NCP5008, NCP5009 Backlight LED Boost Driver The NCP5008/NCP5009 is a high efficiency boost converter operating in current loop control mode to drive Light Emitting Diode. The current mode regulation allows a uniform brightness of the LEDs. Features • • • • • • • • • • • • http://onsemi.com 2.7 to 6.0 V Input Voltage Range Output Voltage from Vbat to 15 V 3.0 A Quiescent Supply Current Automatically LEDs Current Matching No External Sense Resistor Includes Dimming Function Programmable or Automatic Current Output Mode LOCAL or REMOTE Control Facility Photo Transistor Sense Feedback Input Inductor Based Converter brings High Efficiency Low Noise DC/DC Converter All Pins are Fully ESD Protected MARKING DIAGRAM Micro 10 DM SUFFIX CASE 846B 10 5Tx AYW 1 x A Y W Typical Applications = Device Number 8 or 9 = Assembly Location = Year = Work Week PIN CONNECTIONS • LED Display Back Light Control • High Efficiency Step Up Converter Vbat Iref 1 10 NC 2 3 9 8 L1 CS VBIAS 4 7 CLOCK 5 6 GND LOCAL Vbat L2 Iout NCP5008 C1 U1 R1 1 30 k 2 GND Q1 NPN−PHOTO Iref Vbat PHOTO L1 10 10 F/6.3 V GND 9 L1 22 H Vbat 1 10 CS 2 3 9 8 VBIAS 4 7 GND CLOCK 5 6 LOCAL Vbat L1 L2 Iout NCP5009 GND Vcc MICROCONTROLLER Iref Photo D5 MBR0520 4 VBIAS 3 CS 5 CLK D1 LED GND 8 7 GND 6 LOCAL L2 NCP5009 D2 LED D3 D4 LED LED ORDERING INFORMATION GND See detailed ordering and shipping information in the package dimensions section on page 18 of this data sheet. C2 GND 2.2 F/16 V Figure 1. Typical Battery Powered LED Boost Driver Semiconductor Components Industries, LLC, 2003 August, 2003 − Rev. 4 1 Publication Order Number: NCP5008/D NCP5008, NCP5009 BACK LIGHT WHITE LED CURRENT DRIVE CONTROLLER Vbat Vbat POR R1 Iout Reference 50 k 3 9 L1 Vbat 8 L2 7 GND Isense + − CS 5 Vbat POR 1:8 Vref Selection CLK 4 Serial To Parallel Latches VBIAS 10 1R8 BandGap A=10 GND Vbat Vbat Vref Q2 Vbat 50 k POR Iout Q1 LOCAL 6 Iref 1 2 GND Vbat Vbat + Vbat_OK BANDGAP REFERENCE − PHOTO (See Note) CONTROLLER GND NOTE: This functionality is NOT implemented on the NCP5008 type. Figure 2. Block Diagram http://onsemi.com 2 BandGap NCP5008, NCP5009 PIN FUNCTION DESCRIPTION Pin Symbol Type Description 1 Iref INPUT This pin provides the output current range adjustment by means of a resistor connected to ground. The current output tolerance depends upon the accuracy of this resistor. Using a 1% metal film resistor, or better, yields the best output current accuracy. 2 PHOTO SIGNAL This pin provides an access to the output current control loop for the NCP5009 version. The current sunk to ground from this pin is subtracted from the output current mirror. Primary use is the ambient light automatic adjustment by means of an external photo transistor connected across this pin and ground. The output current decreases as the ambient light increases. The internal circuit provides a 1/1 current ratio with the Iref defined by the resistor connected from pin 1 to ground. This current shall be limited to 65 A. This functionality is NOT implemented on the NCP5008 type. 3 CS INPUT Negative going Chip Select logic input. This pin is used to select the NCP5008/ NCP5009 and validate the clock/data when CS = Low. The internal shift register is automatically clear to zero upon the falling edge, thanks to a 20 ns built−in one shoot. The built−in pull−up resistor disables the device when the CS pin is left open. 4 VBIAS POWER 5 CLOCK INPUT The clock signal connected to this pin is used to serially shift right the internal preset high logic level. The clock is valid between the falling edge and until the rising edge of the CS. There is neither a feedback nor an overflow control. If the clock count exceeds 8 bits, the internal register is clear, the output current is forced to zero and the device comes back to the shutdown mode. 6 LOCAL INPUT This pin is used to select the mode of operation. This pin should be connected to Vbat. • When LOCAL = High or Open, the chip is controlled by two digital lines: CS and CLOCK. The output current is programmed by the logic control of these pins, allowing a current adjustment within the range defined by the Iref resistor. • When LOCAL = Low, the chip is turned ON /OFF by means of the CS line, the CLOCK pins being deactivated. The output current is constant, as defined by the Iref resistor value. In order to minimize the standby current a dynamic pull−up resistor is activated when POR is High, this pull−up resistor being disconnected when LOCAL = Low. 7 GND POWER This pin is the system ground for the NCP5008/NCP5009 and carries both the Power and the Digital signals. High quality ground must be provided to avoid spikes and/or uncontrolled operation. Care must be observed to avoid high−density current flow in a limited PCB copper track. 8 L2 POWER This pin is the power side of the external inductor and must be connected either to the external Schottky diode (see Figure 22) or directly to one external LED (see Figure 23). It provides the output current to the load. Since the boost converter operates in a current loop mode, the output voltage can range up to +15 V but shall not extend this limit. The user must make sure this voltage will not be exceeded during the normal operation of this part. An external low cost ceramic capacitor (2.2 F/16 V, ESR < 100 m) is recommended to smooth the current flowing into the diode(s), thus limiting the noise created by the fast transients present in this circuitry. Care must be observed to avoid EMI though the PCB copper tracks connected to this pin. 9 L1 POWER The return side of the external inductor shall be connected to this pin. Typical application will use a 22 H, size 1210, to handle the 2.8 to 364 mA max range. On the other hand, when the desired output current is above 20 mA, the inductor shall have an ESR < 1.0 . The output current tolerance can be improved by using a larger inductor value. 10 Vbat POWER The external voltage supply is connected to this pin. A high quality reservoir capacitor must be connected across pin 10 and Ground to achieve the specified output voltage parameters. A 10 F/6.3 V, low ESR capacitor must be connected as close as possible across pin 10 and ground pin 7. The X5R ceramic types are recommended. http://onsemi.com 3 NCP5008, NCP5009 Table 1. Shift Register Bits Assignment and Functions SetReg shift register (Note: The register content is latched upon CS positive going). Bn Value After POR Iout Peak (mA) B7 B6 B5 B4 B3 B2 B1 0 0 0 0 0 0 0 Iref*k*7.5 Iref*k*6.5 Iref*k*5.5 Iref*k*4.5 Iref*k*3.5 Iref*k*2.5 Iref*k*1.5 LOCAL CLOCK CS B1−B7 Output Current L X H X 0 L X L X Iref * k H or Open X H No Change Iref * k * (Bn + 0.5) H or Open ↓ L No Change Iref * k * (Bn + 0.5) H or Open ↑ L Qdata → Bn Iref * k * (Bn + 0.5) The register is clear to zero during the first 20 ns following the CS falling edge. Note: Coefficient Value (internal ratio): k = 746 Maximum output peak current @ B7 = 1 and Iphoto = 0 A : Iout peak = Iref * (7 + 0.5) * 746 = Iref * 5595 V Iref ref 1.24 V R1 R1 http://onsemi.com 4 NCP5008, NCP5009 MAXIMUM RATINGS Rating Power Supply Symbol Value Unit Vbat, VBIAS 7.0 V VL2 16 V CLK, CS −0.3 V Vbat + 3.0 V 1.0 V mA Output Power Supply Voltage Compliance Digital Input Voltage Digital Input Current Human Body Model: R = 1500 , C = 100 pF ESD 2.0 kV Machine Model ESD 200 V Micro 10 Package Power Dissipation @ TA = +85°C Thermal Resistance Junction−to−Air PD RThja 200 200 mW °C/W Operating Ambient Temperature Range TA −25 to +85 °C Operating Junction Temperature Range TJ −25 to +125 °C TJmax +150 °C Tstg −65 to +150 °C Maximum Junction Temperature Storage Temperature Range Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum−rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. POWER SUPPLY SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.) Rating Pin Symbol Min Typ Max Unit Power Supply 10 Vbat 2.7 − 6.0 V Power Supply Threshold Start Up Voltage 10 VbatThr − 2.3 2.7 V Output Load Voltage Compliance 8 Vout − − 15.0 V Pulsed Current Regulation Range 8 Iout 0 − 400 mA Continuous DC Current in the Load 8 Iout − − 75 mA Output Pulsed Current Tolerance @ Vbat = 3.6 V, L1 = 22 H/0.71 , Rref 1%, ILED = 20 mA (Note 1) 8 Iout − 5.0 − % Output Leakage @ LOCAL = 0, CS = H, Vout = 15 V, Vbat = 6.0 V 8 Iout − − 500 nA Standby Current @ Iout = 0 mA, CS = H, CLK = H, Vbat = VBIAS = 3.6 V 10 Istdb − 3.0 − A Standby Current @ Iout = 0 mA, CS = H, CLK = H, Vbat = VBIAS = 6.0 V 10 Istdb − − 10 A Operating Current @ Vbat = VBIAS = 3.6 V, Iref = 30 A, CLK = H, CS = L, LOCAL = Open 10 Iope − 600 − Boost Internal Oscillator Clock @ L1 = 22 H, Vbat = VBIAS = 3.6 V, Iout = 20 mA (Vout = 14 V) − Fosc − 1. The tolerance refers to the 20 mA to 70 mA current range. http://onsemi.com 5 A 300 − kHz NCP5008, NCP5009 DIGITAL SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.) Pin Symbol Min Typ Max Unit High Level Input Voltage Low Level Input Voltage Input Capacitance 3, 5 VIH VIL Cin 0.7 * Vbat − − − − 10 Vbat 0.3 * Vbat − V V pF High Level Input Voltage Low Level Input Voltage Input Capacitance 6 VIH VIL Cin − − − 0.6 * Vbat 0.4 * Vbat 10 − − − V V pF LOCAL Pull−up Resistor 6 Rloc 20 − 80 k LOCAL Leakage Current 9 ILoc − − 100 nA CS Pull−up Resistor 3 Rcs 20 − 80 k Minimum CS Low Time 3 Tcssetup 250 − − ns Clock Frequency 5 FCLK − − 5.0 MHz CLOCK tr and tf 5 trCLK, tfCLK 10 − − ns Internal Register Clear − tclear 10 30 − ns Internal Power on Reset Width − tPOR − 100 − s Rating 2. Digital inputs undershoot < − 0.30 V, Digital inputs overshoot < 0.30 V. ANALOG SECTION (−25°C to +85°C ambient temperature, unless otherwise noted.) Rating Pin Symbol Min Typ Max Unit Output Voltage Range Reference @ 2.5 A < Iref < 65 A (Note 3) 1 Vref 1.20 1.24 1.28 V Maximum Output Current Range Ratio 8 Iout − 5595 − − Minimum Output Current Range Ratio 8 Iout − 1119 − − 10, 9 Rs − 1.8 5.0 Output Voltage Range Reference @ 2.5 A < Ipho < 65 A 2 Vpho 1.20 1.24 1.28 V Output Current Stabilization tdelay following a DC/DC start up 8 Ioutdly − 100 − s Internal NMOS Resistor @ Vbat = 3.6 V 8 QRDSON − 2.2 3.0 Internal Comparator Delay Time − Tdcomp − 60 − ns Output Current Sense Resistor 3. The overall tolerance depends upon the accuracy of the external resistor. Using a 1%/low PPM metal film resistor is recommended to achieve 5% output current tolerance. http://onsemi.com 6 NCP5008, NCP5009 TYPICAL OPERATING CHARACTERISTICS 80 80 75 75 Vbat = 4.2 V EFFICIENCY (%) EFFICIENCY (%) Condition: Typical Application: L = 22 H, Cin = 10 F, Cout = 2.2 F, R1 = 30 k 70 Vbat = 3.6 V 65 60 55 Vbat = 4.2 V Vbat = 3.6 V 70 65 60 55 Vbat = 3.0 V Vbat = 3.0 V 50 50 0 5 10 15 20 25 30 35 0 5 10 15 ILED (mA) 20 25 30 35 ILED (mA) Figure 4. Efficiency vs. Load Current @ 3 LEDS (Vload = 3*Vf ⇒ 10.5 V) Figure 3. Efficiency vs. Load Current @ 4 LEDS (Vload = 4*Vf ⇒ 14.2 V) 100 85 Vbat = 4.2 V 90 Vbat = 3.6 V 75 EFFICIENCY (%) EFFICIENCY (%) 80 Vbat = 3.0 V 70 Vout =7.5 V Iled = 40 mA 80 Vout = 15 V Iled = 20 mA 70 60 65 50 2.5 60 0 5 10 15 20 25 30 35 3.0 3.5 4.0 4.5 5.0 5.5 ILED (mA) Vbat (V) Figure 5. Efficiency vs. Load Current @ 2 LEDS (Vload = 2*Vf ⇒ 7.1 V) Figure 6. Efficiency vs. Vbat @ Vout = 15 V/Iled = 20mA and Vout = 7.5 V/Iled = 40 mA 100 400 Vbat = 6.0 V 300 7 6 250 5 Ipeak (mA) EFFICIENCY (%) 95 5.0 V 4.2 V 85 4 200 3 150 2 100 80 6.5 Bn 350 90 6.0 1 50 3.6 V 3.0 V 75 0 10 20 30 40 50 60 0 0 70 20 40 60 ILED (mA) Iref (A) Figure 7. Efficiency vs. Load Current @ 4 LEDS (Vload = 2 strings of 2 LEDs in series = 7.1V) Figure 8. Inductor peak Current vs. Iref @ Bn = {1, 2, 3, 4, 5, 6, 7} http://onsemi.com 7 80 NCP5008, NCP5009 TYPICAL OPERATING CHARACTERISTICS Condition: Typical Application: L = 22 H, Cin = 10 F, Cout = 2.2 F, R1 = 30 k 50 20 18 Vload = 10 V 40 16 35 14 Ipeak ERROR (%) ILED (mA) 45 30 Vload = 15 V 25 20 15 12 10 8 6 10 4 5 2 0 0 10 20 30 40 50 60 0 0 70 50 100 150 200 250 300 350 Iref (A) THEORETICAL Ipeak (mA) Figure 9. Load Current (Iled) vs. Iref @ Vbat = 3.6 V, Vload = 15 V and 10 V Figure 10. Inductor Peak Current Error vs. Theoretical Inductor Peak Current 400 7.0 200 180 6.5 Theoretical 160 6.0 Measured 120 Istby (A) Ipeak (mA) 140 100 80 5.5 5.0 4.5 60 4.0 40 3.5 20 0 0 10 20 30 40 3.0 2.4 Iphoto (A) 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 6.0 Vbat (V) Figure 11. Inductor Peak Current vs. Iphoto @ Iref = 34 A Figure 12. Stand by Current vs. Vbat @ T = 20°C http://onsemi.com 8 NCP5008, NCP5009 TYPICAL OPERATING CHARACTERISTICS 80 85 75 80 Vbat = 4.2 V 70 EFFICIENCY (%) EFFICIENCY (%) Condition: Typical Application: L = 22 H, Cin = 10 F, Cout = 2.2 F, R1 = 30 k 65 60 75 Vbat = 3.6 V 70 65 60 Vbat = 3.6 V 55 Vbat = 4.2 V Vbat = 3.0 V 55 Vbat = 3.0 V 50 50 0 5 10 15 20 25 30 35 0 5 10 ILED (mA) 15 20 25 35 ILED (mA) Figure 14. Efficiency vs. Load Current @ 3 LEDS (Vload = 3*Vf ⇒ 10.5 V) Figure 13. Efficiency vs. Load Current @ 4 LEDS (Vload = 4*Vf ⇒ 14.2 V) 90 100 Vbat = 6.0 V Vbat = 4.2 V 95 EFFICIENCY (%) 85 EFFICIENCY (%) 30 Vbat = 3.6 V 80 75 Vbat = 3.0 V 70 5.0 V 90 4.2 V 85 80 3.6 V 65 75 3.0 V 60 70 0 5 10 15 20 25 30 35 0 ILED (mA) 10 20 30 40 50 60 70 ILED (mA) Figure 16. Efficiency vs Load Current @ 4 LEDS (Vload = 2 strings of 2 LEDs in series = 7.1 V) Figure 15. Efficiency vs Load Current @ 2 LEDS (Vload = 2*Vf ⇒ 7.1 V) http://onsemi.com 9 NCP5008, NCP5009 Operating Description Output tCLKmin Vbat ON 90% 50% 10% tf tr OFF Input 0.30* Vbat Figure 17. Digital Timing Definitions 0.70* Vbat Vbat Figure 18. Typical Schmitt Trigger Characteristic Input Schmitt Triggers All the Logic Input pins have built−in Schmitt trigger circuits to prevent the NCP5008/NCP5009 against uncontrolled operation. The typical dynamic characteristics of the related pins are depicted in Figure 18. The output signal is guaranteed to go High when the input voltage is above 0.70*Vbat, and will go Low when the input voltage is below 0.30*Vbat. the current drawn pin 1. The clock signal is irrelevant and the output current is derived by equation Iout = Iref * k, the internal constant k being equal to 746. ESD Protection The NCP5008/NCP5009 includes silicon devices to protect the pins against the ESD spikes voltages. To cope with the different ESD voltages developed in the applications, the built−in structures have been designed to handle 2.0 kV in Human Body Model (HBM) and 200 V in Machine Model (MM) and on each pin. Local Mode When the system operate in a Local Mode (Pin 6, /LOCAL=Low), the output current depends solely upon http://onsemi.com 10 NCP5008, NCP5009 Remote Control Programming Sequence tCSsetup CS tclear CLEAR CLK Qdata B1 B2 B3 B4 B5 Last Latched Bit B6 B7 Iout ref Output Current Programmed Register Internal Latch Data and Reset Ioutdly Iout Figure 19. Programming Sequence Upon CS transition from High to Low, the internal sequence will take place: − Qdata is internally set to high level. − Upon positive going transition of the next CLK signal, the Qdata is shifted to the next Bn stage. − Clear the Qdata flip−flop upon the positive going of the SetReg[B1] transient. The sequence keeps going until CS = High. When the CS line returns to a High state, the programming output current flip−flop is set according to the previous state of the shift register and SetReg B[1−7] is cleared afterward. Depending upon the CS width, for a given CLK period, the last SetReg bit will be latched and the output current will be adjusted accordingly. If the number of CLK pulses is higher than 7, the Qdata is lost and the SetReg register bits B[1−7] are in the Low state, yielding a zero output current. The internal shift register can be clear by sending more than 7 pulses to the CLK pin when the pin CS is low. If the internal shift register is clear upon the CS transition from Low to High, the device will be placed or maintained in the shut down mode. When the register content is higher than zero, the DC/DC is activated and a 100 s delay (typical) is necessary to stabilize the output current to the programmed value. http://onsemi.com 11 NCP5008, NCP5009 Set Up Output Current Range Vbat 1 1 Vbat + Iref BandGap − Vbat GND Iref GND 1 Vbat Rref 30 k 1:746 Iphoto 1 Iout Reference = (Iref−Iphoto)*746*(Bn+0.5) 1 I = (Iref−Iphoto)*(Bn+0.5) Vbat 1 + − 1 1 1:Bn 2:1 BandGap GND GND GND GND GND GND Photo Q1 NPN−PHOTO GND Figure 20. Functional Diagram The current sunk to ground on PHOTO pin is subtracted from the current sunk to ground on Iref pin. The result is multiplied by the programmed value (Bn) and then multiplied by the constant factor ratio (k = 746) in the current mirror. The constant factor k is a ratio between the current on Iout sense and the Iout reference internally fixed. The output current reference is: Ipeak = Ivalley + (Iref − Iphoto) * Bn * k. Where k = 746, Bn represents the bit of the internal shift register, range from 1 to 7, and Ivalley = (Iref − Iphoto) * 0.5 * k. We can write also Ipeak = (Iref − Iphoto) * (Bn + 0.5) * k. Please find below the formula to quickly calculate R1 resistor (resistor on Iref pin): Iref 1.24 R1 http://onsemi.com 12 NCP5008, NCP5009 DC/DC Converter Operation The DC/DC converter operates with a boost structure depicted in Figure 21, the load being supplied by the pulsed current coming from the external inductor L1. The current is monitored by the internal sense resistor Rsense to Set and Reset the flip−flop U3 and U6 according to the comparators U2 and U4 output state. Vbat Vbat Vbat + U1 − Rsense 1R8 L1 Vbat GND L1 22 H + U2 − Ipeak_ref U3 L2 Vbat + U4 − Ivalley_ref D5 MBR0520 GND U5 U6 D4 LED Q1 U7 D3 LED GND GND C2 2.2 F/16 V POR D2 LED D1 LED GND GND Figure 21. Basic DC/DC Boost Structure http://onsemi.com 13 NCP5008, NCP5009 Output Load Drive In order to make profit of the built−in Boost capabilities, one shall operate the NCP5008/NCP5009 in the continuous output current mode. Such a mode is achieved by using and external reservoir capacitor (preferably a low ESR ceramic type) across the LED as depicted in Figures 22, 23, 24, 25, and 26. Using an extra photo sensor is not mandatory and the related pin 2 can be either left open or connected to Vbat, but must not be grounded on the NCP5009 version only. At this point, the designer must carefully analyze two parameters: 1. The output voltage must be limited to 15 V maximum. It’s the designer responsibility to make sure that spike voltages beyond the maximum rating will not exist across pin 8 and ground. Depending upon a specific application (Vbat voltage, PCB layout…), using an external voltage clamp could be necessary. 2. The peak current flowing into the LED diodes shall be within the maximum ratings specified for these devices. The Schottky diode D5, associated with capacitor C2, provides a rectification and filtering function. When a pulse−operating mode is acceptable: • The LEDs brightness can be controlled in LOCAL mode with a PWM on CS pin as depicted in Figure 24. • Or the Schottky can be removed and replaced by at least one LED diode as depicted in Figure 23. TYPICAL APPLICATION CIRCUIT Vbat C1 U1 R1 1 30 k 2 Iref Vbat PHOTO L1 10 F/6.3 V 10 GND 9 GND Vcc Q1 NPN−PHOTO L1 22 H Vbat MICROCONTROLLER GND 4 VBIAS 3 CS 5 CLK GND NCP5009 GND D5 8 7 GND 6 LOCAL L2 D1 D2 D3 D4 LED LED LED LED C2 2.2 F/16 V GND Figure 22. Basic DC Current Mode Operation in REMOTE Control http://onsemi.com 14 MBR0520 NCP5008, NCP5009 Vbat C1 U1 R1 1 30 k 2 GND Vcc Q1 NPN−PHOTO Iref Vbat PHOTO L1 10 F/6.3 V 10 GND 9 L1 22 H Vbat MICROCONTROLLER GND 4 VBIAS 3 CS 5 CLK 8 7 GND 6 LOCAL L2 GND NCP5009 D3 D4 LED LED GND C2 GND 1.0 F/16 V Figure 23. Typical Semi−Pulsed Mode of Operation in REMOTE Mode Vbat C1 U1 R1 1 30 k 2 GND Q1 NPN−PHOTO Iref Vbat PHOTO L1 10 F/6.3 V 10 GND 9 L1 22 H Vbat GND PWM 4 VBIAS 3 CS 5 CLK D5 8 7 GND 6 LOCAL L2 NCP5009 GND D1 D2 D3 D4 LED LED LED LED C2 2.2 F/16 V GND Figure 24. PWM Current Control Mode Operation in LOCAL Mode http://onsemi.com 15 MBR0520 NCP5008, NCP5009 Vbat C1 U1 R1 1 DAC 30 k 2 Q1 NPN−PHOTO Iref PHOTO 10 F/6.3 V 10 Vbat GND 9 L1 L1 22 H Vbat GND 4 VBIAS 3 CS 5 CLK OFF ON D5 8 7 GND 6 LOCAL L2 MBR0520 NCP5009 GND D1 D2 D3 D4 LED LED LED LED C2 2.2 F/16 V GND Figure 25. DAC Current Control Mode Operation in LOCAL Mode Vbat C1 U1 R1 1 30 k 2 GND Q1 NPN−PHOTO Iref Vbat PHOTO L1 10 F/6.3 V 10 GND 9 L1 22 H Vbat GND OFF ON 4 VBIAS 3 CS 5 CLK D5 8 7 GND 6 LOCAL L2 NCP5009 GND D1 D2 D3 D4 LED LED LED LED C2 GND 2.2 F/16 V Figure 26. Basic DC Current Mode Operation in LOCAL Mode http://onsemi.com 16 MBR0520 NCP5008, NCP5009 TYPICAL LEDS LOAD MAPPING 75 mA Load+ D1 LED D3 LED D5 LED D7 LED D9 LED D2 LED D4 LED D6 LED D8 LED D10 LED 6.7 V Example 1 GND 50 mA Load+ D1 LED D4 LED D7 LED D2 LED D5 LED D8 LED D3 LED D6 LED D9 LED 60 mA Load+ D1 LED D3 LED D5 LED D2 LED D4 LED D6 LED 10.4 V 6.7 V GND Example 2 GND Example 3 Figure 27. Three different examples of load can be driven by the NCP5009 or NCP5008 Condition: Vbat = 3.6 V, L = 22 H MANUFACTURER REFERENCE Design Ref Value/Reference or Size Manufacturer Ref # D5 MBR0520/SOD−123 ON Semiconductor MBR0520 L1 22 H/1210 MURATA LQH3C220K34 C1 10 F/ 6.3 V/0805 MURATA GRM40 X5R 106K 6.3 C2 2.2 F/16 V/1206 MURATA GRM42−6 X7R 225K 16 Q1 SFH320/PLCC2 Osram SFH320 D1 to D4 White LED Osram LW5413−VBW−1 http://onsemi.com 17 NCP5008, NCP5009 ORDERING INFORMATION Device Operating Temperature Range Package Shipping Marking NCP5008DMR2 −25°C top +85°C Micro 10 4000 Tape and Reel 5T8 NCP5009DMR2 −25°C top +85°C Micro 10 4000 Tape and Reel 5T9 LAYOUT EXAMPLE Figure 28. Typical Printed Circuit Layout (the Top Silk Screen and the Top Layer) The Figure 28 represents the typical printed circuit layout based on the basic application Figure 1. This application has been routed on a single copper layer to save cost. A dual side PCB has better noise protection and can be the right choice for an industrial system. In order to avoid voltage spikes, care must be observed to group the capacitors, the inductor, the Schottky diode and the integrated circuit in the same area. On the other hand, using large copper tracks to reduce the resistor connectivity is strongly recommended. Obviously, the connectors GND, CLK, CS, Vbat and Load are for engineering purpose only and not for final application. http://onsemi.com 18 NCP5008, NCP5009 PACKAGE DIMENSIONS Micro 10 DM SUFFIX CASE 846B−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A" DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B" DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846B−01 OBSOLETE. NEW STANDARD 846B−02 −A− −B− K D 8 PL 0.08 (0.003) PIN 1 ID G 0.038 (0.0015) −T− SEATING PLANE M T B S A S C H L J http://onsemi.com 19 DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.95 1.10 0.20 0.35 0.50 BSC 0.05 0.15 0.10 0.21 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 0.037 0.043 0.008 0.014 0.020 BSC 0.002 0.006 0.004 0.008 0.187 0.199 0.016 0.028 NCP5008, NCP5009 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indem nify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800−282−9855 Toll Free USA/Canada http://onsemi.com 20 NCP5008/D