MA4P7441F-1091T Non Magnetic SMQ MELF PIN Diode V2 Features ♦ Non-Magnetic Package Suitable for MRI Applications ♦ Rectangular MELF SMQ Ceramic Package ♦ Hermetically Sealed ♦ Low Rs for Low Series Loss ♦ Long τL for Lower Intermodulation Distortion ♦ Low Cj for High Series Isolation ♦ High Average Incident Power Handling ♦ RoHS Compliant Description The MA4P7441F-1091T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM Technology Solutions time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. Incorporated in the package is a hard glass passivated, CERMACHIP™ PIN chip that is full face bonded on both the cathode and anode to maximize surface area for the lowest electrical and thermal resistance. The package utilizes a non-magnetic plating process that provides for a package with extremely low permeability. The MA4P7441F-1091T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The non-magnetic MA4P7441F-1091T is the electrical equivalent of its magnetic counterpart the MA4P4001F-1091T. Applications This diode is well suited for use in low loss, low distortion, high power switching circuits and can be used in high magnetic field environments at HF through UHF frequencies. The low thermal resistance of this device provides excellent performance at high RF power incident levels, up to 200 watts CW. This device is designed to meet the most demanding electrical and mechanical MRI environments. 1 Designed for Automated Assembly These SMQ PIN diodes are designed for high volume tape and reel assembly. The rectangular package design provides for highly efficient automatic pick and place assembly techniques. The parallel flat surfaces are suitable for key jaw or vacuum pickup. All solderable surfaces are tin plated and compatible with reflow and vapor phase soldering methods. Absolute Maximum Ratings1 @ 25°C Parameter Absolute Maximum Operating Temperature -65 °C to +125°C Storage Temperature -65 °C to +150°C Diode Junction Temperature +175 °C Continuous Diode Mounting Temperature +235°C for 10 seconds RF C.W. Incident Power + 53 dBm C.W. Forward D.C. Current + 500 mA Reverse D.C. Voltage @ -10uA l - 100 V l 1. Exceeding these limits may cause permanent damage. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P7441F-1091T Non Magnetic SMQ MELF PIN Diode V2 Electrical Specifications @ +25 °C Parameter Symbol Condition Minimum Maximum Nominal Forward Voltage VF IF = +100 mA - .9 VDC - Voltage Rating VR Ir = -10 uA l –100 l VDC - - Total Capacitance CT -100 V @ 100 MHz - 2.2 pF - Series Resistance RS +100 mA @ 100 MHz - 0.5 Ω - Parallel Resistance RP -10 V @ 100 MHz 20 K Ω - - Carrier Lifetime τL +6 mA / -10 mA (50% - 90% Voltage) - - 18 µs μm - - - 175 μm C.W. Thermal Resistance θ - - 5°C/W - Power Dissipation in Free Air W IF = +100 mA - 9W - Power Dissipation PD IF = +100 mA - 30W - I-Region Length Environmental Capability MELF devices are appropriate for use in industrial and military applications and can be screened to meet the environmental requirements of MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the MIL-STD 750 tests the device is designed to meet. 2 Test Method Description High Temperature Storage 1031 +150°C, for 340 Hours Temperature Shock 1051 -65°C to +150°C, 20 Cycles HTRB 1038 80% of rated VB, +150°C, for 96 Hours Moisture Resistance 1021 No Initial Conditioning, 85% RH, +85°C Gross Leak 1071 Cond. E Dye Penetrant Visual Vibration Fatigue 2046 20,000G’s, 60Hz, x, y, z axis Solderability 2026 Test Temperature = +245°C ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P7441F-1091T Non Magnetic SMQ MELF PIN Diode V2 Typical Electrical Performance MA4P7441F-1091T Rs vs I 1000 100 MHz Rs (Ohms) 100 1000 MHz 10 1 0.1 0.01 0.10 1.00 10.00 100.00 I ( mA ) MA4P7441F-1091T Rp vs Voltage Rp (Ohms) 10000 Rp_1500 MHz 1000 1.0 10.0 100.0 Voltage ( V ) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P7441F-1091T Non Magnetic SMQ MELF PIN Diode V2 Typical Electrical Performance MA4P7441F-1091T Ct vs Voltage Ct (pF) 10 Ct_1500 MHz Ct_100 MHz 1 0.10 1.00 10.00 100.00 Voltage ( V ) MA4P7441F-1091T Ls vs Frequency 1 Ls (nH) Ls_50 mA 0.1 100.00 1000.00 F ( MHz ) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P7441F-1091T Non Magnetic SMQ MELF PIN Diode V2 Typical Non-Magnetic Performance Comparison of Magnetic Moment for MA4P7400F-1091T Non-Magnetic & MA4P4001F-1091T Magnetic Devices 1.5E-01 Device Magnetic Moment 1.0E-01 MA4P4001F-1091T Magnetic 5.0E-02 0.0E+00 MA4P7400F-1091T Non-Magnetic Series -5.0E-02 -1.0E-01 -1.5E-01 -1.0E+04 -8.0E+03 -6.0E+03 -4.0E+03 -2.0E+03 0.0E+00 2.0E+03 4.0E+03 6.0E+03 8.0E+03 1.0E+04 H Field ( Oersteads ) Typical Magnetic Properties of Non-Magnetic MA4P7441F-1091T Device vs. Conventional MA4P4001F-1091T Magnetic Device Magnetic Property MA4P7441F-1091T MA4P4001-1091T Saturation Moment (EMU) @ H = HMAX Oersteads 1.0 x E-3 1.2 x E-1 Remanance Moment (EMU) @ H = 0 Oersteads 1.5 x E-6 3.4 x E-2 3.0 51.3 Coercivity (Oersteads) @ EMU = 0 Moment 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4P7441F-1091T Non Magnetic SMQ MELF PIN Diode V2 Mechanical Information 1091 MELF Surface Mount Package Circuit Pad Layout for 1091 MELF Diodes A B Case Style Dimensions in Inches (mm) A Square Min / Max 1091 B Min / Max Dimension C Min / Max 0.138 / 0.155 0.180 / 0.200 0.008 / 0.030 (3.50/ 3.94) (4.57/ 5.08) (.203 / .762) C B Package Style 1091 inches mm A 0.150 3.81 B 0.050 1.27 C 0.100 2.54 MELF Assembly Recommendations ♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. All solderable surfaces of MELF devices are tin plated 50 μM thick to ensure an optimum connection. ♦ For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM Tech website. Ordering Information 6 Part Number Package MA4P7441F-1091T Tape and Reel ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.