PC451J00000F Series PC451J00000F Series Mini-flat Package, High Collector-emitter Voltage Photocoupler ■ Description ■ Agency approvals/Compliance PC451J00000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 350V. CTR is MIN. 40% at input current of 5mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC451) 2. Package resin : UL flammability grade (94V-0) ■ Applications 1. Telephones 2. Modems ■ Features 1. 4-pin Mini-flat package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO : 350V) 4. High isolation voltage between input and output (Viso(rms) : 3.75kV) 5. Lead-free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A00302EN Date Jun. 30. 2005 © SHARP Corporation PC451J00000F Series ■ Internal Connection Diagram 1 1 4 2 3 2 3 4 Anode Cathode Emitter Collector ■ Outline Dimensions (Unit : mm) 3.6±0.3 2.54±0.25 3 Anode mark 451 1 2 Date code 4.4±0.2 4 SHARP mark "s" 0.4±0.1 Factory identification mark 5.3±0.3 Epoxy resin 0.1±0.1 2.6±0.2 0.2±0.05 45˚ 0.5+0.4 −0.2 6˚ 7.0+0.2 −0.7 Product mass : approx. 0.1g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A00302EN 2 PC451J00000F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please Contact the local SHARP sales reprsentative to see the actual status of the production. Rank mark There is no rank mark indicator. Sheet No.: D2-A00302EN 3 PC451J00000F Series ■ Absolute Maximum Ratings Output Input Parameter Forward current Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature *1 Isolation voltage *2 Soldering temperature Symbol IF VR P VCEO VECO IC PC Ptot Topr Tstg Viso (rms) Tsol Rating 50 6 70 350 6 50 150 170 −25 to +100 −40 to +125 3.75 260 (Ta=25˚C) Unit mA V mW V V mA mW mW ˚C ˚C kV ˚C *1 40 to 60%RH, AC for 1 minute, f=60Hz *2 For 10s ■ Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF IR Reverse Current Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Floating capacitance Cf fC Cut-off frequency tr Rise time Response time Fall time tf Conditions IF=20mA VR=4V V=0, f=1kHz VCE=200V, IF=0 IC=0.1mA, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100Ω, −3dB VCE=2V, IC=2mA, RL=100Ω MIN. − − − − 350 2 − 5×1010 − − − − TYP. 1.2 − 30 − − 4 0.1 1×1011 0.6 50 4 5 MAX. 1.4 10 250 1000 − − 0.3 − 1.0 − 10 12 (Ta=25˚C) Unit V µA pF nA V mA V Ω pF kHz µs µs Sheet No.: D2-A00302EN 4 PC451J00000F Series ■ Model Line-up Package Model No. Taping 3 000 pcs/reel 750 pcs/reel PC451J00000F PC451TJ0000F Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A00302EN 5 PC451J00000F Series Fig.2 Diode Power Dissipation vs. Ambient Temperature 60 120 50 100 Forward current IF (mA) Forward current IF (mA) Fig.1 Forward Current vs. Ambient Temperature 40 30 20 10 80 70 60 40 20 0 −25 0 50 55 25 75 100 0 −25 125 50 55 Fig.3 Collector Power Dissipation vs. Ambient Temperature 125 300 Total power dissipation P tot (mW) 150 100 50 0 −25 0 25 50 75 100 250 200 170 150 100 50 0 −25 125 0 25 50 75 Fig.5 Peak Forward Current vs. Duty Ratio Ta= 75˚C Pulse width≤100µs Ta= 25˚C Forward current IF (mA) 50˚C 1 000 100 10−2 10−1 125 Fig.6 Forward Current vs. Forward Voltage 10 000 10−3 100 Ambient temperature Ta ( ˚C ) Ambient temperature Ta (˚C ) Peak forward current IFM ( mA) 100 Fig.4 Total Power Dissipation vs. Ambient Temperature 200 10 75 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Collector power dissipation PC ( mW ) 25 0 −25˚C 10 1 1 25˚C 0˚C 100 0 0.5 1 1.5 2 2.5 3 3.5 Forward voltage VF (V) Duty ratio Sheet No.: D2-A00302EN 6 PC451J00000F Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 100 mA P C ( MAX. ) 25 50 A 20m 15mA 10 10mA 5mA 0 0 1 10 100 0 5 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 0.16 Collector-emitter saturation voltage VCE(sat) (V) I F=5mA VCE=5V 100 50 0 −25 0 25 10 Collector-emitter voltage VCE ( V ) Forward current IF (mA ) Relative current transfer ratio ( % ) Ta=25˚C IF=30mA 20 Collector current IC ( mA ) Current transfer ratio CTR ( % ) VCE =5V T a = 25˚C 75 50 I F=20mA IC=1mA 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 − 25 100 Ambient temperature Ta (˚C) 0 25 50 75 100 Ambient temperature T a (˚C ) Fig.12 Response Time vs. Load Resistance Fig.11 Collector Dark Current vs. Ambient Temperature 10−5 VCE=2V IC =2mA VCE =200V 100 10−7 Response time (µs) Collector dark current ICEO (A) 10−6 10−8 10−9 Ta=25˚C tr tf 10 td ts 1 10−10 10−11 −25 0 25 50 75 0.1 0.01 100 Ambient temperature Ta (˚C ) 0.1 1 10 Load resistance RL ( kΩ ) Sheet No.: D2-A00302EN 7 PC451J00000F Series Fig.13 Test Circuit for Response Time Fig.14 Frequency Response VCE=5V IC=2mA VCC RL 0 Output Input Output Input Voltage gain Av (dB) RD 10% VCE ts tf td tr 90% T a=25˚C 100 Ω RL=10k Ω −10 1k Ω Please refer to the conditions in Fig.12 −20 10 1 100 Frequency f ( kHz ) Fig.15 Test Circuit for Frequency Response Fig.16 Collector-emitter Saturation Voltage vs. Forward Current 6 RD Collector-emitter saturation voltage VCE(sat) (V) VCC RL Output VCE Please refer to the conditions in Fig.14 Ta=25˚C 5 7mA 5mA 4 3mA 3 1mA 2 IC = 0.5mA 1 0 0 2 4 6 8 10 12 14 16 18 20 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A00302EN 8 PC451J00000F Series ■ Design Considerations ● Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Recommended Foot Print (reference) 0.8 2.54 6.3 1.5 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A00302EN 9 PC451J00000F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A00302EN 10 PC451J00000F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A00302EN 11 PC451J00000F Series ■ Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J MAX . H H A B C I 5˚ K Dimensions List A B 12.0±0.3 5.5±0.1 H I ±0.1 7.4 0.3±0.05 C 1.75±0.1 J 3.1±0.1 D 8.0±0.1 K 4.0±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 370 13.5±1.5 e f 21±1.0 2.0±0.5 f a b (Unit : mm) c d 80±1.0 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A00302EN 12 PC451J00000F Series 2. 750 pcs / reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J 5˚ MAX . H H A B C I K Dimensions List A B 12.0±0.3 5.5±0.1 H I 7.4±0.1 0.3±0.05 C 1.75±0.1 J 3.1±0.1 D 8.0±0.1 K 4.0±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 180 13.5±1.5 e f ±1.0 21 2.0±0.5 f a b (Unit : mm) c d 80±1.0 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 750pcs/reel] Sheet No.: D2-A00302EN 13 PC451J00000F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E200] Sheet No.: D2-A00302EN 14