TTL mode, each pin ENx enables the current sink at the respective LDKx. With pin ELVDS set to 3 channel LVDS mode, the odd ENx pins are the positive and the even ENx pins are the negative LVDS inputs. EN1 and EN2 control LDK1 and LDK2, EN3 and EN4 control LDK3 and LDK4 and EN5 and EN6 control LDK5 and LDK6. For correct LVDS operation 100 Ω terminating resistors between the respective EPx and ENx pins, very close to the inputs, are strongly recommended. Input pins from unused channels have to be connected to GND (TTL operation) resp. EPx to GND and ENx to VDD (LVDS operation). iC-HG 3 A LASER SWITCH Rev B1, Page 9/20 ANALOG CURRENT CONTROL VOLTAGE INPUTS CI1...6 The voltage at pins CI1...6 sets the current in pins LDK1...6. Figures 3 and 4 show the temperature dependency of the current in a single LDKx output versus the voltage at CIx for a typical device. Figures 5 and 6 show the min., typ. and max. variations between devices at 27 °C temperature. The voltage at pins LDKx is 2.5 V. Figure 3: I(LDKx) vs. V(CIx) at VDD = 5 V Figure 4: I(LDKx) vs. V(CIx) at VDD = 3.3 V Figure 5: I(LDKx) vs. V(CIx) at VDD = 5 V Figure 6: I(LDKx) vs. V(CIx) at VDD = 3.3 V iC-HG 3 A LASER SWITCH Rev B1, Page 10/20 LASER OUTPUTS LDK1...6 LDK1...6 are the current outputs for the laser diode cathode. For high speed operation, connect the laser diode as close as possible to this pins to minimize the inductance. To ensure a high switching speed, it is important to minimise the inductance of the whole current loop (cf. Figure 7, marked red) consisting of iCHG (pins LDKx and AGNDx), the laser diode (anode and cathode), the backup capacitors as well as the enclosed area. It may still be necessary though to use an R/C snubber network for damping L/C oscillations. Depending on the residual inductance in the laser current path and the actual laser current, fast freewheeling diodes from LDKx to VLDA may be required (cf. Figure 8, diode D1) to protect the outputs. The anode of the free-wheeling diode should be close to the to be protected LDKx output and the cathode close to the backup capacitors at VLDA for the free-wheeling current to be dumped into, when switching the respective channel off. ..12V CLDA1 100μF CLDA3 100nF CLDA2 10μF CLDA4 10nF CLDA1 100μF CLDA2 10μF CLDA3 100nF CLDA4 10nF 3..5.5V VDD CVDD3 10nF iC-HG CI1 AGND1 & CI3 CI6 AGND4 CI1 10nF CI2 10nF Ipulsemax = ICWmax · 80% CI6 40% RNER 10K CI6 10nF NERROR repetition time(T ) pulse time(t) CI3 10nF CI4 10nF NER CI5 10nF (1) LDK6 AGND6 VDD 80% ELVDS & 60% s from Electrical Characteristics No. 101 and With ICWmax LD5 LDK5 pulses < 10 µs. So for a single channel operated with a 50% duty cycle,LD6the max. laserAGND5 current becomes EN6 AGND6 ENTTL6 VDD ELVDS LDK4 EN4 LDK6 CI6 EN6 AGND3 LD4 CI4 ENTTL4 The current for pulsed operation may be higher than LDK5 CI5 for CW operation. Therefore the RMS current ofCI5the EN5 pulse train ENTTL5 has to be considered.AGND5 EN5 Power & Temperature ANALOG GROUNDS AGND1...6 Monitor 20% GND AGND1...6 are the ground pins for the channels. It is recommended to connect all AGND1...6 pins to GND. ERROR OUTPUT NER The open drain pin NER is a low-active error output. Signalled errors are ELVDS open or at 50% VDD, VDD undervoltage and thermal shutdown. LD3 LDK3 EN3 LDK4 AGND4 CI5 AGND2 CI3 AGND3 CI4 EN4 & LD3 LDK3 PULSED ENTTL3 OPERATION Figure 8: Free-wheeling diode EN2 AGND2 LD2 LDK2 - CI2 Figure 7: Current loop AGND1 + LDK2 ENTTL2 CI4 & LD2 CI2 EN3 LD1 LDK1 EN1 & - CI3 D1 CI1 + EN2 CVDD3 10nF iC-HG LD1 LDK1 ENTTL1 CI2 VDD CVDD2 100nF CI1 EN1 6 F CVDD1 10μF 60% Ipulsemax = 500 mA · & CVDD2 100nF 40% Power & Temperature Monitor 20% GND √ NER 2 = 707 mA RNER 10K NERROR iC-HG 3 A LASER SWITCH Rev B1, Page 11/20 THERMAL SHUTDOWN iC-HG is protected by an integrated thermal shutdown feature. When the shutdown temperature is reached all channels are disabled. Falling temperature after this shutdown will unconditionally enable all channels again. Necessary precaution to prevent damage of the laser may be to also disable any external control circuits for the laser output power or current control during thermal shutdown. The error signal at pin NER can be used to e.g. disable the control circuit. APPLICATION EXAMPLES ..12V CLDA1 100μF CLDA2 10μF CLDA3 100nF CLDA4 10nF 3..5.5V CVDD1 10μF VDD CVDD2 100nF CVDD3 10nF iC-HG LDK1 CI1 EN1 EN+LVDS & AGND1 + EN-LVDS CI CI 10nF LDK2 - CI2 EN2 & AGND2 CI3 LDK3 EN3 AGND3 CI4 LDK4 EN4 AGND4 CI5 LDK5 EN5 AGND5 CI6 LDK6 EN6 AGND6 RNER 10K NER VDD 80% ELVDS 60% & RLVDS 100 40% Power & Temperature Monitor 20% GND Figure 9: 1 channel LVDS fast NERROR iC-HG 3 A LASER SWITCH Rev B1, Page 12/20 ..12V CLDA1 100μF CLDA2 10μF CLDA3 100nF CLDA4 10nF 3..5.5V CVDD1 10μF VDD CVDD2 100nF CVDD3 10nF iC-HG LDK1 CI1 EN1 EN+LVDS & AGND1 + RLVDS 100 LDK2 - CI2 EN2 EN-LVDS & AGND2 CI3 CI CI 10nF LDK3 EN3 AGND3 CI4 LDK4 EN4 AGND4 CI5 LDK5 EN5 AGND5 CI6 LDK6 EN6 AGND6 RNER 10K NER VDD RELVDS1 3.32k ELVDS RELVDS2 7.5k 60% & 80% 40% Power & Temperature Monitor 20% GND Figure 10: 1 channel LVDS slow NERROR iC-HG 3 A LASER SWITCH Rev B1, Page 13/20 ..12V CLDA1 100μF CLDA2 10μF CLDA3 100nF CLDA4 10nF 3..5.5V CVDD1 10μF VDD CVDD2 100nF CVDD3 10nF iC-HG LDK1 CI1 ENTTL EN1 & AGND1 + LDK2 - CI2 EN2 CI 10nF AGND2 CI3 LDK3 EN3 AGND3 CI4 LDK4 EN4 AGND4 CI5 LDK5 EN5 AGND5 CI6 LDK6 EN6 AGND6 RNER 10K NER VDD 80% ELVDS 60% & CI & 40% Power & Temperature Monitor 20% GND Figure 11: 1 channel TTL fast NERROR iC-HG 3 A LASER SWITCH Rev B1, Page 14/20 ..12V CLDA1 100μF CLDA2 10μF CLDA3 100nF CLDA4 10nF 3..5.5V CVDD1 10μF VDD CVDD2 100nF CVDD3 10nF iC-HG LDK1 CI1 EN1 ENTTL & AGND1 + LDK2 - CI2 EN2 & AGND2 CI3 CI CI 10nF LDK3 EN3 AGND3 CI4 LDK4 EN4 AGND4 CI5 LDK5 EN5 AGND5 CI6 LDK6 EN6 AGND6 RNER 10K NER VDD RELVDS1 7.5k ELVDS RELVDS2 3.32k 60% & 80% 40% Power & Temperature Monitor 20% GND Figure 12: 1 channel TTL slow NERROR iC-HG 3 A LASER SWITCH Rev B1, Page 15/20 ..12V CLDA1 100μF CLDA2 10μF CLDA3 100nF CLDA4 10nF 3..5.5V CVDD1 10μF VDD CVDD2 100nF CVDD3 10nF iC-HG LD1 LDK1 CI1 CI1 EN1 EN+LVDS1 & AGND1 + RLVDS1 100 LDK2 - CI2 EN2 EN-LVDS1 & CI1 10nF AGND2 LD2 CI3 CI2 LDK3 EN3 EN+LVDS2 AGND3 CI4 RLVDS2 100 LDK4 EN4 EN-LVDS2 AGND4 LD3 CI5 CI3 LDK5 EN5 EN+LVDS3 RLVDS3 100 LDK6 EN6 AGND6 RNER 10K CI3 10nF NER VDD 80% ELVDS 60% & EN-LVDS3 CI2 10nF AGND5 CI6 40% Power & Temperature Monitor 20% GND Figure 13: 3 channel LVDS fast NERROR Figure 14: 6 channel TTL fast ENTTL6 CI6 ENTTL5 CI5 ENTTL4 CI4 ENTTL3 CI3 ENTTL2 CI2 ENTTL1 CI1 3..5.5V CI1 10nF CI2 10nF CI3 10nF CI4 10nF CI5 10nF CVDD1 10μF CI6 10nF EN6 CI6 EN5 CI5 EN4 CI4 EN3 CI3 EN2 CI2 EN1 CI1 ELVDS CVDD2 100nF VDD 20% 40% 60% 80% - + iC-HG CLDA1 100μF GND & & VDD & ..12V Power & Temperature Monitor CLDA2 10μF NER AGND6 LDK6 AGND5 LDK5 AGND4 LDK4 AGND3 LDK3 AGND2 LDK2 AGND1 LDK1 CVDD3 10nF CLDA3 100nF CLDA4 10nF NERROR RNER 10K LD1 LD2 LD3 LD4 LD5 LD6 iC-HG 3 A LASER SWITCH Rev B1, Page 16/20 J4 2 J4 3 J2-LVDS_P 9 J2-LVDS_N 11 J2-GND6 12 J2-GND5 10 J2-GND4 8 J2-GND3 5 J2-GND2 4 J2-GND1 2 J2-GND 1 J4 1 VDD J2-TTL 3 J2-V5D1 7 J2-V5D 6 iC149_1 S S1 EN4 J3 6 Figure 15: Schematic of the evaluation board EN6 J3 9 J3 10 EN5 J3 8 J3 7 EN3 EN2 EN1 8 7 6 5 4 3 2 1 J3 5 J3 4 J3 3 J3 2 J3 1 LVDS _P LVDS _N GND NC NC GND TT L GND J1 iC149_1 R56 100 R34 100 R12 100 J5 2 J5 3 J5 1 A A A A A L R 1k P6 A C C C C C C R3 3.32k R2 4.22k R1 3.32k VDD L R 1k P5 VDD L R 1k P4 VDD L R 1k P3 VDD L R 1k P2 VDD L R 1k P1 VDD GND1 GND VDD VLDA JP6 JP5 JP4 JP3 JP2 JP1 VDD A A A A A A JP7_4 JP7_3 JP7_2 JP7_1 CI6 CI5 CI4 CI3 CI2 CI1 C6 100nF C5 100nF C4 100nF C3 100nF C2 100nF C1 100nF C7 10μF LVDS /TTL & & & & & & 18 VDD A SUB GND EPAD 4 C9 10nF PWR & TEMP MONITOR 19 ELVDS 14 EN6 7 CI6 15 EN5 6 CI5 16 EN4 5 CI4 17 EN3 3 CI3 20 EN2 2 CI2 21 EN1 1 CI1 U1 iC-HG C8 100nF NER 22 AGND6 8 LDK6 9 AGND5 10 LDK5 11 AGND4 12 LDK4 13 AGND3 24 LDK3 23 AGND2 26 LDK2 25 AGND1 28 LDK1 27 A A A A A A NER LDK6 LDK5 LDK4 LDK3 LDK2 LDK1 562 R7 JP56 JP34 JP12 D7 RD D6 D5 D4 D3 D2 D1 VDD A A A A A A C16 10nF C15 10nF C14 10nF C13 10nF C12 10nF C11 10nF A A A A A A C26 1μF C25 1μF C24 1μF C23 1μF C22 1μF C21 1μF A A A A A A C36 10μF C35 10μF C34 10μF C33 10μF C32 10μF C31 10μF A A C17 47μF C10 47μF iC-HG 3 A LASER SWITCH Rev B1, Page 17/20 EVALUATION BOARD iC-HG comes with an evaluation board for test purpose. Figures 15 and 16 show both the schematic and the component side of the evaluation board. iC-HG 3 A LASER SWITCH Rev B1, Page 18/20 Figure 16: Evaluation board (component side) Figure 17: Evaluation board (solder side) with mounting option for heat sink iC-HG 3 A LASER SWITCH Rev B1, Page 19/20 iC-Haus expressly reserves the right to change its products and/or specifications. An info letter gives details as to any amendments and additions made to the relevant current specifications on our internet website www.ichaus.de/infoletter; this letter is generated automatically and shall be sent to registered users by email. Copying – even as an excerpt – is only permitted with iC-Haus’ approval in writing and precise reference to source. iC-Haus does not warrant the accuracy, completeness or timeliness of the specification and does not assume liability for any errors or omissions in these materials. The data specified is intended solely for the purpose of product description. No representations or warranties, either express or implied, of merchantability, fitness for a particular purpose or of any other nature are made hereunder with respect to information/specification or the products to which information refers and no guarantee with respect to compliance to the intended use is given. In particular, this also applies to the stated possible applications or areas of applications of the product. iC-Haus conveys no patent, copyright, mask work right or other trade mark right to this product. iC-Haus assumes no liability for any patent and/or other trade mark rights of a third party resulting from processing or handling of the product and/or any other use of the product. iC-HG 3 A LASER SWITCH Rev B1, Page 20/20 ORDERING INFORMATION Type Package Options iC-HG QFN28 5 mm x 5 mm General Purpose Evaluation Board iC-HG QFN28 iC-HG EVAL HG1D Host adapter for high-speed modules Host adapter for high-speed modules iC-HG EVAL HG2D with heat-sink assembly kit High-speed module for C-mount laser diodes High-speed module for TO type laser diodes Order Designation iC-HG EVAL HG2D-HSK iC-HG iCSY HG2M iC-HG iCSY HG8M For technical support, information about prices and terms of delivery please contact: iC-Haus GmbH Am Kuemmerling 18 D-55294 Bodenheim GERMANY Tel.: +49 (61 35) 92 92-0 Fax: +49 (61 35) 92 92-192 Web: http://www.ichaus.com E-Mail: [email protected] Appointed local distributors: http://www.ichaus.com/sales_partners