LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 FEATURES • • • • • • D OR PW PACKAGE (TOP VIEW) Excellent Temperature Stability Initial Tolerance…0.2% Max Dynamic Impedance…0.6 Ω Max Wide Operating Current Range Directly Interchangeable With LM136 Needs No Adjustment for Minimum Temperature Coefficient NC NC NC ANODE 1 8 2 7 3 6 4 5 CATHODE NC CATHODE ADJ NC − No internal connection DESCRIPTION/ORDERING INFORMATION LP PACKAGE (TOP VIEW) The LT1009 reference circuit is a precision-trimmed 2.5-V shunt regulator featuring low dynamic impedance and a wide operating current range. The maximum initial tolerance is ±5 mV in the LP package and ±10 mV in the D package. The reference tolerance is achieved by on-chip trimming, which minimizes the initial voltage tolerance and the temperature coefficient, αVZ. ANODE CATHODE ADJ <br/> Although the LT1009 needs no adjustments, a third terminal (ADJ) allows the reference voltage to be adjusted ±5% to eliminate system errors. In many applications, the LT1009 can be used as a terminal-for-terminal replacement for the LM136-2.5, which eliminates the external trim network. The LT1009 uses include 5-V system references, 8-bit analog-to-digital converter (ADC) and digital-to-analog converter (DAC) references, and power-supply monitors. The device also can be used in applications such as digital voltmeters and current-loop measurement and control systems. The LT1009C is characterized for operation from 0°C to 70°C. The LT1009I is characterized for operation from –40°C to 85°C. ORDERING INFORMATION PACKAGE (1) TA SOIC – D 0°C to 70°C TO-226/TO-92 – LP TSSOP – PW SOIC – D –40°C to 85°C TO-226/TO-92 – LP TSSOP – PW (1) ORDERABLE PART NUMBER Tube of 75 LT1009CD Reel of 2500 LT1009CDR Bulk of 1000 LT1009CLP Ammo of 2000 LT1009CLPM Reel of 2000 LT1009CLPR Tube of 150 LT1009CPW Reel of 2000 LT1009CPWR Tube of 75 LT1009ID Reel of 2500 LT1009IDR Bulk of 1000 LT1009ILP Ammo of 2000 LT1009ILPM Reel of 2000 LT1009ILPR Tube of 150 LT1009IPW Reel of 2000 LT1009IPWR TOP-SIDE MARKING 1009C LT1009C 1009C 1009I LT1009I 1009I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1987–2005, Texas Instruments Incorporated LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 SYMBOL ANODE CATHODE ADJ SCHEMATIC CATHODE Q14 Q11 24 kΩ 24 kΩ 6.6 kΩ Q8 20 pF Q7 30 pF Q10 10 kΩ 500 Ω Q2 Q9 Q4 30 kΩ ADJ Q1 6.6 kΩ Q6 Q3 Q12 Q5 720 Ω Q13 ANODE NOTE: All component values shown are nominal. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT IR Reverse current 20 mA IF Forward current 10 mA θJA Package thermal impedance (2) (3) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) 2 D package 97 LP package 140 PW package 149 –65 °C/W 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 Recommended Operating Conditions TA MIN MAX 0 70 –40 85 LT1009C Operating free-air temperature range LT1009I UNIT °C Electrical Characteristics at specified free-air temperature PARAMETER TEST CONDITIONS D package VZ Reference voltage IZ = 1 mA LP package D package LP package VF Forward voltage Adjustment range IF = 2 mA IZ = 1 mA, VADJ = GND to VZ IZ = 1 mA, VADJ = 0.6 V to VZ – 0.6 V ∆VZ(temp) Change in reference voltage with temperature αVZ Average temperature coefficient of reference voltage (2) ∆VZ Change in reference voltage with current IZ = 400 µA to 10 mA ∆VZ/∆t Long-term change in reference voltage IZ = 1 mA ZZ Reference impedance IZ = 1 mA (1) (2) TA (1) 25°C Full range 25°C LT1009C TYP 2.49 2.5 2.495 2.5 2.485 2.515 2.475 2.525 2.491 2.509 2.48 2.52 0.4 1 0.4 1 MAX MIN TYP 2.51 2.49 2.5 2.51 2.505 2.495 2.5 2.505 125 125 45 45 MAX 25°C Full range 0°C to 70°C 15 5 15 4 15 25 –40°C to 85°C 25°C 20 2.6 Full range 10 2.6 12 25°C 20 25°C 0.3 Full range UNIT V V mV D package LP package LT1009I MIN 35 6 10 1 0.3 ppm/ °C mV ppm/ khr 20 1.4 mV 1 1.4 Ω Full range is 0°C to 70°C for the LT1009C and –40°C to 85°C for the LT1009I. The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range. 3 LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 TYPICAL CHARACTERISTICS Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. REFERENCE VOLTAGE vs FREE-AIR TEMPERATURE CHANGE IN REFERENCE VOLTAGE vs REFERENCE CURRENT 2.53 5 ∆V Z − Change in Reference Voltage − mV Iz = 1 mA V Z − Reference Voltage − V 2.52 2.51 2.5 2.49 2.48 2.47 −50 4 3 2 1 0 −25 0 25 50 75 100 TA − Free-Air Temperature − °C 125 0 4 8 12 16 IZ − Reference Current − mA Figure 1. Figure 2. REVERSE CURRENT vs REVERSE VOLTAGE FORWARD VOLTAGE vs FORWARD CURRENT 20 1.2 10−1 TJ = 25°C 1 V F − Forward Voltage − V I R − Reverse Current − A 10−2 10−3 TJ = 125°C 10−4 TJ = −55°C 0.6 1 1.4 1.8 2.2 VR − Reverse Voltage − V Figure 3. 4 0.6 0.4 0.2 TJ = 25°C 10−5 0.8 2.6 0 0.001 0.01 0.1 1 IF − Forward Current − mA Figure 4. 10 LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 TYPICAL CHARACTERISTICS (continued) REFERENCE IMPEDANCE vs FREQUENCY NOISE VOLTAGE vs FREQUENCY 100 250 Iz = 1 mA TJ = 25°C V n − Noise Voltage − nV/ Hz 200 10 1 0.1 10 100 1k 10k f − Frequency − Hz 150 100 50 10 100k 100 Figure 5. 1k f − Frequency − Hz 10k 100k Figure 6. TRANSIENT RESPONSE 3.5 3 Output 2.5 Input and Output Voltages − V ZZ − Reference Impedance − Ω Iz = 1 mA TJ = −55°C to 125°C 2 1.5 1 0.5 5 kΩ Input 0 Output 8 Input 4 0 0 1 20 t − Time − µs Figure 7. 5 LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 APPLICATION INFORMATION 5 V to 35 V 3.6 kΩ Output 10-kΩ Trim (see Note A) LT1009 A. This does not affect temperature coefficient. It provides ±5% trim range. Figure 8. 2.5-V Reference 3.6 V to 40 V V+ LM334 R V− 62 Ω Output LT1009 10 kΩ Figure 9. Adjustable Reference With Wide Supply Range LT1084 VI 10 µF IN ADJ OUT VO 10 µF 1.2 kΩ 374 Ω LT1009 2 kΩ Figure 10. Power Regulator With Low Temperature Coefficient 6 LT1009 2.5-V INTEGRATED REFERENCE CIRCUIT www.ti.com SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005 APPLICATION INFORMATION (continued) 5V 5.1 kΩ 5V 5.1 kΩ LT1009 10 kΩ 1% −5 V Output 9.76 kΩ 1% 500 Ω 5 kΩ −5 V Figure 11. Switchable ±1.25-V Bipolar Reference 1 µF 10 kΩ VI ≥ 6 V 1 kΩ − 10 kΩ 2.5 V 1 kΩ + + 100 kΩ LT1009 + LT1001C 20 µF 20 µF Figure 12. Low-Noise 2.5-V Buffered Reference 7 PACKAGE OPTION ADDENDUM www.ti.com 21-Sep-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LT1009CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CLP ACTIVE TO-92 LP 3 1000 TBD CU SNPB Level-NC-NC-NC LT1009CLPM ACTIVE TO-92 LP 3 2000 TBD CU SNPB Level-NC-NC-NC 2000 TBD CU SNPB Level-NC-NC-NC TBD Call TI Lead/Ball Finish MSL Peak Temp (3) LT1009CLPR ACTIVE TO-92 LP 3 LT1009CPK OBSOLETE SOT-89 PK 3 LT1009CPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Call TI LT1009ILP ACTIVE TO-92 LP 3 1000 TBD CU SNPB Level-NC-NC-NC LT1009ILPR ACTIVE TO-92 LP 3 2000 TBD CU SNPB Level-NC-NC-NC LT1009IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009QDR OBSOLETE SOIC D 8 TBD Call TI Call TI LT1009Y OBSOLETE XCEPT Y 0 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Sep-2005 OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LT1009CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009CLPM ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009CLPME3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009CLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009CLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009CPK OBSOLETE SOT-89 PK 3 TBD Call TI Call TI LT1009CPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009ILP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009ILPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009ILPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009ILPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type LT1009IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LT1009IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LT1009QDR OBSOLETE SOIC D 8 TBD Call TI Call TI LT1009Y OBSOLETE XCEPT Y 0 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001 LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE 0.205 (5,21) 0.175 (4,44) 0.165 (4,19) 0.125 (3,17) DIA 0.210 (5,34) 0.170 (4,32) Seating Plane 0.157 (4,00) MAX 0.050 (1,27) C 0.500 (12,70) MIN 0.104 (2,65) FORMED LEAD OPTION 0.022 (0,56) 0.016 (0,41) 0.016 (0,41) 0.014 (0,35) STRAIGHT LEAD OPTION D 0.135 (3,43) MIN 0.105 (2,67) 0.095 (2,41) 0.055 (1,40) 0.045 (1,14) 1 2 3 0.105 (2,67) 0.080 (2,03) 0.105 (2,67) 0.080 (2,03) 4040001-2 /C 10/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Lead dimensions are not controlled within this area D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92) E. Shipping Method: Straight lead option available in bulk pack only. Formed lead option available in tape & reel or ammo pack. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001 LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE 0.539 (13,70) 0.460 (11,70) 1.260 (32,00) 0.905 (23,00) 0.650 (16,50) 0.610 (15,50) 0.020 (0,50) MIN 0.098 (2,50) 0.384 (9,75) 0.335 (8,50) 0.748 (19,00) 0.217 (5,50) 0.433 (11,00) 0.335 (8,50) 0.748 (19,00) 0.689 (17,50) 0.114 (2,90) 0.094 (2,40) 0.114 (2,90) 0.094 (2,40) 0.169 (4,30) 0.146 (3,70) DIA 0.266 (6,75) 0.234 (5,95) 0.512 (13,00) 0.488 (12,40) TAPE & REEL 4040001-3 /C 10/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Tape and Reel information for the Format Lead Option package. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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