(1/2) 001-01 / 20021008 / e521_mlg1608.fm Inductors MLG Series MLG1608 Type For High Frequency SMD FEATURES • Supports operating frequency bands of up to 10GHz with nominal inductance values from 1 to 100nH. • Provides high Q characteristics. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. PRODUCT IDENTIFICATION MLG 1608 B 2N2 S T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L×W 1608 APPLICATIONS For high-frequency applications including mobile phones, portable phones, cordless phones, pagers and personal handy-phone systems (PHS). SHAPES AND DIMENSIONS 1.6×0.8mm (3) Material code (4) Inductance value 2N2 12N 39N 2.2nH 12nH 39nH 1.6±0.15 (5) Inductance tolerance 0.8±0.15 S D J ±0.3nH ±0.5nH ±5% (6) Packaging style 0.3±0.2 0.8±0.15 T Taping (reel) PACKAGING STYLE AND QUANTITIES Weight: 4mg 0.7 RECOMMENDED PC BOARD PATTERN 0.7 0.7 0.7 Dimensions in mm SPECIFICATIONS Operating temperature range Storage temperature range –25 to +85°C –40 to +85°C [Unit of products] RECOMMENDED REFLOW SOLDERING CONDITIONS 10s max. 230˚C Natural cooling 200˚C 150˚C Preheating 60 to 120s min. 40s max. Time (s) • All specifications are subject to change without notice. Packaging style Taping Quantity 4000 pieces/reel HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 260°C. Soldering time should not exceed 3 seconds. (2/2) 001-01 / 20021008 / e521_mlg1608.fm Inductors MLG Series MLG1608 Type For High Frequency SMD ELECTRICAL CHARACTERISTICS Inductance Inductance Q Test frequency Self-resonant DC resistance (nH) tolerance min. L, Q (MHz) frequency (GHz)min. (Ω)max. 1 ±0.3nH 8 100 10 0.1 1.2 ±0.3nH 8 100 10 0.1 1.5 ±0.3nH 8 100 10 0.1 1.8 ±0.3nH 8 100 9.8 0.1 2.2 ±0.3nH 10 100 7.6 0.15 2.7 ±0.3nH 10 100 7 0.15 3.3 ±0.3nH 10 100 6.2 0.2 3.9 ±0.3nH 10 100 5.6 0.2 4.7 ±0.3nH 10 100 4.8 0.2 5.6 ±0.5nH 10 100 4.6 0.2 6.8 ±0.5nH 10 100 4.2 0.2 8.2 ±0.5nH 10 100 3.6 0.25 10 ±5% 12 100 3.2 0.25 12 ±5% 12 100 2.8 0.3 15 ±5% 12 100 2.6 0.35 18 ±5% 12 100 2.4 0.4 22 ±5% 12 100 2 0.5 27 ±5% 12 100 1.9 0.55 33 ±5% 12 100 1.6 0.6 39 ±5% 12 100 1.4 0.65 47 ±5% 14 100 1.2 0.7 56 ±5% 14 100 1 0.75 68 ±5% 14 100 0.9 0.8 82 ±5% 14 100 0.8 0.9 100 ±5% 14 100 0.7 1 • Test equipment Inductance Q : HP4291A+16193A SRF: HP8720C Rdc: YOKOGAWA TYPE7561 • Rated current : Value obtained when current flows and temperature has risen to 20°C. TYPICAL ELECTRICAL CHARACTERISTICS INDUCTANCE vs. FREQUENCY IMPEDANCE vs. FREQUENCY CHARACTERISTICS CHARACTERISTICS Rated current (mA)max. 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 Part No. MLG1608B1N0S MLG1608B1N2S MLG1608B1N5S MLG1608B1N8S MLG1608B2N2S MLG1608B2N7S MLG1608B3N3S MLG1608B3N9S MLG1608B4N7S MLG1608B5N6D MLG1608B6N8D MLG1608B8N2D MLG1608B10NJ MLG1608B12NJ MLG1608B15NJ MLG1608B18NJ MLG1608B22NJ MLG1608B27NJ MLG1608B33NJ MLG1608B39NJ MLG1608B47NJ MLG1608B56NJ MLG1608B68NJ MLG1608B82NJ MLG1608BR10J Q vs. FREQUENCY CHARACTERISTICS 80 1000 100 300 30 70 Impedance (kΩ) Inductance (nH) 60 100 39nH 30 10nH 10 Q 50 39nH 10 10nH 4.7nH 3 0.3 0.01 0.03 0.1 0.3 1 Frequency (GHz) 3 10 20 0 4.7nH 1 30 0.1 39nH 10 1 3 4.7nH 10nH 40 0.01 0.03 • All specifications are subject to change without notice. 0.1 0.3 1 Frequency (GHz) 3 10 0.1 0.3 1 Frequency (GHz) 3 10