ICS ICS84320AYI-01LF

ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
GENERAL DESCRIPTION
FEATURES
The ICS84320I-01 is a general purpose, dual
output Crystal-to-3.3V Differential LVPECL
HiPerClockS™
High Frequency Synthesizer and a member of
the HiPerClockS™ family of High Performance
Clock Solutions from ICS. The ICS84320I-01
has a selectable TEST_CLK or crystal inputs. The VCO
operates at a frequency range of 620MHz to 780MHz. The
VCO frequency is programmed in steps equal to the
value of the input reference or crystal frequency. The VCO
and output frequency can be programmed using the
serial or parallel interfaces to the configuration logic. The
low phase noise characteristics of the ICS84320I-01
make it an ideal clock source for 10 Gigabit Ethernet,
SONET, and Serial Attached SCSI applications.
• Dual differential 3.3V LVPECL outputs
ICS
• Selectable crystal oscillator interface
or LVCMOS/LVTTL TEST_CLK
• Output frequency range: 77.5MHz to 780MHz
• Crystal input frequency range: 14MHz to 40MHz
• VCO range: 620MHz to 780MHz
• Parallel or serial interface for programming counter
and output dividers
• Duty cycle: 44% - 56% (N > 1)
• RMS period jitter: 2.0ps (typical)
• RMS phase jitter at 155.52MHz, using a 38.88MHz crystal
(12kHz to 20MHz): 2.38ps (typical)
• RMS phase noise at 155.52MHz (typical)
Offset
Noise Power
100Hz ................ -90.5 dBc/Hz
1kHz ............... -114.2 dBc/Hz
10kHz ............... -123.6 dBc/Hz
100kHz ............... -128.1 dBc/Hz
• 3.3V supply voltage
• -40°C to 85°C ambient operating temperature
• Available in both, Standard and RoHS/Lead-Free
compliant packages
BLOCK DIAGRAM
PIN ASSIGNMENT
VCO_SEL
XTAL_SEL
XTAL_IN
M0
M1
M2
M3
1
M4
OSC
nP_LOAD
0
XTAL_IN
VCO_SEL
TEST_CLK
XTAL_OUT
32 31 30 29 28 27 26 25
PLL
PHASE DETECTOR
MR
VCO
÷M
1
FOUT0
nFOUT0
FOUT1
nFOUT1
CONFIGURATION
INTERFACE
LOGIC
1
24
XTAL_OUT
M6
2
23
TEST_CLK
M7
3
22
XTAL_SEL
M8
4
21
VCCA
N0
5
20
S_LOAD
N1
6
19
S_DATA
nc
7
18
S_CLOCK
VEE
8
17
MR
ICS84320I-01
32-Lead LQFP
7mm x 7mm x 1.4mm
package body
Y Package
Top View
9 10 11 12 13 14 15 16
TEST
VEE
nFOUT0
FOUT0
VCCO
nFOUT1
FOUT1
M0:M8
VCC
TEST
S_LOAD
S_DATA
S_CLOCK
nP_LOAD
0
÷N
÷1
÷2
÷4
÷8
M5
N0:N1
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on initial
product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications without notice.
84320AYI-01
www.icst.com/products/hiperclocks.html
1
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
FUNCTIONAL DESCRIPTION
NOTE: The functional description that follows describes operation using a 25MHz crystal. Valid PLL loop divider values
for different crystal or input frequencies are defined in the Input Frequency Characteristics, Table 5, NOTE 1.
matically occur during power-up. The TEST output is LOW when
operating in the parallel input mode. The relation-ship between
the VCO frequency, the crystal frequency and the M divider is
defined as follows:
fVCO = fxtal x M
The ICS84320I-01 features a fully integrated PLL and therefore requires no external components for setting the loop bandwidth. A fundamental crystal is used as the input to the onchip oscillator. The output of the oscillator is fed into the phase
detector. A 25MHz crystal provides a 25MHz phase detector
reference frequency. The VCO of the PLL operates over a
range of 620MHz to 780MHz. The output of the M divider is
also applied to the phase detector.
The M value and the required values of M0 through M8 are
shown in Table 3B to program the VCO Frequency Function
Table. Valid M values for which the PLL will achieve lock for a
25MHz reference are defined as 25 ≤ M ≤ 31. The frequency
out is defined as follows:
FOUT = fVCO = fxtal x M
N
N
Serial operation occurs when nP_LOAD is HIGH and S_LOAD
is LOW. The shift register is loaded by sampling the S_DATA
bits with the rising edge of S_CLOCK. The contents of the
shift register are loaded into the M divider and N output divider when S_LOAD transitions from LOW-to-HIGH. The M
divide and N output divide values are latched on the HIGH-toLOW transition of S_LOAD. If S_LOAD is held HIGH, data at
the S_DATA input is passed directly to the M divider and N
output divider on each rising edge of S_CLOCK. The serial
mode can be used to program the M and N bits and test bits
T1 and T0. The internal registers T0 and T1 determine the state
of the TEST output as follows:
The phase detector and the M divider force the VCO output frequency to be M times the reference frequency by adjusting the
VCO control voltage. Note that for some values of M (either too
high or too low), the PLL will not achieve lock. The output of the
VCO is scaled by a divider prior to being sent to each of the LVPECL
output buffers. The divider provides a 50% output duty cycle.
The programmable features of the ICS84320I-01 support two
input modes to program the M divider and N output divider. The
two input operational modes are parallel and serial. Figure 1 shows
the timing diagram for each mode. In parallel mode, the nP_LOAD
input is initially LOW. The data on inputs M0 through M8 and N0
and N1 is passed directly to the M divider and N output divider.
On the LOW-to-HIGH transition of the nP_LOAD input, the data
is latched and the M divider remains loaded until the next
LOW transition on nP_LOAD or until a serial event occurs. As a
result, the M and N bits can be hardwired to set the M divider
and N output divider to a specific default state that will auto-
T1
T0
TEST Output
0
0
LOW
0
1
S_Data, Shift Register Input
1
0
Output of M divider
1
1
CMOS Fout
SERIAL LOADING
S_CLOCK
S_DATA
T1
t
S_LOAD
S
T0
*NULL
N1
N0
M8
M7
M6
M5
M4
M3
M2
M1
M0
t
H
nP_LOAD
t
S
PARALLEL LOADING
M, N
M0:M8, N0:N1
nP_LOAD
t
S
t
H
S_LOAD
Time
FIGURE 1. PARALLEL & SERIAL LOAD OPERATIONS
*NOTE: The NULL timing slot must be observed.
84320AYI-01
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2
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1
2, 3, 4,
28, 29,
30, 31, 32
M5
M6, M7, M8,
M0, M1,
M2, M3, M4
5, 6
Type
Input
Description
Pullup
Input
M divider inputs. Data latched on LOW-to-HIGH transition of
Pulldown nP_LOAD input. LVCMOS / LVTTL interface levels.
N0, N1
Input
Pulldown
Determines output divider value as defined in Table 3C,
Function Table. LVCMOS / LVTTL interface levels.
No connect.
7
nc
Unused
8, 16
VEE
Power
9
TEST
Output
10
VCC
Power
Negative supply pins.
Test output which is ACTIVE in the serial mode of operation.
Output driven LOW in parallel mode.
LVCMOS/LVTTL interface levels.
Core supply pin.
11, 12
FOUT1, nFOUT1
Output
Differential output for the synthesizer. LVPECL interface levels.
13
VCCO
Power
Output supply pin.
14, 15
FOUT0, nFOUT0
Output
17
MR
Input
Pulldown
18
S_CLOCK
Input
Pulldown
19
S_DATA
Input
Pulldown
20
S_LOAD
Input
Pulldown
21
VCCA
Power
22
XTAL_SEL
Input
Pullup
23
TEST_CLK
XTAL_OUT,
XTAL_IN
Input
Pulldown
26
nP_LOAD
Input
Pulldown
27
VCO_SEL
Input
Pullup
Differential output for the synthesizer. LVPECL interface levels.
Active High Master Reset. When logic HIGH, forces the internal
dividers are reset causing the true outputs FOUTx to go low and the
inver ted outputs nFOUTx to go high. When logic LOW, the internal
dividers and the outputs are enabled. Asser tion of MR does not
affect loaded M, N, and T values. LVCMOS / LVTTL interface levels.
Clocks in serial data present at S_DATA input into the shift register
on the rising edge of S_CLOCK. LVCMOS/LVTTL interface levels.
Shift register serial input. Data sampled on the rising edge of
S_CLOCK. LVCMOS/LVTTL interface levels.
Controls transition of data from shift register into the dividers.
LVCMOS / LVTTL interface levels.
Analog supply pin.
Selects between cr ystal or test inputs as the PLL reference source.
Selects XTAL inputs when HIGH. Selects TEST_CLK when LOW.
LVCMOS / LVTTL interface levels.
Test clock input. LVCMOS / LVTTL interface levels.
Crystal oscillator interface. XTAL_IN is the input.
XTAL_OUT is the output.
Parallel load input. Determines when data present at M8:M0 is
loaded into M divider, and when data present at N1:N0 sets the
N output divider value. LVCMOS / LVTTL interface levels.
Determines whether synthesizer is in PLL or bypass mode.
LVCMOS / LVTTL interface levels.
24, 25
Input
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
84320AYI-01
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3
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
TABLE 3A. PARALLEL
AND
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
SERIAL MODE FUNCTION TABLE
Inputs
Conditions
MR
nP_LOAD
M
N
S_LOAD
S_CLOCK
S_DATA
H
X
X
X
X
X
X
Reset. Forces outputs LOW.
L
L
Data
Data
X
X
X
Data on M and N inputs passed directly to the M
divider and N output divider. TEST output forced LOW.
L
↑
Data
Data
L
X
X
L
H
X
X
L
↑
Data
L
H
X
X
↑
L
Data
L
H
X
X
↓
L
Data
M divider and N output divider values are latched.
L
H
X
X
L
X
X
Parallel or serial input do not affect shift registers.
L
H
X
X
H
↑
Data
Data is latched into input registers and remains loaded
until next LOW transition or until a serial event occurs.
Serial input mode. Shift register is loaded with data on
S_DATA on each rising edge of S_CLOCK.
Contents of the shift register are passed to the
M divider and N output divider.
S_DATA passed directly to M divider as it is clocked.
NOTE: L = LOW
H = HIGH
X = Don't care
↑ = Rising edge transition
↓ = Falling edge transition
TABLE 3B. PROGRAMMABLE VCO FREQUENCY FUNCTION TABLE
256
128
64
32
16
8
4
2
1
M8
M7
M6
M5
M4
M3
M2
M1
M0
25
0
0
0
0
1
1
0
0
1
•
•
•
•
•
•
•
•
•
•
700
28
0
0
0
0
1
1
1
0
0
•
•
•
•
•
•
•
•
•
•
•
VCO Frequency
(MHz)
M Divide
625
•
775
31
0
0
0
0
1
1
1
1
NOTE 1: These M divide values and the resulting frequencies correspond to crystal or TEST_CLK input frequency
of 25MHz.
1
TABLE 3C. PROGRAMMABLE OUTPUT DIVIDER FUNCTION TABLE
Inputs
N1
N0
0
0
N Divider Value
Output Frequency (MHz)
Minimum
Maximum
1
62 0
780
0
1
2
310
390
1
0
4
155
195
1
1
8
77.5
97.5
84320AYI-01
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4
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5 V
Outputs, VO (LVCMOS)
-0.5V to VCCO + 0.5V
Outputs, IO (LVPECL)
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
47.9°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VCC
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
VCCA
Analog Supply Voltage
3.135
3.3
3.465
V
VCCO
Output Supply Voltage
3.135
3.3
3.465
V
IEE
Power Supply Current
155
mA
ICCA
Analog Supply Current
22
mA
Maximum
Units
2
VCC + 0.3
V
2
VCC + 0.3
V
-0.3
0.8
V
-0.3
1.3
V
VCC = VIN = 3.465V
150
µA
VCC = VIN = 3.465V
5
µA
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
VIH
VIL
IIH
Parameter
Input
High Voltage
Input
Low Voltage
Input
High Current
Test Conditions
VCO_SEL, XTAL_SEL, MR,
S_LOAD, nP_LOAD, N0:N1,
S_DATA, S_CLOCK, M0:M8
TEST_CLK
VCO_SEL, XTAL_SEL, MR,
S_LOAD, nP_LOAD, N0:N1,
S_DATA, S_CLOCK, M0:M8
TEST_CLK
M0-M4, M6-M8, N0, N1, MR,
S_CLOCK, TEST_CLK,
S_DATA, S_LOAD, nP_LOAD
M5, XTAL_SEL, VCO_SEL
IIL
Input
Low Current
Minimum
Typical
M0-M4, M6-M8, N0, N1, MR,
S_CLOCK, TEST_CLK,
S_DATA, S_LOAD, nP_LOAD
VCC = 3.465V,
VIN = 0V
-5
µA
M5, XTAL_SEL, VCO_SEL
VCC = 3.465V,
VIN = 0V
-150
µA
2. 6
V
VOH
Output
High Voltage
TEST; NOTE 1
VOL
Output
Low Voltage
TEST; NOTE 1
0.5
V
NOTE 1: Outputs terminated with 50Ω to VCCO/2.
84320AYI-01
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5
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 4C. LVPECL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
V OH
Output High Voltage; NOTE 1
V OL
Output Low Voltage; NOTE 1
Test Conditions
Minimum
Typical
Maximum
Units
VCCO - 1.4
VCCO - 0.9
V
VCCO - 2.0
VCCO - 1.7
V
1.0
V
Maximum
Units
VSWING
Peak-to-Peak Output Voltage Swing
0.6
NOTE 1: Outputs terminated with 50 Ω to VCCO - 2V. See "Parameter Measurement Information" section,
"3.3V Output Load Test Circuit".
TABLE 5. INPUT FREQUENCY CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
Minimum
Typical
TEST_CLK; NOTE 1
14
40
MHz
XTAL_IN, XTAL_OUT;
fIN
Input Frequency
14
40
MHz
NOTE 1
S_CLOCK
50
MHz
NOTE 1: For the input crystal and TEST_CLK frequency range, the M value must be set for the VCO to operate within the
620MHz to780MHz range. Using the minimum input frequency of 14MHz, valid values of M are 45 ≤ M ≤ 55. Using the
maximum frequency of 40MHz, valid values of M are 16 ≤ M ≤ 19.
TABLE 6. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical Maximum
Units
Fundamental
Frequency
40
MHz
Equivalent Series Resistance (ESR)
50
Ω
Shunt Capacitance
7
pF
Drive Level
1
mW
84320AYI-01
14
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6
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 7. AC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = -40°C TO 85°C
Symbol Parameter
Test Conditions
FOUT
Output Frequency
t jit(per)
Period Jitter, RMS; NOTE 1
t sk(o)
Output Skew; NOTE 2, 3
tR / tF
Output Rise/Fall Time
tS
tH
Setup Time
Hold Time
Minimum
Typical
77.5
fOUT > 100MHz
20% to 80%
2.0
100
Units
780
MHz
2.6
ps
15
ps
700
ps
M, N to nP_LOAD
5
ns
S_DATA to S_CLOCK
5
ns
S_CLOCK to S_LOAD
5
ns
M, N to nP_LOAD
5
ns
S_DATA to S_CLOCK
5
ns
S_CLOCK to S_LOAD
5
ns
o dc
Output Duty Cycle
tPW
Output Pulse Width
N>1
49
51
%
fOUT ≤ 625
44
56
%
ƒ > 625
tPERIOD/2 - 150
tPERIOD/2 + 150
PLL Lock Time
tLOCK
See Parameter Measurement Information section.
NOTE 1: Jitter performance using XTAL inputs.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
84320AYI-01
Maximum
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7
1
ps
ms
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TYPICAL PHASE NOISE AT 155.52MHZ
➤
0
-10
-20
OC-48 Sonet Bandpass Filter
-30
-40
155.52MHz
-50
RMS Phase Jitter (Random)
12kHz to 20MHz = 2.38ps (typical)
Raw Phase Noise Data
-70
➤
-80
-90
-100
-110
-120
➤
NOISE POWER dBc
Hz
-60
-130
-140
Phase Noise Result by adding
Sonet Bandpass Filter to raw data
-150
-160
-170
-180
-190
10
100
1k
10k
100k
1M
10M
100M
OFFSET FREQUENCY (HZ)
TYPICAL PHASE NOISE AT 622.08MHZ
➤
0
-10
-20
OC-48 Sonet Bandpass Filter
-30
-40
622.08MHz
-50
RMS Phase Jitter (Random)
12kHz to 20MHz = 2.48ps (typical)
Raw Phase Noise Data
-70
-80
-90
-100
-110
➤
NOISE POWER dBc
Hz
➤
-60
-120
-130
Phase Noise Result by adding
Sonet Bandpass Filter to raw data
-140
-150
-160
-170
-180
-190
10
100
1k
10k
100k
1M
10M
100M
OFFSET FREQUENCY (HZ)
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8
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
PARAMETER MEASUREMENT INFORMATION
2V
V CC ,
VCCA,
VCCO
Qx
SCOPE
nFOUTx
FOUTx
LVPECL
nFOUTy
nQx
VEE
FOUTy
tsk(o)
-1.3V ± 0.165V
OUTPUT SKEW
3.3V OUTPUT LOAD AC TEST CIRCUIT
VOH
nFOUTx
FOUTx
VREF
t PW
t
VOL
1σ contains 68.26% of all measurements
2σ contains 95.4% of all measurements
3σ contains 99.73% of all measurements
4σ contains 99.99366% of all measurements
6σ contains (100-1.973x10-7)% of all measurements
odc =
PERIOD
t PW
x 100%
t PERIOD
Histogram
Reference Point
Mean Period
(Trigger Edge)
(First edge after trigger)
PERIOD JITTER
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
Phase Noise Plot
Noise Power
80%
80%
VSW I N G
Clock
Outputs
Phase Noise Mask
f1
Offset Frequency
20%
20%
tR
tF
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
OUTPUT RISE/FALL TIME
RMS PHASE JITTER
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REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS84320I-01 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC, VCCA, and VCCO
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required. Figure 2 illustrates how
a 24Ω resistor along with a 10μF and a .01μF bypass
capacitor should be connected to each VCCA pin.
3.3V
VCC
.01μF
24Ω
V CCA
.01μF
10μF
FIGURE 2. POWER SUPPLY FILTERING
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
OUTPUTS:
CRYSTAL INPUT:
For applications not requiring the use of the crystal oscillator
input, both XTAL_IN and XTAL_OUT can be left floating.
Though not required, but for additional protection, a 1kΩ
resistor can be tied from XTAL_IN to ground.
LVCMOS OUTPUT:
All unused LVCMOS output can be left floating. We
recommend that there is no trace attached.
LVPECL OUTPUT
All unused LVPECL outputs can be left floating. We
recommend that there is no trace attached. Both sides of the
differential output pair should either be left floating or
terminated.
TEST_CLK INPUT:
For applications not requiring the use of the test clock, it can
be left floating. Though not required, but for additional
protection, a 1kΩ resistor can be tied from the TEST_CLK to
ground.
SELECT PINS:
All select pins have internal pull-ups and pull-downs;
additional resistance is not required but can be added for
additional protection. A 1kΩ resistor can be used.
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10
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
CRYSTAL INPUT INTERFACE
suitable for most applications. Additional accuracy can be
achieved by adding two small capacitors C1 and C2 as shown in
Figure 3.
A crystal can be characterized for either series or parallel mode
operation. The ICS84320I-01 has a built-in crystal oscillator circuit.
This interface can accept either a series or parallel crystal without
additional components and generate frequencies with accuracy
XTAL_OUT
C1
18p
X1
18pF Parallel Crystal
XTAL_IN
C2
22p
Figure 3. CRYSTAL INPUt INTERFACE
TERMINATION FOR LVPECL OUTPUTS
The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned
are recommended only as guidelines.
drive 50Ω transmission lines. Matched impedance techniques
should be used to maximize operating frequency and minimize
signal distortion. Figures 4A and 4B show two different layouts
which are recommended only as guidelines. Other suitable clock
layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
3.3V
Zo = 50Ω
125Ω
FOUT
125Ω
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
RTT =
1
Z
((VOH + VOL) / (VCC – 2)) – 2 o
VCC - 2V
Zo = 50Ω
RTT
84Ω
FIGURE 4A. LVPECL OUTPUT TERMINATION
84320AYI-01
FIN
50Ω
84Ω
FIGURE 4B. LVPECL OUTPUT TERMINATION
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11
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
LAYOUT GUIDELINE
The schematic of the ICS84320I-01 layout example used in
this layout guideline is shown in Figure 5A. The ICS84320I-01
recommended PCB board layout for this example is shown in
Figure 5B. This layout example is used as a general guideline.
The layout in the actual system will depend on the selected
component types, the density of the components, the density
of the traces, and the stack up of the P.C. board.
C1
C2
M5
M6
M7
M8
N0
N1
nc
VEE
VCC
ICS84320i-01
X_OUT
T_CLK
XTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
MR
TEST
VCC
FOUT1
nFOUT1
VCCO
FOUT0
nFOUT0
VEE
1
2
3
4
5
6
7
8
9
10
11
12
VCC
13
FOUT
14
FOUTN 15
16
U1
M4
M3
M2
M1
M0
VCO_SEL
nP_LOAD
X_IN
32
31
30
29
28
27
26
25
X1
VCC
24
23
22
21
20
19
18
17
R7
10
REF_IN
XTAL_SEL
VCCA
S_LOAD
S_DATA
S_CLOCK
C11
0.01u
C16
10u
VCC
R1
125
R3
125
Zo = 50 Ohm
C14
0.1u
TL1
C15
0.1u
+
Zo = 50 Ohm
-
nTL1
VCC=3.3V
R2
84
R4
84
FIGURE 5A. SCHEMATIC OF RECOMMENDED LAYOUT
84320AYI-01
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REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
The following component footprints are used in this layout
example:
• The differential 50Ω output traces should have the
same length.
All the resistors and capacitors are size 0603.
• Avoid sharp angles on the clock trace. Sharp angle
turns cause the characteristic impedance to change on
the transmission lines.
POWER
AND
GROUNDING
Place the decoupling capacitors C14 and C15, as close as possible to the power pins. If space allows, placement of the
decoupling capacitor on the component side is preferred. This
can reduce unwanted inductance between the decoupling capacitor and the power pin caused by the via.
• Keep the clock traces on the same layer. Whenever possible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
• To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
The RC filter consisting of R7, C11, and C16 should be placed
as close to the VCCA pin as possible.
• Make sure no other signal traces are routed between the
clock trace pair.
CLOCK TRACES
• The matching termination resistors should be located as
close to the receiver input pins as possible.
AND
TERMINATION
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital systems,
the clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the board
and the component location. While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
CRYSTAL
The crystal X1 should be located as close as possible to the pins
25 (XTAL_IN) and 24 (XTAL_OUT). The trace length between the
X1 and U1 should be kept to a minimum to avoid unwanted parasitic inductance and capacitance. Other signal traces should not
be routed near the crystal traces.
GND
X1
C1
C2
VCC
VIA
U1
PIN 1
C16
C11
VCCA
R7
Close to the input
pins of the
receiver
TL1N
C15
TL1
C14
TL1
R1
R2
TL1N
R3
R4
TL1, TL21N are 50 Ohm
traces and equal length
FIGURE 5B. PCB BOARD LAYOUT FOR ICS84320I-01
84320AYI-01
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13
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS84320I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS84320I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 155mA = 537.08mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 2 * 30mW = 60mW
Total Power_MAX (3.465V, with all outputs switching) = 537.08mW + 60mW = 597.08mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 8 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.597W * 42.1°C/W = 110.1°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 8. THERMAL RESISTANCE θJA FOR 32-PIN LQFP, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
84320AYI-01
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14
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 6.
VCCO
Q1
VOUT
RL
50
VCCO - 2V
FIGURE 6. LVPECL DRIVER CIRCUIT
TERMINATION
AND
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V - 2V.
CCO
•
For logic high, VOUT = V
OH_MAX
(V
CCO_MAX
•
-V
OH_MAX
OL_MAX
CCO_MAX
-V
CCO_MAX
– 0.9V
) = 0.9V
For logic low, VOUT = V
(V
=V
=V
CCO_MAX
– 1.7V
) = 1.7V
OL_MAX
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
CCO_MAX
L
-V
OH_MAX
) = [(2V - (V
CCO_MAX
-V
OH_MAX
))/R ] * (V
CCO_MAX
L
-V
)=
OH_MAX
[(2V - 0.9V)/50Ω) * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
– (V
CCO_MAX
- 2V))/R ] * (V
L
CCO_MAX
-V
OL_MAX
) = [(2V - (V
CCO_MAX
-V
OL_MAX
))/R ] * (V
L
CCO_MAX
-V
)=
OL_MAX
[(2V - 1.7V)/50Ω) * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
84320AYI-01
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REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
RELIABILITY INFORMATION
TABLE 9. θJAVS. AIR FLOW TABLE FOR 32 LEAD LQFP
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS84320I-01 is: 3776
84320AYI-01
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16
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
PACKAGE OUTLINE - Y SUFFIX FOR 32 LEAD LQFP
TABLE 10. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
BBA
SYMBOL
MINIMUM
NOMINAL
MAXIMUM
32
N
A
--
--
1.60
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.30
0.37
0.45
c
0.09
--
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.60 Ref.
E
9.00 BASIC
E1
7.00 BASIC
E2
5.60 Ref.
e
0.80 BASIC
0.75
L
0.45
0.60
θ
0°
--
7°
ccc
--
--
0.10
Reference Document: JEDEC Publication 95, MS-026
84320AYI-01
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17
REV. A AUGUST 11, 2005
ICS84320I-01
Integrated
Circuit
Systems, Inc.
780MHZ, CRYSTAL-TO-3.3V DIFFERENTIAL
LVPECL FREQUENCY SYNTHESIZER
TABLE 11. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS84320AYI-01
ICS84320AI01
32 Lead LQFP
tray
-40°C to 85°C
ICS84320AYI-01T
ICS84320AI01
32 Lead LQFP
1000 tape & reel
-40°C to 85°C
ICS84320AYI-01LF
TBD
32 Lead "Lead-Free" LQFP
tray
-40°C to 85°C
ICS84320AYI-01LFT
TBD
32 Lead "Lead-Free" LQFP
1000 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
The aforementioned trademark, HiPerClockS is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
84320AYI-01
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18
REV. A AUGUST 11, 2005