MC74AC14, MC74ACT14 Hex Inverter Schmitt Trigger The MC74AC14/74ACT14 contains six logic inverters which accept standard CMOS Input signals (TTL levels for MC74ACT14) and provide standard CMOS output levels. They are capable of transforming slowly changing input signals into sharply defined, jitter–free output signals. In addition, they have a greater noise margin then conventional inverters. The MC74AC14/74ACT14 has hysteresis between the positive–going and negative–going input thresholds (typically 1.0 V) which is determined internally by transistor ratios and is essentially insensitive to temperature and supply voltage variations. • Schmitt Trigger Inputs • Outputs Source/Sink 24 mA • ′ACT14 Has TTL Compatible Inputs http://onsemi.com PDIP–14 N SUFFIX CASE 646 14 1 14 1 14 VCC 14 1 13 12 11 10 9 1 2 3 4 5 6 7 Figure 1. Pinout; 14–Lead Packages Conductors (Top View) FUNCTION TABLE Output A O L H H L EIAJ–14 M SUFFIX CASE 965 ORDERING INFORMATION GND Input TSSOP–14 DT SUFFIX CASE 948G 8 14 1 SO–14 D SUFFIX CASE 751A Device Package Shipping MC74AC14N PDIP–14 25 Units/Rail MC74ACT14N PDIP–14 25 Units/Rail MC74AC14D SOIC–14 55 Units/Rail MC74AC14DR2 SOIC–14 2500 Tape & Reel MC74ACT14D SOIC–14 55 Units/Rail MC74ACT14DR2 SOIC–14 2500 Tape & Reel MC74AC14DT TSSOP–14 96 Units/Rail MC74AC14DTR2 TSSOP–14 2500 Tape & Reel MC74ACT14DT TSSOP–14 MC74ACT14DTR2 TSSOP–14 2500 Tape & Reel 96 Units/Rail MC74AC14M EIAJ–14 50 Units/Rail MC74AC14MEL EIAJ–14 2000 Tape & Reel MC74ACT14M EIAJ–14 50 Units/Rail MC74ACT14MEL EIAJ–14 2000 Tape & Reel DEVICE MARKING INFORMATION See general marking information in the device marking section on page 5 of this data sheet. Semiconductor Components Industries, LLC, 2001 May, 2001 – Rev. 5 1 Publication Order Number: MC74AC14/D MC74AC14, MC74ACT14 MAXIMUM RATINGS* Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) –0.5 to +7.0 V Vin DC Input Voltage (Referenced to GND) –0.5 to VCC +0.5 V Vout DC Output Voltage (Referenced to GND) –0.5 to VCC +0.5 V Iin DC Input Current, per Pin ±20 mA Iout DC Output Sink/Source Current, per Pin ±50 mA ICC DC VCC or GND Current per Output Pin ±50 mA Tstg Storage Temperature –65 to +150 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs tr, tf In ut Rise and Fall Time (Note 2) Input ′ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range IOH IOL Min Typ Max ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 – VCC VCC @ 3.0 V – 150 – VCC @ 4.5 V – 40 – VCC @ 5.5 V – 25 – VCC @ 4.5 V – 10 – VCC @ 5.5 V – 8.0 – Unit V V ns/V ns/V – – 140 °C –40 25 85 °C Output Current – High – – –24 mA Output Current – Low – – 24 mA 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. http://onsemi.com 2 MC74AC14, MC74ACT14 DC CHARACTERISTICS Symbol VOH VOL Parameter Minimum High g Level Output Voltage Maximum Low Level Output Voltage IIN Maximum Input Leakage Current IOLD †Minimum Dynamic O t t Current Output C t IOHD ICC Maximum Q Quiescent Supply Current VCC (V) 74AC 74AC TA = +25°C TA = –40°C to +85°C Typ Guaranteed Limits 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 3.0 4.5 5.5 – – – 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 – – – 0.36 0.36 0.36 0.44 0.44 0.44 55 5.5 – ±0 1 ±0.1 5.5 – 5.5 55 5.5 Unit Conditions IOUT = –50 µA V *VIN = VIL or VIH –12 mA IOH –24 mA –24 mA V IOUT = 50 µA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA ±1 0 ±1.0 µA VI = VCC, GND – 75 mA VOLD = 1.65 V Max – – –75 mA VOHD = 3.85 V Min – 40 4.0 40 µA VIN = VCC or GND *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS (For Figures and Waveforms – See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74AC 74AC TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay 3.3 5.0 1.5 1.5 9.5 7.0 13.5 10.0 1.5 1.5 15.0 11.0 ns 3–5 tPHL Propagation Delay 3.3 5.0 1.5 1.5 7.5 6.0 11.5 8.5 1.5 1.5 13.0 9.5 ns 3–5 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. http://onsemi.com 3 MC74AC14, MC74ACT14 INPUT CHARACTERISTICS (unless otherwise specified) Symbol Parameter VCC (V) 74AC Test Conditions 74ACT Vt + Maximum Positive Threshold 3.0 4.5 5.5 2.2 3.2 3.9 2.0 V TA = Worst Case Vt – Minimum Negative Threshold 3.0 4.5 5.5 0.5 0.9 1.1 0.8 V TA = Worst Case Vh(max) Maximum Hysteresis 3.0 4.5 5.5 1.2 1.4 1.6 1.2 V TA = Worst Case Vh(min) Minimum Hysteresis 3.0 4.5 5.5 0.3 0.4 0.5 0.4 V TA = Worst Case DC CHARACTERISTICS Symbol Parameter VCC ((V)) 74ACT 74ACT TA = +25°C TA = –40°C to +85°C Typ VOH VOL Minimum High g Level Output Voltage Maximum Low Level Output Voltage Unit Conditions Guaranteed Limits IOUT = –50 µA 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 4.5 5.5 – – 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 – – 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA V V V *VIN = VIL or VIH –24 mA IOH –24 mA IOUT = 50 µA IIN Maximum Input Leakage Current 55 5.5 – ±0 1 ±0.1 ±1 0 ±1.0 µA VI = VCC, GND ∆ICCT Additional Max. ICC/Input 5.5 0.6 – 1.5 mA VI = VCC – 2.1 V IOLD †Minimum Dynamic O t t Current Output C t 5.5 – – 75 mA VOLD = 1.65 V Max 5.5 – – –75 mA VOHD = 3.85 V Min 55 5.5 – 40 4.0 40 µA VIN = VCC or GND IOHD ICC Maximum Q Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. http://onsemi.com 4 MC74AC14, MC74ACT14 AC CHARACTERISTICS (For Figures and Waveforms – See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25°C CL = 50 pF TA = –40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay 5.0 1.5 – 11.5 1.0 12.5 ns 3–5 tPHL Propagation Delay 5.0 1.5 – 10.0 1.0 11.0 ns 3–5 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 25 pF VCC = 5.0 V MARKING DIAGRAMS PDIP–14 SO–14 TSSOP–14 EIAJ–14 MC74AC14N AWLYYWW AC14 AWLYWW AC 14 ALYW 74AC14 ALYW MC74ACT14N AWLYYWW ACT14 AWLYWW ACT 14 ALYW 74ACT14 ALYW A WL, L YY, Y WW, W = Assembly Location = Wafer Lot = Year = Work Week http://onsemi.com 5 MC74AC14, MC74ACT14 PACKAGE DIMENSIONS PDIP–14 N SUFFIX 14 PIN PLASTIC DIP PACKAGE CASE 646–06 ISSUE M 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. 8 B 1 7 A F DIM A B C D F G H J K L M N L N C –T– SEATING PLANE J K H D 14 PL G 0.13 (0.005) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 8 –B– 1 P 7 PL 0.25 (0.010) 7 G M B M F R X 45 C –T– SEATING PLANE D 14 PL 0.25 (0.010) M T B J M K S A MILLIMETERS MIN MAX 18.16 18.80 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --10 0.38 1.01 M SO–14 D SUFFIX 14 PIN PLASTIC SOIC PACKAGE CASE 751A–03 ISSUE F 14 INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --10 0.015 0.039 S http://onsemi.com 6 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.228 0.244 0.010 0.019 MC74AC14, MC74ACT14 PACKAGE DIMENSIONS TSSOP–14 DT SUFFIX 14 PIN PLASTIC TSSOP PACKAGE CASE 948G–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B –U– L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A –V– ÇÇÇ ÉÉ ÇÇÇ ÉÉ K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N–N –W– C 0.10 (0.004) –T– SEATING PLANE H G D DETAIL E EIAJ–14 M SUFFIX 14 PIN PLASTIC EIAJ PACKAGE CASE 965–01 ISSUE O 14 LE 8 Q1 E HE L 7 1 M DETAIL P Z D VIEW P A e c b 0.13 (0.005) A1 M 0.10 (0.004) http://onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 --0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 0 10 0.70 0.90 --1.42 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 0 10 0.028 0.035 --0.056 MC74AC14, MC74ACT14 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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