Order this document by MPXS4115A/D SEMICONDUCTOR TECHNICAL DATA ##! ! !#! #" #!# !""$! "! # !#$! OPERATING OVERVIEW INTEGRATED PRESSURE SENSOR 15 to 115kPa (2.2 to 16.7 psi) 0.2 to 4.8 Volts Output "# !# The Motorola MPXS4115A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure. Motorola’s MAP sensor integrates on–chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on–chip integration make the Motorola MAP sensor a logical and economical choice for the automotive system designer. AXIAL PORT OPTION CASE 471B–01 Features • 1.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller–Based Systems • Patented Silicon Shear Stress Strain Gauge PIN NUMBER • Temperature Compensated from – 40° to +125°C • Durable Epoxy Unibody Element • Also Available in Unibody Package (See MPX4115A/D Data Sheet) Application Examples • Aviation Altimeters 1 N/C 5 N/C 2 6 N/C 3 VS Gnd 7 N/C 4 Vout 8 N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. • Industrial Controls • Engine Control • Weather Stations and Weather Reporting Devices VS 2 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 X–ducer SENSING ELEMENT 3 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY 4 Vout PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic This document contains information on a new product. Specifications and information herein are subject to change without notice. Senseon and X–ducer are trademarks of Motorola, Inc. REV 1 Motorola Sensor Device Data Motorola, Inc. 1997 1 MAXIMUM RATINGS(1) Parametrics u P2) Burst Pressure(9) (P1 u P2) Overpressure(9) (P1 Storage Temperature Symbol Value Units Pmax 400 kPa Pburst 1000 kPa Tstg –40° to +125° °C TA –40° to +125° °C Operating Temperature 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 Characteristic Pressure Range u P2) Symbol Min Typ Max Unit POP 15 — 115 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(2) @ VS = 5.1 Volts (0 to 85°C) Voff 0.135 0.204 0.273 Vdc Full Scale Output(3) @ VS = 5.1 Volts (0 to 85°C) VFSO 4.725 4.794 4.863 Vdc Full Scale Span(4) @ VS = 5.1 Volts (0 to 85°C) VFSS — 4.590 — Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS mV/kPa Sensitivity V/P — 45.9 — Response Time(6) tR — 1.0 — mS Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time(7) — — 20 — mSec Offset Stability(8) — — ± 0.5 — %VFSS Symbol Min Typ Max Unit — — 1.5 — Grams ā Decoupling circuit shown in Figure 2 required to meet Electrical Specifications. MECHANICAL CHARACTERISTICS Characteristic Weight, Basic Element (Case 471) NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 9. Exposure beyond these limits may cause permanent damage or degradation to the device. 2 Motorola Sensor Device Data MPXS4115A SENSOR OUTPUT (PIN 4) 50 pF A/D 51 k µ PROCESSOR Figure 2. Recommended Decoupling Filter for Sensor to Microprocessor Interface This surface mount package (Case 471–01) is an absolute sensing configuration package. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXS4115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the recommended decoupling circuit for interfacing the output of the integrated BAP sensor to the A/D input of a microprocessor (see Note 10). Figure 3 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. (Output will saturate outside of the rated pressure range.) 5.0 4.5 OUTPUT (Volts) 4.0 3.5 TRANSFER FUNCTION: Vout = Vs* (.009*P–.095) ± Error VS = 5.1 Vdc TEMP = 0 to 85°C MAX TYP 3.0 2.5 2.0 1.5 MIN 1.0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0.5 Pressure (ref: to sealed vacuum) in kPa Figure 3. Output versus Absolute Pressure Motorola Sensor Device Data 3 Transfer Function (MPXS4115A) Nominal Transfer Value: Vout = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.1 ± 0.25 Vdc Temperature Error Band MPXS4115A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier – 40 0 to 85 125 3 1 3 1.0 0.0 –40 –20 0 20 40 80 60 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) –1.0 – 2.0 – 3.0 Pressure Error (Max) 15 to 115 (kPa) ± 1.5 (kPa) ORDERING INFORMATION Depending upon the Options, the MPXS4115A pressure sensors are available shipped in Sleeves, Tape and Reel, and Trays. Packing Options Sleeve Pack 4 Port Options Leadform Case No. Axial Gull Wing 471B–01 MPXS Series Order No. MPXS4115AC6U Marking MPXS4115A Motorola Sensor Device Data INFORMATION FOR USING THE SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.835 0.100 TYP 0.060 TYP 8X NOT TO SCALE 0.300 0.080 TYP 8X Motorola Sensor Device Data 5 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. MARKING SURFACE –A– 8 1 G –B– W 5 4 X D 8 PL 0.25 (0.010) P M T B S A S R S MOLD GATE LOCATION THIS SURFACE U V Y C –T– SEATING PLANE J M F DIM A B C D F G J M P R S U V W X Y INCHES MIN MAX 0.658 0.668 0.541 0.551 0.555 0.585 0.046 0.054 0.037 0.053 0.100 BSC 0.009 0.011 0_ 7_ 0.856 0.880 0.185 0.195 0.155 0.165 0.120 0.130 0.305 0.315 0.561 0.571 0.010 0.025 0.002 0.010 STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. MILLIMETERS MIN MAX 16.71 16.97 13.74 13.99 14.10 14.86 1.17 1.37 0.94 1.34 2.54 BSC 0.23 0.28 0_ 7_ 21.74 22.35 4.69 4.95 3.94 4.19 3.05 3.30 7.75 8.00 14.25 14.50 0.25 0.63 0.05 0.25 NC VSUPPLY GROUND VOUT NC NC NC NC CASE 471B–01 ISSUE O Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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