19-5331; Rev 2; 6/11 TION KIT EVALUA BLE IL AVA A Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers Features The MAX5974_ provide control for wide-input-voltage, active-clamped, current-mode PWM, forward converters in Power-over-Ethernet (PoE) powered device (PD) applications. The MAX5974A/MAX5974C are well-suited for universal or telecom input range, while the MAX5974B/ MAX5974D also accommodate low input voltage down to 10.5V. S Peak Current-Mode Control, Active-Clamped Forward PWM Controller S Regulation Without Optocoupler (MAX5974A/ MAX5974B) S Internal 1% Error Amplifier S 100kHz to 600kHz Programmable Q8% Switching Frequency, Synchronization Up to 1.2MHz S Programmable Frequency Dithering for Low-EMI, Spread-Spectrum Operation S Programmable Dead Time, PWM Soft-Start, Current Slope Compensation S Programmable Feed-Forward Maximum DutyCycle Clamp, 80% Maximum Limit S Frequency Foldback for High-Efficiency LightLoad Operation S Internal Bootstrap UVLO with Large Hysteresis S 100µA (typ) Startup Supply Current S Fast Cycle-by-Cycle Peak Current-Limit, 35ns Typical Propagation Delay S 115ns Current-Sense Internal Leading-Edge Blanking S Output Short-Circuit Protection with Hiccup Mode S Reverse Current Limit to Prevent Transformer Saturation Due to Reverse Current S Internal 18V Zener Clamp on Supply Input S 3mm x 3mm, Lead-Free, 16-Pin TQFN-EP The devices include several features to enhance supply efficiency. The AUX driver recycles magnetizing current instead of wasting it in a dissipative clamp circuit. Programmable dead time between the AUX and main driver allows for zero-voltage switching (ZVS). Under lightload conditions, the devices reduce the switching frequency (frequency foldback) to reduce switching losses. The MAX5974A/MAX5974B feature unique circuitry to achieve output regulation without using an optocoupler, while the MAX5974C/MAX5974D utilize the traditional optocoupler feedback method. An internal error amplifier with a 1% reference is very useful in nonisolated design, eliminating the need for an external shunt regulator. The devices feature a unique feed-forward maximum duty-cycle clamp that makes the maximum clamp voltage during transient conditions independent of the line voltage, allowing the use of a power MOSFET with lower breakdown voltage. The programmable frequency dithering feature provides low-EMI, spread-spectrum operation. The MAX5974_ are available in 16-pin TQFN-EP packages and are rated for operation over the -40°C to +85°C temperature range. Applications PoE IEEE® 802.3af/at Powered Devices High-Power PD (Beyond the 802.3af/at Standard) Active-Clamped Forward DC-DC Converters IP Phones Wireless Access Nodes Security Cameras Ordering Information/Selector Guide UVLO THRESHOLD (V) FEEDBACK MODE MAX5974AETE+ PART TOP MARK +AHY 16 TQFN-EP* PIN-PACKAGE 16 Sample/Hold MAX5974BETE+ +AHZ 16 TQFN-EP* 8.4 Sample/Hold MAX5974CETE+ +AIA 16 TQFN-EP* 16 Continuously Connected MAX5974DETE+ +AIB 16 TQFN-EP* 8.4 Continuously Connected Note: All devices are specified over the -40°C to +85°C operating temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. IEEE is a registered service mark of the Institute of Electrical and Electronics Engineers, Inc. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX5974A/MAX5974B/MAX5974C/MAX5974D General Description MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers ABSOLUTE MAXIMUM RATINGS IN to GND (VEN = 0V)............................................-0.3V to +26V EN, NDRV, AUXDRV to GND......................-0.3V to (VIN + 0.3V) RT, DT, FFB, COMP, SS, DCLMP, DITHER/SYNC to GND..................................................................-0.3V to +6V FB to GND (MAX5974A/MAX5974B only)...................-6V to +6V FB to GND (MAX5974C/MAX5974D only)...............-0.3V to +6V CS, CSSC to GND....................................................-0.8V to +6V PGND to GND.......................................................-0.3V to +0.3V Maximum Input/Output Current (continuous) IN, NDRV, AUXDRV.......................................................100mA NDRV, AUXDRV (pulsed for less than 100ns)................... Q1A Continuous Power Dissipation (TA = +70NC) (Note 1) 16-Pin TQFN (derate 20.8mW/NC above +70NC)........1666mW Operating Temperature Range........................... -40NC to +85NC Maximum Junction Temperature......................................+150NC Storage Temperature Range............................. -65NC to +150NC Lead Temperature (soldering, 10s).................................+300NC Soldering Temperature (reflow).......................................+260NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) Junction-to-Ambient Thermal Resistance (BJA)...............48NC/W Junction-to-Case Thermal Resistance (BJC)......................7NC/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = +2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, CIN = 1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS MAX5974A/ MAX5974C 15.4 16 16.5 MAX5974B/ MAX5974D 8 8.4 8.85 6.65 7 7.35 V 17 18.5 20 V VIN = +15V (for MAX5974A/ MAX5974C); VIN = +7.5V (for MAX5974B/MAX5974D), when in bootstrap UVLO 100 150 FA IC VIN = +12V 1.8 3 mA VENR VEN rising 1.17 1.215 1.26 VENF VEN falling 1.09 1.14 1.19 UNDERVOLTAGE LOCKOUT/STARTUP (IN) Bootstrap UVLO Wakeup Level Bootstrap UVLO Shutdown Level IN Clamp Voltage IN Supply Current in Undervoltage Lockout IN Supply Current After Startup VINUVR VINUVF VIN_CLAMP ISTART VIN rising VIN falling IIN = 2mA (sinking) V ENABLE (EN) Enable Threshold Input Current IEN 1 V FA OSCILLATOR (RT) RT Bias Voltage VRT NDRV Switching Frequency Range fSW 2 1.23 100 V 600 kHz Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = +2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, CIN = 1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NDRV Switching Frequency Accuracy Maximum Duty Cycle -8 DMAX fSW = 250kHz 79 80 +8 % 82 % SYNCHRONIZATION (SYNC) Synchronization Logic-High Input VIH-SYNC 2.91 fSYNCIN 1.1 x fSW Synchronization Pulse Width Synchronization Frequency Range V 50 Maximum Duty Cycle During Synchronization ns 2x fSW DMAX x fSYNC/ fSW kHz % DITHERING RAMP GENERATOR (DITHER) Charging Current VDITHER = 0V 45 50 55 FA Discharging Current VDITHER = 2.2V 43 50 57 FA Ramp’s High Trip Point 2 V Ramp’s Low Trip Point 0.4 V SOFT-START AND RESTART (SS) Charging Current ISS-CH ISS-D Discharging Current Discharge Threshold to Disable Hiccup and Restart Minimum Restart Time During Hiccup Mode Normal Operating High Voltage Duty-Cycle Control Range ISS-DH 9.5 10 10.5 FA VSS = 2V, normal shutdown 0.65 1.34 2 mA (VEN < VENF or VIN < VINUVF), VSS = 2V, hiccup mode discharge for tRSTRT (Note 3) 1.6 2 2.4 FA VSS-DTH 0.15 V tRSTRT-MIN 1024 Clock Cycles VSS-HI VSS-DMAX 5 DMAX (typ) = (VSS-DMAX/2.43V) 0 V 2 V nA DUTY-CYCLE CLAMP (DCLMP) DCLMP Input Current IDCLMP VDCLMP = 0 to 5V VDCLMP = 0.5V Duty-Cycle Control Range VDCLMP-R DMAX (typ) = 1 - (VDCLMP/2.43V) -100 0 +100 73 75.4 77.5 VDCLMP = 1V 54 56 58 VDCLMP = 2V 14.7 16.5 18.3 % NDRV DRIVER Pulldown Impedance RNDRV-N INDRV (sinking) = 100mA 1.9 3.4 I Pullup Impedance RNDRV-P INDRV (sourcing) = 50mA 4.7 8.3 I Peak Sink Current 1 Peak Source Current A 0.65 A Fall Time tNDRV-F CNDRV = 1nF 14 ns Rise Time tNDRV-R CNDRV = 1nF 27 ns 3 MAX5974A/MAX5974B/MAX5974C/MAX5974D ELECTRICAL CHARACTERISTICS (continued) MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers ELECTRICAL CHARACTERISTICS (continued) (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = +2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, CIN = 1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS AUXDRV DRIVER Pulldown Impedance RAUX-N IAUXDRV (sinking) = 50mA 4.3 7.7 I Pullup Impedance RAUX-P IAUXDRV (sourcing) = 25mA 10.6 18.9 I Peak Sink Current 0.5 Peak Source Current 0.3 A A Fall Time tAUX-F CAUXDRV = 1nF 24 ns Rise Time tAUX-R CAUXDRV = 1nF 45 ns 1.215 V DEAD-TIME PROGRAMMING (DT) DT Bias Voltage VDT NDRV to AUXDRV Delay (Dead Time) tDT From NDRV falling to AUXDRV falling RDT = 10kI From AUXDRV rising to NDRV rising RDT = 10kI RDT = 100kI RDT = 100kI 40 410 ns 300 350 310 360 420 375 393 410 mV -118 -100 -88 mV 40 ns CURRENT-LIMIT COMPARATOR (CS) Cycle-by-Cycle Peak Current-Limit Threshold VCS-PEAK Cycle-by-Cycle Reverse Current-Limit Threshold VCS-REV Current-Sense Blanking Time for Reverse Current Limit tCS-BLANKREV Number of Consecutive Peak Current-Limit Events to Hiccup NHICCUP Current-Sense Leading-Edge Blanking Time tCS-BLANK Propagation Delay from Comparator Input to NDRV tPDCS Minimum On-Time Turns AUXDRV off for the remaining cycle if reverse current limit is exceeded From AUXDRV falling edge 115 ns 8 Events From NDRV rising edge 115 ns From CS rising (10mV overdrive) to NDRV falling (excluding leading-edge blanking) 35 ns tON-MIN 100 150 200 ns 47 52 58 FA SLOPE COMPENSATION (CSSC) Slope Compensation Current Ramp Height Current ramp’s peak added to CSSC input per switching cycle PWM COMPARATOR Comparator Offset Voltage VPWM-OS VCOMP - VCSSC 1.35 1.7 2 V Current-Sense Gain ACS-PWM DVCOMP/DVCSSC (Note 4) 3.1 3.33 3.6 V/V Current-Sense Leading-Edge Blanking Time Comparator Propagation Delay 4 tCSSC-BLANK tPWM From NDRV rising edge 115 ns Change in VCSSC = 10mV (including internal leading-edge blanking) 150 ns Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = +2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, CIN = 1FF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX MAX5974A/ MAX5974B 1.5 1.52 1.54 MAX5974C/ MAX5974D 1.202 1.215 1.227 MAX5974A/ MAX5974B -250 +250 MAX5974C/ MAX5974D -500 +100 UNITS ERROR AMPLIFIER FB Reference Voltage FB Input Bias Current Voltage Gain Transconductance Transconductance Bandwidth VREF IFB VFB when ICOMP = 0, VCOMP = 2.5V VFB = 0 to 1.75V AEAMP nA gM BW V Open loop (typical gain = 1) -3dB frequency 80 dB MAX5974A/ MAX5974B 1.8 2.55 3.2 MAX5974C/ MAX5974D 1.8 2.66 3.5 mS MAX5974A/ MAX5974B 2 MAX5974C/ MAX5974D 30 MHz Source Current VFB = 1V, VCOMP = 2.5V 300 375 455 FA Sink Current VFB = 1.75V, VCOMP = 1V 300 375 455 FA FREQUENCY FOLDBACK (FFB) VCSAVG-to-FFB Comparator Gain FFB Bias Current NDRV Switching Frequency During Foldback IFFB fSW-FB 10 VFFB = 0V, VCS = 0V (not in FFB mode) 26 30 fSW/2 V/V 33 FA kHz Note 2: All devices are 100% production tested at TA = +25NC. Limits over temperature are guaranteed by design. Note 3: See the Output Short-Circuit Protection with Hiccup Mode section. Note 4: The parameter is measured at the trip point of latch with VFB = 0V. Gain is defined as DVCOMP/DVCSSC for 0.15V < DVCSSC < 0.25V. 5 MAX5974A/MAX5974B/MAX5974C/MAX5974D ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = 2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, unless otherwise noted.) IN UVLO WAKE-UP LEVEL vs. TEMPERATURE IN UVLO WAKE-UP LEVEL vs. TEMPERATURE 16.0 15.9 8.4 8.3 8.2 8.1 15.8 8.0 15.7 -15 10 35 60 -15 -40 85 10 35 60 7.2 7.1 7.0 6.9 6.8 85 -40 -15 60 TEMPERATURE (°C) EN RISING THRESHOLD vs. TEMPERATURE EN FALLING THRESHOLD vs. TEMEPRATURE UVLO SHUTDOWN CURRENT vs. TEMPERATURE 1.214 1.148 1.147 1.146 1.145 120 MAX5974A/MAX5974C 100 80 1.144 MAX5974B/MAX5974D 1.143 1.210 60 1.142 -15 10 35 60 85 -15 -40 10 35 60 -40 85 -15 10 35 60 TEMPERATURE (°C) SUPPLY CURRENT vs. SUPPLY VOLTAGE (MAX5974A/MAX5974C) SUPPLY CURRENT vs. SUPPLY VOLTAGE (MAX5974B/MAX5974D) SUPPLY CURRENT vs. SWITCHING FREQUENCY 100 1000 100 TA = -40°C 10 TA = -40°C 10 0 2 4 6 8 10 12 14 16 18 20 TEMPERATURE (°C) 0 2 4 6 8 10 12 14 16 18 20 TEMPERATURE (°C) 2.4 85 MAX5974A/B/C/D toc09 TA = +85°C 2.0 SUPPLY CURRENT (mA) 1000 10,000 SUPPLY CURRENT (µA) TA = +85°C MAX5974A/B/C/D toc08 TEMPERATURE (°C) MAX5974A/B/C/D toc07 TEMPERATURE (°C) 10,000 85 MAX5974A/B/C/D toc06 1.149 140 UVLO CURRENT (µA) 1.216 1.150 MAX5974A/B/C/D toc05 MAX5974A/B/C/D toc04 1.218 1.212 6 35 TEMPERATURE (°C) 1.220 -40 10 TEMPERATURE (°C) EN FALLING THRESHOLD (V) -40 EN RISING THRESHOLD (V) 8.5 7.3 MAX5974A/B/C/D toc03 16.1 MAX5974B/MAX5974D IN UVLO SHUTDOWN LEVEL 16.2 8.6 IN UVLO SHUTDOWN LEVEL vs. TEMPERATURE MAX5974A/B/C/D toc02 MAX5974A/MAX5974C IN UVLO WAKE-UP LEVEL (V) MAX5974A/B/C/D toc01 IN UVLO WAKE-UP LEVEL (V) 16.3 SUPPLY CURRENT (µA) MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers 1.6 1.2 0.8 0.4 0 0 100 200 300 400 500 600 700 800 SWITCHING FREQUENCY (kHz) Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers SWITCHING FREQUENCY vs. RRT VALUE 10.03 10.02 10.01 10.00 9.99 -15 10 35 60 248 247 246 10 85 244 100 -40 35 60 FREQUENCY DITHERING vs. RDITHER MAXIMUM DUTY CYCLE vs. SWITCHING FREQUENCY MAXIMUM DUTY CYCLE vs. TEMPERATURE 4 2 81 80 79 78 77 80.9 76 400 500 600 700 800 900 80.7 80.6 80.5 80.4 80.2 0 1000 80.8 80.3 75 0 100 200 300 400 500 600 700 800 -40 -15 10 35 60 SWITCHING FREQUENCY (kHz) TEMPERATURE (°C) MAXIMUM DUTY CYCLE vs. SYNC FREQUENCY MAXIMUM DUTY CYCLE vs. VSS MAXIMUM DUTY CYCLE vs. VDCLMP 25 20 15 10 80 70 60 50 40 30 20 5 10 0 0 300 350 400 SYNC FREQUENCY (kHz) 450 500 100 85 MAX5974A/B/C/D toc18 90 90 MAXIMUM DUTY CYCLE (%) 30 MAX5974A/B/C/D toc17 35 100 MAXIMUM DUTY CYCLE (%) MAX5974A/B/C/D toc16 RDITHER (kΩ) VSS = 0.5V 85 MAX5974A/B/C/D toc15 MAX5974A/B/C/D toc14 82 81.0 MAXIMUM DUTY CYCLE (%) 6 83 MAXIMUM DUTY CYCLE (%) MAX5974A/B/C/D toc13 8 250 10 TEMPERATURE (°C) 10 300 -15 RRT VALUE (kΩ) 12 40 249 TEMPERATURE (°C) 14 45 250 245 10 -40 FREQUENCY DITHERING (%) 251 9.98 9.97 MAXIMUM DUTY CYCLE (%) 100 252 MAX5974A/B/C/D toc12 10.04 MAX5974A/B/C/D toc11 10.05 1000 SWITCHING FREQUENCY (kHz) MAX5974A/B/C/D toc10 SOFT-START CHARGING CURRENT (µA) 10.06 SWITCHING FREQUENCY vs. TEMPERATURE SWITCHING FREQUENCY (kHz) SOFT-START CHARGING CURRENT vs. TEMPERATURE 80 70 60 50 40 30 20 10 0 0 0.5 1.0 1.5 VSS (V) 2.0 2.5 0 0.5 1.0 1.5 2.0 2.5 VDCLMP (V) 7 MAX5974A/MAX5974B/MAX5974C/MAX5974D Typical Operating Characteristics (continued) (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = 2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, unless otherwise noted.) Typical Operating Characteristics (continued) (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = 2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, unless otherwise noted.) 250 200 150 94 92 100 50 90 0 88 10 20 30 40 50 60 70 80 396 395 394 393 392 391 390 389 388 -40 90 100 397 -15 10 35 60 85 -40 110 -15 10 35 60 RDT VALUE (kΩ) TEMPERATURE (°C) TEMPERATURE (°C) REVERSE CURRENT-LIMIT THRESHOLD vs. TEMPERATURE SLOPE COMPENSATION CURRENT vs. TEMPERATURE NDRV MINIMUM ON-TIME vs. TEMPERATURE -101 -102 -103 -104 -105 -106 -107 -15 10 35 60 52.5 52.0 51.5 51.0 160 155 150 140 -40 -15 10 35 60 85 -40 -15 10 35 TEMPERATURE (°C) TEMPERATURE (°C) CURRENT-SENSE GAIN vs. TEMPERATURE FEEDBACK VOLTAGE vs. TEMPERATURE FEEDBACK VOLTAGE vs. TEMPERATURE 3.37 3.36 3.35 3.34 3.33 1.219 1.218 1.217 1.216 1.215 1.214 1.213 3.32 1.212 3.31 1.211 3.30 MAX5974C/MAX5974D 10 35 TEMPERATURE (°C) 60 85 85 60 85 1.522 1.521 1.520 1.519 1.518 1.517 1.210 -15 60 MAX5974A/B/C/D toc27 3.38 1.220 FEEDBACK VOLTAGE (V) MAX5974A/B/C/D toc25 3.39 MAX5974A/B/C/D toc26 TEMPERATURE (°C) 3.40 -40 165 145 50.5 50.0 85 FEEDBACK VOLTAGE (V) -40 53.0 85 MAX5974A/B/C/D toc24 -100 53.5 170 NDRV MINIMUM ON-TIME (ns) -99 54.0 MAX5974A/B/C/D toc23 -98 SLOPE COMPENSATION CURRENT (mA) MAX5974A/B/C/D toc22 -97 REVERSE CURRENT-LIMIT THRESHOLD (mV) 96 MAX5974A/B/C/D toc21 98 398 PEAK CURRENT-LIMIT THRESHOLD (mV) 100 DEAD TIME (ns) 300 MAX5974A/B/C/D toc20 350 DEAD TIME (ns) 102 MAX5974A/B/C/D toc19 400 8 PEAK CURRENT-LIMIT THRESHOLD vs. TEMPERATURE DEAD TIME vs. TEMPERATURE DEAD TIME vs. RDT VALUE CURRENT-SENSE GAIN (V/V) MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers -40 -15 10 35 TEMPERATURE (°C) 60 85 1.516 -40 -15 10 35 TEMPERATURE (°C) Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers TRANSCONDUCTANCE HISTOGRAM (MAX5974A/MAX5974B) 2.6 20 2.5 2.4 MAX5974A/MAX5974B 15 20 N (%) 2.7 25 MAX5974A/B/C/D toc29 MAX5974C/MAX5974D N (%) TRANSCONDUCTANCE (mS) 2.9 2.8 25 MAX5974A/B/C/D toc28 3.0 TRANSCONDUCTANCE HISTOGRAM (MAX5974C/MAX5974D) MAX5974A/B/C/D toc30 TRANSCONDUCTANCE vs. TEMPERATURE 15 10 10 5 5 2.3 2.2 2.1 2.0 -40 -15 10 35 60 85 0 0 2.44 2.46 2.48 2.50 2.52 2.54 2.56 2.58 2.60 2.62 2.64 2.56 2.58 2.60 2.62 2.64 2.66 2.68 2.70 2.72 2.74 2.76 TRANSCONDUCTANCE (mS) TRANSCONDUCTANCE (mS) TEMPERATURE (°C) SHUTDOWN RESPONSE ENABLE RESPONSE MAX5974A/B/C/D toc31 MAX5974A/B/C/D toc32 VEN 5V/div VEN 5V/div VNDRV 10V/div VNDRV 10V/div VAUXDRV 10V/div VAUXDRV 10V/div VOUT 5V/div 100µs/div 200µs/div VSS RAMP RESPONSE VDCLMP RAMP RESPONSE MAX5974A/B/C/D toc33 10µs/div VOUT 5V/div MAX5974A/B/C/D toc34 VSS 2V/div VDCLMP 2V/div VNDRV 10V/div VNDRV 10V/div VAUXDRV 10V/div VAUXDRV 10V/div 10µs/div 9 MAX5974A/MAX5974B/MAX5974C/MAX5974D Typical Operating Characteristics (continued) (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = 2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, unless otherwise noted.) MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers Typical Operating Characteristics (continued) (VIN = 12V (for MAX5974A/MAX5974C, bring VIN up to 17V for startup), VCS = VCSSC = VDITHER/SYNC = VFB = VFFB = VDCLMP = VGND, VEN = 2V, NDRV = AUXDRV = SS = COMP = unconnected, RRT = 34.8kI, RDT = 25kI, unless otherwise noted.) NDRV 10% TO 90% RISE TIME NDRV 90% TO 10% FALL TIME MAX5974A/B/C/D toc35 AUXDRV 10% TO 90% RISE TIME MAX5974A/B/C/D toc36 MAX5974A/B/C/D toc37 0ns 27.6ns 45.6ns VNDRV 2V/div VNDRV 2V/div 13.8ns 0ns 10ns/div VAUXDRV 2V/div 0ns 10ns/div 10ns/div AUXDRV 90% TO 10% FALL TIME PEAK NDRV CURRENT MAX5974A/B/C/D toc38 MAX5974A/B/C/D toc39 PEAK SOURCE CURRENT 0ns VAUXDRV 2V/div INDRV 0.5A/div 21ns PEAK SINK CURRENT 10ns/div 200ns/div PEAK AUXDRV CURRENT SHORT-CURRENT BEHAVIOR MAX5974A/B/C/D toc40 MAX5974A/B/C/D toc41 15V VIN 5V/div PEAK SOURCE CURRENT 5V IAUXDRV 0.2A/div VNDRV 10V/div VCS 500mV/div PEAK SINK CURRENT 400ns/div 10 40ms/div Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers AUXDRV NDRV PGND CS TOP VIEW 12 11 10 9 IN 13 MAX5974A MAX5974B MAX5974C MAX5974D EN 14 DCLMP 15 EP 2 3 4 FFB DT 1 RT + DITHER/ SYNC SS 16 8 CSSC 7 GND 6 FB 5 COMP THIN QFN Pin Description PIN NAME FUNCTION 1 DT Dead-Time Programming Resistor Connection. Connect resistor RDT from DT to GND to set the desired dead time between the NDRV and AUXDRV signals. See the Dead Time section to calculate the resistor value for a particular dead time. 2 DITHER/ SYNC Frequency Dithering Programming or Synchronization Connection. For spread-spectrum frequency operation, connect a capacitor from DITHER to GND and a resistor from DITHER to RT. To synchronize the internal oscillator to the externally applied frequency, connect DITHER/SYNC to the synchronization pulse. 3 RT Switching Frequency Programming Resistor Connection. Connect resistor RRT from RT to GND to set the PWM switching frequency. See the Oscillator/Switching Frequency section to calculate the resistor value for the desired oscillator frequency. 4 FFB Frequency Foldback Threshold Programming Input. Connect a resistor from FFB to GND to set the output average current threshold below which the converter folds back the switching frequency to 1/2 of its original value. Connect to GND to disable frequency foldback. 5 COMP Transconductance Amplifier Output and PWM Comparator Input. COMP is level shifted down and connected to the inverting input of the PWM comparator. 11 MAX5974A/MAX5974B/MAX5974C/MAX5974D Pin Configuration Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers MAX5974A/MAX5974B/MAX5974C/MAX5974D Pin Description (continued) PIN 12 NAME FUNCTION 6 FB 7 GND Transconductance Amplifier Inverting Input Signal Ground 8 CSSC Current Sense with Slope Compensation Input. A resistor connected from CSSC to CS programs the amount of slope compensation. See the Programmable Slope Compensation section. 9 CS Current-Sense Input. Current-sense connection for average current sense and cycle-by-cycle current limit. Peak current-limit trip voltage is 400mV and reverse current-limit trip voltage is -100mV. 10 PGND Power Ground. PGND is the return path for gate-driver switching currents. 11 NDRV Main Switch Gate-Driver Output 12 AUXDRV 13 IN Converter Supply Input. IN has wide UVLO hysteresis, enabling the design of efficient power supplies. See the Enable Input section to determine if an external zener diode is required at IN. 14 EN Enable Input. The gate drivers are disabled and the device is in a low-power UVLO mode when the voltage on EN is below VENF. When the voltage on EN is above VENR, the device checks for other enable conditions. See the Enable Input section for more information about interfacing to EN. 15 DCLMP Feed-Forward Maximum Duty-Cycle Clamp Programming Input. Connect a resistive divider between the input supply voltage DCLMP and GND. The voltage at DCLMP sets the maximum duty cycle (DMAX) of the converter inversely proportional to the input supply voltage, so that the MOSFET remains protected during line transients. 16 SS Soft-Start Programming Capacitor Connection. Connect a capacitor from SS to GND to program the soft-start period. This capacitor also determines hiccup mode current-limit restart time. A resistor from SS to GND can also be used to set the DMAX below 75%. — EP Exposed Pad. Internally connected to GND. Connect to a large ground plane to maximize thermal performance. Not intended as an electrical connection point. pMOS Active Clamp Switch Gate-Driver Output. AUXDRV can also be used to drive a pulse transformer for synchronous flyback application. 1 3 DT RT SYNC PGND DRIVER 0.5A/-0.3A VC PGND DRIVER 1A/-0.65A 4 2 7 10 FFB DITHER/ SYNC GND PGND VB VB AUXDRV NDRV OSCILLATOR -50µA 50µA/ 90µA 30µA/ 15 20% < DMAX < 80% 12 AUXDRV DCLMP 11 NDRV FFB COMP SS DEAD TIME DEAD-TIME CONTROL 2V/400mV VCSAVG 10X POK NDRV BLANKING PULSE REVERSE ILIM LIMIT TURNS OFF AUX IMMEDIATELY DRIVER LOGIC VB POK VSS < 150mV R S 5V REGULATOR MAX5974A MAX5974B QCLR QSET ENABLE COUNT 8 EVENTS THERMAL SHUTDOWN PWM COMP PEAK ILIM COMP 1.215V R1 18V VB 115ns BLANKING 115ns BLANKING 2 x R1 400mV -100mV UVLO 2µA 1.52V SLOPE COMPENSATION LOW-POWER UVLO VINUVR = 16V (MAX5974A) VINUVR = 8.4V (MAX5974B) VINUVF = 7V gM VB VB POK S/H 2mA 10µA 14 EN 13 IN 6 FB 5 COMP 8 CSSC 9 CS 16 SS Block Diagrams 13 MAX5974A/MAX5974B/MAX5974C/MAX5974D VC HICCUP LATCH REVERSE ILIM COMP VB Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers 14 1 3 DT RT SYNC PGND DRIVER 0.5A/-0.3A VC PGND DRIVER 1A/-0.65A 4 2 7 10 FFB DITHER/ SYNC GND PGND VB VB AUXDRV NDRV OSCILLATOR -50µA 50µA/ 90µA 30µA/ 15 20% < DMAX < 80% 12 AUXDRV DCLMP 11 NDRV VC FFB COMP SS DEAD TIME DEAD-TIME CONTROL 2V/400mV VCSAVG 10X POK NDRV BLANKING PULSE REVERSE ILIM LIMIT TURNS OFF AUX IMMEDIATELY DRIVER LOGIC VB POK VSS < 150mV R S 5V REGULATOR MAX5974C MAX5974D QCLR QSET ENABLE COUNT 8 EVENTS REVERSE ILIM COMP HICCUP LATCH THERMAL SHUTDOWN PWM COMP PEAK ILIM COMP 1.215V R1 18V VB 115ns BLANKING 115ns BLANKING 2 x R1 400mV -100mV UVLO 2µA 1.215V SLOPE COMPENSATION LOW-POWER UVLO VINUVR = 16V (MAX5974C) VINUVR = 8.4V (MAX5974D) VINUVF = 7V gM VB VB POK VB 2mA 10µA 14 EN 13 IN 6 FB 5 COMP 8 CSSC 9 CS 16 SS MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers Block Diagrams (continued) Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers The MAX5974A/MAX5974B/MAX5974C/MAX5974D are optimized for controlling a 25W to 50W active-clamped, self-driven synchronous rectification forward converter in continuous-conduction mode. The main switch gate driver (NDRV) and the active-clamped switch driver (AUXDRV) are sized to optimize efficiency for 25W design. The features-rich devices are ideal for PoE IEEE 802.3af/at-powered devices. The MAX5974A/MAX5974C offer a 16V bootstrap UVLO wake-up level with a 9V wide hysteresis. The low startup and operating currents allow the use of a smaller storage capacitor at the input without compromising startup and hold times. The MAX5974A/MAX5974C are well-suited for universal input (rectified 85V AC to 265V AC) or telecom (-36V DC to -72V DC) power supplies. The MAX5974B/MAX5974D have a UVLO rising threshold of 8.4V and can accommodate for low-input voltage (12V DC to 24V DC) power sources such as wall adapters. Power supplies designed with the MAX5974A/MAX5974C use a high-value startup resistor, RIN, that charges a reservoir capacitor, CIN (see the Typical Application Circuits). During this initial period, while the voltage is less than the internal bootstrap UVLO threshold, the device typically consumes only 100FA of quiescent current. This low startup current and the large bootstrap UVLO hysteresis help to minimize the power dissipation across RIN even at the high end of the universal AC input voltage (265V AC). Feed-forward maximum duty-cycle clamping detects changes in line conditions and adjusts the maximum duty cycle accordingly to eliminate the clamp voltage’s (i.e., the main power FET’s drain voltage) dependence on the input voltage. For EMI-sensitive applications, the programmable frequency dithering feature allows up to Q10% variation in the switching frequency. This spread-spectrum modulation technique spreads the energy of switching harmonics over a wider band while reducing their peaks, helping to meet stringent EMI goals. The devices include a cycle-by-cycle current limit that turns off the main and AUX drivers whenever the internally set threshold of 400mV is exceeded. Eight consecutive occurrences of current-limit events trigger hiccup mode, which protects external components by halting switching for a period of time (tRSTRT) and allowing the overload current to dissipate in the load and body diode of the synchronous rectifier before soft-start is reattempted. The reverse current-limit feature of the devices turns the AUX driver off for the remaining off period when VCS exceeds the -100mV threshold. This protects the transformer core from saturation due to excess reverse current under some extreme transient conditions. Current-Mode Control Loop The advantages of current-mode control over voltagemode control are twofold. First, there is the feed-forward characteristic brought on by the controller’s ability to adjust for variations in the input voltage on a cycle-by-cycle basis. Second, the stability requirements of the current-mode controller are reduced to that of a single-pole system, unlike the double pole in voltage-mode control. The devices use a current-mode control loop where the scaled output of the error amplifier (COMP) is compared to a slope-compensated current-sense signal at CSSC. Input Clamp When the device is enabled, an internal 18V input clamp is active. During an overvoltage condition, the clamp prevents the voltage at the supply input IN from rising above 18.5V (typ). When the device is disabled, the input clamp circuitry is also disabled. Enable Input The enable input is used to enable or disable the device. Driving EN low disables the device. Note that the internal 18V input clamp is also disabled when EN is low. Therefore, an external 18V zener diode is needed for certain operating conditions as described below. 15 MAX5974A/MAX5974B/MAX5974C/MAX5974D Detailed Description MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers UVLO on Power Source The enable input has an accurate threshold of 1.26V (max). For applications that require a UVLO on the power source, connect a resistive divider from the power source to EN to GND as shown in Figure 1. A zener diode between IN and PGND is required to prevent the NDRV and AUXDRV gate-drive voltages from exceeding 20V, the maximum allowed gate voltage of power FETs. The external zener diode should clamp in the following range: 20V > VZ > VUVLO(MAX) where VZ is the zener voltage and VUVLO(MAX) is the maximum wakeup level (16.5V or 8.85V depending on the device version). An 18V zener diode is the best choice. Design the resistive divider by first selecting the value of REN1 to be on the order of 100kω. Then calculate REN2 as follows: VEN2 = R EN1 × UVLO threshold for the power source, below which the device is disabled. The digital output connected to EN should be capable of withstanding more than the maximum supply voltage. MCU Control of Enable Input When using a microcontroller GPIO to control the enable input, an 18V zener diode is required on IN as shown in Figure 2. High-Voltage Logic Control of Enable Input In the case where EN is externally controlled by a highvoltage open-drain/collector output (e.g., PGOOD indicator of a powered device controller), connect IN to EN through a resistor REN and connect EN to an open-drain or open-collector output as shown in Figure 3. Select REN such that the voltage at IN, when EN is low, is less than 20V (i.e., the maximum gate voltage of the main and AUX FETs): VS(MAX) × VEN(MAX) VS(UVLO) _ VEN(MAX) where VEN(MAX) is the maximum enable threshold voltage and is equal to 1.26V and VS(UVLO) is the desired R EN < 20V R EN + RIN where VS(MAX) is the maximum supply voltage. Obeying this relationship eliminates the need for an external zener diode. The digital output connected to EN should be capable of withstanding more than 20V. VS VS RIN RIN IN 18V IN CIN 18V MAX5974 REN1 CIN MAX5974_ MCU DIGITAL CONTROL EN N EN REN2 Figure 1. Programmable UVLO for the Power Source 16 I/O Figure 2. MCU Control of the Enable Input Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers RIN Startup Operation The device starts up when the voltage at IN exceeds 16V (MAX5974A/MAX5974C) or 8.4V (MAX5974B/MAX5974D) and the enable input voltage is greater than 1.26V. IN CIN REN MAX5974 DIGITAL CONTROL EN N Figure 3. High-Voltage Logic Control of the Enable Input VS RIN IN MAX5974_ CIN EN Figure 4. Always-On Operation Always-On Operation For always-on operation, connect EN to IN as shown in Figure 4. No external zener diode is needed for this configuration. Bootstrap Undervoltage Lockout The devices have an internal bootstrap UVLO that is very useful when designing high-voltage power supplies (see the Block Diagrams). This allows the device to bootstrap itself during initial power-up. The MAX5974A/MAX5974C soft-start when VIN exceeds the bootstrap UVLO threshold of VINUVR (16V typ). During normal operation, the voltage at IN is normally derived from a tertiary winding of the transformer (MAX5974C/MAX5974D). However, at startup there is no energy being delivered through the transformer; hence, a special bootstrap sequence is required. In the Typical Application Circuits, CIN charges through the startup resistor, RIN, to an intermediate voltage. Only 100FA of the current supplied through RIN is used by the ICs, the remaining input current charges CIN until VIN reaches the bootstrap UVLO wake-up level. Once VIN exceeds this level, NDRV begins switching the n-channel MOSFET and transfers energy to the secondary and tertiary outputs. If the voltage on the tertiary output builds to higher than 7V (the bootstrap UVLO shutdown level), then startup has been accomplished and sustained operation commences. If VIN drops below 7V before startup is complete, the device goes back to low-current UVLO. In this case, increase the value of CIN in order to store enough energy to allow for the voltage at the tertiary winding to build up. While the MAX5974A/MAX5974B derive their input voltage from the coupled inductor output during normal operation, the startup behavior is similar to that of the MAX5974C/MAX5974D. Soft-Start A capacitor from SS to GND, CSS, programs the softstart time. VSS controls the oscillator duty cycle during startup to provide a slow and smooth increase of the duty cycle to its steady-state value. Calculate the value of CSS as follows: I ×t C SS = SS-CH SS 2V where ISS-CH (10FA typ) is the current charging CSS during soft-start and tSS is the programmed soft-start time. A resistor can also be added from the SS pin to GND to clamp VSS < 2V and, hence, program the maximum duty cycle to be less than 80% (see the Duty-Cycle Clamping section). 17 MAX5974A/MAX5974B/MAX5974C/MAX5974D Because the MAX5974B/MAX5974D are designed for use with low-voltage power sources such as wall adapters outputting 12V to 24V, they have a lower UVLO wake-up threshold of 8.4V. VS MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers n-Channel MOSFET Gate Driver The NDRV output drives an external n-channel MOSFET. NDRV can source/sink in excess of 650mA/1000mA peak current; therefore, select a MOSFET that yields acceptable conduction and switching losses. The external MOSFET used must be able to withstand the maximum clamp voltage. Dead Time Dead time between the main and AUX output edges allow ZVS to occur, minimizing conduction losses and improving efficiency. The dead time (tDT) is applied to both leading and trailing edges of the main and AUX outputs as shown in Figure 5. Connect a resistor between DT and GND to set tDT to any value between 40ns and 400ns: p-Channel MOSFET Gate Driver The AUXDRV output drives an external p-channel MOSFET with the aid of a level shifter. The level shifter consists of CAUX, RAUX, and D5 as shown in the Typical Application Circuits. When AUXDRV is high, CAUX is recharged through D5. When AUXDRV is low, the gate of the p-channel MOSFET is pulled below the source by the voltage stored on CAUX, turning on the pFET. Add a zener diode between gate to source of the external n-channel and p-channel MOSFETs after the gate resistors to protect VGS from rising above its absolute maximum rating during transient condition (see the Typical Application Circuits). R DT = 10kΩ × t DT 40ns Oscillator/Switching Frequency The ICs’ switching frequency is programmable between 100kHz and 600kHz with a resistor RRT connected between RT and GND. Use the following formula to determine the appropriate value of RRT needed to generate the desired output-switching frequency (fSW): R RT = 8.7 × 10 9 fSW where fSW is the desired switching frequency. BLANKING, tBLK NDRV AUXDRV DEAD TIME, tDT Figure 5. Dead Time Between AUXDRV and NDRV 18 Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers R CS = 400mV IPRI where IPRI is the peak current in the primary side of the transformer, which also flows through the MOSFET. When the voltage produced by this current (through the current-sense resistor) exceeds the current-limit comparator threshold, the MOSFET driver (NDRV) terminates the current on-cycle, within 35ns (typ). The devices implement 115ns of leading-edge blanking to ignore leading-edge current spikes. These spikes are caused by reflected secondary currents, currentdischarging capacitance at the FET’s drain, and gatecharging current. Use a small RC network for additional filtering of the leading-edge spike on the sense waveform when needed. Set the corner frequency between 10MHz and 20MHz. After the leading-edge blanking time, the device monitors VCS for any breaches of the peak current limit of VCSBL (BLANKED CS VOLTAGE) 400mV. The duty cycle is terminated immediately when VCS exceeds 400mV. Reverse Current Limit The devices protect the transformer against saturation due to reverse current by monitoring the voltage across RCS while the AUX output is low and the p-channel FET is on. Output Short-Circuit Protection with Hiccup Mode When the device detects eight consecutive peak currentlimit events, both NDRV and AUXDRV driver outputs are turned off for a restart period, tRSTRT. After tRSTRT, the device undergoes soft-start. The duration of the restart period depends on the value of the capacitor at SS (CSS). During this period, CSS is discharged with a pulldown current of ISS-DH (2FA typ). Once its voltage reaches 0.15V, the restart period ends and the device initiates a soft-start sequence. An internal counter ensures that the minimum restart period (tRSTRT-MIN) is 1024 clock cycles when the time required for CSS to discharge to 0.15V is less than 1024 clock cycles. Figure 6 shows the behavior of the device prior and during hiccup mode. Frequency Foldback for High-Efficiency Light-Load Operation The frequency foldback threshold can be programmed from 0 to 20% of the full load current using a resistor from FFB to GND. VCS-PEAK (400mV) HICCUP DISCHARGE WITH ISS-DH VSS-HI SOFT-START VOLTAGE, VSS VSS-DTH tSS tRSTRT Figure 6. Hiccup Mode Timing Diagram 19 MAX5974A/MAX5974B/MAX5974C/MAX5974D Peak Current Limit The current-sense resistor (RCS in the Typical Application Circuits), connected between the source of the n-channel MOSFET and PGND, sets the current limit. The current-limit comparator has a voltage trip level (VCS-PEAK) of 400mV. Use the following equation to calculate the value of RCS: MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers When VCSAVG falls below VFFB, the device folds back the switching frequency to 1/2 the original value to reduce switching losses and increase the converter efficiency. Calculate the value of RFFB as follows: R FFB = 10 × ILOAD(LIGHT) × R CS IFFB where RFFB is the resistor between FFB and GND, ILOAD(LIGHT) is the current at light-load conditions that triggers frequency foldback, RCS is the value of the sense resistor connected between CS and PGND, and IFFB is the current sourced from FFB to RFFB (30FA typ). Duty-Cycle Clamping The maximum duty cycle is determined by the lowest of three voltages: 2V, the voltage at SS (VSS), and the voltage (2.43V - VDCLMP). The maximum duty cycle is calculated as: V D MAX = MIN 2.43V where VMIN = minimum (2V, VSS, 2.43V - VDCLMP). SS By connecting a resistor between SS and ground, the voltage at SS can be made to be lower than 2V. VSS is calculated as follows: VSS = R SS × I SS-CH where RSS is the resistor connected between SS and GND, and ISS-CH is the current sourced from SS to RSS (10FA typ). DCLMP To set DMAX using supply voltage feed-forward, connect a resistive divider between the supply voltage, DCLMP, and GND as shown in the Typical Application Circuits. This feed-forward duty-cycle clamp ensures that the external n-channel MOSFET is not stressed during supply transients. VDCLMP is calculated as follows: VDCLMP = R DCLMP2 × VS R DCLMP1 + R DCLMP2 where RDCLMP1 and RDCLMP2 are the resistive divider values shown in the Typical Application Circuits and VS is the input supply voltage. 20 Oscillator Synchronization The internal oscillator can be synchronized to an external clock by applying the clock to DITHER/SYNC directly. The external clock frequency can be set anywhere between 1.1x to 2x the internal clock frequency. Using an external clock increases the maximum duty cycle by a factor equal to fSYNC/fSW. This factor should be accounted for in setting the maximum duty cycle using any of the methods described in the Duty-Cycle Clamping section. The formula below shows how the maximum duty cycle is affected by the external clock frequency: D MAX = VMIN fSYNC × 2.43V fSW where VMIN is described in the Duty-Cycle Clamping section, fSW is the switching frequency as set by the resistor connected between RT and GND, and fSYNC is the external clock frequency. Frequency Dithering for SpreadSpectrum Applications (Low EMI) The switching frequency of the converter can be dithered in a range of Q10% by connecting a capacitor from DITHER/SYNC to GND, and a resistor from DITHER/SYNC to RT as shown in the Typical Application Circuits. This results in lower EMI. A current source at DITHER/SYNC charges the capacitor CDITHER to 2V at 50FA. Upon reaching this trip point, it discharges CDITHER to 0.4V at 50FA. The charging and discharging of the capacitor generates a triangular waveform on DITHER/SYNC with peak levels at 0.4V and 2V and a frequency that is equal to: fTRI = 50µA C DITHER × 3.2V Typically, fTRI should be set close to 1kHz. The resistor RDITHER connected from DITHER/SYNC to RT determines the amount of dither as follows: %DITHER = R RT 4 × 3 RDITHER where %DITHER is the amount of dither expressed as a percentage of the switching frequency. Setting RDITHER to 10 x RRT generates Q10% dither. Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers m= R CSSC × 50µA × fSW 80% where m is the ramp rate of the slope-compensation signal, RCSSC is the value of the resistor connected between CSSC and CS used to program the ramp rate, and fSW is the switching frequency. Error Amplifier The MAX5974A/MAX5974B include an internal error amplifier with a sample-and-hold input. The feedback input of the MAX5974C/MAX5974D is continuously connected. The noninverting input of the error amplifier is connected to the internal reference and feedback is provided at the inverting input. High open-loop gain and unity-gain bandwidth allow good closed-loop bandwidth and transient response. Calculate the power-supply output voltage using the following equation: R + R FB2 VOUT = VREF × FB1 R FB2 where VREF = 1.52V for the MAX5974A/MAX5974B and VREF = 1.215V for the MAX5974C/MAX5974D. The amplifier’s noninverting input is internally connected to a soft-start circuit that gradually increases the reference voltage during startup. This forces the output voltage to come up in an orderly and well-defined manner under all load conditions. Applications Information Startup Time Considerations The bypass capacitor at IN, CIN, supplies current immediately after the devices wake up (see the Typical Application Circuits). Large values of CIN increase the startup time, but also supply gate charge for more cycles during initial startup. If the value of CIN is too small, VIN drops below 7V because NDRV does not have enough time to switch and build up sufficient voltage across the tertiary output (MAX5974C/MAX5974D) or coupled inductor output (MAX5974A/MAX5974B), which powers the device. The device goes back into UVLO and does not start. Use a low-leakage capacitor for CIN. Typically, offline power supplies keep startup times to less than 500ms even in low-line conditions (85V AC input for universal offline or 36V DC for telecom applications). Size the startup resistor, RIN, to supply both the maximum startup bias of the device (150FA) and the charging current for CIN. CIN must be charged to 16V within the desired 500ms time period. CIN must store enough charge to deliver current to the device for at least the soft-start time (tSS) set by CSS. To calculate the approximate amount of capacitance required, use the following formula: IG = Q GTOT fSW (I + I )(t ) CIN = IN G SS VHYST where IIN is the ICs’ internal supply current (1.8mA) after startup, QGTOT is the total gate charge for the n-channel and p-channel FETs, fSW is the ICs’ switching frequency, VHYST is the bootstrap UVLO hysteresis (9V typ), and tSS is the soft-start time. RIN is then calculated as follows: RIN ≅ VS(MIN) − VINUVR I START where VS(MIN) is the minimum input supply voltage for the application (36V for telecom), VINUVR is the bootstrap UVLO wake-up level (16V), and ISTART is the IN supply current at startup (150FA max). 21 MAX5974A/MAX5974B/MAX5974C/MAX5974D Programmable Slope Compensation The device generates a current ramp at CSSC such that its peak is 50FA at 80% duty cycle of the oscillator. An external resistor connected from CSSC to the CS then converts this current ramp into programmable slopecompensation amplitude, which is added to the currentsense signal for stability of the peak current-mode control loop. The ramp rate of the slope compensation signal is given by: MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers Choose a higher value for RIN than the one calculated above if a longer startup time can be tolerated in order to minimize power loss on this resistor. Active Clamp Circuit Traditional clamp circuits prevent transformer saturation by channeling the magnetizing current (IM) of the transformer onto a dissipative RC network. To improve efficiency, the active clamp circuit recycles IM between the magnetizing inductance and clamp capacitor. VCLAMP is given by: VCLAMP = 2π L MAG × C CLAMP where VS is the voltage of the power source and D is the duty cycle. To select n-channel and p-channel FETs with adequate breakdown voltages, use the maximum value of VCLAMP. VCLAMP(MAX) occurs when the input voltage is at its minimum and the duty cycle is at its maximum. VCLAMP(MAX-NORMAL) during normal operation is therefore: VS(MIN) NP × VO 1− N S × VS(MIN) where VS(MIN) is the minimum voltage of the power source, NP/NS is the primary to secondary turns ratio, and VO is the output voltage. The clamp capacitor, n-channel, and p-channel FETs must have breakdown voltages exceeding this level. If feed-forward maximum duty-cycle clamp is used then: V V D MAX-FF = MIN = 1 − DCLMP 2.43 2.43 V RDCLMP2 = 1 − S × 2.43 R DCLMP1 + R DCLMP2 Therefore, VCLAMP(MAX-FF) during feed-forward maximum duty clamp is: VCLAMP(MAX-FF) = = 22 VS 1 − D MAX −FF 2.43 × (R DCLMP1 + R DCLMP2 ) RDCLMP2 Additionally, CCLAMP should be chosen such that the complex poles formed with magnetizing inductance (LMAG) and CCLAMP are 2x to 4x away from the loop bandwidth: 1-D VS 1− D VCLAMP(MAX-NORMAL) = The AUX driver controls the p-channel FET through a level shifter. The level shifter consists of an RC network (formed by CAUX and RAUX) and diode D5, as shown in the Typical Application Circuits. Choose RAUX and CAUX so that the time constant exceeds 100/fSW. Diode D5 is a small-signal diode with a voltage rating exceeding 25V. > 3 × fBW Bias Circuit Optocoupler Feedback (MAX5974C/MAX5974D) An in-phase tertiary winding is needed to power the bias circuit when using optocoupler feedback. The voltage across the tertiary VT during the on-time is: N VT = VOUT × T N S where VOUT is the output voltage and NT/NS is the turns ratio from the tertiary to the secondary winding. Select the turns ratio so that VT is above the UVLO shutdown level (7.35V max) by a margin determined by the holdup time needed to “ride through” a brownout. Coupled-Inductor Feedback (MAX5974A/MAX5974B) When using coupled-inductor feedback, the power for the devices can be taken from the coupled inductor during the off-time. The voltage across the coupled inductor, VCOUPLED, during the off-time is: N VCOUPLED = VOUT × C N O where VOUT is the output voltage and NC/NO is the turns ratio from the coupled output to the main output winding. Select the turns ratio so that VCOUPLED is above the UVLO shutdown level (7.5V max) by a margin determined by the holdup time needed to “ride through” a brownout. This voltage appears at the input of the devices, less a diode drop. An RC network consisting of RSNUB and CSNUB is for damping the reverse recovery transients of diode D6. Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers N VCOUPLED-ON = −(VS × S NP NC NO − VOUT ) where VS is the input supply voltage. Care must be taken to ensure that the voltage at FB (equal to VCOUPLED-ON attenuated by the feedback resistive divider) is not more than 5V: VFB-ON = VCOUPLED-ON × R FB2 < 5V R ( FB1 + R FB2 ) If this condition is not met, a signal diode should be placed from GND (anode) to FB (cathode). Typically, there are two sources of noise emission in a switching power supply: high di/dt loops and high dV/dt surfaces. For example, traces that carry the drain current often form high di/dt loops. Similarly, the heatsink of the main MOSFET presents a dV/dt source; therefore, minimize the surface area of the MOSFET heatsink as much as possible. Keep all PCB traces carrying switching currents as short as possible to minimize current loops. Use a ground plane for best results. For universal AC input design, follow all applicable safety regulations. Offline power supplies can require UL, VDE, and other similar agency approvals. Refer to the MAX5974A and MAX5974C Evaluation Kit data sheets for recommended layout and component values. 23 MAX5974A/MAX5974B/MAX5974C/MAX5974D Layout Recommendations During on-time, the coupled output is: MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers Typical Application Circuits VS 36V TO 57V L1 3.3mH CBULK 33µF D1 NT RIN 100kI D2 L2 6.8µH CIN 1µF 25V D3 RDCLMP1 30.1kI 1% PGOOD NP IN T1 NS RGATE2 10I RGATE1 10I N RFB2 2.49kI 1% N DCLMP SS RDT 16.9kI 1% DT CDITHER 10nF RRT 14.7kI 1% N1 5i412DP MAX5974C MAX5974D IN N3 FDS3692 (OPTOCOUPLER FEEDBACK) DITHER/ SYNC CCLAMP 47nF RGATE3 10I NDRV N P CAUX 47nF RFFB 10.0kI 1% RF 499I 1% FFB RG1 RG2 121kI 1% 200kI 1% ROPTO3 4.99kI 1% ROPTO1 825I 1% CCOMP1 2.2nF U1 FOD817CSD RGATE4 10I AUXDRV RT N4 IRF6217 RBIAS 4.02kI 1% CINT 0.1µF CF 330pF FB COMP D5 CSSC PGND RCOMP2 499I 1% CCOMP2 6.8pF CS GND 24 N2 5i412DP D4 EN CSS 0.1µF ROPTO2 1kI 1% COUT5 COUT1 COUT2 COUT3 COUT4 0.1µF REN 100kI RDCLMP2 750I 1% 5V, 5A RFB1 7.5kI 1% RCSSC 4.02kI 1% RAUX 10kI RCOMP2 2.00kI 1% U2 TLV4314AIDBVT-1.24V RCS 0.2I Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers D6 RFB1 54.9kI 1% CSNUB RSNUB 10pF 69.8I 1% VS 36V TO 57V CBULK 33µF 63V TO FB RFB2 10kI 1% RIN 100kI CIN 1µF 25V RDCLMP1 30.1kI 1% NP T1 RGATE2 10I D3 NS RGATE1 10I COUT1 COUT2 COUT3 COUT4 COUT5 0.1µF N DCLMP N1 5i412DP CSS 0.1µF SS MAX5974A MAX5974B RDT 16.9kI 1% DT 5V, 5A D4 EN CDITHER 10nF N2 5i412DP N IN RDCLMP2 750I 1% 4 x 47µF 6.3V NO REN 100kI PGOOD LCOUPLED NC (COUPLED INDUCTOR FEEDBACK) DITHER/ SYNC RRT 14.7kI 1% RGATE3 10I NDRV N3 FDS3692 CCLAMP 47nF N RGATE4 10I P AUXDRV RT CAUX 47nF RFFB 10kI 1% N4 IRF6217 RF 499I 1% FFB CS CF 330pF FB CCOMP 4.7nF RZ 2kI 1% D5 COMP GND CINT 47nF CSSC PGND RAUX 10kI RCSSC 4.02kI 1% RCS 0.2I 25 MAX5974A/MAX5974B/MAX5974C/MAX5974D Typical Application Circuits (continued) MAX5974A/MAX5974B/MAX5974C/MAX5974D Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers Typical Application Circuits (continued) D1 L1 VS NT CBULK D2 RIN L2 CIN T1 D3 NP NS RGATE2 COUT1 COUT2 COUT3 COUT4 RGATE1 N IN RDCLMP1 REN 100kI N2 RFB1 RFB2 D4 PGOOD EN N DCLMP N1 RDCLMP2 CSS SS RDT MAX5974C MAX5974D DT RDITHER CDITHER CCLAMP RGATE3 DITHER/ SYNC RRT NDRV N N3 RGATE4 P AUXDRV RT N4 CAUX RFFB FFB CS CSSC FB RCSSC COMP Rz GND D5 RAUX PGND RCS CCOMP CHF Chip Information PROCESS: BiCMOS 26 Package Information For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 16 TQFN-EP T1633+4 21-0136 90-0031 Active-Clamped, Spread-Spectrum, Current-Mode PWM Controllers REVISION NUMBER REVISION DATE 0 6/10 Initial release 1 9/10 Introduced the MAX5974B/MAX5974D. Updated the Absolute Maximum Ratings, Electrical Characteristics, Pin Description, the p-Channel MOSFET Gate Driver, Frequency Foldback for High-Efficiency Light-Load Operation sections, and Typical Application Circuits. 2 6/11 Added internal zener diode information DESCRIPTION PAGES CHANGED — 1, 2, 3, 12, 15, 17, 19, 21, 23, 24, 25 1–10, 12–17, 19–25 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2011 Maxim Integrated Products 27 Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX5974A/MAX5974B/MAX5974C/MAX5974D Revision History