P2560B October 2006 rev 1.3 Low Frequency EMI Reduction Features circuit board layers and shielding traditionally required to pass EMI regulations. • FCC approved method of EMI attenuation • Generates a low EMI spread spectrum and a non spread reference signal of the input clock spread the bandwidth of a synthesized clock, thereby frequency • decreasing the peak amplitudes of its harmonics. Optimized for input frequency range from 20 to 32MHz • Internal loop filter minimizes external components and board space This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most clock generators. Lowering EMI by increasing a signal’s • Two selectable spread ranges • 3.3V Operating Voltage • Ultra low power CMOS design: 5.50 mA @3.3V • Supports notebook VGA and other LCD timing bandwidth is called spread spectrum clock generation. The P2560B uses the most efficient and optimized modulation profile approved by the FCC and is implemented controller applications • The P2560B modulates the output of a single PLL in order to by using a proprietary all-digital method. Available in 8-pin SOIC and TSSOP Applications Product Description The P2560B is targeted toward the notebook VGA chip and The P2560B is a versatile spread spectrum frequency other displays using an LVDS interface, PC peripheral modulator designed specifically for a wide range of clock devices and embedded systems. frequencies. It reduces electromagnetic interference (EMI) at the clock source allowing system-wide reduction of EMI of downstream clock and data dependent signals. It allows significant system cost savings by reducing the number of Block Diagram VDD Crystal Oscillator XOUT PLL Modulation XIN /CLKIN Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. P2560B October 2006 rev 1.3 Pin Configuration XIN / CLKIN 1 8 XOUT VDD 2 7 NC VSS 3 6 NC ModOUT 4 5 NC P2560B Pin Description Pin# Pin Name Type Description 1 XIN / CLKIN I Crystal Connection or external frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock 2 VDD P Power Supply for the entire chip. 3 VSS P Ground to entire chip. 4 ModOUT O Spread spectrum low EMI output. 5 NC - No Connect 6 NC - No Connect 7 NC - No Connect 8 XOUT O Crystal Connection. If using an external reference, this pin must be left unconnected. Spread Range Selection, VDD = 3.3 V CLKIN frequency Spreading range 20 MHz ±1.16% 25 MHz ±1.13% 27 MHz ±1.11% 30 MHz ±1.10% 32 MHz ±1.10% Modulation rate (CLKIN/10) * 20.83 kHz Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 2 of 8 P2560B October 2006 rev 1.3 Schematic for Notebook VGA Application 27 MHz 27pF 27pF 1 VDD FB : Optional ferrite bead FB 0.1uF GND CLKIN/XIN XOUT 8 2 VDD NC 7 3 VSS NC 6 4 ModOUT NC 5 P2560B Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TSTG TDV Static Discharge Voltage (As per JEDEC STD 22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 3 of 8 P2560B October 2006 rev 1.3 DC Electrical Characteristics Symbol Parameter Min Typ Max Unit VIL Input Low Voltage VSS – 0.3 - 0.8 V VIH Input High Voltage 2.0 - VDD + 0.3 V IIL Input Low current -60.0 - -35 µA IIH Input High current - - 35 µA IXOL XOUT Output low current VXOL at 0.4V, VDD = 3.3V - 3 - mA IXOH XOUT Output high current VXOH at 2.5V, VDD = 3.3V - 3 - mA VOL Output Low Voltage VDD = 3.3V, IOH = 20mA - - 0.4 V VOH Output High Voltage VDD = 3.3V, IOH = 20mA 2.5 - - V IDD Static supply current CLKIN / XIN pulled LOW - 0.6 - mA ICC Dynamic supply current 3.3V and 10pF loading 3.2 - 7.0 mA VDD Operating Voltage 3.0 3.3 3.6 V tON Power up time (first locked clock cycle after power up) - 0.18 - mS Clock Output impedance - 50 - Ω ZOUT AC Electrical Characteristics Symbol Min Typ Max Unit Input Frequency 20 - 32 MHz fOUT Output Frequency 20 - 32 MHz tLH1 Output Rise time Measured from 0.8V to 2.0V 0.7 0.9 1.1 nS Output Fall time Measured from 2.0V to 0.8V 0.6 0.8 1.0 nS - - 360 pS 45 50 55 % fIN tHL 1 Parameter tJC Jitter (Cycle to cycle) tD Output Duty cycle Note: 1. tLH and tHL are measured into a capacitive load of 15pF Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 4 of 8 P2560B October 2006 rev 1.3 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 5 of 8 P2560B October 2006 rev 1.3 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 6 of 8 P2560B October 2006 rev 1.3 Ordering Information Part number Marking Package Configuration Temperature Range P2560BG-08ST P2560BG 8-Pin SOIC, Tube, Green Commercial P2560BG-08SR P2560BG 8-Pin SOIC, Tape and Reel, Green Commercial I2560BG-08ST I2560BG 8-Pin SOIC, Tube, Green Industrial I2560BG-08SR I2560BG 8-Pin SOIC, Tape and Reel, Green Industrial P2560BG-08TT P2560BG 8-Pin TSSOP, Tube, Green Commercial P2560BG-08TR P2560BG 8-Pin TSSOP, Tape and Reel, Green Commercial I2560BG-08ST I2560BG 8-Pin TSSOP, Tube, Green Industrial I2560BG-08SR I2560BG 8-Pin TSSOP, Tape and Reel, Green Industrial Device Ordering Information P 2 5 6 0 B G - 0 8 X X SR - SOIC, T/R TT – TSSOP, TUBE TR - TSSOP, T/R ST – SOIC, TUBE Pin Count G = GREEN PACKAGE, LEAD FREE, and RoHS Deviation (%) and Spread option Identifier DEVICE NUMBER Flow: P = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (-40°C to 85°C) Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 7 of 8 P2560B October 2006 rev 1.3 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Preliminary Information Part Number: P2560B Document Version: v1.3 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Frequency EMI Reduction Notice: The information in this document is subject to change without notice. 8 of 8