MF194 860 nm - 70 MHz High Performance LED Data Sheet September 2004 Ordering Information MF194 MF194 MF194 MF194 MF194 ST SC SMA FC TO-46 Package ST Housing SC Housing SMA Housing FC Housing -40 °C to +85°C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. Features Description • 860 nm Surface-Emitting LED • 70 MHz Bandwidth • Designed for 50/125 µm fiber This device is designed for Ethernet and general applications and offers an excellent price/performance ratio for cost-effective solutions. Its double-lens optical system results in optimum coupling of power into the fiber. Applications • LANs • Test Equipment • General Purpose CASE CATHODE ANODE CATHODE ANODE Bottom View The diode chip is isolated from the case. Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved. MF194 Data Sheet Optical and Electrical Characteristics - Case Temperature 25°C Parameter Symbol Min Typ Fiber-Coupled Power (Figures 3, 4, and 5) (Table 1) Pfiber 25 45 Rise and Fall Time (10-90%) tr,tf 5 Bandwidth (3dBel) fc 70 Peak Wavelength λp Spectral Width (FWHM) ∆λ 50 Forward Voltage (Figure 7) VF 1.7 Reverse Current IR Capacitance C Note 1: 840 Max 860 Unit Test Condition µW IF=60 mA (Note 1) ns IF=60 mA (no bias) MHz IF=60 mA nm IF=60mA nm IF=60 mA 1.9 V IF=60 mA 20 µA VR=1 V pF VR-0 V, f=1 MHz 7 880 250 Fiber: 50/125 µm Graded Index NA=0.20 Measured at the exit of 100 meters of fiber. Absolute Maximum Ratings Parameter Symbol Limit Storage Temperature Tstg -55 to +125°C Operating Temperature (derating: Figure 6) Top -40 to +85°C Electrical Power Dissipation (derating: Figure 6) Ptot 160 mW IF 80 mA IFRM 130 mA Reverse Voltage VR 1.5 V Soldering Temperature (2 mm from the case for 10 sec.) Tsld 260°C Continuous Forward Current (f<10 kHz) Peak Forward Current (duty cycle<50%,f>1 MHz 2 Zarlink Semiconductor Inc. MF194 Data Sheet Thermal Characteristics Parameter Symbol Min. Typ. Max. Unit Thermal Resistance - Infinite Heat Sink Rthjc 200 °C/W Thermal Resistance - No Heat Sink Rthja 500 ° C/W Temperature Coefficient - Optical Power dP/dTj -0.5 %/°C Temperature Coefficient - Wavelength dλ/dTj 0.3 nm/°C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/12 5µm 0.20 62.5/125 µm 0.275 100/140 µm 0.29 200/230 µm 0.37 45 µW 95 µW 210 µW 440 µW 3 Zarlink Semiconductor Inc. MF194 Data Sheet 100 r Relative Fiber-coupled Power (%) 80 z r - optimal ØC = 50 µm 60 40 20 0 0.5 1 1.5 2 2.5 3 z - Axial Displacem ent of Fiber (µm) (m m ) Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber 100 Relative Fiber-coupled Power (%) r z 80 z - optimal ØC = 50 µm 60 40 20 0 0 20 40 60 80 100 r - Radial Displacem ent of Fiber (µm) (m ) Figure 4 - Relative Fiber-coupled Power vs. r - Radial Displacement of Fiber 4 Zarlink Semiconductor Inc. MF194 Data Sheet 80 60 50% Duty Cycle DC 40 20 Heat Sinked 0 0 20 40 60 80 100 120 140 160 180 Forw ard Current (m A) Figure 5 - Relative Fiber-coupled Power vs. Forward Current 300 Max. Electrical Power Dissipation (mW) Relative Fiber-coupled Power (%) 100 250 Infinite Heat Sink 200 150 No Heat Sink 100 50 0 0 25 50 75 100 125 150 o Operating Tem perature ( C) Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature 5 Zarlink Semiconductor Inc. 200 MF194 Data Sheet 200 Forward Current (mA) 150 100 50 0 0 0.5 1 1.5 2 Forw ard Voltage (V) Figure 7 - Forward Current vs. Forward Voltage 6 Zarlink Semiconductor Inc. 2.5 3 BOTTOM VIEW ( 10 : 1 ) SIDE VIEW 13,46`0,76 3,8 2,54 0,6 0,03 (3x) n0,45 + - 0,05 (3x) n1,17 + - 0,04 n4,7 0 R2,7 45° R0,2 max (4x) 0,3 max glass overmould (2x) R0,4 max 2` 0, 3 3, 6 1, 0 Lens n1.5`0.05 NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 µm. Header: Ni 2-3 µm / Au min 1,32 µm. Package code © Zarlink Semiconductor 2002. All rights reserved. ISSUE 1 ACN JS004 076R1 A DATE 22-MAR-03 APPRD. TD/BE Previous package codes TB Drawing type Package drawing, TO-46 with lens Title JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. 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