Order this document by MPX2700A/D SEMICONDUCTOR TECHNICAL DATA '# '# %&&(% !$%'(% #!$"&' %' #" %&&(% "&#%& The MPX2700A series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin–film resistor network integrated on–chip. The sensor is laser trimmed for precise span and offset calibration and temperature compensation. X–ducer SILICON PRESSURE SENSORS Features • Unique Silicon Shear Stress Strain Gauge • ± 1.0% Linearity • Full Scale Span Calibrated to 40 mV • Easy to Use Chip Carrier Package • Basic Element, Single Ported Devices Available Application Examples • Pump/Motor Controllers • Pneumatic Control • Tire Pressure Gauges • Robotics • Medical Diagnostics BASIC CHIP CARRIER ELEMENT CASE 344–11 Style 1 DIFFERENTIAL PORT OPTION CASE 350–05 Style 1 • Pressure Switching • Hydraulics Pin Number 1 2 3 4 Ground + Vout VS – Vout MAXIMUM RATINGS Rating (8) Overpressure (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit Pmax 2800 kPa Pburst 5000 kPa Tstg – 40 to +125 °C TA – 40 to +125 °C VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand–alone pressure sensor chip. VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY X–ducer SENSING ELEMENT 2 4 Vout+ Vout– 1 X–ducer is a trademark of Motorola, Inc. GND Figure 1. Temperature Compensated Pressure Sensor Schematic Sensor Motorola Motorola, Inc. 1996 Device Data 1 OPERATING CHARACTERISTICS (VCC = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 700 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc VFSS 37.5 40 42.5 mV Voff –2.0 — 2.0 mV Sensitivity ∆V/∆P — 0.057 — mV/kPa Linearity(5) — – 1.0 — 1.0 %VFSS Pressure Hysteresis(5) (0 to 700 kPa) — — ± 0.1 — %VFSS Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %VFSS TCVFSS –1.0 — 1.0 %VFSS TCVoff –1.0 — 1.0 mV Zin 1300 — 4000 Ω Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Offset Stability(5) — — ± 0.5 — %VFSS Full Scale Span(3) Offset(4) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance MECHANICAL CHARACTERISTICS Symbol Min Typ Max Unit Weight (Basic Element Case 344) Characteristic — — 2.0 — Grams Warm–Up — — 15 — Sec Cavity Volume — — — 0.01 Cubic In Volumetric Displacement — — — 0.001 Cubic In Common Mode Line Pressure(7) — — — 690 kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, – 40 to 125°C, and 1.5 million pressure cycles, with zero differential pressure applied. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. 2 Motorola Sensor Device Data LEAST SQUARES FIT EXAGGERATED PERFORMANCE CURVE RELATIVE VOLTAGE OUTPUT LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit (see Figure 3). While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 0 50 PRESSURE (% FULLSCALE) 100 Figure 2. Linearity Specification Comparison ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2700A series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full–Scale Span and Offset are very small and are shown under Operating Characteristics. 50 OUTPUT (mV) 40 VS = 10 V TA = 25°C P1 > P2 30 TYP SILICONE DIE COAT MAX SPAN RANGE (TYP) 20 MIN –5 PSI kPa 20 140 40 280 60 420 80 560 100 700 LEAD FRAME OFFSET Figure 3. Output versus Pressure Differential Figure 4 shows the cross section of the Motorola MPX pressure sensor die in the chip carrier package. A silicone gel isolates the die surface and wire bonds from harsh environments, while allowing the pressure signal to be transmitted to the silicon diaphragm. MPX2700A series pressure sensor operating characteristics and internal reli- Motorola Sensor Device Data DIE P1 WIRE BOND 10 0 ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ P2 STAINLESS STEEL METAL COVER RTV DIE BOND THERMOPLASTIC CASE Figure 4. Cross–Section of Differential Pressure Sensor Die in Its Basic Package (Not to Scale) ability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which protects the die from harsh media. The Motorola MPX presPart Number sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type Pressure (P1) Side Identifier MPX2700A 344–11 Stainless Steel Cap MPX2700AP 350–05 Side with Port Attached MPX2700ASX 371C–03 Side with Port Attached ORDERING INFORMATION MPX2700A series pressure sensors are available in various absolute configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute Case 344–11 MPX2700A MPX2700A Ported Elements Stovepipe Case 350–05 MPX2700AP MPX2700AP Axial Case 371C–03 MPX2700ASX MPX2700A 4 Motorola Sensor Device Data PACKAGE DIMENSIONS C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– DOES NOT INCLUDE MOLDED FLASH RING. MOLDED FLASH RING NOT TO EXCEED 16.00 (0.630). R M B –A– DIM A B C D F G J L M N R N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J G F D 4 PL 0.136 (0.005) T A M M INCHES MIN MAX 0.595 0.620 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 15.75 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–11 ISSUE R BASIC ELEMENT (A, D) SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– –T– U L R H N PORT #1 POSITIVE PRESSURE –Q– B 1 2 3 4 PIN 1 K –P– 0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 350–05 ISSUE J PRESSURE SIDE PORTED (AP, GP) Motorola Sensor Device Data 5 PACKAGE DIMENSIONS — CONTINUED –T– C A E –Q– U N V B R PORT #1 POSITIVE PRESSURE PIN 1 –P– 0.25 (0.010) M T Q M 4 3 2 1 S K F J G D 4 PL 0.13 (0.005) M T P S Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. S MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 GROUND V (+) OUT V SUPPLY V (–) OUT CASE 371C–03 ISSUE C PRESSURE SIDE PORTED (ASX, GSX) Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 6 ◊ *MPX2700A/D* Motorola Sensor Device Data MPX2700A/D