ICS ICS86953BYIT-147

ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS86953I-147 is a low voltage, low skew
1-to-9 Differential-to-LVCMOS/LVTTL Clock
HiPerClockS™
Generator and a member of the HiPerClockS™
family of High Performance Clock Solutions from
ICS. The PCLK, nPCLK pair can accept most standard differential input levels. With output frequencies up to 175MHz,
the ICS86953I-147 is targeted for high performance clock applications. Along with a fully integrated PLL, the ICS86953I-147
contains frequency configurable outputs and an external feedback input for regenerating clocks with “zero delay”.
• 9 single ended LVCMOS/LVTTL outputs;
(8) clocks, (1) feedback
ICS
• PCLK, nPCLK pair can accept the following differential
input levels: LVPECL, CML, SSTL
• Maximum output frequency: PLL Mode, 175MHz
• VCO range: 250MHz to 700MHz
• Output skew: 75ps (maximum)
• Cycle-to-cycle jitter: 50ps (maximum)
• Static phase offset: 90ps ± 110ps
• 3.3V supply voltage
PIN ASSIGNMENT
• -40°C to 85°C ambient operating temperature
GND
Q0
VDDO
QFB
GND
PLL_SEL
nBYPASS
VCO_SEL
• Pin compatible to the MPC953
32 31 30 29 28 27 26 25
VDDA
1
24
Q1
FB_CLK
2
23
VDDO
nc
3
22
Q2
nc
4
21
GND
nc
5
20
Q3
nc
6
19
VDDO
GND
7
18
Q4
PCLK
8
17
GND
ICS86953I-147
9 10 11 12 13 14 15 16
Q5
VDDO
Q6
GND
Q7
VDDO
MR/nOE
nPCLK
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y package
Top View
BLOCK DIAGRAM
PCLK
nPCLK
FB_CLK
QFB
0
Phase
Detector
0
0
LPF
1
VCO
÷4
÷2
1
7
/
Q0:Q6
1
Q7
VCO_SEL
nBYPASS
MR/nOE
PLL_SEL
86953BYI-147
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1
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Nam e
Type
1
VDDA
Power
2
FB_CLK
Input
3, 4, 5, 6
7, 13, 17,
21, 25, 29
8
nc
Unused
GND
Power
PCLK
Input
Description
Analog supply pin.
Pullup
Feedback clock input. LVCMOS / LVTTL interface levels.
No connect.
Power supply ground.
Pullup
Non-inver ting LVPECL differential clock input.
Pullup/ Inver ting LVPECL differential clock input.
9
nPCLK
Input
Pulldown Internally biased to VDDO/2.
Active HIGH Master Reset. Active LOW output enable. When
logic High, the internal dividers are reset and the outputs are
10
MR/nOE
Input
Pulldown
tri-stated (HiZ). When logic LOW, the internal dividers and
the outputs are enabled. LVCMOS / LVTTL interface levels.
Power
Output supply pins.
11, 15, 19, 23, 27
VDDO
12, 14, 16, 18,
Q7, Q6, Q5, Q4,
Clock outputs. LVCMOS / LVTTL interface levels.
Output
20, 22, 24, 26
Q3, Q2, Q1, Q0
14Ω typical output impedance.
Feedback clock output. LVCMOS / LVTTL interface levels.
28
QFB
Output
14Ω typical output impedance.
Selects VCO when HIGH. When LOW, selects PCLK,
30
PLL_SEL
Input
Pullup
nPCLK. LVCMOS / LVTTL interface levels.
31
nBYPASS
Input
Pullup
Selects PLL when HIGH. When LOW, in Bypass mode.
Selects VCO ÷2 when HIGH. Selects VCO ÷1 when LOW.
32
VCO_SEL
Input
Pullup
LVCMOS / LVTTL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
Test Conditions
Minimum Typical
Maximum
4
Units
pF
RPULLUP
Input Pullup Resistor
51
KΩ
RPULLDOWN
Input Pulldown Resistor
51
KΩ
CP D
Power Dissipation Capacitance (per output)
ROUT
Output Impedance
VDDA, VDDO = 3.465V
5
7
14
12
pF
Ω
TABLE 3A. OUTPUT CONTROL PIN FUNCTION TABLE
Input
Outputs
MR/nOE
QFB, Q0:Q7
1
HiZ
0
Enabled
TABLE 3B. PROGRAMMABLE OUTPUT FREQUENCY FUNCTION TABLE
Inputs
Operation
Outputs
Bypass
PLL_SEL
VCO_SEL
0
X
X
Test Mode: PLL and divider bypass
CL K
1
0
0
Test Mode: PLL bypass
CLK/4
1
0
1
Test Mode: PLL bypass
CLK/8
1
1
0
PLL Mode
VCO/4
1
1
1
PLL Mode
VCO/8
86953BYI-147
QFB, Q0:Q7
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2
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5 V
Outputs, VO
-0.5V to VDDO + 0.5V
Package Thermal Impedance, θJA
47.9°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDDA = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
VDDA
VDDO
IDDA
IDDO
Parameter
Analog Supply Voltage
Output Supply Voltage
Analog Supply Current
Output Supply Current
Test Conditions
Minimum
3.135
3.135
Typical
3.3
3.3
Maximum
3.465
3.465
20
75
Units
V
V
mA
mA
Maximum
Units
2
VDD + 0.3
V
2
VDD + 0.3
V
-0.3
0.8
V
-0.3
1.3
V
±120
µA
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VDDA = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
VIH
VIL
Parameter
Input
High Voltage
Input
Low Voltage
Test Conditions
VCO_SEL, nBYPASS,
PLL_SEL, MR/nOE
FB_CLK
VCO_SEL, nBYPASS,
PLL_SEL, MR/nOE
FB_CLK
IIN
Input Current
VOH
Output High Voltage; NOTE 1
IOH = -20mA
VOL
Output Low Voltage; NOTE 1
IOL = 20mA
Minimum
Typical
VDD - 0.6
V
0.6
V
NOTE: Outputs terminated with 50Ω to VDDO/2. See Parameter Measurement section, "3.3V Output Load Test Circuit".
TABLE 4C. LVPECL DC CHARACTERISTICS, VDDA = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
IIN
Input Current
V PP
Peak-to-Peak Input Voltage
Test Conditions
Minimum
Typical
0.15
Common Mode Input Voltage; NOTE 1, 2
GND + 0.5
VCMR
NOTE 1: Common mode voltage is defined as VIH.
NOTE 2: For single ended applications, the maximum input voltage for PCLK, nPCLK is VDD + 0.3V.
86953BYI-147
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3
Maximum
Units
±120
µA
1.3
V
VDD - 0.85
V
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
TABLE 5. PLL INPUT REFERENCE CHARACTERISTICS, VDDA = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
Parameter
fREF
Input Reference Frequency
Test Conditions
Minimum
Typical
Maximum
Units
175
MHz
Maximum
Units
87.5
MHz
TABLE 6. AC CHARACTERISTICS, VDDA = VDDO = 3.3V±5%, TA = -40°C TO 85°C
Symbol
fMAX
Parameter
Output Frequency
Test Conditions
Minimum
PLL Mode
VCO_SEL = 1
31.25
PLL Mode
VCO_SEL = 0
62.50
Typical
Bypass Mode
tPD
Propagation Delay;
NOTE 1
tsk(o)
Output Skew; NOTE 2, 4
tjitter(cc)
Cycle-to-Cycle Jitter; NOTE 5
t(Ø)
Static Phase Offset; NOTE 3, 5
tR / tF
Output Rise/Fall Time
PCLK, nPCLK
2.5
Measured on rising edge
at VDD/2
-20
20% to 80%
90
100
47
50
175
MHz
200
MHz
4
ns
75
ps
50
ps
200
ps
700
ps
odc
Output Duty Cycle
53
%
tLOCK
PLL Lock Time
10
ms
t EN
Output Enable Time; NOTE 4
6
ns
Output Disable Time; NOTE 4
7
tDIS
NOTE: Termination of 50Ω to VDD/2.
NOTE 1: Measured from the differential input crossing point to VDDO/2 of the output.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at VDDO/2.
NOTE 3: Defined as the time difference between the input reference clock and the average feedback input signal
when the PLL is locked and the input reference frequency is stable.
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.
86953BYI-147
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ns
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
PARAMETER MEASUREMENT INFORMATION
1.65V±5%
V DD
SCOPE
VDDA,
VDDO
nPCLK
Qx
LVCMOS
V
Cross Points
PP
V
CMR
PCLK
GND
GND
-1.65V±5%
3.3V OUTPUT LOAD AC TEST CIRCUIT
V
V
DDO
Q0:Q7,
QFB
DIFFERENTIAL INPUT LEVEL
V
DDO
2
➤
tcycle
➤
n
V
DDO
2
DDO
2
tcycle n+1
Qx
2
➤
➤
V
DDO
t jit(cc) = tcycle n –tcycle n+1
Qy
2
t sk(o)
1000 Cycles
CYCLE-TO-CYCLE JITTER
OUTPUT SKEW
nPCLK
80%
80%
PCLK
Clock
Outputs
20%
20%
tR
tF
VDDO
2
t
Q0:Q7,
QFB
PD
OUTPUT RISE/FALL TIME
PROPAGATION DELAY
nPCLK
VOH
PCLK
VOL
V
DDO
Q0:Q7
QFB
2
Pulse Width
t
VOH
VDDO
PERIOD
2
FB_CLK
➤ t (Ø)
t PW
➤
odc =
VOL
tjit(Ø) = t (Ø) — t (Ø) mean = Phase Jitter
t PERIOD
(where t (Ø) is any random sample, and t (Ø) mean is the average
of the sampled cycles measured on controlled edges)
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
86953BYI-147
PHASE JITTER & STATIC PHASE OFFSET
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REV. B APRIL 23, 2004
Integrated
Circuit
Systems, Inc.
ICS86953I-147
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
Figure 1 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VDD/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
of R1 and R2 might need to be adjusted to position the V_REF in
the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
VDD
R1
1K
Single Ended Clock Input
PCLK
V_REF
nPCLK
C1
0.1u
R2
1K
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. The ICS86953I-147 provides separate power supplies to isolate any high switching noise from the
outputs to the internal PLL. VDDA and VDDO should be individually
connected to the power supply plane through vias, and bypass
capacitors should be used for each pin. To achieve optimum
jitter performance, power supply isolation is required. Figure 2
illustrates how a 10Ω resistor along with a 10µF and a .01µF
bypass capacitor should be connected to each VDDA pin.
3.3V
VDDO
.01µF
10Ω
VDDA
.01µF
10 µF
FIGURE 2. POWER SUPPLY FILTERING
86953BYI-147
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REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
PCLK/nPCLK CLOCK INPUT INTERFACE
gested here are examples only. If the driver is from another
vendor, use their termination recommendation. Please consult with the vendor of the driver component to confirm the
driver termination requirements.
The PCLK/ nPCLK accepts LVPECL, CML, SSTL and other
differential signals. Both VSWING and VOH must meet the VPP
and VCMR input requirements. Figures 3A to 3D show interface examples for the HiPerClockS PCLK/nPCLK input driven
by the most common driver types. The input interfaces sug-
2.5V
3.3V
3.3V
3.3V
2.5V
3.3V
R1
50
CML
R3
120
R2
50
Zo = 60 Ohm
SSTL
Zo = 50 Ohm
R4
120
PCLK
PCLK
Zo = 60 Ohm
Zo = 50 Ohm
nPCLK
nPCLK
HiPerClockS
PCLK/nPCLK
R1
120
FIGURE 3A. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A CML DRIVER
HiPerClockS
PCLK/nPCLK
R2
120
FIGURE 3B. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY AN SSTL IN DRIVER
3.3V
3.3V
3.3V
3.3V
3.3V
R3
125
3.3V
R4
125
Zo = 50 Ohm
Zo = 50 Ohm
C1
LVDS
R3
1K
R4
1K
PCLK
PCLK
R5
100
Zo = 50 Ohm
nPCLK
LVPECL
R1
84
nPCLK
Zo = 50 Ohm
HiPerClockS
Input
R1
1K
R2
84
FIGURE 3C. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A 3.3V LVPECL DRIVER
86953BYI-147
C2
HiPerClockS
PC L K /n PC LK
R2
1K
FIGURE 3D. HIPERCLOCKS PCLK/NPCLK INPUT DRIVEN
BY A 3.3V LVDS DRIVER
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7
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
LAYOUT GUIDELINE
depend on the selected component types, the density of the
components, the density of the traces, and the stack up of the
P.C. board.
The schematic of the ICS86953I-147 layout example is shown in
Figure 4A. The ICS86953I-147 recommended PCB board layout
for this example is shown in Figure 4B. This layout example is
used as a general guideline. The layout in the actual system will
VDD
R10
1K
R8
1K
R9
1K
R1
Zo = 50
36
VDDA
FB_CLK
nc
nc
nc
nc
GND
PCLK
nPCLK
MR/nOE
VDDO
Q7
GND
Q6
VDDO
Q5
VCC
C11
0.01u
1
2
3
4
5
6
7
8
VCO_SEL
nBYPASS
PLL_SEL
GND
QFB
VDDO
Q0
GND
U1
R7
10 - 15
C16
10u
32
31
30
29
28
27
26
25
VDD
Zo = 50 Ohm
Q1
VDDO
Q2
GND
Q3
VDDO
Q4
GND
24
23
22
21
20
19
18
17
9
10
11
12
13
14
15
16
ICS86953I-147
Zo = 50 Ohm
VDD
LVPECL Driv er
Zo = 50
R3
50
R4
50
C6 (Option)
0.1u
R5
50
R6
1K
(U1-11)
VDD
R2
(U1-15)
(U1-19)
C3
0.1uF
C2
0.1uF
36
(U1-23)
C4
0.1uF
C5
0.1uF
(U1-27)
C1
0.1uF
FIGURE 4A. ICS86953I-147 LVCMOS ZERO DELAY BUFFER SCHEMATIC EXAMPLE
86953BYI-147
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8
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
The following component footprints are used in this layout
example:
trace delay might be restricted by the available space on the board
and the component location. While routing the traces, the clock
signal traces should be routed first and should be locked prior to
routing other signal traces.
All the resistors and capacitors are size 0603.
POWER AND GROUNDING
• The 50Ω output traces should have same length.
Place the decoupling capacitors as close as possible to the power
pins. If space allows, placement of the decoupling capacitor on
the component side is preferred. This can reduce unwanted inductance between the decoupling capacitor and the power pin
caused by the via.
• Avoid sharp angles on the clock trace. Sharp angle turns
cause the characteristic impedance to change on
the transmission lines.
• Keep the clock traces on the same layer. Whenever possible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
• To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
The RC filter consisting of R7, C11, and C16 should be placed
as close to the VDDA pin as possible.
CLOCK TRACES AND TERMINATION
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital systems,
the clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
• Make sure no other signal traces are routed between the
clock trace pair.
• The series termination resistors should be located as
close to the driver pins as possible.
GND
50 Ohm
Trace
C1
R7
C16
VDD
R1
VCCA
VIA
Other
signals
U1
Pin 1
C11
C5
C4
R2
C2
C3
50 Ohm
Trace
FIGURE 4B. PCB BOARD LAYOUT FOR ICS86953I-147
86953BYI-147
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9
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
RELIABILITY INFORMATION
TABLE 7. θJAVS. AIR FLOW TABLE
FOR
32 LEAD LQFP
θJA by Velocity (Linear Feet per Minute)
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
0
200
500
67.8°C/W
47.9°C/W
55.9°C/W
42.1°C/W
50.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for ICS86953I-147 is: 1758
86953BYI-147
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10
REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - Y SUFFIX
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
FOR
32 LEAD LQFP
TABLE 8. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
BBA
SYMBOL
MINIMUM
NOMINAL
MAXIMUM
32
N
A
--
--
1.60
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.30
0.37
0.45
c
0.09
--
0.20
D
9.00 BASIC
D1
7.00 BASIC
D2
5.60 Ref.
E
9.00 BASIC
E1
7.00 BASIC
E2
5.60 Ref.
0.80 BASIC
e
L
0.45
0.60
0.75
θ
0°
--
7°
ccc
--
--
0.10
Reference Document: JEDEC Publication 95, MS-026
86953BYI-147
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REV. B APRIL 23, 2004
ICS86953I-147
Integrated
Circuit
Systems, Inc.
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
TABLE 9. ORDERING INFORMATION
Part/Order Number
Marking
Package
Count
Temperature
ICS86953BYI-147
ICS6953BI147
32 Lead LQFP
250 per tray
-40°C to 85°C
ICS86953BYIT-147
ICS6953BI147
32 Lead LQFP on Tape and Reel
1000
-40°C to 85°C
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
86953BYI-147
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12
REV. B APRIL 23, 2004
Integrated
Circuit
Systems, Inc.
ICS86953I-147
LOW SKEW, 1-TO-9
DIFFERENTIAL-TO-LVCMOS / LVTTL ZERO DELAY BUFFER
REVISION HISTORY SHEET
Rev
Table
T1
T2
Page
2
2
T2
7
8&9
2
B
B
86953BYI-147
Description of Change
Added Pullup/Pulldown to Pin 9.
Pin Characteristics table - changed CIN limit from 4pF max. to 4pF typical.
Added 5pF min. and 7pF typical to CPD.
Updated Figure 3C and 3D.
Added Layout Guideline and PCB Board layout.
Pin Characteristics Table - added ROUT row.
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13
Date
10/28/03
4/23/04
REV. B APRIL 23, 2004