MC74LCX139 Dual Low−Voltage CMOS 2−to−4 Decoder/Demultiplexer With 5V−Tolerant Inputs The MC74LCX139 is a high performance, 2−to−4 decoder/ demultiplexer operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX139 inputs to be safely driven from 5 V devices. The MC74LCX139 is suitable for memory address decoding and other TTL level bus oriented applications. The MC74LCX139 high−speed 2−to−4 decoder/demultiplexer accepts two binary weighted inputs (A0, A1) and, when enabled, provides four mutually exclusive active−LOW outputs. The LCX139 features an active low Enable input. All outputs will be HIGH unless En is LOW. The LCX139 can be used as an 8−output demultiplexer by using one of the active−LOW Enable inputs as the data input and the other Enable input as a strobe. The Enable inputs which are not used must be permanently tied to ground. Current drive capability is 24 mA at the outputs. http://onsemi.com MARKING DIAGRAMS 16 SOIC−16 D SUFFIX CASE 751B 16 1 LCX139 AWLYWW 1 16 16 1 TSSOP−16 DT SUFFIX CASE 948F LCX 139 ALYW Features • • • • • • 1 Designed for 2.3 to 3.6 V VCC Operation 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic SOEIAJ−16 M SUFFIX CASE 966 LVTTL Compatible LVCMOS Compatible 16 74LCX139 ALYW 1 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA • • ESD Performance: • 16 Human Body Model >2000 V Machine Model >200 V Pb−Free Packages are Available* 1 A L, WL Y W, WW = = = = Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 August, 2005 − Rev. 4 1 Publication Order Number: MC74LCX139/D MC74LCX139 Ea 1 16 VCC A0a 2 15 Eb 3 A1a 14 A0b X/Y A1a 3 A0a 2 2 1 Ea 1 EN 2 Y0a 4 13 A1b Y1a 5 12 Y0b Y2a 6 11 Y1b A1b 13 A0b 14 Y3a 7 10 Y2b Eb 15 GND 8 9 Y3b 1 0 3 Address Inputs Enable Inputs Outputs A0a A1a Ea TRUTH TABLE Inputs E A1 H L L L L X L L H H Outputs A0 X L H L H Y0 H L H H H Y1 Y2 H H L H H H H H L H 6 Y2a 7 Y3a 12 Y0b Ea 1 DMUX 0 0 G 3 1 1 0 2 3 A1b 13 A0b 14 Eb 15 4 Y0a 5 Y1a 6 Y2a 7 Y3a 12 Y0b 11 Y1b 10 Y2b 9 Y3b Figure 2. IEC Logic Diagram ADDRESS INPUTS A0n−A1n En Y0n−Y3n A0a 3 2 10 Y2b 9 Y3b PIN NAMES Function A1a 11 Y1b Figure 1. Pin Assignment Pins 4 Y0a 5 Y1a Y3 H H H H L ADDRESS INPUTS A0b A1b 2 3 4 Y0a 5 Y1a 6 Y2a 7 Y3a 1 14 12 13 11 10 9 Eb H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State Y0b Y1b Y2b Y3b 15 Figure 3. Logic Diagram En Y0 Y1 A0 Y2 Y3 A1 Figure 4. Expanded Logic Diagram (1/2 of Device) http://onsemi.com 2 ACTIVE−LOW OUTPUTS ACTIVE−LOW OUTPUTS MC74LCX139 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK Value Condition Unit −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State. (Note 1) V DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Typ Max Unit 2.0 1.5 2.3 to 3.3 3.6 3.6 V 0 5.5 V 0 VCC V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 mA IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 mA TA Operating Free−Air Temperature −40 +85 °C Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V (HIGH or LOW State) ORDERING INFORMATION Package Shipping † MC74LCX139D SOIC−16 48 Units / Rail MC74LCX139DR2 SOIC−16 2500 Tape & Reel MC74LCX139DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel MC74LCX139DT TSSOP−16* 96 Units / Rail MC74LCX139DTR2 TSSOP−16* 2500 Tape & Reel MC74LCX139M SOEIAJ−16 48 Units / Rail MC74LCX139MEL SOEIAJ−16 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 3 MC74LCX139 DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol VIH VIL VOH VOL Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.7 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 Unit V V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL= 8 mA 0.7 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 V II Input Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5 mA ICC Quiescent Supply Current 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 10 mA 2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±10 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 DICC Increase in ICC per Input mA 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W Limits TA= −40°C to +85°C VCC= 3.0 V to 3.6 V VCC= 2.7 V VCC= 2.3 V to 2.7 V CL= 50 pF CL= 50 pF CL= 30pF Parameter Min Max Min Max Min Max Unit tPLH Propagation Delay 0.8 6.2 1.0 7.3 0.8 9.3 ns tPHL A to Y 0.8 6.2 1.0 7.3 0.8 9.3 ns tPLH Propagation Delay 0.8 4.7 1.0 5.2 0.8 7.2 ns tPHL E to Y 0.8 4.7 1.0 5.2 0.8 7.2 ns Symbol tOSHL Output−to−Output Skew (Note 3) tOSLH 1.0 ns 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF http://onsemi.com 4 MC74LCX139 A VCC 50% E GND 50% tPHL tPLH Y VCC tPHL 50% VCC GND 50% VCC Y Figure 5. Waveform 1 Prop Delays tPLH Figure 6. Waveform 2 Output Enable VCC PULSE GENERATOR DUT RT CL CL = 50 pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W) Figure 7. Test Circuit http://onsemi.com 5 RL MC74LCX139 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 1 8 −B− P 8 PL 0.25 (0.010) M B S G R K DIM A B C D F G J K M P R F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 S TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S K ÉÉ ÇÇ ÇÇ ÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74LCX139 PACKAGE DIMENSIONS SOEIAJ−16 M SUFFIX CASE 966−01 ISSUE O 16 LE 9 Q1 M_ E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 7 MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 0_ 10 _ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 MC74LCX139 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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