E2A0013-16-X1 ¡ Semiconductor MSM7510 Semiconductor This version: Jan. 1998 MSM7510 Previous version: Nov. 1996 300 bps Full Duplex FSK Modem – ITU-T V.21 GENERAL DESCRIPTION The MSM7510 is useful for the ITU-T V.21 modem, for examples, low cost built-in modems, telecontrol systems, home security systems, etc. The family version, MSM7512B for ITU-T V.23, will be available following this device. Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these devices need two power supplies, +5 V for digital and +12 V for analog. New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power consumption. FEATURES • Conforms to ITU-T V.21, 300 bps Full Duplex • ITU-T V.25 Answer Tone (2100 Hz) with Generator/Detector • Single Power Supply : +3 V to +5 V • Low Power Consumption Operating Mode: 25 mW Typ. Power Down Mode : 0.1 mW Max. • Line Hybrid Circuit on Chip (direct drive capability of 600W) • ALB (Analog–Loop back) with test mode. • 3.579545 MHz Crystal Oscillator • Digital Interface: TTL • Package options: 16-pin plastic DIP (DIP16-P-300-2.45) (Product name: MSM7510RS) 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM7510GS-K) 1/12 Semiconductor MSM7510 BLOCK DIAGRAM AI (2) + Demodulator – *R1 *R1 AOG *R2 Modulator *R2 – AO (3) FSK & ANS Bandpass Filter *R3 *R2 + EAI (4) X1 (6) X2 (7) O/A (13) OSC MOD1 (14) CLK GEN. CONT. CLK (8) VDD (1) GND (5) RD (9) CD (10) XD (11) RS (12) MOD2 (15) AOG (16) SG GEN. * R1 to R3 ≥ 50 kW ( ) : for MSM7510RS 2/12 Semiconductor MSM7510 PIN CONFIGURATION (TOP VIEW) VDD 1 16 AOG AI 2 15 MOD2 AO 3 14 MOD1 EAI 4 13 O/A GND 5 12 RS X1 6 11 XD X2 7 10 CD CLK 8 9 RD 16-Pin Plastic DIP 24 AOG VDD 1 NC 2 23 NC 22 MOD2 AI 3 NC 4 21 NC AO 5 20 MOD1 EAI 6 19 O/A GND 7 18 RS X1 8 17 XD NC 9 16 NC X2 10 15 CD NC 11 14 NC CLK 12 13 RD 24-Pin Plastic SOP NC: No connect pin 3/12 Semiconductor MSM7510 PIN DESCRIPTION No. RS GS-VK Name I/O Description 1 1 VDD — +3 V to +5 V Power Supply 2 3 AI I Analog receive signal input. 3 5 AO O Analog transmit signal output. External analog signal input. 4 6 EAI I The signal applied to this pin is transmitted from AO via transmit output amplifier. When not using this pin, it should be left opened. 5 7 GND — 6 8 X1 I 7 10 X2 O 8 12 CLK O Ground, 0 V. 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock 3.579545 MHz to the device, it should be applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1 has to be opened. 3.579545 MHz clock signal output. Modem receive serial data output. 9 13 RD O Digital "1" and "0" correspond to "Mark" and "Space", respectively. When CD (Carrier Detect) is off, RD is held at "Mark" state. 10 15 CD O 11 17 XD I* 12 18 RS I* 13 19 O/A I* FSK receive signal and answer tone detect. Digital "0" and "1" represent "Detect" and "Non-detect", respectively. Modem transmit serial data input. Digital "1" and "0" correspond to "Mark" and "Space", respectively. FSK signal and answer tone transmit enable. When digital "0" is applied to RS, transmitting becomes enable. Originate/Answer mode select. Digital "1" Æ Originate mode Digital "0" Æ Answer mode 14 20 MOD1 I* Operation mode select. 15 22 MOD2 I* Refer to Table 1. 16 24 AOG I* Analog transmit signal amplitude select. Digital "1" Æ –10 dBm Typ. at AO Digital "0" Æ –4 dBm Typ. at AO Note : I* : Internally pulled-up input pin. 4/12 Semiconductor MSM7510 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit VDD Ta = 25°C, –0.3 to +7 V Input Voltage VIN With respect to GND –0.3 to VDD + 0.3 V Storage Temperature TSTG — –55 to +150 °C Power Supply Voltage RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Typ. Max. Unit VDD — +2.7 — +5.5 V Top — –40 — +85 °C Input Clock Frequency fCLK To 3.579545 MHz –0.1 — +0.1 % VDD Bypass Capacitor CVDD VDD – GND 10 — — mF Crystal Power Supply Voltage Operating Temperature Oscillation Frequency — — — 3.579545 — MHz Frequency Deviation — +25°C ±5°C –100 — +100 ppm Temperature Characteristics — –40°C to +85°C –50 — +50 ppm Equivalent Series Resistance — — — — 50 W Load Capacitance — — — 16 — pF ELECTRICAL CHARACTERISTICS DC Characteristics ( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Parameter Power Supply Current Digital Input Voltage Digital Input Leakage Current Digital Output Voltage * Symbol Condition Min. Typ. Max. Unit IDD Operating Mode — 5.0 10.0 mA ISS Power Down Mode — 5.0 20.0 mA VIL — 0 — 0.8 V VIH — 2.2 — VDD V IIL VI = 0 V * –80 — 10 mA IIH VI = 5 V –10 — 10 mA VOL IOL = 1.6 mA 0 0.2 0.4 V VOH IOH = –0.4 mA 2.4 — VDD V Internally pulled-up pins 5/12 Semiconductor MSM7510 AC Characteristics Modulator/analog output (AO) characteristics (VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Parameter Symbol fOM FSK Transmit fOS Signal Frequency fAM fAS V. 25 Answer Tone Frequency FSK Transmit fAST Condition Originate Mode Answer Mode Typ. Max. Unit XD = "1" 976 980 984 Hz XD = "0" 1176 1180 1184 Hz XD = "1" 1646 1650 1654 Hz XD = "0" 1846 1850 1854 Hz 2096 2100 2104 Hz AOG = "0" –6 –4 –2 dBm AOG = "1" –12 –10 –8 dBm AOG = "0" –2 0 2 dB AOG = "1" –8 –6 –4 dB Answer Tone Mode RS = "0" VAO1 Signal, Answer Min. AO Tone Amplitude VAO2 Analog External VEA1 Input Signal Gain VEA2 VAO – VEAI FSK Transmit Signal Amplitude VAOD VAO(MARK) – VAO(SPACE) –2 0 2 dB — — P–20 dB VSPS 4 kHz to 8 kHz P : In-band Signal Energy 8 kHz to 12 kHz (0.3 kHz to 3.4 kHz) More than12 kHz — — P–20 dB — — P–60 dB VOFF To VDD/2 –150 — +150 mV RAO — 600 — — W Ratio Out-of-band Energy Output Offset Voltage Output Load Resistance * 0 dBm = 0.775 Vrms 6/12 Semiconductor MSM7510 Demodulator/analog input (Al, EAI) characteristics ( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Parameter Receive Signal Amplitude Symbol Condition Min. Typ. Max. Unit VAI FSK Signal, at AI — — –6 dBm Receive Signal VON FSK Signal, at AI OFF Æ ON — — –42 dBm Detect Amplitude (CD) VOFF I/O Alternative Pattern OFF Æ OFF –48 — — dBm Hysteresis (CD) VHYS VON Æ VOFF — 2 — dB CD Delay Time tCDD See Fig. 1 5 15 20 ms CD Hold Time tCDH FSK Signal, Answer Tone 20 40 60 ms DBS 300 bps, I/O Alternative Pattern –10 — 10 % fASR 2100 Hz –20 — 20 Hz VAON Detect, at AI –46 — –6 FAOF Non-Detect, at AI — — –60 RAI AI — 10 — MW REAI EAI 20 — — kW Receive Data (RD) Bias Distortion Answer Tone Detect (CD) Freq. Answer Tone Detect, Non-Detect Amplitude (CD) Input Resistance * dB 0 dBm = 0.775 Vrms AI CD tCDD tCDH Figure 1 Carrier Detect (CD) Timing 7/12 Semiconductor MSM7510 OPERATION MODE Table 1 Operation Mode MOD2 MOD1 0 0 FSK Modem Normal Mode (Fig.2) 0 1 Analog Loop Back Test Mode (Fig.3) 1 0 Answer Tone Transmit/Detect Mode* 1 1 Power Down Mode Mode * Answer Tone Transmit: RS = "0" RS = "1" Answer Tone Detect: Detect Non-detect Æ Æ Æ Æ Enable Disable CD = "0" CD = "1" When transmitting the answer tone, CD is held at digital "1". AI Receive Filter Demodulator RD Phone Line DTE AO Transmit Filter Modulator XD Figure 2 FSK Modem Normal Mode AI Receive Filter Demodulator RD Phone Line DTE XD AO Transmit Filter Modulator SG Figure 3 Analog Loop Back Test Mode 8/12 Semiconductor MSM7510 APPLICATION CIRCUIT ➀ MSM7510RS 1 VDD AI AO 600 W EAI GND 10 mF X1 X2 3.58 MHz CLK 8 600 W : 600 W 2.2 mF – + + – Lone AOG MOD2 MOD1 O/A RS XD CD RD 16 CONT. 9 To other circuit ➁ MSM7510RS 600 W : 600 W 2.2 mF – + VDD AI AO 600 W EAI GND 10 mF X1 X2 100 pF CLK 8 + – Line 1 External Clock AOG MOD2 MOD1 O/A RS XD CD RD 16 CONT. 9 3.58 MHz 2.2 mF External Analog Transmit Signal 9/12 Semiconductor MSM7510 An Example of the External Adjustment for a Transmitting Level and Detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit. R2 51 kW VAOL Line 600 W 51 kW – – R1 2.2 mF VAO AO + + 51 kW R4 600 W R3 51 kW – VAIL + AI 2.2 mF VAI Line transmitting level : VAOL = VAO ¥ (R2/R1) IC input level : VAI = VAIL ¥ (R4/R3) 10/12 Semiconductor MSM7510 PACKAGE DIMENSIONS (Unit : mm) DIP16-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.99 TYP. 11/12 Semiconductor MSM7510 (Unit : mm) SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12