ETC NM93C86ALN

NM93C86AL
16,384-Bit Serial Interface, Low Voltage
CMOS EEPROM (MICROWIRE TM Synchronous Bus)
General Description
Features
The NM93C86AL is 16,384 bits of CMOS nonvolatile, electrically erasable memory available user organized as either
1024 16-bit registers or 2048 8-bit registers. The user organization is determined by the status of the ORG input. The
memory device is fabricated using National Semiconductor’s floating gate CMOS process for high reliability, high
endurance, and low power consumption. The NM93C86AL
is available in an 8-pin SO package for space considerations.
The EEPROM is MICROWIRE compatible for simple interfacing to a wide variety of microcontrollers and microprocessors. There are 7 instructions that operate the
NM93C86AL: Read, Erase/Write Enable, Erase, Write,
Erase/Write Disable, Write All, and Erase All.
The NM93C86AL defaults to the 1024 x 16 configuration if
the ORG pin (Pin 6) is left floating, as it is internally pulled up
to VCC.
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
2.7V to 5.5V operation in all modes
Typical active current of 100 mA; Typical standby
current of 1 mA
Device status indication during programming mode
No erase required before write
Reliable CMOS floating gate technology
MICROWIRE compatible serial I/O
Self-timed programming cycle
40 years data retention
Endurance: 106 data changes
Packages available: 8-pin SO, 8-pin DIP
Block Diagram
TL/D/12511 – 1
TRI-STATEÉ is a registered trademark of National Semiconductor Corporation.
MICROWIRETM is a trademark of National Semiconductor Corporation.
C1996 National Semiconductor Corporation
TL/D/12511
RRD-B30M96/Printed in U. S. A.
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NM93C86AL 16,384-Bit Serial Interface, Low Voltage
CMOS EEPROM (MICROWIRE Synchronous Bus)
September 1996
Connection Diagram
Dual-In-Line Package (N)
and 8-Pin SO Package (M8)
TL/D/12511 – 3
Top View
See NS Package Number
N08E and M08A
Pin Names
CS
Chip Select
SK
Serial Data Clock
DI
Serial Data Input
DO
Serial Data Output
VSS
Ground
ORG
Memory Organizational Select
NC
No Connect
VCC
Positive Power Supply
Ordering Information
Commercial Temp. Range (0§ C to a 70§ C)
Order Number
NM93C86ALN
NM93C86ALM8
Extended Temp. Range (b40§ C to a 85§ C)
Order Number
NM93C86ALEN
NM93C86ALEM8
Automotive Temp. Range (b40§ C to a 125§ C)
Order Number
NM93C86ALVN
NM93C86ALVM8
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2
Absolute Maximum Ratings (Note 1)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Ambient Operating Temperature
NM93C86AL
NM93C86ALE
NM93C86ALV
Ambient Storage Temperature
All Input or Output Voltage
with Respect to Ground
Lead Temperature (Soldering, 10 sec.)
ESD Rating
b 65§ C to a 150§ C
0§ C to a 70§ C
b 40§ C to a 85§ C
b 40§ C to a 125§ C
Power Supply (VCC) Range
2.7V to 5.5V
VCC a 1 to b0.3V
a 300§ C
2000V
DC and AC Electrical Characteristics 2.7V s VCC k 4.5V
Symbol
ICCA
Parameter
Part Number
Condition
Min
Operating Current
CS e VIH, fSK e 250 kHz
ICCS
Standby Current
CS e 0V, ORG e VCC or NC
IIL
Input Leakage
VIN e 0V to VCC (Note 2)
IILO
Input Leakage
ORG pin
ORG tied to VCC
ORG tied to VSS
(Note 3)
IOL
Output Leakage
VIN e 0V to VCC
VIL
Input Low Voltage
VIH
Input High Voltage
0.8 VCC
VOL
Output Low Voltage
IOL e 10 mA
VOH
Output High Voltage
IOH e b10 mA
fSK
SK Clock Frequency
(Note 4)
tSKH
SK High Time
tSKL
SK Low Time
tCS
Minimum CS Low Time
tCSS
Max
Units
1
mA
50
mA
b1
1
mA
b1
b 2.5
1
2.5
mA
b1
1
mA
b 0.1
0.15 VCC
V
VCC a 1
V
0.2
0.9 VCC
0
V
V
250
kHz
1
ms
1
ms
1
ms
CS Set-up Time
0.2
ms
tDH
DO Hold Time
70
ns
tDIS
DI Set-up Time
0.4
ms
tCSH
CS Hold Time
0
ms
tDIH
DI Hold Time
0.4
tPD1
Output Delay to ‘‘1’’
2
ms
tPD0
Output Delay to ‘‘0’’
2
ms
tSV
CS to Status Valid
1
ms
tDF
CS to DO in TRI-STATEÉ
0.4
ms
tWP
Write Cycle Time
15
ms
(Note 5)
3
ms
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DC and AC Electrical Characteristics 4.5V s VCC k 5.5V
Max
Units
ICCA
Symbol
Operating Current
CS e VIH, fSK e 250 kHz
1
mA
ICCS
Standby Current
CS e 0V, ORG e VCC or NC
50
mA
IIL
Input Leakage
VIN e 0V to VCC (Note 2)
b1
1
mA
IILO
Input Leakage
ORG pin
ORG tied to VCC
ORG tied to VSS
(Note 3)
b1
b 2.5
1
2.5
mA
Output Leakage
VIN e 0V to VCC
b1
IOL
Parameter
Part Number
Condition
Min
VIL
Input Low Voltage
b 0.1
VIH
Input High Voltage
2
VOL1
Output Low Voltage
IOL e 2.1 mA
VOH1
Output High Voltage
IOH e b400 mA
VOL2
Output Low Voltage
IOL e 10 mA
VOH2
Output High Voltage
IOH e b10 mA
fSK
SK Clock Frequency
(Note 4)
tSKH
SK High Time
tSKL
SK Low Time
tCS
Minimum CS Low Time
tCSS
CS Set-up Time
tDH
tDIS
NM93C86AL
NM93C86ALE/V
mA
0.8
V
VCC a 1
V
0.4
2.4
0.2
V
1
MHz
VCC b 0.2
0
V
V
V
250
300
ns
250
ns
250
ns
50
ns
DO Hold Time
70
ns
DI Set-up Time
100
ns
tCSH
CS Hold Time
0
ns
tDIH
DI Hold Time
20
ns
tPD1
Output Delay to ‘‘1’’
500
ns
tPD0
Output Delay to ‘‘0’’
500
ns
tSV
CS to Status Valid
500
ns
tDF
CS to DO in TRI-STATE
100
ns
tWP
Write Cycle Time
10
ms
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(Note 5)
1
4
Capacitance TA e a 25§ C, f e 1 MHz
Test
Max
Units
COUT
Symbol
Output Capacitance
5
pF
CIN
Input Capacitance
5
pF
AC Test Conditions
Output Load
1 TTL Gate and CL e 100 pF
Input Pulse Levels
0.4V and 2.4V
Timing Measurement Reference Level
Input
1V and 2V
Output
0.8V and 2.0V
Note 1: Stress ratings above those listed under ‘‘Absolute Maximum Ratings’’ may cause permanent damage to the device. This is a stress rating only and
operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note 2: Typical leakage values are in the 20 nA range.
Note 3: The ORG pin may draw l 1 mA when in the x8 mode due to an internal pull-up transistor.
Note 4: The shortest allowable SK clock period e 1/fSK (as shown under the fSK parameter). Maximum SK clock speed (minimum SK period) is determined by the
interaction of several AC parameters stated in the datasheet. Within this SK period, both tSKH and tSKL limits must be observed. Therefore, it is not allowable to set
1/tSK e tSKH(minimum) a tSKL(minimum) for shorter SK cycle time operation.
Note 5: CS (Chip Select) must be brought low (to VIL) for an interval of tCS in order to reset all internal device registers (device reset) prior to beginning another
opcode cycle. (This is shown in the opcode diagrams in the following pages.)
5
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Interface Pin Description
Chip Select (CS):
Data-Out (DO):
Chip Select performs several functions. It is used to differentiate between various devices on the same MICROWIRE
bus. The rising edge resets the internal circuitry of the device, a function necessary prior to initiating a new cycle.
Chip Select (as shown on Block Diagram) also gates the
Data Input (DI) and Serial Clock (SK) Input, to disable these
functions. In the case of these EEPROMs, Chip Select cannot be tied HIGH even if it is the only device on the bus.
Chip Select must be held HIGH continuously during the
course of clocking in the start bit, op-code address, and
data-in or data-out. Otherwise the internal circuits will reset
and the cycle will have to be started again with a new start
bit.
Chip Select initiates the internal programming cycle. The
falling edge of Chip Select will start the internal asynchronous programming cycle after a programming op-code has
been entered (Erase, Write, Erase All, or Write All). In conjunction with Chip Select, Data-Out (DO) will indicate when
programming is complete. If the internal programming is incomplete, then Data-Out pin will be LOW. Then when the
internal programming is complete, the Data-Out pin will be
HIGH (see Timing Diagrams).
The Data-Out pin sends Read data onto the MICROWIRE
bus and it is clocked out on the rising edge of the Serial
Clock. During the Read cycle, the DO output begins to drive
actively after the last address bit (A0) is clocked in.
Data-Out also carries the device’s status during the asynchronous programming cycle. The Data-Out pin drives LOW
while the device is still in its internal programming cycle.
After the EEPROM has completed this internal programming, Data-Out will drive HIGH. This is accomplished while
Chip Select is held HIGH.
Finally, if Chip Select is pulsed LOW to HIGH, Data-Out pin
will again produce a pulse HIGH. Thus indicating the completion of the programming cycle.
To clear the Ready/Busy polling, it is necessary to raise
Chip Select and clock in another start bit. Once the start bit
is clocked in, Data-Out will return to the HIGH impedance
state. It is not necessary to continue with a cycle after this
start bit has been clocked in, although it is permissible to
start a new cycle with this start bit. This clearing of Ready/
Busy status may be necessary if a bidirectional data bus is
used (Data-In tied to Data-Out) as the Data-Out output will
interfere with the new data being presented on the Data-In
pin. This connecting of the two Data pins is used for threewire interface schemes.
Serial Clock (SK):
The Serial Clock input is used to clock all start bits, opcodes, data, addresses, and data bits into or out of the
EEPROMs. The clock’s rising edge controls the input and
output of bits. The falling edge has no effect on the device.
The Serial Clock is not necessary for the asynchronous
Ready/Busy polling function.
The Serial Clock is in a ‘‘Don’t Care’’ at any time Chip Select
is LOW. It is also in a ‘‘Don’t Care’’ state prior to clocking in
a start bit, or during Ready/Busy polling. During either of
these last two conditions, Data-In (DI) must be held at a
LOW level, otherwise a new start bit will be interpreted.
Organization (ORG):
The Organization input (ORG) is available on the
NM93C86AL device and it is used to control the internal
organization of the memory. The two selectable organizations are 16-bit words and 8-bit words. By connecting the
ORG pin to VCC, 16-bit words are selected. In contrast, by
connecting the ORG pin to GND, 8-bit words are selected. If
the ORG pin is left floating, then default setting is the 16-bit
word. When in the 8-bit mode, one additional address bit is
required in the instruction sequence since the depth of the
memory is doubled.
Data-In (DI):
The Data-In pin receives the start bit, address, and input
data synchronously. Each bit is clocked in on the rising edge
of SK. DI is gated by Chip Select to provide a high degree of
noise immunity. Data-In is routed to both the instruction shift
register and the data shift register. After the start bit is
clocked into the last bit of the instruction register, the clock
is switched to the data register to receive input data. To
avoid false reading of a start bit, it is safer to keep the DataIn pin at LOW level when not in use.
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Instruction Set for the NM93C86AL
The NM93C86AL has 7 instructions as described below. Note that the MSB of any instruction is a ‘‘1’’ and is viewed as a start bit
in the interface sequence. The next 2 bits carry the op code, the next 10 (or 11) bits carry the address for selection of 1 of 1024
16-bit registers or 1 of 2048 8-bit registers, depending on memory array organization.
1024 by 16-Bit Organization (NM93C86AL when ORG e VCC or NC)
SB
OP-Code
2 Bits
READ
1
10
A9–A0
EWEN
1
00
11XXXXXXXX
EWDS
1
00
00XXXXXXXX
ERASE
1
11
A9–A0
WRITE
1
01
A9–A0
ERAL
1
00
10XXXXXXXX
WRAL
1
00
01XXXXXXXX
Instruction
Address
10 Bits
Data
16 Bits
Function
Read data stored in selected register.
Enables programming modes.
Disables all programming modes.
Erases selected register.
D15 – D0
Writes data pattern D15 – D0 into selected register.
Erases all registers.
D15 – D0
Writes data pattern D15 – D0 into all registers.
2048 by 8-Bit Organization (NM93C86AL when ORG e GND)
SB
OP-Code
2 Bits
READ
1
10
A10 – A0
EWEN
1
00
11XXXXXXXXX
Enables programming modes.
EWDS
1
00
00XXXXXXXXX
Disables all programming modes.
ERASE
1
11
A10– A0
WRITE
1
01
A10– A0
ERAL
1
00
10XXXXXXXXX
WRAL
1
00
01XXXXXXXXX
Instruction
Address
11 Bits
Data
18 Bits
Function
Read data stored in selected register.
Erases selected register.
D7 – D0
Writes data pattern D7 – D0 into selected register.
Erases all registers.
D7 – D0
Writes data pattern D7 – D0 into all registers.
Functional Description
Device
NM93C86AL
CS held ‘‘high’’, the DO pin will exit the high impedance
state and indicate the READY/BUSY status of the device.
DO e logical ‘‘0’’ indicates that programming is still in progress and no other instruction can be executed. DO e logical ‘‘1’’ indicates that the device is READY for another instruction. If CS is forced ‘‘low’’ the DO pin will return to the
high impedance state. After the programming cycle has
been completed and DO e logical ‘‘1’’, the DO pin can be
reset back to the high impedance state by clocking a logical
‘‘1’’ into the DI pin. (This is also performed with the start bit
on all op codes, thus clocking an instruction has the same
effect.)
ORG Pin
Memory
Logic Configuration Ý of Address Bits
0
2048 x 8
11 Bits
1
1024 x 16
10 Bits
Programming
The programming cycle for both devices is automatically
started after entering the D0 data bit; independent of the
status of the CS input pin. This feature allows a programming instruction (ERASE/WRITE/ERAL/WRAL) to be cancelled at any time before entering the last data bit (D0). This
is accomplished by forcing the CS input pin low (for tCS) at
any time before the DO data bit is clocked in. Note that the
CS input pin can be brought low after the D0 bit is clocked
in, to maintain compatibility with the other family members,
but is not necessary to start a programming cycle.
In all programming modes the READY/BUSY status of the
device can be determined by polling the DO pin. After clocking in the last bit of the instruction sequence and with the
Read (READ)
The READ instruction outputs serial data on the DO pin.
After a READ instruction is received, the instruction and address are decoded, followed by data transfer from the selected memory register into a serial-out shift register. A
dummy bit (logical 0) precedes the serial data output string.
Output data changes are initiated by a low to high transition
of the SK clock after the last address bit (A0) is clocked in.
7
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Functional Description (Continued)
Write (WRITE)
The WRITE instruction is followed by 16 bits of data (or
8 bits of data when using the NM93C86AL in the x8 organization) to be written into the specified address. Note that if
the CS is brought ‘‘low’’ before clocking in all of the data
bits, then the WRITE instruction will be aborted. The selftimed programming cycle is initiated on the rising edge of
the SK clock as the last data bit (D0) is clocked in. At this
point, CS, SK and DI become don’t care states. No separate
ERASE cycle is required before a WRITE instruction.
As in the ERASE instruction, after starting a WRITE cycle,
the DO pin indicates the READY/BUSY status of the chip if
CS is held ‘‘high’’. DO e logical ‘‘0’’ indicates that programming is still in progress. DO e logical ‘‘1’’ indicates that the
register, at the address specified in the instruction, has been
written and that the part is ready for another instruction.
Erase/Write Enable (EWEN)
When VCC is applied to the part, it ‘‘powers up’’ in the
Erase/Write Disable (EWDS) state. Therefore, all programming modes must be preceded by an Erase/Write Enable
(EWEN) instruction. Once an Erase/Write Enable instruction is executed, programming remains enabled until an
Erase/Write Disable (EWDS) instruction is executed or VCC
is removed from the part.
Erase/Write Disable (EWDS)
To protect against accidental data overwrites, the Erase/
Write Disable (EWDS) instruction disables all programming
modes and should follow all programming operations. Execution of a READ instruction is independent of both the
EWEN and EWDS instructions.
Erase (ERASE)
The ERASE instruction will program all bits in the specified
register to the logical ‘‘1’’ state. The self-timed programming
cycle is initiated on the rising edge of the SK clock as the
last address bit (A0) is clocked in. At this point CS, SK, and
DI become don’t care states. After starting an ERASE cycle
the DO pin indicates the READY/BUSY status of the chip if
CS is held ‘‘high’’. DO e logical ‘‘0’’ indicates that programming is still in progress. DO e logical ‘‘1’’ indicates that the
register, at the address specified in the instruction, has been
erased.
Erase All (ERAL)
The ERAL instruction will simultaneously program all registers in the memory array to the logical ‘‘1’’ state.
Write All (WRAL)
The WRAL instruction will simultaneously program all registers with the data pattern specified in the instruction.
Timing Diagrams for the NM93C86AL
Synchronous Data Timing
TL/D/12511 – 4
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8
Timing Diagrams (Continued)
Organization of Address and Data Fields for the NM93C86AL
Organization
AN
DN
VCC or NC
Org
1024 x 16
A9
D15
VSS
2048 x 8
A10
D7
READ
TL/D/12511 – 5
EWEN
DO e TRI-STATE
TL/D/12511 – 6
EWDS
DO e TRI-STATE
TL/D/12511 – 7
ERASE
TL/D/12511 – 8
9
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Timing Diagrams (Continued)
WRITE
TL/D/12511 – 9
ERAL
TL/D/12511 – 10
WRAL
TL/D/12511 – 11
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10
Physical Dimensions inches (millimeters) unless otherwise noted
Molded Small Out-Line Package (M8)
NS Package Number M08A
11
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NM93C86AL 16,384-Bit Serial Interface, Low Voltage
CMOS EEPROM (MICROWIRE Synchronous Bus)
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Molded Dual-In-Line Package (N)
NS Package Number N08E
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