FAIRCHILD MM74HC244MTCX

Revised May 2005
MM74HC244
Octal 3-STATE Buffer
General Description
Features
The MM74HC244 is a non-inverting buffer and has two
active low enables (1G and 2G); each enable independently controls 4 buffers. This device does not have
Schmitt trigger inputs.
These 3-STATE buffers utilize advanced silicon-gate
CMOS technology and are general purpose high speed
non-inverting buffers. They possess high drive current outputs which enable high speed operation even when driving
large bus capacitances. These circuits achieve speeds
comparable to low power Schottky devices, while retaining
the advantage of CMOS circuitry, i.e., high noise immunity,
and low power consumption. All three devices have a
fanout of 15 LS-TTL equivalent inputs.
■ Typical propagation delay: 14 ns
■ 3-STATE outputs for connection to system buses
■ Wide power supply range: 2–6V
■ Low quiescent supply current: 80 PA
■ Output current: 6 mA
All inputs are protected from damage due to static discharge by diodes to VCC and ground.
Ordering Code:
Order Number
Package Number
MM74HC244WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC244SJ
MM74HC244MTC
MM74HC244N
MTC20
N20A
Package Description
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Truth Table
1G
1A
1Y
2G
2A
2Y
L
L
L
L
L
L
L
H
H
L
H
H
H
L
Z
H
L
Z
H
H
Z
H
H
Z
H HIGH Level
L LOW Level
Z High Impedance
Top View
© 2005 Fairchild Semiconductor Corporation
DS005327
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MM74HC244 Octal 3-STATE Buffer
September 1983
MM74HC244
Logic Diagram
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2
Recommended Operating
Conditions
0.5 to 7.0V
1.5 to VCC 1.5V
0.5 to VCC 0.5V
r 20 mA
r 35 mA
r 70 mA
65qC to 150qC
Supply Voltage (VCC )
DC Input Voltage (VIN)
DC Output Voltage (VOUT)
Clamp Diode Current (IIK, IOK)
DC Output Current, per pin (IOUT)
DC VCC or GND Current, per pin (ICC)
Storage Temperature Range (TSTG)
Supply Voltage (VCC)
600 mW
S.O. Package only
500 mW
(VIN, VOUT)
Operating Temperature Range (TA)
Symbol
VIH
VIL
Parameter
Conditions
V
85
qC
(tr, tf) VCC
2.0V
1000
ns
VCC
4.5V
500
ns
VCC
6.0V
400
ns
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating — plastic “N” package: 12 mW/qC from 65qC to 85qC.
VCC
TA
25qC
Typ
TA
40 to 85qC TA
55 to 125qC
Guaranteed Limits
Units
2.0V
1.5
1.5
1.5
V
Input Voltage
4.5V
3.15
3.15
3.15
V
6.0V
4.2
4.2
4.2
V
Maximum LOW Level
2.0V
0.5
0.5
0.5
V
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
Minimum HIGH Level
VIN
Output Voltage
|IOUT | d 20 PA
VIH or VIL
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
VIH or VIL
V
V
|IOUT | d 6.0 mA
4.5V
4.2
3.98
3.84
3.7
V
|IOUT | d 7.8 mA
6.0V
5.7
5.4
5.34
5.2
V
Maximum LOW Level
VIN
VIH or VIL
Output Voltage
|IOUT | d 20 PA
VIN
IIN
VCC
Minimum HIGH Level
VIN
VOL
0
40
(Note 4)
Input Voltage
VOH
V
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
260qC
DC Electrical Characteristics
Units
6
Input Rise or Fall Times
Lead Temperature (TL)
(Soldering 10 seconds)
Max
2
DC Input or Output Voltage
Power Dissipation (PD)
(Note 3)
Min
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
V
VIH or VIL
|IOUT | d 6.0 mA
4.5V
0.2
0.26
0.33
0.4
|IOUT | d 7.8 mA
6.0V
0.2
0.26
0.33
0.4
V
VIN
VCC or GND
6.0V
r 0.1
r 1.0
r1.0
PA
Maximum 3-STATE
VIN
VIH, or VIL
6.0V
r 0.5
r5
r10
PA
Output Leakage
VOUT
6.0V
8.0
80
160
PA
Maximum Input
Current
IOZ
ICC
Current
G
Maximum Quiescent
VIN
Supply Current
IOUT
VCC or GND
VIH
VCC or GND
0 PA
Note 4: For a power supply of 5V r 10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
3
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MM74HC244
Absolute Maximum Ratings(Note 1)
(Note 2)
MM74HC244
AC Electrical Characteristics
VCC
5V, TA
25qC, tr
tf 6 ns
Symbol
tPHL, tPLH
Parameter
Conditions
Maximum Propagation
Typ
Guaranteed
Limit
Units
CL
45 pF
14
20
ns
Maximum Enable Delay
RL
1 k:
17
28
ns
to Active Output
CL
45 pF
Maximum Disable Delay
RL
1 k:
15
25
ns
from Active Output
CL
5 pF
Delay
tPZH, tPZL
tPHZ, tPLZ
AC Electrical Characteristics
VCC
2.0V-6.0V, CL
Symbol
50 pF, tr
tf 6 ns (unless otherwise specified)
Parameter
tPHL, tPLH Maximum Propagation
Delay
tPZH, tPZL Maximum Output Enable
Time
tPHZ, tPLZ Maximum Output Disable
Time
Conditions
Capacitance (Note 5)
CIN
25qC
TA
40 to 85qC TA
55 to 125qC
Guaranteed Limits
Units
CL
50 pF
2.0V
58
115
145
171
150 pF
2.0V
83
165
208
246
ns
CL
50 pF
4.5V
14
23
29
34
ns
CL
150 pF
4.5V
17
33
42
49
ns
CL
50 pF
6.0V
10
20
25
29
ns
CL
150 pF
6.0V
14
28
35
42
ns
RL
1 k:
ns
CL
50 pF
2.0V
75
150
189
224
ns
CL
150 pF
2.0V
100
200
252
298
ns
CL
50 pF
4.5V
15
30
38
45
ns
CL
150 pF
4.5V
30
40
50
60
ns
CL
50 pF
6.0V
13
26
32
38
ns
CL
150 pF
6.0V
17
34
43
51
ns
RL
1 k:
2.0V
75
150
189
224
ns
CL
50 pF
4.5V
15
30
38
45
ns
6.0V
13
2.0V
Rise and Fall Time
Power Dissipation
TA
Typ
CL
tTLH, tTHL Maximum Output
CPD
VCC
26
32
38
ns
60
75
90
ns
4.5V
12
15
18
ns
6.0V
10
13
15
ns
(per buffer)
G
VIH
12
G
VIL
50
Maximum Input
pF
pF
5
10
10
10
pF
10
20
20
20
pF
Capacitance
COUT
Maximum Output
Capacitance
Note 5: CPD determines the no load dynamic power consumption, PD
IS CPD VCC f ICC.
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CPD VCC2f ICC VCC, and the no load dynamic current consumption,
4
MM74HC244
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
5
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MM74HC244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
MM74HC244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
7
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MM74HC244 Octal 3-STATE Buffer
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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