P2N2222A Amplifier Transistors NPN Silicon Features • These are Pb--Free Devices* http://onsemi.com COLLECTOR 1 MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Collector--Emitter Voltage VCEO 40 Vdc Collector--Base Voltage VCBO 75 Vdc Emitter--Base Voltage VEBO 6.0 Vdc Collector Current -- Continuous IC 600 mAdc Total Device Dissipation @ TA = 25°C Derate above 25°C PD 625 5.0 mW mW/°C Total Device Dissipation @ TC = 25°C Derate above 25°C PD 1.5 12 W mW/°C TJ, Tstg --55 to +150 °C Operating and Storage Junction Temperature Range 2 BASE 3 EMITTER TO--92 CASE 29 STYLE 17 Characteristic 1 12 THERMAL CHARACTERISTICS Symbol Max Unit Thermal Resistance, Junction to Ambient RθJA 200 °C/W Thermal Resistance, Junction to Case RθJC 83.3 °C/W 3 STRAIGHT LEAD BULK PACK 2 3 BENT LEAD TAPE & REEL AMMO PACK MARKING DIAGRAM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. P2N2 222A AYWW G G A = Assembly Location Y = Year WW = Work Week G = Pb--Free Package (Note: Microdot may be in either location) ORDERING INFORMATION *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2007 April, 2007 -- Rev. 5 1 Device Package Shipping† P2N2222AG TO--92 (Pb--Free) 5000 Units/Bulk P2N2222ARL1G TO--92 (Pb--Free) 2000/Tape & Ammo †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: P2N2222A/D P2N2222A ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Characteristic Min Max 40 -- Unit OFF CHARACTERISTICS Collector--Emitter Breakdown Voltage (IC = 10 mAdc, IB = 0) V(BR)CEO Collector--Base Breakdown Voltage (IC = 10 mAdc, IE = 0) V(BR)CBO Emitter--Base Breakdown Voltage (IE = 10 mAdc, IC = 0) V(BR)EBO Collector Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) ICEX Collector Cutoff Current (VCB = 60 Vdc, IE = 0) (VCB = 60 Vdc, IE = 0, TA = 150°C) ICBO Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0) IEBO Collector Cutoff Current (VCE = 10 V) ICEO Base Cutoff Current (VCE = 60 Vdc, VEB(off) = 3.0 Vdc) IBEX 75 -- 6.0 -- -- 10 --- 0.01 10 -- 10 -- 10 -- 20 35 50 75 35 100 50 40 ----300 --- --- 0.3 1.0 0.6 -- 1.2 2.0 300 -- -- 8.0 -- 25 2.0 0.25 8.0 1.25 --- 8.0 4.0 50 75 300 375 5.0 25 35 200 -- 150 -- 4.0 Vdc Vdc Vdc nAdc mAdc nAdc nAdc nAdc ON CHARACTERISTICS DC Current Gain (IC = 0.1 mAdc, VCE = 10 Vdc) (IC = 1.0 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc, TA = --55°C) (IC = 150 mAdc, VCE = 10 Vdc) (Note 1) (IC = 150 mAdc, VCE = 1.0 Vdc) (Note 1) (IC = 500 mAdc, VCE = 10 Vdc) (Note 1) hFE Collector--Emitter Saturation Voltage (Note 1) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VCE(sat) Base--Emitter Saturation Voltage (Note 1) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VBE(sat) -- Vdc Vdc SMALL--SIGNAL CHARACTERISTICS Current--Gain -- Bandwidth Product (Note 2) (IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)C fT Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cobo Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) Cibo Input Impedance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hie Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hre Small--Signal Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hfe Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hoe Collector Base Time Constant (IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz) rb′Cc Noise Figure (IC = 100 mAdc, VCE = 10 Vdc, RS = 1.0 kΩ, f = 1.0 kHz) NF 1. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%. 2. fT is defined as the frequency at which |hfe| extrapolates to unity. http://onsemi.com 2 MHz pF pF kΩ X 10 --4 -- mMhos ps dB P2N2222A ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued) Symbol Min Max Unit (VCC = 30 Vdc, VBE(off) = --2.0 Vdc, IC = 150 mAdc, IB1 = 15 mAdc) (Figure 1) td -- 10 ns tr -- 25 ns (VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc) (Figure 2) ts -- 225 ns tf -- 60 ns Characteristic SWITCHING CHARACTERISTICS Delay Time Rise Time Storage Time Fall Time SWITCHING TIME EQUIVALENT TEST CIRCUITS +30 V +30 V 1.0 to 100 ms, DUTY CYCLE ≈ 2.0% +16 V 0 --2 V 200 +16 V 0 < 2 ns 1 kΩ CS* < 10 pF --14 V 1.0 to 100 ms, DUTY CYCLE ≈ 2.0% < 20 ns 1k --4 V Figure 2. Turn--Off Time 1000 700 500 hFE , DC CURRENT GAIN CS* < 10 pF 1N914 Scope rise time < 4 ns *Total shunt capacitance of test jig, connectors, and oscilloscope. Figure 1. Turn--On Time 200 TJ = 125°C 300 200 25°C 100 70 50 --55°C 30 VCE = 1.0 V VCE = 10 V 20 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 IC, COLLECTOR CURRENT (mA) Figure 3. DC Current Gain http://onsemi.com 3 50 70 100 200 300 500 700 1.0 k VCE , COLLECTOR--EMITTER VOLTAGE (VOLTS) P2N2222A 1.0 TJ = 25°C 0.8 0.6 IC = 1.0 mA 10 mA 150 mA 500 mA 0.4 0.2 0 0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 IB, BASE CURRENT (mA) 2.0 3.0 5.0 10 20 30 50 Figure 4. Collector Saturation Region 200 100 70 50 tr @ VCC = 30 V td @ VEB(off) = 2.0 V td @ VEB(off) = 0 30 20 10 7.0 5.0 200 t′s = ts -- 1/8 tf 100 70 50 tf 30 20 10 7.0 5.0 3.0 2.0 5.0 7.0 10 200 300 20 30 50 70 100 IC, COLLECTOR CURRENT (mA) 500 5.0 7.0 10 Figure 5. Turn--On Time 6.0 RS = OPTIMUM RS = SOURCE RS = RESISTANCE IC = 1.0 mA, RS = 150 Ω 500 mA, RS = 200 Ω 100 mA, RS = 2.0 kΩ 50 mA, RS = 4.0 kΩ 20 30 50 70 100 200 IC, COLLECTOR CURRENT (mA) 300 500 Figure 6. Turn--Off Time 4.0 10 f = 1.0 kHz 8.0 NF, NOISE FIGURE (dB) NF, NOISE FIGURE (dB) 10 8.0 VCC = 30 V IC/IB = 10 IB1 = IB2 TJ = 25°C 300 t, TIME (ns) t, TIME (ns) 500 IC/IB = 10 TJ = 25°C IC = 50 mA 100 mA 500 mA 1.0 mA 6.0 4.0 2.0 2.0 0 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 0 50 50 100 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS) Figure 7. Frequency Effects Figure 8. Source Resistance Effects http://onsemi.com 4 50 k 100 k 30 CAPACITANCE (pF) 20 Ceb 10 7.0 5.0 Ccb 3.0 2.0 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 REVERSE VOLTAGE (VOLTS) 20 30 50 f T, CURRENT--GAIN BANDWIDTH PRODUCT (MHz) P2N2222A 500 300 200 100 70 50 1.0 Figure 9. Capacitances 0 VBE(sat) @ IC/IB = 10 0.6 COEFFICIENT (mV/°C) 0.8 1.0 V VBE(on) @ VCE = 10 V 0.4 0.2 50 70 100 RθVC for VCE(sat) --0.5 --1.0 --1.5 RθVB for VBE --2.0 VCE(sat) @ IC/IB = 10 0.1 0.2 3.0 5.0 7.0 10 20 30 IC, COLLECTOR CURRENT (mA) +0.5 TJ = 25°C V, VOLTAGE (VOLTS) 2.0 Figure 10. Current--Gain Bandwidth Product 1.0 0 VCE = 20 V TJ = 25°C 50 100 200 0.5 1.0 2.0 5.0 10 20 IC, COLLECTOR CURRENT (mA) --2.5 500 1.0 k 0.1 0.2 Figure 11. “On” Voltages 0.5 1.0 2.0 5.0 10 20 50 100 200 IC, COLLECTOR CURRENT (mA) Figure 12. Temperature Coefficients http://onsemi.com 5 500 P2N2222A PACKAGE DIMENSIONS TO--92 (TO--226) CASE 29--11 ISSUE AM A B STRAIGHT LEAD BULK PACK R P L SEATING PLANE K D X X G J H V C 1 SECTION X--X N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 -----0.250 -----0.080 0.105 -----0.100 0.115 -----0.135 ------ MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 -----6.35 -----2.04 2.66 -----2.54 2.93 -----3.43 ------ N A R BENT LEAD TAPE & REEL AMMO PACK B P T SEATING PLANE G K D X X J V 1 C N SECTION X--X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G J K N P R V MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 -----2.04 2.66 1.50 4.00 2.93 -----3.43 -----STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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