ZARLINK MF194

MF194
860 nm - 70 MHz High Performance LED
Data Sheet
September 2004
Ordering Information
MF194
MF194
MF194
MF194
MF194
ST
SC
SMA
FC
TO-46 Package
ST Housing
SC Housing
SMA Housing
FC Housing
-40 °C to +85°C
Note: Rated Fiber coupled power apply only on the TO-46
package, for housing options fiber coupled power is
typically 10% less.
Features
Description
•
860 nm Surface-Emitting LED
•
70 MHz Bandwidth
•
Designed for 50/125 µm fiber
This device is designed for Ethernet and general
applications and offers an excellent price/performance
ratio for cost-effective solutions. Its double-lens optical
system results in optimum coupling of power into the
fiber.
Applications
•
LANs
•
Test Equipment
•
General Purpose
CASE
CATHODE
ANODE
CATHODE
ANODE
Bottom View
The diode chip is isolated from the case.
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved.
MF194
Data Sheet
Optical and Electrical Characteristics - Case Temperature 25°C
Parameter
Symbol
Min
Typ
Fiber-Coupled Power
(Figures 3, 4, and 5) (Table 1)
Pfiber
25
45
Rise and Fall Time (10-90%)
tr,tf
5
Bandwidth (3dBel)
fc
70
Peak Wavelength
λp
Spectral Width (FWHM)
∆λ
50
Forward Voltage (Figure 7)
VF
1.7
Reverse Current
IR
Capacitance
C
Note 1:
840
Max
860
Unit
Test Condition
µW
IF=60 mA
(Note 1)
ns
IF=60 mA
(no bias)
MHz
IF=60 mA
nm
IF=60mA
nm
IF=60 mA
1.9
V
IF=60 mA
20
µA
VR=1 V
pF
VR-0 V, f=1 MHz
7
880
250
Fiber:
50/125 µm
Graded
Index
NA=0.20
Measured at the exit of 100 meters of fiber.
Absolute Maximum Ratings
Parameter
Symbol
Limit
Storage Temperature
Tstg
-55 to +125°C
Operating Temperature (derating: Figure 6)
Top
-40 to +85°C
Electrical Power Dissipation (derating: Figure 6)
Ptot
160 mW
IF
80 mA
IFRM
130 mA
Reverse Voltage
VR
1.5 V
Soldering Temperature (2 mm from the case for 10 sec.)
Tsld
260°C
Continuous Forward Current (f<10 kHz)
Peak Forward Current (duty cycle<50%,f>1 MHz
2
Zarlink Semiconductor Inc.
MF194
Data Sheet
Thermal Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistance - Infinite Heat Sink
Rthjc
200
°C/W
Thermal Resistance - No Heat Sink
Rthja
500
°
C/W
Temperature Coefficient - Optical Power
dP/dTj
-0.5
%/°C
Temperature Coefficient - Wavelength
dλ/dTj
0.3
nm/°C
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numerical Aperture
50/12 5µm
0.20
62.5/125 µm
0.275
100/140 µm
0.29
200/230 µm
0.37
45 µW
95 µW
210 µW
440 µW
3
Zarlink Semiconductor Inc.
MF194
Data Sheet
100
r
Relative Fiber-coupled Power (%)
80
z
r - optimal
ØC = 50 µm
60
40
20
0
0.5
1
1.5
2
2.5
3
z - Axial Displacem ent of Fiber (µm)
(m m )
Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber
100
Relative Fiber-coupled Power (%)
r
z
80
z - optimal
ØC = 50 µm
60
40
20
0
0
20
40
60
80
100
r - Radial Displacem ent of Fiber (µm)
(m )
Figure 4 - Relative Fiber-coupled Power vs. r - Radial Displacement of Fiber
4
Zarlink Semiconductor Inc.
MF194
Data Sheet
80
60
50% Duty Cycle
DC
40
20
Heat Sinked
0
0
20
40
60
80
100
120
140
160
180
Forw ard Current (m A)
Figure 5 - Relative Fiber-coupled Power vs. Forward Current
300
Max. Electrical Power Dissipation (mW)
Relative Fiber-coupled Power (%)
100
250
Infinite Heat Sink
200
150
No Heat Sink
100
50
0
0
25
50
75
100
125
150
o
Operating Tem perature ( C)
Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature
5
Zarlink Semiconductor Inc.
200
MF194
Data Sheet
200
Forward Current (mA)
150
100
50
0
0
0.5
1
1.5
2
Forw ard Voltage (V)
Figure 7 - Forward Current vs. Forward Voltage
6
Zarlink Semiconductor Inc.
2.5
3
BOTTOM VIEW ( 10 : 1 )
SIDE VIEW
13,46`0,76
3,8
2,54
0,6
0,03 (3x)
n0,45 +
-
0,05 (3x)
n1,17 +
-
0,04
n4,7
0
R2,7
45°
R0,2 max (4x)
0,3 max glass overmould (2x)
R0,4 max
2`
0,
3
3,
6
1,
0
Lens n1.5`0.05
NOTES:1. All dimensions in mm.
2. General tol. ISO-2768-mK.
3. Coating: Case: Ni 1,5-2,5 µm.
Header: Ni 2-3 µm / Au min 1,32 µm.
Package code
© Zarlink Semiconductor 2002. All rights reserved.
ISSUE
1
ACN
JS004 076R1 A
DATE
22-MAR-03
APPRD. TD/BE
Previous package codes
TB
Drawing type
Package drawing, TO-46 with lens
Title
JS004076
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable.
However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE