TI LT1009

LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
FEATURES
•
•
•
•
•
•
D OR PW PACKAGE
(TOP VIEW)
Excellent Temperature Stability
Initial Tolerance…0.2% Max
Dynamic Impedance…0.6 Ω Max
Wide Operating Current Range
Directly Interchangeable With LM136
Needs No Adjustment for Minimum
Temperature Coefficient
NC
NC
NC
ANODE
1
8
2
7
3
6
4
5
CATHODE
NC
CATHODE
ADJ
NC − No internal connection
DESCRIPTION/ORDERING INFORMATION
LP PACKAGE
(TOP VIEW)
The LT1009 reference circuit is a precision-trimmed
2.5-V shunt regulator featuring low dynamic
impedance and a wide operating current range. The
maximum initial tolerance is ±5 mV in the LP package
and ±10 mV in the D package. The reference
tolerance is achieved by on-chip trimming, which
minimizes the initial voltage tolerance and the
temperature coefficient, αVZ.
ANODE
CATHODE
ADJ
<br/>
Although the LT1009 needs no adjustments, a third terminal (ADJ) allows the reference voltage to be adjusted
±5% to eliminate system errors. In many applications, the LT1009 can be used as a terminal-for-terminal
replacement for the LM136-2.5, which eliminates the external trim network.
The LT1009 uses include 5-V system references, 8-bit analog-to-digital converter (ADC) and digital-to-analog
converter (DAC) references, and power-supply monitors. The device also can be used in applications such as
digital voltmeters and current-loop measurement and control systems.
The LT1009C is characterized for operation from 0°C to 70°C. The LT1009I is characterized for operation from
–40°C to 85°C.
ORDERING INFORMATION
PACKAGE (1)
TA
SOIC – D
0°C to 70°C
TO-226/TO-92 – LP
TSSOP – PW
SOIC – D
–40°C to 85°C
TO-226/TO-92 – LP
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Tube of 75
LT1009CD
Reel of 2500
LT1009CDR
Bulk of 1000
LT1009CLP
Ammo of 2000
LT1009CLPM
Reel of 2000
LT1009CLPR
Tube of 150
LT1009CPW
Reel of 2000
LT1009CPWR
Tube of 75
LT1009ID
Reel of 2500
LT1009IDR
Bulk of 1000
LT1009ILP
Ammo of 2000
LT1009ILPM
Reel of 2000
LT1009ILPR
Tube of 150
LT1009IPW
Reel of 2000
LT1009IPWR
TOP-SIDE MARKING
1009C
LT1009C
1009C
1009I
LT1009I
1009I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1987–2005, Texas Instruments Incorporated
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
SYMBOL
ANODE
CATHODE
ADJ
SCHEMATIC
CATHODE
Q14
Q11
24 kΩ
24 kΩ
6.6 kΩ
Q8
20 pF
Q7
30 pF
Q10
10 kΩ
500 Ω
Q2
Q9
Q4
30 kΩ
ADJ
Q1
6.6 kΩ
Q6
Q3
Q12
Q5
720 Ω
Q13
ANODE
NOTE: All component values shown are nominal.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
IR
Reverse current
20
mA
IF
Forward current
10
mA
θJA
Package thermal impedance (2) (3)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
2
D package
97
LP package
140
PW package
149
–65
°C/W
150
°C
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
Recommended Operating Conditions
TA
MIN
MAX
0
70
–40
85
LT1009C
Operating free-air temperature range
LT1009I
UNIT
°C
Electrical Characteristics
at specified free-air temperature
PARAMETER
TEST CONDITIONS
D package
VZ
Reference voltage
IZ = 1 mA
LP package
D package
LP package
VF
Forward voltage
Adjustment range
IF = 2 mA
IZ = 1 mA,
VADJ = GND to VZ
IZ = 1 mA,
VADJ = 0.6 V to VZ – 0.6 V
∆VZ(temp)
Change in
reference voltage
with temperature
αVZ
Average temperature
coefficient of
reference voltage (2)
∆VZ
Change in reference
voltage with current
IZ = 400 µA to 10 mA
∆VZ/∆t
Long-term change in
reference voltage
IZ = 1 mA
ZZ
Reference impedance IZ = 1 mA
(1)
(2)
TA (1)
25°C
Full range
25°C
LT1009C
TYP
2.49
2.5
2.495
2.5
2.485
2.515
2.475
2.525
2.491
2.509
2.48
2.52
0.4
1
0.4
1
MAX
MIN
TYP
2.51
2.49
2.5
2.51
2.505
2.495
2.5
2.505
125
125
45
45
MAX
25°C
Full range
0°C to 70°C
15
5
15
4
15
25
–40°C to 85°C
25°C
20
2.6
Full range
10
2.6
12
25°C
20
25°C
0.3
Full range
UNIT
V
V
mV
D package
LP package
LT1009I
MIN
35
6
10
1
0.3
ppm/
°C
mV
ppm/
khr
20
1.4
mV
1
1.4
Ω
Full range is 0°C to 70°C for the LT1009C and –40°C to 85°C for the LT1009I.
The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified
temperature range.
3
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of
the various devices.
REFERENCE VOLTAGE
vs
FREE-AIR TEMPERATURE
CHANGE IN REFERENCE VOLTAGE
vs
REFERENCE CURRENT
2.53
5
∆V Z − Change in Reference Voltage − mV
Iz = 1 mA
V Z − Reference Voltage − V
2.52
2.51
2.5
2.49
2.48
2.47
−50
4
3
2
1
0
−25
0
25
50
75
100
TA − Free-Air Temperature − °C
125
0
4
8
12
16
IZ − Reference Current − mA
Figure 1.
Figure 2.
REVERSE CURRENT
vs
REVERSE VOLTAGE
FORWARD VOLTAGE
vs
FORWARD CURRENT
20
1.2
10−1
TJ = 25°C
1
V F − Forward Voltage − V
I R − Reverse Current − A
10−2
10−3
TJ = 125°C
10−4
TJ = −55°C
0.6
1
1.4
1.8
2.2
VR − Reverse Voltage − V
Figure 3.
4
0.6
0.4
0.2
TJ = 25°C
10−5
0.8
2.6
0
0.001
0.01
0.1
1
IF − Forward Current − mA
Figure 4.
10
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
REFERENCE IMPEDANCE
vs
FREQUENCY
NOISE VOLTAGE
vs
FREQUENCY
100
250
Iz = 1 mA
TJ = 25°C
V n − Noise Voltage − nV/ Hz
200
10
1
0.1
10
100
1k
10k
f − Frequency − Hz
150
100
50
10
100k
100
Figure 5.
1k
f − Frequency − Hz
10k
100k
Figure 6.
TRANSIENT RESPONSE
3.5
3
Output
2.5
Input and Output Voltages − V
ZZ − Reference Impedance − Ω
Iz = 1 mA
TJ = −55°C to 125°C
2
1.5
1
0.5
5 kΩ
Input
0
Output
8
Input
4
0
0
1
20
t − Time − µs
Figure 7.
5
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
APPLICATION INFORMATION
5 V to 35 V
3.6 kΩ
Output
10-kΩ
Trim
(see Note A)
LT1009
A.
This does not affect temperature coefficient. It provides ±5% trim range.
Figure 8. 2.5-V Reference
3.6 V to 40 V
V+
LM334 R
V−
62 Ω
Output
LT1009
10 kΩ
Figure 9. Adjustable Reference With Wide Supply Range
LT1084
VI
10 µF
IN
ADJ
OUT
VO
10 µF
1.2 kΩ
374 Ω
LT1009
2 kΩ
Figure 10. Power Regulator With Low Temperature Coefficient
6
LT1009
2.5-V INTEGRATED REFERENCE CIRCUIT
www.ti.com
SLVS013L – MAY 1987 – REVISED SEPTEMBER 2005
APPLICATION INFORMATION (continued)
5V
5.1 kΩ
5V
5.1 kΩ
LT1009
10 kΩ
1%
−5 V
Output
9.76 kΩ
1%
500 Ω
5 kΩ
−5 V
Figure 11. Switchable ±1.25-V Bipolar Reference
1 µF
10 kΩ
VI ≥ 6 V
1 kΩ
−
10 kΩ
2.5 V
1 kΩ
+
+
100 kΩ
LT1009
+
LT1001C
20 µF
20 µF
Figure 12. Low-Noise 2.5-V Buffered Reference
7
PACKAGE OPTION ADDENDUM
www.ti.com
21-Sep-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LT1009CD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CLP
ACTIVE
TO-92
LP
3
1000
TBD
CU SNPB
Level-NC-NC-NC
LT1009CLPM
ACTIVE
TO-92
LP
3
2000
TBD
CU SNPB
Level-NC-NC-NC
2000
TBD
CU SNPB
Level-NC-NC-NC
TBD
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
LT1009CLPR
ACTIVE
TO-92
LP
3
LT1009CPK
OBSOLETE
SOT-89
PK
3
LT1009CPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Call TI
LT1009ILP
ACTIVE
TO-92
LP
3
1000
TBD
CU SNPB
Level-NC-NC-NC
LT1009ILPR
ACTIVE
TO-92
LP
3
2000
TBD
CU SNPB
Level-NC-NC-NC
LT1009IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009QDR
OBSOLETE
SOIC
D
8
TBD
Call TI
Call TI
LT1009Y
OBSOLETE
XCEPT
Y
0
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Sep-2005
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LT1009CD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CLP
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009CLPE3
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009CLPM
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009CLPME3
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009CLPR
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009CLPRE3
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009CPK
OBSOLETE
SOT-89
PK
3
TBD
Call TI
Call TI
LT1009CPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009CPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009ILP
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009ILPE3
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009ILPR
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009ILPRE3
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
LT1009IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
LT1009IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
LT1009QDR
OBSOLETE
SOIC
D
8
TBD
Call TI
Call TI
LT1009Y
OBSOLETE
XCEPT
Y
0
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.205 (5,21)
0.175 (4,44)
0.165 (4,19)
0.125 (3,17)
DIA
0.210 (5,34)
0.170 (4,32)
Seating
Plane
0.157 (4,00) MAX
0.050 (1,27)
C
0.500 (12,70) MIN
0.104 (2,65)
FORMED LEAD OPTION
0.022 (0,56)
0.016 (0,41)
0.016 (0,41)
0.014 (0,35)
STRAIGHT LEAD OPTION
D
0.135 (3,43) MIN
0.105 (2,67)
0.095 (2,41)
0.055 (1,40)
0.045 (1,14)
1
2
3
0.105 (2,67)
0.080 (2,03)
0.105 (2,67)
0.080 (2,03)
4040001-2 /C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)
E. Shipping Method:
Straight lead option available in bulk pack only.
Formed lead option available in tape & reel or ammo pack.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
LP (O-PBCY-W3)
PLASTIC CYLINDRICAL PACKAGE
0.539 (13,70)
0.460 (11,70)
1.260 (32,00)
0.905 (23,00)
0.650 (16,50)
0.610 (15,50)
0.020 (0,50) MIN
0.098 (2,50)
0.384 (9,75)
0.335 (8,50)
0.748 (19,00)
0.217 (5,50)
0.433 (11,00)
0.335 (8,50)
0.748 (19,00)
0.689 (17,50)
0.114 (2,90)
0.094 (2,40)
0.114 (2,90)
0.094 (2,40)
0.169 (4,30)
0.146 (3,70)
DIA
0.266 (6,75)
0.234 (5,95)
0.512 (13,00)
0.488 (12,40)
TAPE & REEL
4040001-3 /C 10/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Tape and Reel information for the Format Lead Option package.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated