ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 ISOLATED 5-V FULL AND HALF-DUPLEX RS-485 TRANSCEIVERS Check for Samples: ISO3080, ISO3086 ISO3082, ISO3088 FEATURES APPLICATIONS • • • • • • • 1 • • • • • • • • • 4000-VPEAK Isolation, 560-Vpeak VIORM – UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), IEC 61010-1, IEC 60950-1 and CSA Approved Bus-Pin ESD Protection – 16 kV HBM Between Bus Pins and GND2 – 6 kV HBM Between Bus Pins and GND1 1/8 Unit Load – Up to 256 Nodes on a Bus Meets or Exceeds TIA/EIA RS-485 Requirements Signaling Rates up to 20 Mbps Thermal Shutdown Protection Low Bus Capacitance – 16 pF (Typ) 50 kV/μs Typical Transient Immunity Fail-safe Receiver for Bus Open, Short, Idle 3.3-V Inputs are 5-V Tolerant Security Systems Chemical Production Factory Automation Motor/Motion Control HVAC and Building Automation Networks Networked Security Stations ISO3080 Full-Duplex 200 kbps ISO3086 Full-Duplex 20 Mbps ISO3082 Half-Duplex 200 kbps ISO3088 Half-Duplex 20 Mbps DESCRIPTION The ISO3080, and ISO3086 are isolated full-duplex differential line drivers and receivers while the ISO3082, and ISO3088 are isolated half-duplex differential line transceivers for TIA/EIA 485/422 applications. These devices are ideal for long transmission lines since the ground loop is broken to allow for a much larger common-mode voltage range. The symmetrical isolation barrier of the device is tested to provide 2500 Vrms of isolation for 60s between the bus-line transceiver and the logic-level interface. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the transceiver and/or near-by sensitive circuitry if they are of sufficient magnitude and duration. These isolated devices can significantly increase protection and reduce the risk of damage to expensive control circuits. The ISO3080, SO3082, ISO3086 and ISO3088 are qualified for use from –40°C to 85°C. ISO3080, ISO3086 GND1 GND1 1 2 16 15 Vcc2 GND2 3 4 5 6 7 8 14 13 12 A B Z Y GND2 11 10 9 R 3 4 RE DE 5 D 6 GALVANIC ISOLATIO N Vcc1 GND1 R RE DE D function diagram GND2 14 13 12 11 function diagram DW PACKAGE A B Z Y Vcc1 GND1 R RE DE D GND1 GND1 1 2 16 15 3 4 5 6 7 8 14 13 12 11 10 9 5 Vcc2 DE GND2 nc 6 D B 3 A R 4 nc RE GND2 GALVANIC ISOLATION DW PACKAGE ISO3082, ISO3088 13 12 B A GND2 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2009, Texas Instruments Incorporated ISO3080, ISO3086 ISO3082, ISO3088 SLOS581C – MAY 2008 – REVISED OCTOBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT –0.3 to 6 V Voltage at any bus I/O terminal –9 to 14 V Voltage input, transient pulse, A, B, Y, and Z (through 100Ω, see Figure 11) –50 to 50 V VI Voltage input at any D, DE or RE terminal –0.5 to 7 V IO Receiver output current ±10 mA VCC Input supply voltage, VO VIT (2) VCC1, VCC2 Human Body Model ESD TJ (1) (2) Electrostatic discharge JEDEC Standard 22, Test Method A114-C.01 Charged Device Model JEDEC Standard 22, Test Method C101 Machine Model ANSI/ESDS5.2-1996 Bus pins and GND1 ±6 Bus pins and GND2 ±16 All pins ±4 kV ±1 All pins Maximum junction temperature kV ±200 V 150 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values RECOMMENDED OPERATING CONDITIONS MIN (1) VCC1 Logic-side supply voltage VCC2 Bus-side supply voltage (1) VOC Voltage at either bus I/O terminal VIH High-level input voltage VIL Low-level input voltage VID Differential input voltage RL Differential input resistance Output current TJ Operating junction temperature (1) MAX UNIT 5.5 V 5.5 V –7 12 V 2 VCC 0 0.8 A with respect to B –12 12 Driver –60 60 –8 8 –40 85 4.5 A, B D, DE, RE IO TYP 3.15 5 54 Receiver V V Ω 60 mA °C For 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For 3-V operation, VCC1 is specified from 3.15 V to 3.6V. SUPPLY CURRENT over recommended operating condition (unless otherwise noted) PARAMETER ICC1 Logic-side supply current ICC2 Bus-side supply current 2 TEST CONDITIONS MIN RE at 0 V or VCC, DE at 0 V or VCC1 3.3-V VCC1 RE at 0 V or VCC, DE at 0 V or VCC1 5-V VCC1 RE at 0 V or VCC, DE at 0 V, No load Submit Documentation Feedback TYP MAX 8 10 15 UNIT mA mA Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 DRIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS IO = 0 mA, no load RL = 54 Ω, See Figure 1 | VOD | Differential output voltage magnitude Δ|VOD| Change in magnitude of the differential output voltage VOC(SS) Steady-state common-mode output voltage ΔVOC(SS) Change in steady-state common-mode output voltage VOC(pp) Peak-to-peak common-mode output voltage See Figure 3 II Input current D, DE, VI at 0 V or VCC1 RL = 100 Ω (RS-422), See Figure 1 Vtest from –7 V to +12 V, See Figure 2 High-impedance state output current IOZ See Figure 3 ISO3080 ISO3086 TYP MAX 3 4.3 VCC 1.5 2.3 2 2.3 UNIT V 1.5 See Figure 1 and Figure 2 ISO3082 ISO3088 MIN –0.2 0 0.2 1 2.6 3 –0.1 0.1 0.5 –10 V V V 10 μA See receiver input current VY or VZ = 12 V, VCC = 0 V or 5 V, DE = 0 V 1 Other input at 0 V VY or VZ = –7 V. VCC = 0 V or 5 V, DE = 0 V μA –1 VA or VB at –7 V Other input at 0 V IOS Short-circuit output current CMTI Common-mode transient immunity VI = VCC1 or 0 V, See Figure 12 VA or VB at 12 V –200 25 200 50 mA kV/μs DRIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER tPLH, tPHL Propagation delay PWD (1) Pulse skew (|tPHL – tPLH|) tr, tf Differential output signal rise and fall time tPZH, tPZL Propagation delay, high-impedance-to-high-level ouput Propagation delay, high-impendance-to-low-level output tPHZ, tPLZ Propagation delay, high-level-to-high-impedance output Propagaitin delya, low-level to high-impedance output (1) TYP MAX ISO3080/82 TEST CONDITIONS 0.7 1.3 ISO3086/88 25 45 20 200 3 7.5 0.9 1.5 μs 7 15 ns 50% Vo 2.5 7 90% Vo 1.8 ISO3080/82 See Figure 4 ISO3086/88 ISO3080/82 0.5 ISO3086/88 ISO3080/82 ISO3086/88 ISO3080/82 MIN See Figure 5 and Figure 6, DE at 0 V ISO3086/88 25 55 95 225 25 55 UNIT ns ns μs ns Also known as pulse skew Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 3 ISO3080, ISO3086 ISO3082, ISO3088 SLOS581C – MAY 2008 – REVISED OCTOBER 2009 www.ti.com RECEIVER ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS VIT(+) Positive-going input threshold voltage IO = –8 mA VIT(–) Negative-going input threshold voltage IO = 8 mA Vhys Hysteresis voltage (VIT+ – VIT–) VOH High-level output voltage MIN –200 UNIT –85 –10 mV –115 mV 30 mV VCC10.4 3.1 4 4.8 3.3-V VCC1 VID = –200 mV, IO = 8 mA, See Figure 7 3.3-V VCC1 0.15 0.4 5-V VCC1 0.15 0.4 0.04 0.1 0.06 0.13 5-V VCC1 Low-level output voltage IO(Z) High-impedance state output current VI = –7 to 12 V, Other input = 0 V –1 VA or VB = 12 V, VCC = 0 Other input at 0 V VA or VB = –7 V VA or VB = –7 V, VCC = 0 V 1 VA or VB = 12 V Bus input current MAX VID = 200 mV, IO = –8 mA, See Figure 7 VOL II TYP –0.1 –0.04 –0.05 –0.03 IIH High-level input current, RE VIH = 2 V –10 10 IIL Low-level input current, RE VIL = 0.8 V –10 10 RID Differential input resistance A, B CD Differential input capacitance Test input signal is a 1.5 MHz sine wave with 1Vpp amplitude. CD is measured across A and B. 48 V μA mA μA μA kΩ 7 pF RECEIVER SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER tPLH, tPHL PWD (1) TEST CONDITIONS MIN Propagation delay Pulse width distortion |tPHL – tPLH| See Figure 8 TYP MAX 90 125 4 12 ns tr, tf Output signal rise and fall time tPZH, tPZL Propagation delay, high-level-to-high-impedance output Propagation delay, high-impedance-to-high-level output See Figure 9, DE at 0 V 22 ns tPHZ, tPLZ Propagation delay, high-impedance-to-low-level output Propagation delay, low-level-to-high-impedance output See Figure 10, DE at 0 V 22 ns (1) 1 UNIT ns lso known as pulse skew. PARAMETER MEASUREMENT INFORMATION VCC2 VCC1 IOA DE A 0 or VCC1 VOD B 0 or3 V D B + VOD - 60 W -7 V to12 V IOB GND 2 VOB GND 2 VOA Figure 1. Driver VOD Test and Current Definitions 4 375 W A GND 1 VI GND 1 DE II Submit Documentation Feedback GND 2 375 W Figure 2. Driver VOD With Common-Mode Loading Test Circuit Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) VCC1 I OA DE 27 W A II Input B VB 27 W I OB GND2 VOC VOA VOB VOC(SS) VOC(p-p) V OC GND2 GND1 VA VOD B GND1 VI A Input Generator: PRR= 100 kHz, 50 % duty cycle, t r < 6ns , t f < 6 ns , ZO = 50 W Figure 3. Test Circuit and Waveform Definitions For The Driver Common-Mode Output Voltage DE VCC1 3V A D Input Generator B VI VOD CL = 50 pF RL = 54 W ±20% ±1% 50 W GND 1 C L includes fixture and instrumentation capacitance Generator: PRR = 100 kHz, 50 % duty cycle, t r < 6ns , t f <6 ns , ZO = 50 50% VI 50% tPHL tPLH VOD 90% 50% 10% VOD(H) 90% tr tf 50% 10% VOD(L) Figure 4. Driver Switching Test Circuit and Voltage Waveforms A 3 V if testing A output , 0 V if testing B output 3 V or 0 V D 3V S1 50 W 50% VI 50% 0V DE Input V Generator I VO CL = 50 pF ±20% CL includes fixture and instrumentation capacitance RL = 110 W ±1% tPZH 90% VO VOH 50% tPHZ ~0 V ~ GND 1 Generator PRR = 50 kHz, 50% duty cycle, tr <6ns, tf <6ns, ZO = 50 W Figure 5. Driver High-Level Output Enable and Disable Time Test Circuit and Voltage Waveforms Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 5 ISO3080, ISO3086 ISO3082, ISO3088 SLOS581C – MAY 2008 – REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 3V 0 V if testing A output , 3 V if testing B output RL = 110 W ±1% A S1 D 3V 50% VI 3 V or 0 V 0V B tPZL DE Input Generator CL = 50 pF ±20% VI 50 W 50% tPLZ VO 5V 50% CL includes fixture and instrumentation capacitance GND 2 10% VOL Generator: PRR =50 kHz ,50% duty cycle, t r< 6ns, t < 6ns, Z = 50 f Figure 6. Driver Low-Level Output Enable and Disable Time Test Circuit and Voltage Waveform IA A R VA VA+ VB 2 B VIC VB IO VID VO IB Figure 7. Receiver Voltage and Current Definitions 3 V A Input Generator VI 50 W 1.5 V RE 50% 0 V CL = 15 pF ±20% B tPHL tPLH CL includes fixture and instrumentation capacitance Generator: PRR=100 kHz, 50% duty cycle, t < 6ns, t < 6ns, ZO = 50 W r f 50% VI R VO VO 90% 50% 10% 50% tf tr V OH V OL Figure 8. Receiver Switching Test Circuit and Waveforms R VO B 0V Input Generator VCC A 1.5 V 3V 1 kW ±1% S1 CL = 15 pF ±20 % RE VI CL includes fixture and instrumentation capacitance t pHZ tPZH VO VI 50% 50% 90% V OH 50% 50 W !0 V Generator:PRR=100 kHz, 50% duty cycle , t r<6ns, t f <6ns, Z O = 50 W Figure 9. Receiver Enable Test Circuit and Waveforms, Data Output High 6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) R VO B 1.5 V Input Generator VCC A 0V VI 3V 1 kW ±1% VI S1 50% 50% CL = 15 pF ±20% RE 0V CL includes fixture and instrumentation capacitance tPZL tPLZ VCC 50% V O 50 W 10% VOL Generator: PRR =100 kHz, 50% dutycycle, tr< 6 ns, t f < 6ns, ZO= 50 W Figure 10. Receiver Enable Test Circuit and Waveforms, Data Output Low 0V A RE R B Pulse Generator 15 ms duration 1% duty cycle tr, tf £100 ns 100 W ±1% + _ D DE 3V Note:This test is conducted to test survivability only. Data stability at the R output is not specified. Figure 11. Transient Over-Voltage Test Circuit C = 0.1 mF ±1% 2V VCC1 VCC2 GND1 C = 0.1 mF ±1% A DE D 54 W S1 B VOH or VOL 0.8 V R VOH or VOL RE 1 kW GND1 GND2 CL = 15 pF (includes probe and jig capacitance) V TEST Figure 12. Half-Duplex Common-Mode Transient Immunity Test Circuit Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 7 ISO3080, ISO3086 ISO3082, ISO3088 SLOS581C – MAY 2008 – REVISED OCTOBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) C = 0.1 mF ±1% 2V VCC1 VCC2 A C = 0.1 mF ±1% DE GND1 D VOH or VOL 54 W S1 B Y 0.8 V 1.5 V or 0 V 54 W VOH or VOL RE Z 1 kW 0 V or 1.5 V GND2 GND1 CL = 15 pF (includes probe and jig capacitance) VTEST Figure 13. Full-Duplex Common-Mode Transient Immunity Test Circuit DEVICE INFORMATION Table 1. Driver Function Table VCC1 VCC2 INPUT (D) ENABLE INPUT (DE) OUTPUTS Y Z PU PU H H H L PU PU L H L H PU PU X L Z Z PU PU X OPEN Z Z PU PU OPEN H H L PD PU X X Z Z PU PD X X Z Z PD PD X X Z Z Table 2. Receiver Function Table 8 DIFFERENTIAL INPUT VID = (VA – VB) ENABLE (RE) OUTPUT (R) PU –0.01 V ≤ VID L H PU –0.2 V < VID < –0.01 V L ? PU PU VID ≤ –0.2 V L L PU PU X H Z PU PU X OPEN Z PU PU Open circuit L H VCC1 VCC2 PU PU Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 Table 2. Receiver Function Table (continued) DIFFERENTIAL INPUT VID = (VA – VB) ENABLE (RE) OUTPUT (R) PU Short Circuit L H PU Idle (terminated) bus L H PD PU X X Z PU PD X L H VCC1 VCC2 PU PU PACKAGE CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER (1) TEST CONDITIONS MIN TYP MAX UNIT L(I01) Minimum air gap (Clearance) Shortest terminal to terminal distance through air L(I02) Minimum external tracking (Creepage) Shortest terminal to terminal distance across the package surface CTI Tracking resistance (Comparative Tracking Index) DIN IEC 60112 / VDE 0303 Part 1 ≥175 V Minimum Internal Gap (Internal Clearance) Distance through the insulation 0.008 mm RIO Isolation resistance Input to output, VIO = 500 V, all pins on each side of the barrier tied together creating a two-terminal device CIO Barrier capacitance Input to output CI Input capacitance to ground (1) 8.34 mm 8.1 mm >1012 Ω VI = 0.4 sin (4E6πt) 2 pF VI = 0.4 sin (4E6πt) 2 pF Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. IEC 60664-1 RATINGS TABLE PARAMETER TEST CONDITIONS Basic isolation group Material group IIIa Rated mains voltage ≤ 150 VRMS I-IV Rated mains voltage ≤ 300 VRMS I-III Rated mains voltage ≤ 400 VRMS I-II Installation classification IEC 60747-5-2 INSULATION CHARACTERISTICS SPECIFICATION (1) over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS SPECIFICATION UNIT 560 V VIORM Maximum working insulation voltage VPR Input to output test voltage Method b1, VPR = VIORM × 1.875, 100% Production test with t = 1 s, Partial discharge < 5 pC 1050 V VIOTM Transient overvoltage t = 60 s 4000 V 9 Ω RS Insulation resistance VIO = 500 V at TS >10 Pollution degree (1) 2 Climatic Clasification 40/125/21 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 9 ISO3080, ISO3086 ISO3082, ISO3088 SLOS581C – MAY 2008 – REVISED OCTOBER 2009 www.ti.com REGULATORY INFORMATION VDE CSA UL Certified according to IEC 60747-5-2 Approved under CSA Component Acceptance Notice Recognized under 1577 Component Recognition Program (1) File Number: 40016131 File Number: 1698195 File Number: E181974 (1) Production tested ≥3000 VRMS for 1 second in accordance with UL 1577. IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER MIN IS Safety input, output, or supply current DW-16 TS Maximum case temperature DW-16 TYP θJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C MAX UNIT 210 mA 150 °C The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. THERMAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX Low-K Thermal Resistance (1) 168 High-K Thermal Resistance 96.1 UNIT θJA Junction-to-Air θJB Junction-to-Board Thermal Resistance 61 °C/W θJC Junction-to-Case Thermal Resistance 48 °C/W PD (1) 10 VCC1 = VCC2 = 5.25 V, TJ = 150°C, CL = 15 pF, Input a 20 MHz 50% duty cycle square wave Device Power Dissipation °C/W 220 mW Tested in accordance with the Low-K or High-K thermal metric defintions of EIA/JESD51-3 for leaded surface mount packages. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 150 Safety Limiting Current -- mA 125 VCC1,2 at 5.5 V 100 75 50 25 0 0 50 100 150 TC - Case Temperature - C 200 Figure 14. DW-16 θJC Thermal Derating Curve per IEC 60747-5-2 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 11 ISO3080, ISO3086 ISO3082, ISO3088 SLOS581C – MAY 2008 – REVISED OCTOBER 2009 www.ti.com EQUIVALENT CIRCUIT SCHEMATICS D and RE Input VCC1 VCC1 DE Input VCC1 VCC1 VCC1 1 MW Input 500 W 500 W Input 1 MW A Input B Input VCC 16 V VCC 16 V 36 kW 180 kW 36 kW 180 kW Input Input 16 V 36 kW 16 V 36 kW Y and Z Outputs VCC 16 V Output 16 V 5V R Output 3.3V R Output VCC1 VCC1 12 4W 5.5 W 6.4 W 11 W Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 ISO3080, ISO3086 ISO3082, ISO3088 www.ti.com SLOS581C – MAY 2008 – REVISED OCTOBER 2009 REVISION HISTORY Changes from Original (May 2008) to Revision A Page • Changed the Package Characteristics table - L(101) Minimum air gap (Clearance) From 7.7mm To 8.34mm .................. 9 • Deleted the CSA column from the Regulatory Information Table. ..................................................................................... 10 • Changed the file number in the VDE column of the Regulatory Information table From: 40014131 To: 40016131 .......... 10 Changes from Revision A (June 2008) to Revision B Page • Changed Features bullet From: 4000-VPEAK Isolation, To: 4000-VPEAK Isolation,, 560-VPEAK VIORM ..................................... 1 • Added Features sub bullet: UL 1577, IEC 60747-5-2 (VDE 0884, Rev. 2), IEC 61010-1, IEC 60950-1 and CSA Approved ............................................................................................................................................................................... 1 • Added the CSA column to the Regulatory Information table .............................................................................................. 10 Changes from Revision B (December 2008) to Revision C • Page Changed Recommended Operatings Condition table note From: For 3-V operation, VCC1 or VCC2 is specified from 3.15 V to 3.6V. To: For 3-V operation, VCC1 is specified from 3.15 V to 3.6V. ..................................................................... 2 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 13 PACKAGE OPTION ADDENDUM www.ti.com 20-Feb-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ISO3080DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO3080DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO3080DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO3080DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ISO3082DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3082DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3082DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3082DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3086DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3086DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3086DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3086DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3088DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3088DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3088DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR ISO3088DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 20-Feb-2010 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Nov-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ISO3080DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 ISO3082DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 ISO3086DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 ISO3088DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Nov-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ISO3080DWR SOIC DW 16 2000 358.0 335.0 35.0 ISO3082DWR SOIC DW 16 2000 358.0 335.0 35.0 ISO3086DWR SOIC DW 16 2000 358.0 335.0 35.0 ISO3088DWR SOIC DW 16 2000 358.0 335.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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