MAXIM MAX3946ETG

19-5182; Rev 1; 5/11
TION KIT
EVALUA BLE
AVAILA
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
The MAX3946 is a +3.3V, multirate, low-power laser
diode driver designed for Ethernet and Fibre Channel
transmission systems at data rates up to 11.3Gbps.
This device is optimized to drive a differential transmitter optical subassembly (TOSA) with a 25I flex circuit.
The unique design of the output stage enables use of
unmatched TOSAs, greatly reducing headroom limitations and lowering power consumption.
The device receives differential CML-compatible signals
with on-chip line termination. It can deliver laser modulation current of up to 80mA, at an edge speed of 22ps
(20% to 80%), into a 5I to 25I external differential load.
The device is designed to have a symmetrical output
stage with on-chip back terminations integrated into
its outputs. A high-bandwidth, fully differential signal
path is implemented to minimize deterministic jitter. An
equalization block can be activated to compensate for
the SFP+ connector. The integrated bias circuit provides
programmable laser bias current up to 80mA. Both the
laser bias generator and the laser modulator can be disabled from a single pin.
A 3-wire digital interface reduces the pin count and
permits adjustment of input equalization, pulse-width
adjustment, Tx polarity, Tx deemphasis, modulation current, and bias current without the need for external components. The MAX3946 is available in a 4mm x 4mm,
24-pin TQFN package.
Applications
4x/8x FC SFP+ Optical Transceivers
10GFC SFP+ Optical Transceivers
10GBASE-LR SFP+ Optical Transceivers
10GBASE-LRM SFP+ Optical Transceivers
Features
S225mW Power Dissipation Enables < 1W SFP+
Modules
SUp to 100mW Power Consumption Reduction by
Enabling the Use of Unmatched FP/DFB TOSAs
SSupports SFF-8431 SFP+ MSA and SFF-8472
Digital Diagnostic
S225mW Power Dissipation at 3.3V (IMOD = 40mA,
IBIAS = 60mA Assuming 25I TOSA)
SSingle +3.3V Power Supply
SUp to 11.3Gbps (NRZ) Operation
SProgrammable Modulation Current from 10mA to
100mA (5I Load)
SProgrammable Bias Current from 5mA to 80mA
SProgrammable Input Equalization
SProgrammable Output Deemphasis
S25I Output Back Termination at TOUT+ and
TOUTSDJ Performance 7psP-P with Mismatched
Differential Load (5I)
SDJ Performance 5psP-P with Mismatched
Differential Load (25I)
SDJ Performance 5psP-P with 50I Differential Load
SProgrammable Pulse Width
SEdge Transition Times of 22ps
SBias Current Monitor
SIntegrated Eye Safety Features
S3-Wire Digital Interface
S-40°C to +95°C Operation
Ordering Information
OC192-SR XFP/SFP+ SDH/SONET Transceivers
PART
MAX3946ETG+
TEMP RANGE
PIN-PACKAGE
-40°C to +85°C
24 TQFN-EP*
Note: Parts are guaranteed by design and characterization to
operate over the -40°C to +95°C ambient temperature range
(TA) and are tested up to +85°C.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX3946
General Description
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
ABSOLUTE MAXIMUM RATINGS
VCC, VCCT, VCCD .................................................-0.3V to +4.0V
Current Into TOUT+ and TOUT-..................................... +100mA
Current Into TIN+ and TIN-.............................. -20mA to +20mA
Voltage Range at TIN+, TIN-,
DISABLE, SDA, SCL, CSEL, FAULT,
BMAX, and BMON................................. -0.3V to (VCC + 0.3V)
Voltage Range at BIAS.........................................................-0.3V to VCC
Voltage Range at TOUT+ and TOUT-.....(VCC - 1.3V) to (VCC + 1.3V)
Current into BIAS..........................................................................+130mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 27.8mW/NC above +70NC)..................2222mW
Storage Temperature Range ........................... -55NC to +150NC
Die Attach Temperature . ................................................+400NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (qJA)...........36°C/W
Junction-to-Case Thermal Resistance (qJC)..................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VCC = +2.85V to +3.63V, TA = -40°C to +85°C, and Figure 1. Guaranteed by design and characterization from TA = -40°C to +95°C.
Typical values are at VCC = +3.3V, IBIAS = 60mA, IMOD = 40mA, 25I differential output load, and TA = +25°C, unless otherwise
noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
Power-Supply Current
ICC
Excludes output current through the external pullup inductors (Note 3)
Power-Supply Voltage
VCC
MIN
TYP
MAX
UNITS
68
90
mA
3.63
V
POWER SUPPLY
Power-Supply Noise
2.85
DC to 10MHz
100
10MHz to 20MHz
10
mVP-P
POWER-ON RESET
VCC for Enable High
2.55
VCC for Enable Low
2.3
2.45
1
10
2.75
V
V
DATA INPUT SPECIFICATION
Input Data Rate
TXEQ_EN = high, launch amplitude into
FR4 transmission line P 5.5in
0.19
TXEQ_EN = low
0.15
11.3
0.7
Gbps
Differential Input Voltage
VIN
Differential Input Resistance
RIN
Differential Input Return Loss
SDD11
Part powered on, f P 10GHz
12
dB
Common-Mode Input Return
Loss
SCC11
Part powered on, 1GHz P f P 10GHz
10
dB
75
VP-P
1.0
100
125
I
BIAS GENERATOR
Maximum Bias Current
IBIASMAX
Current into BIAS pin, DISABLE = low, and
TX_EN = high
80
2 _______________________________________________________________________________________
mA
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
(VCC = +2.85V to +3.63V, TA = -40°C to +85°C, and Figure 1. Guaranteed by design and characterization from TA = -40°C to +95°C.
Typical values are at VCC = +3.3V, IBIAS = 60mA, IMOD = 40mA, 25I differential output load, and TA = +25°C, unless otherwise
noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
Minimum Bias Current
IBIASMIN
Current into BIAS pin, DISABLE = low, and
TX_EN = high
Bias-Off Current
IBIAS-OFF
Current into BIAS pin, DISABLE = high or
TX_EN = low or SET_IBIAS[8:0] = H0x00;
BIAS pin voltage at VCC
BMON Current Gain
MAX
UNITS
5
mA
100
FA
1
3
%
0.9
1.5
2.1
V
9
10
11
mA/A
5mA P IBIAS P 80mA, VBIAS = VCC - 1.5V
(Notes 2, 4)
Bias Current DAC Stability
Instantaneous Compliance
Voltage at BIAS
MIN
VBIAS
GBMON
GBMON = IBMON/IBIAS, external resistor to
ground defines voltage
Compliance Voltage at BMON
TYP
0
BMON Current Gain Stability
1.2
5mA P IBIAS P 80mA (Notes 2, 4)
1.8
V
4
%
VCC +
1.0
V
LASER MODULATOR
TOUT+ and TOUTInstantaneous Output
Compliance Voltage
Maximum Modulation Current
VCC 1.0
IMODMAX
Minimum Modulation Current
IMODMIN
Differential Output Resistance
2 x ROUT
Modulation-Off Maximum Current
IMOD-OFF
Modulation Current DAC Stability
Modulation Current Edge Speed
(Note 2)
Deterministic Jitter (Notes 2, 5)
tR, tF
DJ
Current into external 25I differential termination, output common-mode
voltage = VCC
80
Current into external 50I differential termination, output common-mode
voltage = VCC
60
mAP-P
10
50
Current between TOUT+ and TOUT- when
DISABLE = high or TX_EN = low or
SET_IMOD[8:0] = H0x00
mAP-P
I
100
FA
%
10mA P IMOD P 80mA (Notes 2, 4)
1.5
3
20% to 80%, 20mA P IMOD P 80mA
22
30
20% to 80%, 10mA P IMOD P 80mA,
TXDE_MD[1:0] = 3d
22
30
10mA P IMOD P 60mA, 11.3Gbps, output
differential load = 50I
5
12
10mA P IMOD P 80mA, 11.3Gbps, output
differential load = 25I
5
12
10mA P IMOD P 80mA, 11.3Gbps, output
differential load = 5I
7
10mA P IMOD P 60mA, 10.7Gbps, output
differential load = 50I (K28.5 pattern)
5
ps
psP-P
10.5
_______________________________________________________________________________________ 3
MAX3946
ELECTRICAL CHARACTERISTICS (continued)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.85V to +3.63V, TA = -40°C to +85°C, and Figure 1. Guaranteed by design and characterization from TA = -40°C to +95°C.
Typical values are at VCC = +3.3V, IBIAS = 60mA, IMOD = 40mA, 25I differential output load, and TA = +25°C, unless otherwise
noted.) (Note 2)
PARAMETER
Random Jitter
Differential Output Return Loss
SYMBOL
RJ
SDD22
CONDITIONS
MIN
10mA P IMOD P 80mA, output differential
load = 25I (Note 2)
TYP
MAX
UNITS
0.19
0.55
psRMS
Part powered on, f P 5GHz
8
Part powered on, f P 10GHz
6
dB
SAFETY FEATURES
Threshold Voltage at BMAX
VBMAX
FAULT always occurs for VBMAX R 1.3V,
FAULT never occurs for VBMAX < 1.1V
(Note 2, Figure 1)
1.1
1.2
1.3
V
Threshold Voltage at BIAS
VBIAS
FAULT never occurs for VBIAS R 0.57V,
FAULT always occurs for VBIAS < 0.44V
0.44
0.48
0.57
V
Warning always occurs for VBMON R
VCC - 0.5V, warning never occurs for
VBMON < VCC - 0.7V
VCC 0.7
VCC 0.6
VCC 0.5
V
Threshold Voltage at BMON
VBMON
SFP TIMING REQUIREMENTS
DISABLE Assert Time
t_OFF
Time from rising edge of DISABLE input
signal to IBIAS < IBIAS-OFF and IMOD <
IMOD-OFF
0.05
1
Fs
DISABLE Negate Time
t_ON
Time from falling edge of DISABLE to IBIAS
and IMOD at 90% of steady state
0.5
5
Fs
FAULT Reset Time of Power-On
Time
t_INIT
Time from power-on or negation of FAULT
using DISABLE
50
200
Fs
Time from fault to FAULT on, CFAULT P
20pF, RFAULT = 4.7kI
0.5
2
Fs
FAULT Reset Time
t_FAULT
DISABLE to Reset
Time DISABLE must be held high to reset
FAULT
0.5
SET_IBIAS[8:1] = HxFF
80
Fs
BIAS CURRENT DAC
Full-Scale Current
IBIAS-FS
LSB Size
100
mA
190
FA
Integral Nonlinearity
INL
5mA P IBIAS P 80mA
±0.5
%FS
Differential Nonlinearity
DNL
5mA P IBIAS P 80mA, guaranteed monotonic at 8-bit resolution SET_IBIAS[8:1]
±0.5
LSB
105
mA
MODULATION CURRENT DAC (25I DIFFERENTIAL LOAD)
Full-Scale Current
IMOD-FS
SET_IMOD[8:1] = HxFF
LSB Size
Integral Nonlinearity
INL
10mA P IMOD P 80mA
Differential Nonlinearity
DNL
10mA P IMOD P 80mA, guaranteed monotonic at 9-bit resolution SET_IMOD[8:0]
80
200
FA
Q1
%FS
Q0.5
LSB
4 _______________________________________________________________________________________
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
(VCC = +2.85V to +3.63V, TA = -40°C to +85°C, and Figure 1. Guaranteed by design and characterization from TA = -40°C to +95°C.
Typical values are at VCC = +3.3V, IBIAS = 60mA, IMOD = 40mA, 25I differential output load, and TA = +25°C, unless otherwise
noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
500
800
UNITS
CONTROL I/O SPECIFICATIONS
DISABLE Input Current
DISABLE Input High Voltage
IIH
IIL
12
Depends on pullup resistance
VIH
DISABLE Input Low Voltage
VIL
DISABLE Input Resistance
RPULL
1.8
VCC
0
Internal pullup resistor
4.7
7.5
FA
V
0.8
V
10
kI
VCC
V
0.8
V
3-WIRE DIGITAL I/O SPECIFICATIONS (SDA, SCL, CSEL)
Input High Voltage
VIH
Input Low Voltage
VIL
Input Hysteresis
2.0
VHYST
Input Leakage Current
IIL, IIH
Output High Voltage
VOH
Output Low Voltage
VOL
80
VIN = 0V or VCC, internal pullup or
pulldown is 75kI typical
External pullup is (4.7kI to 10kI) to VCC
External pullup is (4.7kI to 10kI) to VCC
mV
150
VCC - 0.5
FA
V
0.4
V
1000
kHz
3-WIRE DIGITAL INTERFACE TIMING CHARACTERISTICS (Figure 5)
SCL Clock Frequency
fSCL
SCL Pulse-Width High
tCH
0.5
SCL Pulse-Width Low
tCL
0.5
SDA Setup Time
tDS
100
ns
SDA Hold Time
tDH
100
ns
tD
5
ns
SCL Rise to SDA Propagation
Time
CSEL Pulse-Width Low
400
tCSW
Fs
Fs
500
ns
CSEL Leading Time Before the
First SCL Edge
tL
500
ns
CSEL Trailing Time After the Last
SCL Edge
tT
500
ns
SDA, SCL Load
CB
Total bus capacitance on one line with
4.7kI pullup to VCC
20
pF
Note 2: Guaranteed by design and characterization (TA = -40NC to +95NC).
Note 3: BIAS is connected to 2.0V. TOUT+/TOUT- are connected through pullup inductors to a separate supply that is equal to VCCT.
Note 4: Stability is defined as [(I_measured) - (I_reference)]/(I_reference) over the listed current range, temperature, and VCC =
VCCREF Q5%. VCCREF = 3.0V to 3.45V. Reference current measured at VCCREF, TA = +25NC.
Note 5: Measured with K28.5 data pattern at 10.7Gbps and with a (27 - 1 PRBS + 72 zeros + 27 - 1 PRBS (inverted) + 72 ones)
pattern at 11.3Gbps.
_______________________________________________________________________________________ 5
MAX3946
ELECTRICAL CHARACTERISTICS (continued)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
VCCD 0.01µF
VCC
+
-
VCCT
2.0V
4.7kI
0.1µF
VCCT
BIAS
VCCD
VEET
CSEL
SCL
VCC
SDA
0.01µF
VCCT
VCC
VCC
0.01µF
0.01µF
0.1µF
35I
Z0 = 50I
TIN+
25I
TOUT+
MAX3946
50I
75I
0.01µF
Z0 = 50I
TIN-
0.1µF
50I
25I
TOUT-
SAMPLING
OSCILLOSCOPE
35I
VCC
VCC
EP
VEET
VCCT
50I
VCCT
BMON
BMAX
FAULT
DISABLE
VCCD
0.01µF
VCCT
VCC
4.7kI
0.01µF
1kI
0.01µF
0.1µF
1kI
Figure 1. AC Test Setup
6 _______________________________________________________________________________________
50I
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
10.3Gbps OPTICAL EYE DIAGRAM
10.3Gbps ELECTRICAL EYE DIAGRAM
MAX3946 toc01
MAX3946 toc02
223 - 1 PRBS
20ps/div
-5
-5
0
-10
-15
-20
-15
-20
-25
-25
-30
-30
-35
SCD11 (dB)
-10
SCC11 (dB)
-35
100
1000
10,000
100,000
-30
-50
10,000
1000
100,000
1000
100
10,000
100,000
FREQUENCY (MHz)
FREQUENCY (MHz)
OUTPUT DIFFERENTIAL RETURN LOSS
vs. FREQUENCY
OUTPUT COMMON-MODE RETURN LOSS
vs. FREQUENCY
RANDOM JITTER vs. MODULATION
CURRENT (AT LOAD)
MAX3946 toc06
0
-10
1.0
-5
0.8
0.7
RJ (psRMS)
SCC22 (dB)
-30
-15
-20
1000
10,000
FREQUENCY (MHz)
100,000
0.4
0.1
0
-35
100
0.5
0.2
-30
-50
0.6
0.3
-25
-40
11.3Gbps, 25Ω DIFFERENTIAL LOAD
1111 0000 PATTERN
0.9
-10
-20
MAX3946 toc08
FREQUENCY (MHz)
0
SDD22 (dB)
-20
-40
MAX3946 toc07
SDD11 (dB)
-10
INPUT DIFFERENTIAL TO COMMON-MODE
RETURN LOSS vs. FREQUENCY
MAX3946 toc04
0
MAX3946 toc03
0
INPUT COMMON-MODE RETURN LOSS
vs. FREQUENCY
MAX3946 toc05
INPUT DIFFERENTIAL RETURN LOSS
vs. FREQUENCY
100
1000
10,000
FREQUENCY (MHz)
100,000
0
10
20
30
40
50
60
70
80
MODULATION CURRENT (mAP-P)
_______________________________________________________________________________________ 7
MAX3946
Typical Operating Characteristics
(VCC = +3.3V, TA = +25°C, data pattern = 27 - 1 PRBS + 72 zeros + 27 - 1 PRBS (inverted) +72 ones, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VCC = +3.3V, TA = +25°C, data pattern = 27 - 1 PRBS + 72 zeros + 27 - 1 PRBS (inverted) +72 ones, unless otherwise noted.)
70
60
70
65
200
60
190
25Ω LOAD
180
170
5Ω LOAD
20
35
50
65
80
95
5
20
35
50
65
80
BIAS CURRENT
vs. DAC SETTING
MODULATION CURRENT (AT LOAD)
vs. DAC SETTING
40
20
0
RLOAD = 25Ω
DIFFERENTIAL
60
50
40
RLOAD = 50Ω
DIFFERENTIAL
30
10
8
200
400
7
6
5
4
3
20
2
10
1
0
0
600
SET_IMOD[8:0] = 230d
TXDE_MD[1:0] = 2d
9
DEEMPHASIS (%)
60
MODULATION CURRENT DEEMPHASIS
vs. MANUAL DEEMPHASIS SETTING
MAX3946 toc13
MAX3946 toc12
80
80
70
25
95
SET_PWCTRL[3:0]
90
MODULATION CURRENT (mAP-P)
0
0
200
400
600
10
20
30
SET_IMOD[8:0]
SET_TXDE[5:0]
BIAS MONITOR CURRENT
vs. TEMPERATURE
EDGE SPEED
vs. MODULATION CURRENT
EDGE SPEED
vs. DEEMPHASIS SETTING
40
MAX3946 toc15
700
600
25Ω LOAD, 20% TO 80%
10Gbps, 11111 00000 PATTERN
35
40
SET_IMOD[8:0] = 230d
25Ω LOAD, 20% TO 80%
10Gbps, 1111 0000 PATTERN
35
40
MAX3946 toc17
SET_IBIAS[8:0]
MAX3946 toc16
EDGE SPEED (ps)
IBIAS = 60mA
IBIAS = 30mA
400
300
IBIAS = 10mA
200
30
FALL TIME
25
20
0
-40 -25 -10
5
20
35
50
TEMPERATURE (°C)
65
80
95
20
40
60
IMOD (mA)
FALL TIME
25
20
15
10
0
30
RISE TIME
RISE TIME
15
100
EDGE SPEED (ps)
BIAS CURRENT (mA)
-40 -25 -10
TEMPERATURE (°C)
100
500
30
TEMPERATURE (°C)
120
45
1001
1010
1011
1100
1101
1110
1111
0000
0001
0010
0011
0100
0101
0110
0111
5
50
35
140
-40 -25 -10
55
40
160
150
50
MAX3946 toc11
75
MAX3946 toc14
SUPPLY CURRENT (mA)
80
CURRENT INTO VCC, VCCT, AND VCCD PINS
PLUS MODULATION AND BIAS CURRENT
210
EYE CROSSING PERCENT
vs. SET_PWCTRL
CROSSING (%)
CURRENT INTO VCC, VCCT, AND VCCD PINS
90
SUPPLY CURRENT (mA)
220
MAX3946 toc09
100
TOTAL CURRENT vs. TEMPERATURE
(IMOD AT LOAD = 40mAP-P, IBIAS = 60mA)
MAX3946 toc10
SUPPLY CURRENT vs. TEMPERATURE
(IMOD = 40mAP-P, IBIAS = 60mA)
BMON CURRENT (µA)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
80
100
10
10
20
30
SET_TXDE[5:0]
8 _______________________________________________________________________________________
40
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
TRANSMITTER DISABLE
TRANSMITTER ENABLE
MAX3946 toc18
VCC
VCC
3.3V
RESPONSE TO FAULT
MAX3946 toc19
3.3V
EXTERNAL FAULT
VBIAS
t_ON = 600ns
FAULT
DISABLE
LOW
HIGH
HIGH
DISABLE
LOW
HIGH
FAULT
LOW
FAULT
MAX3946 toc20
LOW
LOW
DISABLE
OUTPUT
OUTPUT
OUTPUT
100ns/div
1µs/div
FAULT RECOVERY
VBIAS
DISABLE
MAX3946 toc22
VBIAS
LOW
HIGH
LOW
OUTPUT
FREQUENT ASSERTION OF DISABLE
MAX3946 toc21
EXTERNAL FAULT
REMOVED
FAULT
1µs/div
FAULT
DISABLE
EXTERNAL FAULT
HIGH
LOW
HIGH
LOW
OUTPUT
4µs/div
4µs/div
_______________________________________________________________________________________ 9
MAX3946
Typical Operating Characteristics (continued)
(VCC = +3.3V, TA = +25°C, data pattern = 27 - 1 PRBS + 72 zeros + 27 - 1 PRBS (inverted) +72 ones, unless otherwise noted.)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
SDA
CSEL
VCCD
BIAS
VCCT
TOP VIEW
SCL
Pin Configuration
18
17
16
15
14
13
VEET 19
12
VCCT
VCC 20
11
TOUT+
TIN+ 21
10
TOUT+
9
TOUT-
8
TOUT-
7
VCCT
MAX3946
TIN- 22
VCC 23
*EP
+
1
2
3
4
5
6
VCCD
DISABLE
FAULT
BMAX
BMON
VCCT
VEET 24
THIN QFN
(4mm × 4mm)
*EXPOSED PAD CONNECTED TO GROUND.
Pin Description
PIN
NAME
1, 15
VCCD
2
DISABLE
FUNCTION
Power Supply. Provides supply voltage to the digital block.
Disable Input, CMOS. Set to logic-low for normal operation. Logic-high or open disables both the
modulation current and the bias current. Internally pulled up by a 7.5kI resistor to VCCD.
3
FAULT
Fault Output, Open Drain. Logic-high indicates a fault condition. FAULT remains high even after the
fault condition has been removed. A logic-low occurs when the fault condition has been removed and
the fault latch has been cleared by toggling the DISABLE pin. FAULT should be pulled up to VCC by
a 4.7kI to 10kI resistor.
4
BMAX
Analog Laser Bias-Current Limit. A resistive voltage-divider connected among BMON, BMAX, and
ground sets the maximum allowed laser bias current limit. The voltage at BMAX is internally compared to 1.2V bandgap reference voltage.
5
BMON
Bias Current-Monitor Output. Current out of this pin develops a ground-referenced voltage across
external resistor(s) that is proportional to the laser bias current. The current sourced by this pin is
typically 1/100th the BIAS pin current.
6, 7, 12, 13
VCCT
Power Supply. Provides supply voltage to the output block.
8, 9
TOUT-
Inverted Modulation Current Output. Internally pulled up by a 25I resistor to VCCT.
10, 11
TOUT+
14
BIAS
Noninverted Modulation Current Output. Internally pulled up by a 25I resistor to VCCT.
Laser Bias Current Connection. This pin requires a 0.1µF capacitor to VEET for proper operation.
16
CSEL
Chip-Select Input, CMOS. Setting CSEL to logic-high starts a cycle. Setting CSEL to logic-low ends
the cycle and resets the control state machine. Internally pulled down by a 75kI resistor to VEET.
17
SDA
Serial-Data Bidirectional Input, CMOS. Open-drain output. This pin has a 75kI internal pullup, but it
requires an external 4.7kI to 10kI pullup resistor. (Data line-collision protection is implemented.)
10 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
PIN
NAME
FUNCTION
18
SCL
Serial-Clock Input, CMOS. This pin has a 75kI internal pulldown.
19, 24
VEET
Ground
20, 23
VCC
Power-Supply Connections. Provides supply voltage to the core circuitry.
21
TIN+
Noninverted Data Input
22
TIN-
Inverted Data Input
—
EP
Exposed Pad. Ground. Must be soldered to circuit board ground for proper thermal and electrical
performance (see the Exposed-Pad Package and Thermal Considerations section).
VCCD
7.5kI
TOUT+
DISABLE
EYE SAFETY AND
OUTPUT CONTROL
TX_EN
FAULT
BMAX
25I
VCCT
LASER BIAS
CURRENT LIMITER
VCM
25I
POWER-ON RESET
50I
50I
TIN+
EQ
TIN-
TOUT-
TX_POL
1
IBIAS
PW
CONTROL
0
IBIAS
IMOD_DAC + IDE_DAC
VCCD
BIAS
VCC
100
BMON
CONTROL
LOGIC
75kI
SDA
3-WIRE
INTERFACE
SCL
CSEL
75kI
75kI
REGISTER
SET_TXEQ
MAX3946
SET_PWCTRL
VEET
VEET
9b DAC SET_IMOD
6b DAC SET_TXDE
9b DAC SET_IBIAS
Figure 2. Functional Diagram
______________________________________________________________________________________ 11
MAX3946
Pin Description (continued)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Detailed Description
The MAX3946 SFP+ laser driver is designed to drive
5I to 50I TOSAs from 1Gbps to 11.3Gbps. The device
contains an input buffer with programmable equalization, pulse-width adjustment, bias current and modulation current DACs, output driver with programmable
deemphasis, power-on reset circuitry, bias monitor, laser
current limiter, and eye-safety circuitry. A 3-wire digital
interface is used to control the transmitter functions.
The registers that control the device’s functionality are
TXCTRL, SET_IMOD, SET_IBIAS, IMODMAX, IBIASMAX,
MODINC, BIASINC, SET_TXEQ, SET_PWCTRL, and
SET_TXDE.
Input Buffer with Programmable
Equalization
The input is internally biased and terminated with 50I to
a common-mode voltage. The first amplifier stage features a programmable equalizer for high-frequency losses including SFP connector. Equalization is controlled
by the SET_TXEQ register and TXEQ_EN bit, TXCTRL[3]
(Table 1). The TX_POL bit in the TXCTRL register controls the polarity of TOUT+ and TOUT- vs. TIN+ and TIN-.
The SET_PWCTRL register controls the output eye crossing (Table 5). A status indicator bit (TXED) monitors the
presence of an AC input signal.
Bias Current DAC
The device’s bias current is optimized to provide up
to 80mA of bias current into a 5I to 50I laser load
with 200FA resolution. The bias current is controlled
through the 3-wire digital interface using the SET_IBIAS,
IBIASMAX, and BIASINC registers.
For laser operation, the laser bias current can be set
using the 9-bit SET_IBIAS DAC. The upper 8 bits are set
by the SET_IBIAS[8:1] register, commonly used during
the initialization procedure after POR. The LSB (bit 0)
of SET_IBIAS is initialized to zero after POR and can
be updated using the BIASINC register. The IBIASMAX
register should be programmed to a desired maximum
bias current value (up to 96mA) to protect the laser. The
IBIASMAX register limits the maximum SET_IBIAS[8:1]
DAC code.
After initialization the value of the SET_IBIAS DAC register should be updated using the BIASINC register
to optimize cycle time and enhance laser safety. The
BIASINC register is an 8-bit register where the first 5
bits contain the increment information in two’s complement notation. Increment values range from -16 to +15
LSBs. If the updated value of SET_IBIAS[8:1] exceeds
IBIASMAX[7:0], the IBIASERR warning flag is set and
SET_IBIAS[8:0] remains unchanged.
Modulation Current DAC
The modulation current from the device is optimized to
provide up to 80mA of modulation current into a 5I to
25I differential laser load (60mA for 50I laser load)
with 300FA to 200FA resolution. The modulation current
is controlled through the 3-wire digital interface using
the SET_IMOD, IMODMAX, MODINC, and SET_TXDE
registers.
For laser operation, the laser modulation current can be
set using the 9-bit SET_IMOD DAC. The upper 8 bits
are set by the SET_IMOD[8:1] register, commonly used
during the initialization procedure after POR. The LSB (bit 0)
of SET_IMOD is initialized to zero after POR and can
be updated using the MODINC register. The IMODMAX
register should be programmed to a desired maximum
modulation current value (up to 96mA) to protect the
laser. The IMODMAX register limits the maximum
SET_IMOD[8:1] DAC code.
Table 1. Input Equalization Control Register Settings
TXCTRL[3]
TXEQ_EN
SET_TXEQ[2:1]
DESCRIPTION
0
X
X
150mVP-P to 1000mVP-P differential input amplitude (default setting)
1
0
0
Optimized for 1in to 4in FR4, 190mVP-P to 450mVP-P differential launch amplitude from source
1
0
1
Optimized for 4in to 6in FR4, 190mVP-P to 450mVP-P differential launch amplitude from source
1
1
0
Optimized for 1in to 4in FR4, 450mVP-P to 700mVP-P differential launch amplitude from source
1
1
1
Optimized for 4in to 6in FR4, 450mVP-P to 700mVP-P differential launch amplitude from source
12 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
MAX3946
0.6V
IBIAS
+
-
100
OR
WARNING
BMON
IF BMAX IS
NOT USED
R1
100kI
OR
IF BMON IS
NOT USED
R1
OR
IF BMAX AND
BMON ARE
NOT USED
1kI
BMAX
FAULT
1.2V
R2
1kI
R2
Figure 3. BMON and BMAX Circuitry
After initialization the value of the SET_IMOD DAC register should be updated using the MODINC register
to optimize cycle time and enhance laser safety. The
MODINC register is an 8-bit register where the first 5 bits
contain the increment information in two’s complement notation. Increment values range from -16 to +15
LSBs. If the updated value of SET_IMOD[8:1] exceeds
IMODMAX[7:0], the IMODERR warning flag is set and
SET_IMOD[8:0] remains unchanged.
Modulation current sent to the laser is actually the combination of the current generated by the SET_IMOD register and current subtracted from this by the SET_TXDE
register.
Output Driver
The output driver is optimized for a 5I to 50I differential load. The output stage also features programmable
deemphasis that can be set as a percentage of the modulation current. The deemphasis function is controlled by
the TXDE_MD[1] and TXDE_MD[0] bits (TXCTRL[5:4])
and SET_TXDE[5:0].
Power-On Reset (POR)
POR ensures that the laser is off until supply voltage has
reached a specified threshold (2.75V). After POR, bias
current and modulation current ramps are controlled to
avoid overshoot. In the case of a POR, all registers are
reset to their default values.
BMON and BMAX Functions
Current out of the BMON pin is typically 1/100th the
value of the current at the BIAS pin. The total resistance
to ground at BMON sets the voltage gain. An internal
comparator at the BMAX pin latches a fault if the voltage
on BMAX exceeds the value of 1.2V. The BMAX voltagesense pin is connected by means of a voltage-divider to
the BMON pin and ground. The full-scale range of the
BMON voltage is 1.2V x (R1/R2 + 1) (Figure 3). The analog bias-current limit is determined by (1.2V/R2) x 100.
Eye Safety and Output Control Circuitry
The safety and output control circuitry includes the disable pin (DISABLE) and disable bit (TX_EN), along with a
fault indicator and fault detectors (Figure 4). The device
has two types of faults, HARD FAULT and SOFT FAULT.
A HARD FAULT triggers the FAULT pin, and the output
to the laser is disabled. A SOFT FAULT operates as a
warning, and the outputs are not disabled. Both types of
faults are stored in the TXSTAT1 and TXSTAT2 registers.
The FAULT pin is a latched output that can be cleared
by toggling the DISABLE pin. Toggling the DISABLE pin
also clears the TXSTAT1 and TXSTAT2 registers. A single-point fault can be a short to VCC or ground. Table 2
shows the circuit response to various single-point faults.
______________________________________________________________________________________ 13
MAX3946
BIAS
VCC
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
FAULT REGISTERS
VCCT
TOUTTOUT+
VEET
<0> FAULT
IMOD
0.44V
<1>
VEET
BIAS
VCC - 2V
<2>
FAULT REGISTER
TXSTAT1
<3>
VCC - 1.3V
IBIAS
ADDR = H0x06
BMAX
<4>
1.3V
IBIAS
100
UNUSED
<5>
VEET
BMON
<6>
VCC - 0.5V
POR
2.3V
<7>
VCCD
RESET
7.5kI
DISABLE
UNUSED
LOSS-OF-SIGNAL
CIRCUIT
WARNING REGISTER
TXSTAT2
<0>
ADDR = H0x07
<1>
SET_IBIAS
IBIASMAX
SET_IMOD
IMODMAX
<2>
<3>
Figure 4. Eye Safety Circuitry
14 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
PIN
NAME
1
VCCD
2
DISABLE
3
4
SHORT TO VCC
SHORT TO GROUND
OPEN
Normal
Disabled—HARD FAULT
Normal (Note 3)—Redundant path
Disabled
Normal (Note 1). Can only be disabled by other means.
Disabled
FAULT
Normal (Note 1)
Normal (Note 1)
Normal (Note 1)
BMAX
Disabled—HARD FAULT
Normal (Note 1)
Disabled—HARD FAULT
5
BMON
Disabled—HARD FAULT
Normal (Note 1)
Disabled—HARD FAULT
6
VCCT
Normal
Disabled—Fault (external supply
shorted) (Note 2)
Normal (Note 3)—Redundant path
7
VCCT
Normal
Disabled—Fault (external supply
shorted) (Note 2)
Normal (Note 3)—Redundant path
8
TOUT-
IMOD is reduced
Disabled—HARD FAULT
IMOD is reduced
9
TOUT-
IMOD is reduced
Disabled—HARD FAULT
IMOD is reduced
10
TOUT+
IMOD is reduced
Disabled—HARD FAULT
IMOD is reduced
11
TOUT+
IMOD is reduced
Disabled—HARD FAULT
IMOD is reduced
Normal (Note 3)—Redundant path
12
VCCT
Normal
Disabled—Fault (external supply
shorted) (Note 2)
13
VCCT
Normal
Disabled—Fault (external supply
shorted) (Note 2)
Normal (Note 3)—Redundant path
14
BIAS
IBIAS is on—No fault
Disabled—HARD FAULT
Disabled—HARD FAULT
15
VCCD
Normal
Disabled—Fault (external supply
shorted) (Note 2)
Normal (Note 3)—Redundant path
16
CSEL
Normal (Note 1)
Normal (Note 1)
Normal (Note 1)
17
SDA
Normal (Note 1)
Normal (Note 1)
Normal (Note 1)
18
SCL
Normal (Note 1)
Normal (Note 1)
Normal (Note 1)
19
VEET
Disabled—Fault (external
supply shorted) (Note 2)
Normal
Normal (Note 3)—Redundant path
20
VCC
Normal
Disabled—HARD FAULT (external
supply shorted) (Note 2)
Normal (Note 3)—Redundant path
21
TIN+
SOFT FAULT
SOFT FAULT
Normal (Note 1)
22
TIN-
SOFT FAULT
SOFT FAULT
Normal (Note 1)
Normal (Note 3)—Redundant path
Normal (Note 3)—Redundant path
23
VCC
Normal
Disabled—HARD FAULT (external
supply shorted) (Note 2)
24
VEET
Disabled—Fault (external
supply shorted) (Note 2)
Normal
Note 1: Normal—Does not affect laser power.
Note 2: S
upply-shorted current is assumed to be primarily on the circuit board (outside this device), and the main supply is collapsed by the short.
Note 3: Normal in functionality, but performance could be affected.
Warning: Shorted to VCC or shorted to ground on some pins can violate the Absolute Maximum Ratings.
______________________________________________________________________________________ 15
MAX3946
Table 2. Circuit Response to Single-Point Faults
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
3-Wire Interface
Read Mode (RWN = 1)
The master generates 16 total clock cycles at SCL. The
master outputs a total of 8 bits (MSB first) to the SDA line
at the falling edge of the clock. The SDA line is released
after the RWN bit has been transmitted. The slave outputs 8 bits of data (MSB first) at the rising edge of the
clock. The master closes the transmission by setting
CSEL to 0. Figure 5 shows the interface timing.
The device implements a proprietary 3-wire digital interface. An external controller generates the clock. The
3-wire interface consists of an SDA bidirectional data
line, an SCL clock signal input, and a CSEL chip-select
input (active high). The external master initiates a data
transfer by asserting the CSEL pin. The master starts to
generate a clock signal after the CSEL pin has been set
to a logic-high. All data transfers are most significant bit
(MSB) first.
Mode Control
Normal mode allows read-only instruction for all registers except MODINC and BIASINC. The MODINC and
BIASINC registers can be updated during normal mode.
Doing so speeds up the laser control update through the
3-wire interface by a factor of two. The normal mode is
the default mode.
Protocol
Each operation consists of 16-bit transfers (15-bit
address/data, 1-bit RWN). The bus master generates 16
clock cycles to SCL. All operations transfer 8 bits to the
device. The RWN bit determines if the cycle is read or
write. See Table 3.
Setup mode allows the master to write unrestricted data
into any register except the status (TXSTAT1, TXSTAT2)
registers. To enter the setup mode, the MODECTRL
register (address = H0x0E) must be set to H0x12. After
the MODECTRL register has been set to H0x12, the
next operation is unrestricted. The setup mode is automatically exited after the next operation is finished. This
sequence must be repeated if further unrestricted settings are necessary.
Register Addresses
The device contains 13 registers available for programming. Table 4 shows the registers and addresses.
Write Mode (RWN = 0)
The master generates 16 total clock cycles at SCL. The
master outputs a total of 16 bits (MSB first) to the SDA
line at the falling edge of the clock. The master closes
the transmission by setting CSEL to 0. Figure 5 shows
the interface timing.
Table 3. Digital Communication Word Structure
BIT
15
14
13
12
11
10
Register Address
9
8
7
6
RWN
5
4
3
2
Data that is written or read
Table 4. Register Descriptions and Addresses
ADDRESS
NAME
H0x05
TXCTRL
Transmitter Control Register
FUNCTION
H0x06
TXSTAT1
Transmitter Status Register 1
H0x07
TXSTAT2
Transmitter Status Register 2
H0x08
SET_IBIAS
Bias Current Setting Register
H0x09
SET_IMOD
Modulation Current Setting Register
H0x0A
IMODMAX
Maximum Modulation Current Setting Register
H0x0B
IBIASMAX
Maximum Bias Current Setting Register
H0x0C
MODINC
Modulation Current Increment Setting Register
H0x0D
BIASINC
Bias Current Increment Setting Register
H0x0E
MODECTRL
H0x0F
SET_PWCTRL
Pulse-Width Control Register
H0x10
SET_TXDE
Deemphasis Control Register
H0x11
SET_TXEQ
Equalization Control Register
Mode Control Register
16 �������������������������������������������������������������������������������������
1
0
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
MAX3946
WRITE MODE
CSEL
tL
tT
tCH
SCL
0
tCL
1
2
3
4
5
6
7
8
9
A4
A3
A2
A1
A0
RWN
D7
D6
10
11
12
13
14
15
tDS
SDA
A6
A5
D5
D4
D3
D2
D1
D0
tDH
READ MODE
CSEL
tL
tCH
SCL
0
tT
tCL
1
2
3
4
5
6
7
8
9
10
tDS
SDA
A6
A5
A4
11
12
13
14
15
tD
A3
A2
A1
A0
RWN
D7
D6
D5
D4
D3
D2
D1
D0
tDH
Figure 5. Timing for 3-Wire Digital Interface
Transmitter Control Register (TXCTRL)
Bit #
7
6
Name
X
X
Default Value
X
X
5
4
TXDE_MD[1] TXDE_MD[0]
0
3
2
1
0
TXEQ_EN
SOFTRES
TX_POL
TX_EN
0
0
1
1
0
ADDRESS
H0x05
Bits 5 and 4: TXDE_MD[1:0]. Controls the mode of the transmit output deemphasis circuitry.
00 = deemphasis is fixed at 6.25% of the modulation amplitude
01 = deemphasis is fixed at 3.125% of the modulation amplitude
10 = deemphasis is programmed by the SET_TXDE register setting
11 = deemphasis is at its maximum of approximately 9%
Bit 3: TXEQ_EN. Enables or disables the input equalization circuitry.
0 = disabled
1 = enabled
Bit 2: SOFTRES. Resets all registers to their default values (the DISABLE pin must be at a logic 1 during a write to
SOFTRES for the registers to be set to their default values).
0 = normal
1 = reset
Bit 1: TX_POL. Controls the polarity of the signal path.
0 = inverse
1 = normal
Bit 0: TX_EN. Enables or disables the output circuitry.
0 = disabled
1 = enabled
______________________________________________________________________________________ 17
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Transmitter Status Register 1 (TXSTAT1)
Bit #
Name
Default Value
7
(STICKY)
6
(STICKY)
5
(STICKY)
4
(STICKY)
3
(STICKY)
2
(STICKY)
1
(STICKY)
0
(STICKY)
FST[7]
FST[6]
X
FST[4]
FST[3]
FST[2]
FST[1]
TX_FAULT
X
X
X
X
X
X
X
X
ADDRESS
H0x06
Bit 7: FST[7]. When the VCCT supply voltage is below 2.3V, the POR circuitry reports a fault. Once the VCCT supply
voltage is above 2.75V, the POR resets all registers to their default values and the fault is cleared.
Bit 6: FST[6]. When the voltage at BMON is above VCC - 0.5V, a SOFT FAULT is reported.
Bit 4: FST[4]. When the voltage at BMAX goes above 1.3V, a HARD FAULT is reported.
Bit 3: FST[3]. When the common-mode voltage at VTOUTQ goes below VCC - 1.3V, a SOFT FAULT is reported.
Bit 2: FST[2]. When the voltage at VTOUTQ goes below VCC - 0.8V, a HARD FAULT is reported.
Bit 1: FST[1]. When the BIAS voltage goes below 0.44V, a HARD FAULT is reported.
Bit 0: TX_FAULT. Copy of a FAULT signal in FST[7:6] and FST[4:1]. A POR resets the FST bits to 0.
Transmitter Status Register 2 (TXSTAT2)
Bit #
7
6
5
4
3
(STICKY)
2
(STICKY)
1
(STICKY)
0
(STICKY)
Name
X
X
X
X
IMODERR
IBIASERR
TXED
X
Default Value
X
X
X
X
X
X
X
X
ADDRESS
H0x07
Bit 3: IMODERR. Any attempt to modify SET_IMOD[8:1] above IMODMAX[7:0] flags a warning at IMODERR. (See the
Programming Modulation Current section.)
Bit 2: IBIASERR. Any attempt to modify SET_IBIAS[8:1] above IBIASMAX[7:0] flags a warning at IBIASERR. (See the
Programming Bias Current section.)
Bit 1: TXED. This indicates the absence of an AC signal at the transmit input.
Bias Current Setting Register (SET_IBIAS)
Bit #
Name
Default Value
7
6
5
4
3
2
1
0
SET_IBIAS SET_IBIAS SET_IBIAS SET_IBIAS SET_IBIAS SET_IBIAS SET_IBIAS SET_IBIAS
[8] (MSB)
[7]
[6]
[5]
[4]
[3]
[2]
[1]
0
0
0
0
0
0
0
ADDRESS
H0x08
1
Bits 7 to 0: SET_IBIAS[8:1]. The bias current DAC is controlled by a total of 9 bits. The SET_IBIAS[8:1] bits are used
to set the bias current with even denominations from 0 to 510 bits. The LSB (SET_IBIAS[0]) is controlled by the BIASINC
register and is used to set the odd denominations in the SET_IBIAS[8:0]. Any direct write to SET_IBIAS[8:1] resets the
LSB.
18 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Bit #
Name
Default Value
7
6
5
4
3
2
1
0
SET_IMOD SET_IMOD SET_IMOD SET_IMOD SET_IMOD SET_IMOD SET_IMOD SET_IMOD
[8] (MSB)
[7]
[6]
[5]
[4]
[3]
[2]
[1]
0
0
0
0
0
1
0
ADDRESS
H0x09
0
Bits 7 to 0: SET_IMOD[8:1]. The modulation current DAC is controlled by a total of 9 bits. The SET_IMOD[8:1] bits
are used to set the modulation current with even denominations from 0 to 510 bits. The LSB (SET_IMOD[0]) is controlled by the MODINC register and is used to set the odd denominations in the SET_IMOD[8:0]. Any direct write to
SET_IMOD[8:1] resets the LSB.
Maximum Modulation Current Setting Register (IMODMAX)
Bit #
Name
Default Value
7
6
5
4
3
2
1
0
IMODMAX IMODMAX IMODMAX IMODMAX IMODMAX IMODMAX IMODMAX IMODMAX
[7] (MSB)
[6]
[5]
[4]
[3]
[2]
[1]
[0] (LSB)
0
0
1
0
0
0
0
ADDRESS
H0x0A
0
Bits 7 to 0: IMODMAX[7:0]. The IMODMAX register is an 8-bit register that can be used to limit the maximum modulation current. IMODMAX[7:0] is continuously compared to SET_IMOD[8:1]. Any attempt to modify SET_IMOD[8:1] above
IMODMAX[7:0] is ignored and flags a warning at IMODERR.
Maximum Bias Current Setting Register (IBIASMAX)
Bit #
Name
Default Value
7
6
5
4
3
2
1
0
ADDRESS
IBIASMAX
[7] (MSB)
IBIASMAX
[6]
IBIASMAX
[5]
IBIASMAX
[4]
IBIASMAX
[3]
IBIASMAX
[2]
IBIASMAX
[1]
IBIASMAX
[0] (LSB)
H0x0B
0
0
1
0
0
0
0
0
Bits 7 to 0: IBIASMAX[7:0]. The IBIASMAX register is an 8-bit register that can be used to limit the maximum bias
current. IBIASMAX[7:0] is continuously compared to SET_IBIAS[8:1]. Any attempt to modify SET_IBIAS[8:1] above
IBIASMAX[7:0] is ignored and flags a warning at IBIASERR.
Modulation Current Increment Setting Register (MODINC)
Bit #
Name
Default Value
7
SET_IMOD
[0] (LSB)
0
6
5
4
3
2
1
0
ADDRESS
X
X
MODINC
[4] (MSB)
MODINC
[3]
MODINC
[2]
MODINC
[1]
MODINC
[0] (LSB)
H0x0C
0
0
0
0
0
0
0
Bit 7: SET_IMOD[0]. This is the LSB of the SET_IMOD[8:0] bits. This bit can only be updated by the use of MODINC[4:0].
Bits 4 to 0: MODINC[4:0]. This string of bits is used to increment or decrement the modulation current. When written
to, the SET_IMOD[8:0] bits are updated. MODINC[4:0] are a two’s complement string.
______________________________________________________________________________________ 19
MAX3946
Modulation Current Setting Register (SET_IMOD)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Bias Current Increment Setting Register (BIASINC)
Bit #
Name
7
SET_IBIAS
[0] (LSB)
0
Default Value
6
5
4
3
2
1
0
ADDRESS
X
X
BIASINC
[4] (MSB)
BIASINC
[3]
BIASINC
[2]
BIASINC
[1]
BIASINC
[0] (LSB)
H0x0D
0
0
0
0
0
0
0
Bit 7: SET_IBIAS[0]. This is the LSB of the SET_IBIAS[8:0] bits. This bit can only be updated by the use of BIASINC[4:0].
Bits 4 to 0: BIASINC[4:0]. This string of bits is used to increment or decrement the bias current. When written to, the
SET_IBIAS[8:0] bits are updated. BIASINC[4:0] are a two’s complement string.
Mode Control Register (MODECTRL)
Bit #
Name
7
6
5
4
3
2
1
0
MODECTRL
MODECTRL
MODECTRL
MODECTRL
MODECTRL
MODECTRL
MODECTRL
MODECTRL
[7] (MSB)
[6]
[5]
[4]
[3]
[2]
[1]
[0] (LSB)
0
0
0
0
0
0
0
0
Default Value
ADDRESS
H0x0E
Bits 7 to 0: MODECTRL[7:0]. The MODECTRL register enables the user to switch between normal and setup modes.
The setup mode is achieved by setting this register to H0x12. MODECTRL must be updated before each write operation. Exceptions are MODINC and BIASINC, which can be updated in normal mode.
Pulse-Width Control Register (SET_PWCTRL)
Bit #
7
6
5
4
Name
X
X
X
X
Default Value
X
X
X
X
3
2
1
0
ADDRESS
SET_PWCTRL SET_PWCTRL SET_PWCTRL SET_PWCTRL
[3] (MSB)
[2]
[1]
[0] (LSB)
0
0
0
0
H0x0F
Bits 3 to 0: SET_PWCTRL[3:0]. This is a 4-bit register used to control the eye crossing by adjusting the pulse width.
Deemphasis Control Register (SET_TXDE)
Bit #
7
6
Name
X
X
Default Value
X
X
5
4
3
2
1
0
SET_TXDE SET_TXDE SET_TXDE SET_TXDE SET_TXDE SET_TXDE
[5] (MSB)
[4]
[3]
[2]
[1]
[0] (LSB)
0
0
0
0
0
ADDRESS
H0x10
1
Bits 5 to 0: SET_TXDE[5:0]. This is a 6-bit register used to control the amount of deemphasis on the transmitter output.
When calculating the total modulation current, the amount of deemphasis must be taken into account. The deemphasis
is set as a percentage of modulation current.
Equalization Control Register (SET_TXEQ)
Bit #
7
6
5
4
3
Name
X
X
X
X
X
Default Value
X
X
X
X
X
2
1
SET_TXEQ SET_TXEQ
[2]
[1]
0
0
0
X
ADDRESS
H0x11
X
Bits 2 to 1: SET_TXEQ[2:1]. These 2 bits are used to control the amount of equalization on the transmitter input. See
Table 1 for more information.
20 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Programming Bias Current
1) IBIASMAX[7:0] = Maximum_Bias_Current_Value
2) SET_IBIASi[8:1] = Initial_Bias_Current_Value
Note: The total bias current is calculated using the
SET_IBIAS[8:0] DAC value. SET_IBIAS[8:1] are the bits
that can be manually written. SET_IBIAS[0] can only be
updated using the BIASINC register.
When implementing an APC loop it is recommended to
use the BIASINC register, which guarantees the fastest
bias current update.
3) BIASINCi[4:0] = New_Increment_Value
4) If (SET_IBIASi[8:1] P IBIASMAX[7:0]), then (SET_
IBIASi[8:0] = SET_IBIASi-1[8:0] + BIASINCi[4:0])
5) Else (SET_IBIASi[8:0] = SET_IBIASi-1[8:0])
The total bias current can be calculated as follows:
6) IBIAS = [SET_IBIASi[8:0] + 16] x 200FA
Programming Modulation Current
1) IMODMAX[7:0] = Maximum_Modulation_Current_Value
2) SET_IMODi[8:1] = Initial_Modulation_Current_Value x 1.06
Note: The total modulation laser current is calculated
using the SET_IMOD[8:0] DAC value and the SET_TXDE
register value. SET_IMOD[8:1] are the bits that can be
manually written. SET_IMOD[0] can only be updated
using the MODINC register.
When implementing modulation compensation, it is recommended to use the MODINC register, which guarantees the fastest modulation current update.
3) MODINCi[4:0] = New_Increment_Value
4) If (SET_IMODi[8:1] P IMODMAX[7:0]), then (SET_
IMODi[8:0] = SET_IMODi-1[8:0] + MODINCi[4:0])
5) Else (SET_IMODi[8:0] = SET_IMODi-1[8:0])
The following equations give the modulation current
(peak-to-peak) seen at the laser when driven differentially. REXTD is the differential load impedance of the
laser plus any added series resistance.
6a) TXDE_MD[1:0] = 00, then
0.3mA(SET_IMOD[8 : 0] + 16) 
50Ω
×
IMOD = 
50Ω + R LD
− 0.15mA(SET_IMOD[8 : 3] + 2)
6b) TXDE_MD[1:0] = 01, then
0.3mA(SET_IMOD[8 : 0] + 16) 
50Ω
×
IMOD = 
− 0.15mA(SET_IMOD[8 : 4] + 1) 50Ω + R LD
6c) T
XDE_MD[1:0] = 10, then set SET_TXDE[5:0] can be
set to any value ≥ SET_IMOD[8:4] and
0.3mA(SET_IMOD[8 : 0] + 16) 
50Ω
×
IMOD = 
− 0.15mA(SET_TXDE[5:0] + 1) 50Ω + R LD
When SET_TXDE[5:0] is increased, the deemphasis
current increases and the overall peak-to-peak modulation current decreases. This effect saturates when
SET_TXDE[5:0] = 0.2 x (SET_IMOD[8:0] + 16) - 1, and
further increases to SET_TXDE[5:0] do not increase the
deemphasis current.
6d) TXDE_MD[1:0] = 11, then
IMOD = 0.9 × 0.3mA(SET_IMOD[8 : 0] + 16) ×
50Ω
50Ω + RLD
Note: When TXDE_MD[1:0] = 10 and the SET_TXDE
register is set by the user, the minimum allowed deemphasis is 3% and the maximum is 10%. These limits are
internally set by the MAX3946.
Programming Transmit Output Deemphasis
1) TXDE_MD[1:0] = Transmit_Deemphasis_Mode
2) S
ET_TXDE[5:0] = Transmit_Deemphasis_Value. If
TXDE_MD[1:0] = 00, 01, or 11, the value of SET_TXDE
is automatically set by the device and there is no
need to enter data to SET_TXDE.
For Transmit_Deemphasis_Mode:
00 = deemphasis is fixed at 6% of the modulation amplitude (the device controls the SET_TXDE value), default
setting
01 = deemphasis is fixed at 3% of the modulation amplitude (the device controls the SET_TXDE value)
10 = deemphasis is programmed by the SET_TXDE
register setting
11 = deemphasis is at its maximum of approximately 9%
(the device controls the SET_TXDE value)
______________________________________________________________________________________ 21
MAX3946
Design Procedure
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Programming Pulse-Width Control
pulse-width distortion. The code of 1111 corresponds to
a balanced state for differential output. The pulse-width
distortion is bidirectional around the balanced state (see
the Typical Operating Characteristics section).
The eye crossing at the Tx output can be adjusted using
the SET_PWCTRL register. Table 5 shows these settings. The sign of the number specifies the direction of
Applications Information
Table 5. Eye-Crossing Settings for
SET_PWCTRL
Laser Safety and IEC 825
SET_PWCTRL[3:0]
PWD
SET_PWCTRL[3:0]
PWD
1000
-7
0111
8
1001
-6
0110
7
1010
-5
0101
6
1011
-4
0100
5
1100
-3
0011
4
1101
-2
0010
3
1110
-1
0001
2
1111
0
0000
1
Using the MAX3946 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Each user must determine the level of
fault tolerance required by the application, recognizing
that Maxim products are neither designed nor authorized
for use as components in systems intended for surgical
implant into the body, for applications intended to support or sustain life, or for any other application in which
the failure of a Maxim product could create a situation
where personal injury or death could occur.
Table 6. Register Summary
REGISTER
FUNCTION/
ADDRESS
Transmitter
Control Register
Address =
H0x05
Transmitter
Status Register 1
Address =
H0x06
REGISTER
NAME
TXCTRL
TXSTAT1
NORMAL
MODE
SETUP
MODE
BIT
NUMBER/
TYPE
BIT NAME
DEFAULT
VALUE
R
RW
5
TXDE_MD[1]
0
MSB deemphasis mode
R
RW
4
TXDE_MD[0]
0
LSB deemphasis mode
R
RW
3
TXEQ_EN
0
Input equalization
0: disabled, 1: enabled
R
RW
2
SOFTRES
0
Global digital reset
R
RW
1
TX_POL
1
Tx polarity
0: inverse, 1: normal
R
RW
0
TX_EN
1
Tx control
0: disabled, 1: enabled
R
R
7 (sticky)
FST[7]
X
TX_PORàTX_VCC lowlimit violation
R
R
6 (sticky)
FST[6]
X
BMON open/shorted to
VCC
R
R
4 (sticky)
FST[4]
X
BMAX current exceeded
or open/short to ground
R
R
3 (sticky)
FST[3]
X
VTOUT+/- common-mode
low-limit
R
R
2 (sticky)
FST[2]
X
VTOUT+/- low-limit violation
R
R
1 (sticky)
FST[1]
X
BIAS open or shorted to
ground
R
R
0 (sticky)
TX_FAULT
X
Copy of FAULT signal
in case POR bits 6 to 1
reset to 0
NOTES
22 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
REGISTER
FUNCTION/
ADDRESS
Transmitter
Status Register 2
Address =
H0x07
Bias Current
Setting Register
Address =
H0x08
REGISTER
NAME
TXSTAT2
SET_IBIAS
NORMAL
MODE
SETUP
MODE
BIT
NUMBER/
TYPE
BIT NAME
DEFAULT
VALUE
NOTES
R
R
3 (sticky)
IMODERR
X
Warning increment result
> IMODMAX
R
R
2 (sticky)
IBIASERR
X
Warning increment result
> IBIASMAX
R
R
1 (sticky)
TXED
X
Tx edge detection
R
RW
7
SET_IBIAS[8]
0
MSB bias DAC
R
RW
6
SET_IBIAS[7]
0
R
RW
5
SET_IBIAS[6]
0
R
RW
4
SET_IBIAS[5]
0
R
RW
3
SET_IBIAS[4]
0
R
RW
2
SET_IBIAS[3]
0
R
RW
1
SET_IBIAS[2]
0
R
RW
0
SET_IBIAS[1]
1
7
SET_IBIAS[0]
0
LSB bias DAC
MSB modulation DAC
Accessible through
REG_ADDR = H0x0D
Modulation
Current Setting
Register
Address =
H0x09
SET_IMOD
R
RW
7
SET_IMOD[8]
0
R
RW
6
SET_IMOD[7]
0
R
RW
5
SET_IMOD[6]
0
R
RW
4
SET_IMOD[5]
0
R
RW
3
SET_IMOD[4]
0
R
RW
2
SET_IMOD[3]
1
R
RW
1
SET_IMOD[2]
0
R
RW
0
SET_IMOD[1]
0
7
SET_IMOD[0]
0
LSB modulation DAC
MSB modulation limit
Accessible through
REG_ADDR = H0x0C
Maximum
Modulation
Current Setting
Register
Address =
H0x0A
Maximum Bias
Current Setting
Register
Address =
H0x0B
IMODMAX
IBIASMAX
R
RW
7
IMODMAX[7]
0
R
RW
6
IMODMAX[6]
0
R
RW
5
IMODMAX[5]
1
R
RW
4
IMODMAX[4]
0
R
RW
3
IMODMAX[3]
0
R
RW
2
IMODMAX[2]
0
R
RW
1
IMODMAX[1]
0
R
RW
0
IMODMAX[0]
0
LSB modulation limit
R
RW
7
IBIASMAX[7]
0
MSB bias limit
R
RW
6
IBIASMAX[6]
0
R
RW
5
IBIASMAX[5]
1
R
RW
4
IBIASMAX[4]
0
R
RW
3
IBIASMAX[3]
0
R
RW
2
IBIASMAX[2]
0
R
RW
1
IBIASMAX[1]
0
R
RW
0
IBIASMAX[0]
0
LSB bias limit
______________________________________________________________________________________ 23
MAX3946
Table 6. Register Summary (continued)
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Table 6. Register Summary (continued)
REGISTER
FUNCTION/
ADDRESS
Modulation
Current
Increment
Setting Register
Address =
H0x0C
Bias Current
Increment
Setting Register
Address =
H0x0D
Mode Control
Register
Address =
H0x0E
Pulse-Width
Control Register
Address =
H0x0F
Deemphasis
Control Register
Address = H0x10
Equalization
Control Register
Address = H0x11
REGISTER
NAME
MODINC
BIASINC
MODECTRL
SET_
PWCTRL
SET_TXDE
SET_TXEQ
NORMAL
MODE
SETUP
MODE
BIT
NUMBER/
TYPE
BIT NAME
DEFAULT
VALUE
NOTES
R
R
7
SET_IMOD[0]
0
LSB of SET_IMOD DAC
register address = H0x09
RW
RW
4
MODINC[4]
0
MSB MOD DAC two’s
complement
RW
RW
3
MODINC[3]
0
RW
RW
2
MODINC[2]
0
RW
RW
1
MODINC[1]
0
RW
RW
0
MODINC[0]
0
LSB MOD DAC two’s
complement
R
R
7
SET_IBIAS[0]
0
LSB of SET_IBIAS DAC
register address = H0x08
RW
RW
4
BIASINC[4]
0
MSB bias DAC two’s
complement
RW
RW
3
BIASINC[3]
0
RW
RW
2
BIASINC[2]
0
RW
RW
1
BIASINC[1]
0
RW
RW
0
BIASINC[0]
0
LSB bias DAC two’s
complement
RW
RW
7
MODECTRL[7]
0
MSB mode control
RW
RW
6
MODECTRL[6]
0
RW
RW
5
MODECTRL[5]
0
RW
RW
4
MODECTRL[4]
0
RW
RW
3
MODECTRL[3]
0
RW
RW
2
MODECTRL[2]
0
RW
RW
1
MODECTRL[1]
0
RW
RW
0
MODECTRL[0]
0
LSB mode control
R
RW
3
SET_PWCTRL[3]
0
MSB Tx pulse-width
control
R
RW
2
SET_PWCTRL[2]
0
R
RW
1
SET_PWCTRL[1]
0
R
RW
0
SET_PWCTRL[0]
0
LSB Tx pulse-width control
R
RW
5
SET_TXDE[5]
0
MSB Tx deemphasis
R
RW
4
SET_TXDE[4]
0
R
RW
3
SET_TXDE[3]
0
R
RW
2
SET_TXDE[2]
0
R
RW
1
SET_TXDE[1]
0
R
RW
0
SET_TXDE[0]
1
R
RW
2
SET_TXEQ[2]
0
R
RW
1
SET_TXEQ[1]
0
LSB Tx deemphasis
Tx equalization
24 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
DEEMPHASIS
CONTROL
25I
25I
TOUT+
TIN+
TOUT50I
CONTROL
LOOP
50I
TIN-
VEET
VCCD
VEET
VCCD
VCCD
FAULT
7.5kI
75kI
CLAMP
DISABLE
SDA
SCL, CSEL
75kI
VEET
VEET
VEET
VEET
Figure 6. Simplified I/O Structures
Layout Considerations
The data inputs and outputs are the most critical paths
for the device and great care should be taken to minimize discontinuities on these transmission lines between
the connector and the IC. Here are some suggestions for
maximizing the performance of the IC:
• T
he data inputs should be wired directly between the
module connector and IC without stubs.
• T
he data transmission lines to the laser should be kept
as short as possible and be designed for 50I differential or 25I single-ended characteristic impedance.
• A
n uninterrupted ground plane should be positioned
beneath the high-speed I/Os.
• G
round path vias should be placed close to the IC and
the input/output interfaces to allow a return current
path to the IC and the laser.
• M
aintain 100I differential transmission line impedance into the IC.
• U
se good high-frequency layout techniques and multilayer boards with an uninterrupted ground plane to
minimize EMI and crosstalk.
Refer to the schematic and board layers of the MAX3946
Evaluation Kit (MAX3946EVKIT) for more information.
Exposed-Pad Package and
Thermal Considerations
The exposed pad on the 24-pin TQFN provides a very
low-thermal resistance path for heat removal from the IC.
The pad is also electrical ground on the IC and must be
soldered to the circuit board ground for proper thermal
and electrical performance. Refer to Application Note 862:
HFAN-08.1: Thermal Considerations of QFN and Other
Exposed-Paddle Packages for additional information.
______________________________________________________________________________________ 25
MAX3946
VCCT
VCCT
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Typical Application Circuit for 10GBASE-LRM
HOST BOARD
SFP+ OPTICAL TRANSCEIVER
SFP CONNECTOR
HOST FILTER
VCC (3.3V)
SUPPLY FILTER
VCC
VCCD
ZDIFF = 100I
VCCT
0.1µF
TOUTTIN+
TIN-
FR4 MICROSTRIP UP
TO 5.5in
TOUT+
0.1µF
10G FP-TOSA
BIAS
MAX3946
BMAX
BMON
3-WIRE
INTERFACE
FAULT
0.1µF
R2
R1
SCL
SDA
CSEL
DISABLE
VEET
VCC
SerDes
4.7kI TO 10kI
TX_FAULT
DS1878
SFP CONTROLLER
TX_DISABLE
RATE SELECT
MODE_DEF1 (SCL)
MODE_DEF2 (SDA)
SOFTWARE
3-WIRE
INTERFACE
ADC
I2C
RPD
VCC
HOST FILTER
VCC (3.3V)
ZDIFF = 100I
0.1µF
FR4 MICROSTRIP UP
TO 12in
0.1µF
10G LINEAR PIN ROSA
SUPPLY FILTER
RMON
26 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
SFP CONNECTOR
HOST BOARD
HOST FILTER
SFP+ OPTICAL TRANSCEIVER
VCC (3.3V)
SUPPLY FILTER
VCC
VCCD
ZDIFF = 100I
VCCT
0.1µF
TOUTTIN+
TIN-
FR4 MICROSTRIP UP
TO 5.5in
TOUT+
0.1µF
10G DFBTOSA
BIAS
MAX3946
11.3G FP/DFB
LDD
0.1µF
BMAX
BMON
R2
3-WIRE
INTERFACE
FAULT
R1
SCL
SDA
CSEL
DISABLE
VEET
VCC
SerDes
4.7kI TO 10kI
TX_FAULT
SOFTWARE
3-WIRE
INTERFACE
DS1878
SFP CONTROLLER
RATE SELECT
TX_DISABLE
MODE_DEF1 (SCL)
MODE_DEF2 (SDA)
ADC
I2C
RPD
VCC
HOST FILTER
VCC (3.3V)
SUPPLY FILTER
VCCR
CAZ
VCC
3-WIRE
INTERFACE
4.7kI TO 10kI
SCL
SDA
CSEL
RPMIN
LOS
ZDIFF = 100I
LOS
0.1µF
MAX3945
11.3G LAM
ROUT+
0.1µF
RMON
RIN0.1µF
ROUTFR4 MICROSTRIP UP
TO 12in
0.1µF
RIN+
VEE
10G PIN ROSA
______________________________________________________________________________________ 27
MAX3946
Typical Application Circuit for 10GBASE-LR
MAX3946
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
Chip Information
PROCESS: SiGe BiPOLAR
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TQFN-EP
T2444+3
21-0139
90-0021
28 �������������������������������������������������������������������������������������
1Gbps to 11.3Gbps, SFP+ Laser Driver
with Laser Impedance Mismatch Tolerance
REVISION
NUMBER
REVISION
DATE
0
3/10
Initial release
5/11
Changed the title from 1.0625Gbps to 1Gbps; changed the edge speed from 20ps
to 22ps in the General Description and Features; added the Package Thermal
Characteristics section; updated graphs 2, 10, 16, and 17 and replaced graphs 6
and 7 in the Typical Operating Characteristics section; updated the BIAS (requires
a 0.1µF capacitor to VEET) and CSEL (pulled down to VEET rather than GND) pin
descriptions in the Pin Description table; updated Figure 2 SCL and CSEL connections; changed the increment value range from -8 to +7 LSBs to -16 to +15 LSBs in
the Bias Current DAC and Modulation Current DAC sections; changed the ground
symbols to VEET in Figure 4; updated the Transmitter Control Register (TXCTRL)
bit 2 (SOFTRES) description; updated Figure 6, Typical Application Circuit for
10GBASE-LRM, and Typical Application Circuit for 10GBASE-LR; added the land
pattern no. to the Package Information table
1
DESCRIPTION
PAGES
CHANGED
—
1, 2, 7, 8, 10,
11, 12, 14, 17,
25–28
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
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Maxim Integrated Products 29
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