Order this document by MPX5999D/D SEMICONDUCTOR TECHNICAL DATA +' # +' &!"( " &$ '&"+"'& +' ,+(,+ %()+,) '%(&*+ & $")+ "$"'& )**,) &*') X–ducer SILICON PRESSURE SENSORS The MPX5999D piezoresistive transducer is a state–of–the–art pressure sensor designed for a wide range of applications, but particularly for those employing a microcontroller or microprocessor with A/D inputs. This patented, single element X–ducer combines advanced micromachining techniques, thin–film metallization and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on the stand–alone sensing chip. Features • Temperature Compensated Over 0 to 85°C BASIC CHIP CARRIER ELEMENT CASE 867–08, STYLE 1 • Ideally Suited for Microprocessor or Microcontroller–Based Systems • Patented Silicon Shear Stress Strain Gauge • Durable Epoxy Unibody Element PIN NUMBER VS 1 Vout 4 N/C 3 2 Gnd 5 N/C 3 VS 6 N/C THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X–ducer SENSING ELEMENT 2 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 1 NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead. Vout PINS 4, 5 AND 6 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic MAXIMUM RATINGS(1) Parametrics Symbol Value Unit Overpressure(2) (P1 > P2) Pmax 4000 kPa Burst Pressure(2) (P1 > P2) Pburst 6000 kPa Tstg – 40° to +150 °C TA – 40° to +125 °C Storage Temperature Operating Temperature 1. TC = 25°C unless otherwise noted. Maximum Ratings apply to Case 867–08 only. 2. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 3. This sensor is designed for applications where P1 is always greater than, or equal to P2. Senseon and X–ducer are trademarks of Motorola, Inc. (Replaces MPX5999) Motorola Sensor Device Data Motorola, Inc. 1997 1 MPX5999D OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 1000 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Characteristic Zero Pressure Offset(3) Voff 0.088 0.2 0.313 Vdc Full Scale Output(4) (0 to 85°C) (0 to 85°C) VFSO 4.587 4.7 4.813 Vdc Full Scale Span(5) (0 to 85°C) VFSS — 4.5 — Vdc V/P — 4.5 — mV/kPa — — — ± 2.5 %VFSS tR — 1.0 — ms IO+ — 0.1 — mA — — 20 — Sec Symbol Min Typ Max Unit Weight, Basic Element (Case 867) — — 4.0 — Grams Cavity Volume — — — 0.01 IN3 Volumetric Displacement — — — 0.001 IN3 Sensitivity Accuracy(6) (0 to 85°C) Response Time(7) Output Source Current at Full Scale Output Warm–Up(8) MECHANICAL CHARACTERISTICS Characteristic NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. 9. P2 max is 500 kPa. 2 Motorola Sensor Device Data MPX5999D ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over 0°C to 85°C. (Device output may be nonlinear outside of the rated pressure range.) The performance over temperature is achieved by integrating the shear–stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the differential or gauge configuration in the basic chip carrier (Case 867). A fluoro silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX5999D pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows a typical decoupling circuit for interfacing the output of the MPX5999D to the A/D microprocessor. Proper decoupling of the power supply is recommended. OUTPUT (V) 5.0 TRANSFER FUNCTION: 4.5 Vout = VS*(0.000901*P+0.04) ± ERROR 4.0 VS = 5.0 Vdc TEMP = 0 to 85°C 3.5 3.0 TYPICAL 2.5 2.0 MAX MIN 1.5 1.0 0.5 0 0 100 200 300 400 500 600 700 800 DIFFERENTIAL PRESSURE (kPa) 900 1000 1100 Figure 2. Output versus Pressure Differential SILICONE DIE COAT STAINLESS STEEL METAL COVER DIE ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ P1 WIRE BOND LEAD FRAME P2 THERMOPLASTIC CASE Figure 3. Cross–Sectional Diagram (Not to Scale) Motorola Sensor Device Data MPX5999D OUTPUT (PIN 1) 50 pF A/D 51 k µ PROCESSOR RTV DIE BOND Figure 4. Typical Decoupling Filter for Sensor to Microprocessor Interface 3 MPX5999D PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX Part Number pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5999D 867–08 Stainless Steel Cap ORDERING INFORMATION The MPX5999D pressure sensor is available as an element only. MPX Series D i T Device Type Basic Element 4 O i Options Differential C Case Type T 867–08 Order Number MPX5999D Device Marking MPX5999D Motorola Sensor Device Data MPX5999D PACKAGE DIMENSIONS C R POSITIVE PRESSURE (P1) M B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). –A– N PIN 1 SEATING PLANE J S 1 2 3 4 5 L 6 –T– G F D 6 PL 0.136 (0.005) M T A CASE 867–08 ISSUE N M DIM A B C D F G J L M N R S INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 VOUT GROUND VCC V1 V2 VEX BASIC ELEMENT (A, D) Motorola Sensor Device Data 5 MPX5999D Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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