ONSEMI LMV321

LMV321, LMV358, LMV324
Single, Dual, Quad
Low-Voltage, Rail-to-Rail
Operational Amplifiers
The LMV321, LMV358, and LMV324 are CMOS single, dual, and
quad low voltage operational amplifiers with rail−to−rail output
swing. These amplifiers are a cost−effective solution for applications
where low power consumption and space saving packages are critical.
Specification tables are provided for operation from power supply
voltages at 2.7 V and 5 V. Rail−to−Rail operation provides improved
signal−to−noise preformance. Ultra low quiescent current makes this
series of amplifiers ideal for portable, battery operated equipment. The
common mode input range includes ground making the device useful
for low−side current−shunt measurements. The ultra small packages
allow for placement on the PCB in close proximity to the signal source
thereby reducing noise pickup.
Features
•
•
•
•
•
•
•
•
Operation from 2.7 V to 5.0 V Single−Sided Power Supply
LMV321 Single Available in Ultra Small 5 Pin SC70 Package
No Output Crossover Distortion
Industrial temperature Range: −40°C to +85°C
Rail−to−Rail Output
Low Quiescent Current: LMV358 Dual − 220 mA, Max per Channel
No Output Phase−Reversal from Overdriven Input
These are Pb−Free Devices
Typical Applications
• Notebook Computers and PDA’s
• Portable Battery−Operated Instruments
• Active Filters
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5
1
1
TSOP−5
CASE 483
SC−70
CASE 419A
1
Micro8]
CASE 846A
8
8
1
SOIC−8
CASE 751
1
UDFN8
CASE 517AJ
1
1
SOIC−14
CASE 751A
TSSOP−14
CASE 948G
ORDERING AND MARKING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
120
80
100
70
CMRR (dB)
GAIN (dB)
80
60
40
60
VS = 5 V
50
20
40
Over −40°C to +85°C
Same Gain $1.8 dB (Typ)
0
−20
10
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
Figure 1. Open Loop Frequency Response
(RL = 2 kW, TA = 255C, VS = 5 V)
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 8
30
−1
0
1
2
3
4
INPUT COMMON MODE VOLTAGE (V)
5
Figure 2. CMRR vs. Input Common Mode
Voltage
1
Publication Order Number:
LMV321/D
LMV321, LMV358, LMV324
MARKING DIAGRAMS
SC−70
Micro8
TSOP−5
8
5
V358
AYWG
G
3ACAYWG
G
AAC MG
G
1
AAC
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
1
3AC = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
V358
= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
SOIC−8
UDFN8
8
V358
ALYWX
G
AC M
G
1
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
V358
A
L
Y
W
G
AC = Specific Device Code
M = Date Code
G
= Pb−Free Package
SOIC−14
TSSOP−14
14
14
LMV
324
ALYW
LMV324
AWLYWWG
1
1
LMV324 = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
LMV324 = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
PIN CONNECTIONS
2
V−
3
+
−
−IN
IN A−
4
IN A+
2
7 OUT B
6 IN B−
3
B
+ −
OUTPUT
V−
A
− +
4
(Top View)
5 IN B+
SOIC−14
TSSOP−14
14 OUT D
OUT A
1
13 IN D−
IN A−
2
3
12 IN D+
IN A+
3
12 IN D+
4
11 V−
V+
4
11 V−
IN B+
5
10 IN C+
IN B+
5
10 IN C+
IN B−
6
OUT B
7
OUT A
1
IN A−
2
IN A+
V+
(Top View)
A
− +
+ −
V+
+IN
8 V+
1
B
D
+ −
− +
UDFN8/Micro8/SOIC−8
OUT A
5
C
(Top View)
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2
9
IN C−
IN B−
6
8
OUT C
OUT B
7
A
− +
+ −
1
B
D
+ −
− +
SC70−5/TSOP−5
C
(Top View)
14 OUT D
13 IN D−
9
IN C−
8
OUT C
LMV321, LMV358, LMV324
MAXIMUM RATINGS
Symbol
VS
Rating
Supply Voltage (Operating Range VS = 2.7 V to 5.5 V)
Value
Unit
5.5
V
VIDR
Input Differential Voltage
$Supply Voltage
V
VICR
Input Common Mode Voltage Range
−0.5 to (V+) + 0.5
V
10
mA
Maximum Input Current
tSo
Output Short Circuit (Note 1)
TJ
Maximum Junction Temperature (Operating Range −40°C to 85°C)
qJA
Thermal Resistance:
Tstg
Continuous
°C
°C/W
SC−70
280
Micro8
238
TSOP−5
333
UDFN8 (1.2 mm x 1.8 mm x 0.5 mm)
350
SOIC−8
212
SOIC−14
156
TSSOP−14
190
Storage Temperature
Mounting Temperature (Infrared or Convection −20 sec)
VESD
150
ESD Tolerance
LMV321
Machine Model
Human Body Model
LMV358/324
Machine Model
Human Body Mode
−65 to 150
°C
235
°C
V
100
1000
100
2000
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may
affect device reliability.
1. Continuous short−circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of 45 mA over long term may adversely affect reliability. Shorting output to either V+
or V− will adversely affect reliability.
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3
LMV321, LMV358, LMV324
2.7 V DC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 2.7 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter
Input Offset Voltage
Input Offset Voltage Average Drift
Input Bias Current
Input Offset Current
Symbol
Condition
VIO
Min
Typ
Max
Unit
TA = −40°C to +85°C
1.7
9
mV
ICVOS
TA = −40°C to +85°C
5
mV/°C
IB
TA = −40°C to +85°C
<1
nA
IIO
TA = −40°C to +85°C
<1
nA
Common Mode Rejection Ratio
CMRR
0 V v VCM v 1.7 V
50
63
dB
Power Supply Rejection Ratio
PSRR
2.7 V v V+ v 5 V,
VO = 1 V
50
60
dB
Input Common−Mode Voltage Range
VCM
For CMRR w 50 dB
0 to 1.7
−0.2 to 1.9
V
Output Swing
VOH
RL = 10 kW to 1.35 V
VCC − 100
VCC − 10
mV
VOL
RL = 10 kW to 1.35 V (Note 2)
Supply Current
LMV321
LMV358 (Both Amplifiers)
LMV324 (4 Amplifiers)
ICC
60
180
mV
80
140
260
185
340
680
mA
2.7 V AC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 2.7 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter
Gain Bandwidth Product
Symbol
Condition
GBWP
CL = 200 pF
Phase Margin
Qm
Gain Margin
Gm
Input−Referred Voltage Noise
en
f = 50 kHz
2. Guaranteed by design and/or characterization.
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4
Min
Typ
Max
Unit
1
MHz
60
°
10
dB
50
nV/√Hz
LMV321, LMV358, LMV324
5.0 V DC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5.0 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter
Input Offset Voltage
Input Offset Voltage Average Drift
Input Bias Current (Note 3)
Symbol
Condition
VIO
TCVIO
Min
Typ
Max
Unit
TA = −40°C to +85°C
1.7
9
mV
TA = −40°C to +85°C
5
mV/°C
<1
nA
<1
nA
IB
TA = −40°C to +85°C
Input Offset Current (Note 3)
IIO
TA = −40°C to +85°C
Common Mode Rejection Ratio
CMRR
0 V v VCM v 4 V
50
65
dB
Power Supply Rejection Ratio
PSRR
2.7 V v V+ v 5 V,
VO = 1 V, VCM = 1 V
50
60
dB
VCM
For CMRR w 50 dB
0 to 4
−0.2 to 4.2
V
AV
RL = 2 kW
15
100
V/mV
TA = −40°C to +85°C
10
VOH
RL = 2 kW to 2.5 V
TA = −40°C to +85°C
VCC − 300
VCC − 400
VCC − 40
V
VOL
RL = 2 kW to 2.5 V (Note 3)
TA = −40°C to +85°C
VOH
RL = 10 kW to 2.5 V (Note 3)
TA = −40°C to +85°C
VOL
RL = 10 kW to 2.5 V
TA = −40°C to +85°C
Output Short Circuit Current
IO
Sourcing = VO = 0 V (Note 3)
Sinking = VO = 5 V (Note 3)
Supply Current
ICC
LMV321
TA = −40°C to +85°C
130
250
350
LMV358 Both Amplifiers
TA = −40°C to +85°C
210
440
615
LMV324 All Four Amplifiers
TA = −40°C to +85°C
410
830
1160
Input Common−Mode Voltage Range
Large Signal Voltage Gain (Note 3)
Output Swing
120
300
400
VCC − 100
VCC − 200
V
65
10
10
mV
180
280
60
160
mV
mA
mA
5.0 V AC ELECTRICAL CHARACTERISTICS (Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5.0 V,
RL = 1 MW, V− = 0 V, VO = V+/2)
Parameter
Slew Rate
Gain Bandwidth Product
Symbol
Condition
SR
GBWP
CL = 200 pF
Min
Typ
Max
Unit
1
V/ms
1
MHz
Phase Margin
Qm
60
°
Gain Margin
Gm
10
dB
Input−Referred Voltage Noise
en
50
nV/√Hz
f = 50 kHz
3. Guaranteed by design and/or characterization.
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5
LMV321, LMV358, LMV324
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
120
170
100
150
PHASE MARGIN (°)
GAIN (dB)
80
60
40
20
0
−20
10
Over −40°C to +85°C
Same Gain $1.8 dB (Typ)
110
90
70
50
30
1k
10k
100k
FREQUENCY (Hz)
100
130
1M
10
10M
10
90
75
80
70
70
65
60
60
CMRR (dB)
CMRR (dB)
80
50
40
55
100k
1M
10M
45
20
40
10
35
10k
30
−0.5
100k
VS = 2.7 V
f = 10 kHz
50
30
1k
10k
Figure 4. Open Loop Phase Margin
(RL = 2 kW, TA = 255C, VS = 5 V)
100
100
1k
FREQUENCY (Hz)
Figure 3. Open Loop Frequency Response
(RL = 2 kW, TA = 255C, VS = 5 V)
0
10
100
0
0.5
1
1.5
2
2.5
FREQUENCY (Hz)
INPUT COMMON MODE VOLTAGE (V)
Figure 5. CMRR vs. Frequency
(RL = 5 kW, VS = 5 V)
Figure 6. CMRR vs. Input Common Mode
Voltage
80
3
100
90
70
80
60
PSRR (dB)
CMRR (dB)
70
VS = 5 V
f = 10 kHz
50
60
50
40
30
20
40
10
30
−1
0
1
2
3
4
0
1k
5
10k
100k
1M
INPUT COMMON MODE VOLTAGE (V)
FREQUENCY (Hz)
Figure 7. CMRR vs. Input Common Mode
Voltage
Figure 8. PSRR vs. Frequency
(RL = 5 kW, VS = 2.7 V, +PSRR)
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6
10M
LMV321, LMV358, LMV324
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
90
100
80
90
70
80
70
PSRR (dB)
PSRR (dB)
60
50
40
30
60
50
40
30
20
20
10
10
0
1k
10k
100k
1M
0
1k
10M
10k
FREQUENCY (Hz)
90
80
4
70
3.5
60
3
VOS (mV)
PSRR (dB)
5
4.5
50
40
2.5
2
30
1.5
20
1
10
0.5
10k
100k
1M
0
10M
VS = 2.7 V
0
0.5
FREQUENCY (Hz)
200
180
4
160
SUPPLY CURRENT (mA)
5
3.5
VOS (mV)
1.5
2
2.5
3
Figure 12. VOS vs CMR
4.5
3
2.5
2
1.5
VS = 5.0 V
0.5
0
1
VCM (V)
Figure 11. PSRR vs. Frequency
(RL = 5 kW, VS = 5 V, −PSRR)
1
10M
Figure 10. PSRR vs. Frequency
(RL = 5 kW, VS = 5 V, +PSRR)
100
1k
1M
FREQUENCY (Hz)
Figure 9. PSRR vs. Frequency
(RL = 5 kW, VS = 2.7 V, −PSRR)
0
100k
140
120
100
80
60
40
20
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0
0
5
0.5
1
1.5
2
2.5
3
3.5
4
4.5
VCM (V)
SUPPLY VOLTAGE (V)
Figure 13. VOS vs CMR
Figure 14. Supply Current vs. Supply Voltage
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7
5
LMV321, LMV358, LMV324
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
1
0
VOUT REFERENCED TO V+ (V)
RL = 10 kW
Vout = 1 VPP
Av = +1
(%)
0.1
0.01
100
1k
10k
−0.03
−0.04
−0.05
−0.06
−0.07
−0.08
−0.09
−0.1
2.5
4.5
5
Figure 16. Output Voltage Swing vs Supply
Voltage (RL = 10k)
−20
0.08
0.07
0.06
0.05
0.04
0.03
0.02
3
3.5
4
SUPPLY VOLTAGE (V)
−60
−80
−100
−120
−140
Negative Swing
0.01
−40
4.5
−160
5
0
−20
100
SOURCE CURRENT (mA)
120
−40
−60
−80
−100
2
3
4
1
1.5
2
2.5
Figure 18. Sink Current vs. Output Voltage
VS = 2.7 V
0
1
0.5
VOUT REFERENCED TO V− (V)
Figure 17. Output Voltage Swing vs Supply
Voltage (RL = 10k)
SINK CURRENT (mA)
4
Figure 15. THD+N vs Frequency
0.09
0
3.5
SUPPLY VOLTAGE (V)
0
−120
3
(Hz)
0.1
0
2.5
Positive Swing
−0.02
100k
SINK CURRENT (mA)
VOUT REFERENCED TO V− (V)
0.001
10
−0.01
80
60
40
20
0
5
VOUT REFERENCED TO V− (V)
0
0.5
1.0
1.5
2.0
VOUT REFERENCED TO V+ (V)
Figure 19. Sink Current vs. Output Voltage
VS = 5.0 V
Figure 20. Source Current vs. Output Voltage
VS = 2.7 V
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8
2.5
LMV321, LMV358, LMV324
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
110
RL = 2 kW
AV = 1
50 mV/div
2 ms/div
SOURCE CURRENT (mA)
100
90
80
70
60
50
40
30
20
10
0
0
1
2
3
4
VOUT REFERENCED TO V+ (V)
5
Figure 21. Source Current vs. Output Voltage
VS = 5.0 V
Figure 22. Settling Time vs. Capacitive Load
50 mV/div
2 ms/div
RL = 1 MW
AV = 1
50 mV/div
2 ms/div
Non−Inverting (G = +1)
Input
Output
Figure 23. Settling Time vs. Capacitive Load
Figure 24. Step Response − Small Signal
50 mV/div
2 ms/div
1 V/div
2 ms/div
Non−Inverting (G = +1)
Inverting (G = −1)
Input
Input
Output
Output
Figure 26. Step Response − Large Signal
Figure 25. Step Response − Small Signal
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9
LMV321, LMV358, LMV324
TYPICAL CHARACTERISTICS
(TA = 25°C and VS = 5 V unless otherwise specified)
1 V/div
2 ms/div
Inverting (G = −1)
Input
Output
Figure 27. Step Response − Large Signal
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10
LMV321, LMV358, LMV324
APPLICATIONS
50 k
R1
5.0 k
VCC
VCC
R2
10 k
MC1403
2.5 V
VO
LMV321
VO
LMV321
VCC
−
Vref
−
+
+
1
V ref + V CC
2
R1
V O + 2.5 V(1 )
)
R2
R
R
Figure 28. Voltage Reference
fO +
C
C
1
2pRC
For: fo = 1.0 kHz
R = 16 kW
C = 0.01 mF
Figure 29. Wien Bridge Oscillator
VCC
C
R1
Vin
R2
C
R3
−
Hysteresis
Vin
R1
+
R2
VOH
Vref
LMV321
−
VO
VOL
VO
CO = 10 C
Vref
VO
+
CO
LMV321
VinL
Given: fo = center frequency
A(fo) = gain at center frequency
VinH
Choose value fo, C
Q
Then : R3 +
pf O C
Vref
R1
(V OL * V ref) ) V ref
R1 ) R2
R1
V inH +
(V OH * V ref) ) V ref
R1 ) R2
R1
H+
(V OH * V OL)
R1 ) R2
V inL +
R1 +
R2 +
R3
2 A(f O)
R1 R3
4Q 2 R1 * R3
Figure 30. Comparator with Hysteresis
For less than 10% error from operational amplifier,
((QO fO)/BW) < 0.1 where fo and BW are expressed in Hz.
If source impedance varies, filter may be preceded with
voltage follower buffer to stabilize filter parameters.
Figure 31. Multiple Feedback Bandpass Filter
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11
LMV321, LMV358, LMV324
ORDERING INFORMATION
Number
of
Channels
Specific Device Marking
Package Type
Shipping†
LMV321SQ3T2G
Single
AAC
SC−70
(Pb−Free)
3000 / Tape & Reel
LMV321SN3T1G*
Single
3AC
TSOP−5
(Pb−Free)
3000 / Tape & Reel
LMV358DMR2G
Dual
V358
Micro8
(Pb−Free)
4000 / Tape & Reel
LMV358MUTAG
Dual
AC
UDFN8
(Pb−Free)
3000 / Tape & Reel
LMV358DR2G
Dual
V358
SOIC−8
(Pb−Free)
2500 / Tape & Reel
LMV324DR2G
Quad
LMV324
SOIC−14
(Pb−Free)
2500 / Tape & Reel
LMV324DTBR2G
Quad
LMV
324
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
Order Number
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Contact factory.
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12
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
K
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13
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE H
D 5X
NOTE 5
2X
0.10 T
2X
0.20 T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
M
5
1
4
2
L
3
B
S
K
DETAIL Z
G
A
DIM
A
B
C
D
G
H
J
K
L
M
S
DETAIL Z
J
C
0.05
SEATING
PLANE
H
T
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
1.25
1.55
0_
10 _
2.50
3.00
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
Micro8™
CASE 846A−02
ISSUE H
D
HE
PIN 1 ID
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
E
e
b 8 PL
0.08 (0.003)
T B
M
S
A
DIM
A
A1
b
c
D
E
e
L
HE
S
SEATING
−T− PLANE
0.038 (0.0015)
A
A1
MILLIMETERS
NOM
MAX
−−
1.10
0.08
0.15
0.33
0.40
0.18
0.23
3.00
3.10
3.00
3.10
0.65 BSC
0.40
0.55
0.70
4.75
4.90
5.05
MIN
−−
0.05
0.25
0.13
2.90
2.90
L
c
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
3.20
0.126
6X
8X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
15
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.016
0.021
0.187
0.193
MIN
−−
0.002
0.010
0.005
0.114
0.114
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AJ
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
S
M
J
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
16
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
UDFN8 1.8x1.2, 0.4P
CASE 517AJ−01
ISSUE O
PIN ONE
REFERENCE
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH MAY
NOT EXCEED 0.03 ONTO BOTTOM
SURFACE OF TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
A B
D
0.10 C
L1
E
DETAIL A
NOTE 5
TOP VIEW
(A3)
0.05 C
DIM
A
A1
A3
b
b2
D
E
e
L
L1
L2
A
0.05 C
SIDE VIEW
e/2
(b2)
A1
e
1
C
SEATING
PLANE
DETAIL A
8X
L
4
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
0.30 REF
1.80 BSC
1.20 BSC
0.40 BSC
0.45
0.55
0.00
0.03
0.40 REF
MOUNTING FOOTPRINT*
SOLDERMASK DEFINED
(L2)
8
5
BOTTOM VIEW
8X
8X b
0.66
7X
0.10
M
C A B
0.05
M
C
0.22
NOTE 3
1.50
1
0.32
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
0.25 (0.010)
M
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
D 14 PL
F
R X 45 _
C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
18
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
LMV321, LMV358, LMV324
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
T U
M
V
S
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
DETAIL E
K
A
−V−
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
19
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
−−−
1.20
−−− 0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
LMV321, LMV358, LMV324
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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20
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LMV321/D