MC74AC244, MC74ACT244 Octal Buffer/Line Driver with 3-State Outputs The MC74AC244/74ACT244 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus oriented transmitter/receiver which provides improved PC board density. http://onsemi.com • 3–State Outputs Drive Bus Lines or Buffer Memory Address PDIP–20 N SUFFIX CASE 738 Registers • Outputs Source/Sink 24 mA • ′ACT244 Has TTL Compatible Inputs VCC OE2 20 19 18 17 16 15 14 20 1 13 12 SO–20 DW SUFFIX CASE 751 20 11 1 TSSOP–20 DT SUFFIX CASE 948E 20 1 1 2 3 4 5 6 OE1 7 8 9 20 GND 1 Figure 1. Pinout: 20–Lead Packages Conductors (Top View) ORDERING INFORMATION TRUTH TABLE Inputs Outputs OE1 D (Pins 12, 14, 16, 18) L L H L H X L H Z NOTE: H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance TRUTH TABLE Inputs Outputs OE2 D (Pins 3, 5, 7, 9) L L H L H X L H Z NOTE: EIAJ–20 M SUFFIX CASE 967 10 H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance Device Package Shipping MC74AC244N PDIP–20 18 Units/Rail MC74ACT244N PDIP–20 18 Units/Rail MC74AC244DW SOIC–20 38 Units/Rail MC74AC244DWR2 SOIC–20 1000 Tape & Reel MC74ACT244DW SOIC–20 38 Units/Rail MC74ACT244DWR2 SOIC–20 1000 Tape & Reel MC74AC244DT TSSOP–20 75 Units/Rail MC74AC244DTR2 TSSOP–20 2500 Tape & Reel MC74ACT244DT TSSOP–20 75 Units/Rail MC74ACT244DTR2 TSSOP–20 2500 Tape & Reel MC74AC244M EIAJ–20 40 Units/Rail MC74AC244MEL EIAJ–20 2000 Tape & Reel MC74ACT244M EIAJ–20 40 Units/Rail MC74ACT244MEL EIAJ–20 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2001 May, 2001 – Rev. 5 1 Publication Order Number: MC74AC244/D MC74AC244, MC74ACT244 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) –0.5 to VCC +0.5 V VOUT DC Output Voltage (Referenced to GND) –0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature –65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 – VCC VCC @ 3.0 V – 150 – VCC @ 4.5 V – 40 – VCC @ 5.5 V – 25 – VCC @ 4.5 V – 10 – VCC @ 5.5 V – 8.0 – – – 140 °C –40 25 85 °C V V ns/V tr, tf In ut Rise and Fall Time (Note 2) Input ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH Output Current – High – – –24 mA IOL Output Current – Low – – 24 mA ns/V 1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC244, MC74ACT244 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = –40°C to +85°C Typ VIH VIL VOH VOL Unit Conditions Guaranteed Limits Minimum High g Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC – 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC – 0.1 V Minimum High g Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 – – – 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 – – – 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Low Level Output Voltage IOUT = –50 µA V *VIN = VIL or VIH –12 mA IOH –24 mA –24 mA IOUT = 50 µA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum Input Leakage Current 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND IOZ Maximum 3–State C Current 5.5 – ±0.5 ±5.0 µA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 µA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic O t t Current Output C t Maximum Q Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. http://onsemi.com 3 MC74AC244, MC74ACT244 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay Data to Output 3.3 5.0 2.0 1.5 6.5 5.0 9.0 7.0 1.5 1.0 10.0 7.5 ns 3–5 tPHL Propagation Delay Data to Output 3.3 5.0 2.0 1.5 6.5 5.0 9.0 7.0 2.0 1.0 10.0 7.5 ns 3–5 tPZH Output Enable Time 3.3 5.0 2.0 1.5 6.0 5.0 10.5 7.0 1.5 1.5 11.0 8.0 ns 3–7 tPZL Output Enable Time 3.3 5.0 2.5 1.5 7.5 5.5 10.0 8.0 2.0 1.5 11.0 8.5 ns 3–8 tPHZ Output Disable Time 3.3 5.0 3.0 2.5 7.0 6.5 10.0 9.0 1.5 1.0 10.5 9.5 ns 3–7 tPLZ Output Disable Time 3.3 5.0 2.5 2.0 7.5 6.5 10.5 9.0 2.5 2.0 11.5 9.5 ns 3–8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = –40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High g Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC – 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC – 0.1 V VOH Minimum High g Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 – – 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 – – 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage V V IOUT = –50 µA *VIN = VIL or VIH –24 mA IOH –24 mA IOUT = 50 µA IIN Maximum Input Leakage Current 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND ∆ICCT Additional Max. ICC/Input 5.5 0.6 – 1.5 mA VI = VCC – 2.1 V IOZ Maximum 3–State C Current 5.5 – ±0.5 ±5.0 µA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 80 8.0 80 µA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic O t t Current Output C t Maximum Q Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 4 MC74AC244, MC74ACT244 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Pro agation Delay Propagation Data to Output 50 5.0 20 2.0 65 6.5 90 9.0 15 1.5 10 0 10.0 ns 3–5 tPHL Pro agation Delay Propagation Data to Output 50 5.0 20 2.0 70 7.0 90 9.0 15 1.5 10 0 10.0 ns 3–5 tPZH Output Enable Time 5.0 1.5 6.0 8.5 1.0 9.5 ns 3–7 tPZL Output Enable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3–8 tPHZ Output Disable Time 5.0 2.0 7.0 9.5 1.5 10.5 ns 3–7 tPLZ Output Disable Time 5.0 2.5 7.5 10.0 2.0 10.5 ns 3–8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V MARKING DIAGRAMS PDIP–20 SO–20 MC74AC244N AWLYYWW AC244 AWLYYWW MC74ACT244N AWLYYWW ACT244 AWLYYWW A WL, L YY, Y WW, W TSSOP–20 EIAJ–20 AC 244 ALYW 74AC244 AWLYWW ACT 244 ALYW 74ACT244 AWLYWW = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 5 MC74AC244, MC74ACT244 PACKAGE DIMENSIONS PDIP–20 N SUFFIX 20 PIN PLASTIC DIP PACKAGE CASE 738–03 ISSUE E –A– 20 11 1 10 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. B L C –T– K SEATING PLANE M N E G F J D 20 PL 0.25 (0.010) 20 PL 0.25 (0.010) M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0 15 0.51 1.01 SO–20 DW SUFFIX 20 PIN PLASTIC SOIC PACKAGE CASE 751D–05 ISSUE F A 20 11 X 45 M h 1 10 20X B B 0.25 M T A S B S A L 10X E 0.25 H B M D 18X e A1 SEATING PLANE C T http://onsemi.com 6 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 0 7 MC74AC244, MC74ACT244 PACKAGE DIMENSIONS TSSOP–20 DT SUFFIX 20 PIN PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 20X 0.15 (0.006) T U 2X K REF 0.10 (0.004) S L/2 20 M T U S V S K K1 11 J J1 B L –U– PIN 1 IDENT ÍÍÍ ÍÍÍ ÍÍÍ SECTION N–N 1 10 0.25 (0.010) N 0.15 (0.006) T U S M A –V– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. N F DETAIL E –W– C G D H DETAIL E 0.100 (0.004) –T– SEATING DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.252 0.260 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 PLANE EIAJ–20 M SUFFIX 20 PIN PLASTIC EIAJ PACKAGE CASE 967–01 ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) M 0.10 (0.004) http://onsemi.com 7 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 0 10 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 0 10 0.028 0.035 --0.032 MC74AC244, MC74ACT244 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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