PHILIPS PCF26100ET

INTEGRATED CIRCUITS
DATA SHEET
PCF26100
Bluetooth Adapter IC
Preliminary specification
File under Integrated Circuits, IC17
2001 Jun 19
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
CONTENTS
1
FEATURES
2
GENERAL DESCRIPTION
3
ORDERING INFORMATION
4
BLOCK DIAGRAM
5
PINNING INFORMATION
5.1
5.2
Pinning
Pin description
6
FUNCTIONAL DESCRIPTION
6.1
6.2
6.3
6.4
6.5
PCF26100 overview
BlueRF pin mapping
Timing
Serial interface
Registers
7
REFERENCE DOCUMENTS
8
LIMITING VALUES
9
DC CHARACTERISTICS
10
AC CHARACTERISTICS
11
APPLICATIONS
12
PACKAGE OUTLINE
13
SOLDERING
13.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
13.2
13.3
13.4
13.5
14
DATA SHEET STATUS
15
DEFINITIONS
16
DISCLAIMERS
2001 Jun 19
2
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
1
PCF26100
• Provides radio ID through the serial JTAG interface
FEATURES
• System clock oscillator trimming.
The PCF26100 performs the following functions:
• Power-on reset (reset)
• System clock generation for baseband controller
2
• Reference clock generation for the UAA3558
The PCF26100 is a mixed signal based adapter device for
wireless Bluetooth systems. The device adapts the
baseband interface of the Philips UAA3558 radio to the
Philips PCF26002 and PCF26003 baseband controller
devices and also to the BlueRF JTAG Unidirectional
RxMode 2.
• Low-power clock generation for baseband controller
• Transmit clock generation for baseband controller
(1 MHz)
• Serial interface conversion between JTAG and 3-wire
S-bus
The adapter is provided as a low risk solution to a working
Bluetooth system based on existing components. The
adapter ASIC implementation incorporates, as much as
possible, features to come to a complete Bluetooth
system, meeting the Bluetooth RF requirements.
• Timing control generation for the UAA3558
• Transmit data conversion from digital-to-analog
gaussian shaped
• RSSI conversion from analog-to-digital and access
through serial JTAG interface
From the Bluetooth system point of view the PCF26100 is
a transparent adaptation device between the baseband
controller and the UAA3558 radio.
• Transmit PA control information from JTAG interface
digital-to-analog conversion
3
GENERAL DESCRIPTION
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
PCF26100ET
TFBGA48
plastic thin fine-pitch ball grid array package; 48 balls; 5 × 5 × 0.8 mm
SOT641-1
2001 Jun 19
3
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
4
PCF26100
BLOCK DIAGRAM
handbook, full pagewidth
VSS
VDD
SYS_CLK
SYS_CLK_REQ
LPO_CLK
VSS(osc) VSS(I/O) VSSA
VDD(osc) VDD(I/O) VDDA
XIN
XOUT
MCLK
OSCILLATOR
SYSTEM
CLOCK
LOW POWER
CLOCK
DIVIDER
REFERENCE
CLOCK
2.048 MHz
DIVIDER
T_SW
MUX
TX_DATA
RX/TX
MUX
REF_CLK
XOTRIM
TRANSMIT
DATA CLOCK
DIVIDER
TX_CLK
UBMODE
T_SW
DAC
T_GFSK
RX SAMPLE
R_DATA
GFSK
FILTER
RX_DATA
PCF26100
SLCCTR
SYNTH_ON
TIMING
CONTROL
TIMING
SETTINGS
ADC
RSSI
DAC
PACNTL
PX_ON
ID
RSSI
PACNTL
SI_CMS
SI_CLK
SI_CDO
S_EN
SERIAL
INTERFACE
3-WIRE
INTERFACE
SI_CDI
CHANNEL
POR
POR_EXT
VIO_POWER
RESET
AND
POR
CHANNEL
CHANNEL
CONVERSION
STATIC
S_DATA
S_CLK
TEST
MGT751
SCANTEST
Fig.1 Block diagram.
2001 Jun 19
4
TEST_EN
ANATEST
SHIFTCTRL
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
5
5.1
PCF26100
PINNING INFORMATION
Pinning
MBL245
H
G
F
E
PCF26100ET
D
C
B
A
1
2
3
4
5
6
7
8
Fig.2 Pin configuration.
2001 Jun 19
5
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Table 1
Pin description for the TFABGA48 package
SYMBOL
BALL
DESCRIPTION
I/O
SIGNAL TYPE
SOURCE
6
POR
A1
reset output to baseband controller
O
1 × CMOS output
BB
SHIFTCTRL
C2
test mode
I
non-inverting CMOS input with pull-down
test
VIO_POWER
B1
power-on reset reference
I
Schmitt-trigger input
VDD
C1
core supply voltage
P
core power
LPO_CLK
D1
3.2 kHz low-power clock to baseband controller
O
1 × CMOS output
BB
PX_ON
E1
receive packet synchronization correlation achieved
I
non-inverting CMOS input
BB
VSS(I/O)
E2
I/O ground supply
P
I/O ground
SYS_CLK_REQ
F1
system clock control input from baseband controller
I
non-inverting CMOS input
BB
SYS_CLK
G1
controlled system clock output to baseband
controller
O
3 × CMOS output
BB
TX_CLK
F2
transmit data clock output to baseband controller
O
1 × CMOS output
BB
VSS
G2
core ground supply
P
core ground
RX_DATA
H1
receive data output to baseband controller
O
1 × CMOS output
BB
ANATEST
G3
test mode
I
non-inverting CMOS input with pull-down
test
VSS(osc)
H2
oscillator ground supply
P
oscillator ground
XOUT
H3
oscillator output
O
oscillator output
misc
XIN
H4
oscillator input
I
oscillator input
misc
VDD(osc)
H5
oscillator supply voltage
P
oscillator power
VDD(I/O)
G5
I/O supply voltage
P
I/O power
POR_EXT
H6
reset and POR on control input
I
non-inverting CMOS input
host
test
TEST_EN
H7
test mode
I
non-inverting CMOS input with pull-down
SLCCTR
G6
DC offset control to UAA3558
O
1 × CMOS output
VSS(I/O)
G7
I/O ground supply
P
I/O ground
serial interface and timing control output to UAA3558
O
1 × CMOS output
UAA
F7
serial interface clock output to UAA3558
O
1 × CMOS output
UAA
S_DATA
G8
serial interface data output to UAA3558
O
1 × CMOS output
UAA
REF_CLK
F8
reference clock output to UAA3558
O
3 × CMOS output
UAA
VSSA
E8, D8
analog ground supply
P
analog ground
RSSI
D7
RSSI analog input from UAA3558
I
analog input
UAA
T_GFSK
C8
analog transmit data output to UAA3558
O
analog output
UAA
Preliminary specification
H8
PCF26100
S_EN
S_CLK
Philips Semiconductors
Pin description
Bluetooth Adapter IC
2001 Jun 19
5.2
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DESCRIPTION
I/O
SIGNAL TYPE
analog output
SOURCE
PACNTL
B8
analog PA control output to external PA
O
misc
VDDA
C7
analog supply voltage
P
analog power
R_DATA
B7
receive data input from UAA3558 (UAA3558
output = 0 to 2.2 V)
I
non-inverting CMOS input
UAA
T_SW
A8
transmit switch timing control to UAA3558
multiplexed with 2.048 MHz clock output
O
3 × CMOS output
UAA
7
SCANTEST
B6
test mode
I
non-inverting CMOS input with pull-down
test
TX_DATA
A7
transmit data
I
non-inverting CMOS input
BB
VSS(I/O)
A6
I/O ground supply
P
I/O ground
SYNTH_ON
A5
timing control input from baseband controller
I
non-inverting CMOS input
BB
UBMODE
A4
unidirectional/bidirectional mode selection
I
non-inverting CMOS input
misc
VDD(I/O)
B4
I/O supply voltage
P
I/O power
SI_CLK
A3
serial interface clock input from baseband controller
I
non-inverting CMOS input
BB
SI_CMS
A2
serial interface mode select input from baseband
controller
I
non-inverting CMOS input
BB
SI_CDI
B3
serial interface data input from baseband controller
I
non-inverting CMOS input
BB
SI_CDO
B2
serial interface data output to baseband controller
O
1 × CMOS output
BB
Philips Semiconductors
BALL
Bluetooth Adapter IC
2001 Jun 19
SYMBOL
Preliminary specification
PCF26100
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6
6.1
PCF26100
FUNCTIONAL DESCRIPTION
The digital power amplifier control information
communicated from the baseband controller to the
PCF26100 is converted to an analog control voltage for the
radio.
PCF26100 overview
The adapter features a Power-on reset which is used to
reset the adapter logic. There is also a POR_EXT signal
which is used for controlling the reset of the PCF26100
within the application.
The PCF26100 provides an identification number, which
can be read by the baseband controller through the JTAG
interface.
The system clock for the application is generated by the
PCF26100. The system clock is then provided to the
baseband SYS_CLK and the radio REF_CLK. Both the
SYS_CLK and REF_CLK clocks are controlled within the
PCF26100.
For frequency compensation and tuning, the PCF26100
provides a tuning capability on the system oscillator.
6.2
BlueRF pin mapping
Table 2
From the system clock a low-power 3.2 kHz clock
LPO_CLK is generated.
Adapter and BlueRF unidirectional pin mapping.
ADAPTER TO
BASEBAND PIN NAME
From the PCF26100 a 1 MHz TX_CLK is generated to be
used in the baseband controller to clock out the transmit
data on TX_DATA.
The serial interface to the baseband controller is a JTAG
interface. This interface is used to initialize and control the
PCF26100 and subsequently the radio. The channel
information received from the JTAG interface is converted
and forwarded to the radio 3-wire S-bus interface.
BLUERF PIN NAME JTAG
UNIDIRECTIONAL
RXMODE 2
POR_EXT
BnPWR
POR
not applicable
LPO_CLK
not applicable
SYS_CLK
not applicable
SYS_CLK_REQ
BXTLEN
TX_CLK
BRCLK
TX_DATA
BTXD/BDATA1
RX_DATA
BRXD
SYNTH_ON
BSEN
PX_ON
BPKTCTL/BDATA2
The PCF26100 converts the digital transmit data from the
baseband controller to analog gaussian shaped transmit
data to the radio.
SI_CMS
BnDEN
SI_CLK
BDCLK
SI_CDI
BMOSI/BDDATA
The analog RSSI from the radio is converted to digital and
made available to the baseband controller via the JTAG
interface.
SI_CDO
BMISO
VIO_POWER
not applicable
The timing control signals to the UAA3558 radio are
generated in the PCF26100. For this a minimum number
of reference timing signals from the baseband controller
are used. The exact timing of the control signals is
programmable in the PCF26100.
2001 Jun 19
8
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.3
PCF26100
Timing
The timing for the radio is generated in the PCF26100 using a minimal number of baseband signals. The channel
programming is received from the JTAG serial interface. The SYNTH_ON signal is used to determine the start and end
of the packet. The radio SLCCTR signals is also controlled with PX_ON.
handbook, full pagewidth
TX packet
RX packet
JTAG
SYNTH_ON
PX_ON
TX_DATA
RX_DATA
S_xxx
t1
t1
REF_CLK
t3
t2
t2
t3
S_EN
t5
t6
t5
t7
t6
t8
t9
t9
T_SW
t 18
t 17
T_GFSK
t 10
t 12
t 11
R_DATA
SLCCTR
t 14
t 13
RSSI
t4
TX_CLK
t 12
t 10
Fig.3 Detailed timing diagram.
2001 Jun 19
9
MGT756
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
Table 3
Adapter timing parameters
PARAMETER
6.3.1
PCF26100
DESCRIPTION
VALUE
UNIT
t1
SYNTH_ON rising edge to 3-wire serial data
0.35
µs
t2
SYNTH_ON rising edge to REFCLK start
S_EN start
µs
t3
S_EN falling edge to REFCLK stop delay
2
µs
t4
S_EN falling edge to RSSI measurement
RSSI_start
µs
t5
SYNTH_ON rising edge to S_EN rising edge
S_EN start
µs
t6
S_EN width
S_EN width
µs
t7
SYNTH_ON falling edge to S_EN pulse rising edge
S_EN pulse start
µs
t8
SYNTH_ON falling edge to S_EN pulse rising edge
S_EN pulse start
µs
t9
S_EN pulse width
2
µs
t10
SYNTH_ON rising edge to T_GFSK DC bias and TXCLK
enable
GFSK_DC_bias start
µs
t11
TX_DATA digital in to T_GFSK analog out delay
14
13 MHz cycles
t12
S_EN pulse falling edge to T_GFSK LOW and TXCLK
disable
0
µs
t13
S_EN falling edge to SLCCTR rising edge
SLCCTR start
µs
t14
PX_ON rising edge to SLCCTR falling edge
0
µs
t17
SYNTH_ON rising edge to T_SW rising edge
T_SW start
µs
t18
S_EN pulse falling edge to T_SW falling edge
0
µs
T_GFSK
The Txdata phase is used when TXDATA is present.
In this phase the TX_DATA is fed into the GFSK filter. The
presence of TXDATA is determined by detecting the first
TXDATA edge. The end of the TXDATA is detected by the
end of packet from the baseband controller. To not lose
TXDATA information in the T_GFSK output, due to the
data detection, the data from the GFSK input is delayed
with 1-bit.
The T_GFSK data output has 3 phases:
1. Idle phase
2. DCbias phase
3. Txdata phase.
The Idle phase is used outside transmit packets. In this
phase the T_GFSK output state is defined by the
‘gfsk float’ bit in the Enable Register. If the ‘gfsk float’ bit is
set to a logic 0, the T_GFSK output is pulled to ground; if
set to a logic 1 the T_GFSK output is floating.
The T_GFSK output requires an external low-pass filter.
The reference voltage for the T_GFSK comes directly from
the VDDA power supply. Any variation on VDDA has a direct
relation to a variation in the T_GFSK levels. The VDDA
power supply should be provided from a voltage reference.
The DCbias phase is used during the transmit slot as
start-up phase before the transmit data. The DCbias
phase is active GFSK_DC_BIAS_Start delay following the
S_EN rising edge until the first transmit data bit on
TX_DATA.
The TX_CLK output is activated during the DC_BIAS
phase and the Txdata phase.
During this phase a DC bias is generated by the GFSK
filter, which is achieved by selecting the GFSK table
mid-value as the output of the GFSK filter.
2001 Jun 19
10
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.3.2
PCF26100
The function of SYS_CLK_REQ has 2 phases:
RESET
1. After reset, SYS_CLK_REQ is not taken into account
for the generation of SYS_CLK. After reset the 13 MHz
system clock is enabled on SYS_CLK.
The PCF26100 is reset with a Power-on reset using the
VIO_POWER signal. This will reset all registers and put
the device into a known state. The POR_EXT reset signal
will also reset the device and put it in the same state as the
Power-on reset. However, POR_EXT is intended to be
used for a reset from a host.
2. Once the ‘rdy’ bit is set to logic 1, the 13 MHz clock on
the SYS_CLK is controlled with SYS_CLK_REQ.
The SYS_CLK_REQ signal will not control or disable the
oscillator.
Following the Power-on reset or a reset by POR_EXT, the
system oscillator is started and the SYS_CLK output is
activated (enabled). The SYS_CLK output can be
controlled by the SYS_CLK_REQ signal but only if the ‘rdy’
bit in the Control Register has been set to logic 1.
The LPO_CLK output is only controlled by the POR_EXT
signal which also controls the POR output. The POR is
activated 4 SYS_CLK cycles after POR_EXT.
handbook, full pagewidth
VIO_POWER
OSC
SYS_CLK_REQ
SYS_CLK
POR_EXT
POR
LPO_CLK
phase 1 Rdy = 0
phase 2 Rdy = 1
MGT755
Fig.4 Reset timing.
2001 Jun 19
11
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.4
PCF26100
Serial interface
6.4.1
3-WIRE S-BUS
The 3-wire S-bus at the radio side is a 32-bit serial interface which is used for control, TX/RX and channel information.
The 32-bit definition is given in Tables 4 and 5.
Bits 31 to 9 are static values and will not change dynamically, the value for these bits come from the static registers. Only
the trx and main divider fields will control the UAA3558 on a slot-by-slot basis. The trx and main divider information comes
from the baseband controller serial interface channel word; see Section 6.5.1. However, the baseband controller channel
information needs a conversion to get the correct main divider information for the UAA3558.
Table 4
31
UAA3558 3-wire programming word
30
29
28
test
Table 5
27
26
dpo
25
24
BW adjust
22
21
20
19
18
17
16
strc
sdsn
sdco
ssqs
ssth
dmo
tin
6
5
4
3
2
1
0
UAA3558 3-wire programming word (continued)
15
14
13
12
11
10
9
8
tsw
tamp
ref1
ref0
txp1
txp0
pll
trx
6.4.2
23
7
main divider (n)
JTAG
The JTAG serial interface is used to control the PCF26100 and subsequently the radio. The PCF26100 must be the only
slave on the JTAG bus as the PCF26100 does not allow for multi-slave operation. The JTAG interface protocol used is
fully compliant with the standard set out in “IEEE Std 1149.1-1990”. The following features are supported:
• 5-bit register address
• 8-bit data
• Set instruction register
• Read/write data register (note: some addresses have a separate read and write data register).
The JTAG interface allows for 2 ways of accessing a register. One is the communicate address and data, and the second
one is for successive accesses to the same registers where only the data is communicated. This can, for example, be
used for updating the channel information before every packet.
2001 Jun 19
12
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.5
PCF26100
Registers
The registers that are controlled via the serial interface are shown in Table 6.
Table 6
Register map
TYPE
ADDRESS
(DECIMAL)
RESET
(HEX)
S_EN_start
R/W
8
0C
S_EN start delay
S_EN_width
R/W
9
C8
S_EN width
T_SW_start
R/W
10
64
T_SW start delay
SLCCTR_start
R/W
11
0A
SLCCTR start delay
S_EN_PULSE_start
R/W
12
02
S_EN pulse start delay
RSSI_start
R/W
13
64
RSSI measurement position
STATIC_B15_9
R/W
14
24
UAA3558 serial word static values
STATIC_B23_16
R/W
15
12
UAA3558 serial word static values
STATIC_B31_24
R/W
16
00
UAA3558 serial word static values
REGISTER
DESCRIPTION
CHANNEL
W
18
00
frequency channel number and TX/RX information
RSSI
R
18
00
RSSI
XO-trim
W
19
80
trim value for the system clock oscillator
ID
R
19
A1
device identification
CONTROL
R/W
22
00
system clock control
PACONTROL
R/W
24
00
for external PA power control
ENABLE
R/W
25
00
adapter control
GFSK_DC_BIAS_start
R/W
26
64
GFSK DC bias start delay
GFSK_TABLE
R/W
28
00
GFSK look-up table values
RXFREQ
W
30
61
RX channel conversion number
TXFREQ
W
31
60
TX channel conversion number
6.5.1
CHANNEL PROGRAMMING
The serial interface channel programming word is forwarded to the UAA3558 3-wire interface. The channel information
cannot normally be used directly and needs a conversion to get the right number for the UAA3558.
Table 7
Table 8
Channel programming word
ADDRESS
7
18 (decimal)
trx
6
5
4
3
2
1
channel number (m)
Description of Channel programming word bits
BIT
7
6 to 0
2001 Jun 19
DESCRIPTION
If trx = 0, then device in Transmit mode. If trx = 1, then device in Receive mode.
These 7 bits determine the channel number (m).
13
0
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.5.2
PCF26100
FREQUENCY CHANNEL CONVERSION
The conversion number is programmable for TX and RX. The function implemented is:
TX frequency = 2304 + m + TXFREQ; where m is the BT channel number and TXFREQ is programmable between
0 and 255
RX frequency = 2304 + m + RXFREQ; where m is the BT channel number and RXFREQ is programmable between
0 and 255.
Table 9
Frequency conversion word RXFREQ
ADDRESS
7
6
5
4
30 (decimal)
3
2
1
0
3
2
1
0
RXFREQ
Table 10 Frequency conversion word TXFREQ
ADDRESS
7
6
5
4
31 (decimal)
6.5.3
TXFREQ
STATIC VALUES
The UAA3558 bits 31 to 9 are static values and will not change dynamically. These values are programmed into the
adapter via the serial interface. The static words are: STATIC_B15_9, STATIC_B23_16 and STATIC_B31_24.
Table 11 Static word STATIC_B15_9
ADDRESS
7
6
14 (decimal)
5
4
3
2
1
static value bits 15 to 9
0
not used
Table 12 Static word STATIC_B23_16
ADDRESS
7
6
5
4
15 (decimal)
3
2
1
0
2
1
0
static value bits 23 to 16
Table 13 Static word STATIC_B31_24
ADDRESS
7
6
5
4
16 (decimal)
2001 Jun 19
3
static value bits 31 to 24
14
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.5.4
PCF26100
TIMING VALUES
The UAA3558 needs some timing signals which do not have a corresponding signal at the BlueRF interface. These
signals are generated internally in the adapter. The timing values for these will not change dynamically. These values
are programmed into the adapter via the serial interface. The timing words are: S_EN_start, S_EN_width, T_SW_start,
SLCCTR_start, S_EN_PULSE_start, RSSI_start, and GFSK_DC_bias.
Table 14 Timing control word S_EN_start
ADDRESS
7
6
5
4
3
2
1
0
1
0
1
0
1
0
1
0
1
0
1
0
programmed timing value (resolution of 1-bit = 1 µs)
8 (decimal)
Table 15 Timing control word S_EN_width
ADDRESS
7
6
5
4
3
2
programmed timing value (resolution of 1-bit = 1 µs)
9 (decimal)
Table 16 Timing control word T_SW_start
ADDRESS
7
6
5
4
3
2
programmed timing value (resolution of 1-bit = 1 µs)
10 (decimal)
Table 17 Timing control word SLCCTR_start
ADDRESS
7
6
5
4
3
2
programmed timing value (resolution of 1-bit = 1 µs)
11 (decimal)
Table 18 Timing control word S_EN_PULSE_start
ADDRESS
7
6
5
4
3
2
programmed timing value (resolution of 1-bit = 1 µs)
12 (decimal)
Table 19 Timing control word RSSI_start
ADDRESS
7
6
5
4
3
2
programmed timing value (resolution of 1-bit = 1 µs)
13 (decimal)
Table 20 Timing control word GFSK_DC_bias
ADDRESS
26 (decimal)
2001 Jun 19
7
6
5
4
3
2
programmed timing value (resolution of 1-bit = 1 µs)
15
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
Table 21 Register values range and actual timings
REGISTER
RANGE
TIMING
ACTUAL VALUE
UNIT
S_EN_START
0 < x < 256
t2 and t5
S_EN_START + (0 to 1)
µs
S_EN_WIDTH
0 < x < 256
t6
S_EN_WIDTH
µs
T_SW_START
S_EN_START < x < 256
t17
T_SW_START + (0 to 1)
µs
SLCCTR_START
0 < x < 256
t13
SLCCTR_START + 1
µs
S_EN_PULSE_DEL
0 < x < 256
t7 and t8
S_EN_PULSE_DEL + (0 to 1)
µs
RSSI_START
0 < x < 256
t4
RSSI_START
µs
GFSK_DC_BIAS
0 < x < 256
t10
GFSK_DC_BIAS + (0 to 1)
µs
6.5.5
RSSI
The RSSI is read via the serial interface. The UAA3558 provides an analog RSSI output. The interface logic converts the
analog RSSI value and stores the result in a serial interface register. The timing for converting the RSSI is programmed
using the RSSI_start register. The RSSI can only be measured starting 10 µs after the S_EN falling edge. The RSSI
value can only be read from the serial interface register after the measurement has been completed, this is at the end of
the packet. RSSI measurements are only done in receive packets.
Table 22 RSSI control word
ADDRESS
7
6
5
4
18 (decimal)
6.5.6
3
2
1
0
RSSI
TRANSMIT POWER CONTROL
The transmit power can be controlled from a serial interface register. The 8-bit transmit power control word is used to
control the PA DAC. Writing to the PA DAC register will directly change the PA DAC output. The PA control register
should be written when the transmitter is not active.
Table 23 Unidirectional JTAG PA control word
ADDRESS
7
6
5
4
24 (decimal)
6.5.7
3
2
1
0
PA power control
GFSK TABLE
The values for the GFSK filter are stored in a 13-byte GFSK table. The GFSK table is accessed through a single control
word which is used to store the data in the GFSK table on subsequent writes. To align the writing to the GFSK table a
table address reset bit is available in the Enable register. When the reset bit ‘grst’ in the Enable register is set to a logic 1
the GFSK table address will be reset and the next GFSK control word is written at location 0 in the GFSK table. Every
subsequent write to the GFSK control word will be stored at the next address in the GFSK table. If the last address is
reached, subsequent writes will continue to effect the last address.
The values for the GFSK table depend on the reference voltage on VDDA. The T_GFSK signal should have a DC_Bias
of 1.2 V with a peak-to-peak swing of 1 V (amplitude = 0.5 V). For this the values for the GFSK table are calculated as
shown in Table 26.
Table 24 Unidirectional JTAG GFSK control word
GFSK_TABLE
7
6
5
4
28 (decimal)
2001 Jun 19
3
GFSK table value
16
2
1
0
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
Table 25 GFSK table reset values
TABLE ADDRESS
(DECIMAL)
RESET VALUE
(HEX)
12
91
11
90
10
8E
9
89
8
81
7
74
6
64
5
54
4
47
3
3E
2
3A
1
38
0
37
Table 26 GFSK value calculation
TABLE ADDRESS
(DECIMAL)
CALCULATION(1)
VALUE AT 3 V
DECIMAL
HEX
0
[ DCBias + ( A × – 96 ) ] × B
59
3B
1
[ DCBias + ( A × – 94 ) ] × B
60
3C
2
[ DCBias + ( A × – 90 ) ] × B
62
3E
3
[ DCBias + ( A × – 80 ) ] × B
66
42
4
[ DCBias + ( A × – 62 ) ] × B
74
4A
5
[ DCBias + ( A × – 34 ) ] × B
87
57
6
[ DCBias + ( A × 0 ) ] × B
102
66
7
[ DCBias + ( A × 34 ) ] × B
117
75
8
[ DCBias + ( A × 62 ) ] × B
130
82
9
[ DCBias + ( A × 80 ) ] × B
138
8A
10
[ DCBias + ( A × 90 ) ] × B
142
8E
11
[ DCBias + ( A × 94 ) ] × B
144
90
12
[ DCBias + ( A × 96 ) ] × B
145
91
Note
Amp
255
1. Where A = ------------ and B = -------------96
V DDA
2001 Jun 19
17
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.5.8
PCF26100
CONTROL REGISTER (CONTROL)
The Control Register is used to control SYS_CLK in the adapter.
Table 27 Control Register
ADDRESS
7
6
5
4
3
2
1
0
22 (decimal)
−
−
−
−
−
rdy
−
−
Table 28 Description of CONTROL bits
BIT
SYMBOL
7 to 3
−
2
rdy
1
−
0
−
6.5.9
DESCRIPTION
These 5 bits are reserved and are not to be used.
Baseband ready. This bit is used to control the function of SYS_CLK_REQ.
These 2 bits are reserved and are not to be used.
ENABLE REGISTER (ENABLE)
The Enable Register is used to control functions in the adapter.
Table 29 Enable Register
ADDRESS
7
6
5
4
3
2
1
0
25 (decimal)
gfsk float
grst
pa float
clk en
test.2
test.1
test.0
−
Table 30 Description of ENABLE bits
BIT
SYMBOL
DESCRIPTION
7
gfsk float
Controls the T_GFSK output outside TX packet. If gfsk = 0, then output tied to ground. If
gfsk = 1, then output floats.
6
grst
5
pa float
4
clk en
Enables the 2.048 MHz clock on T_SW. If clk en = 0, then pin T_SW = T_SW. If
clk en = 1, then pin T_SW = 2.048 MHz.
3
test.2
These 3 bits are used for test purposes.
2
test.1
1
test.0
0
−
2001 Jun 19
GFSK table address reset. Writing a logic 1 will reset the GFSK table addressing.
Controls the PA output outside TX packet. If pa float = 0, then output tied to ground. If
pa float = 1, then output floats.
This bit is reserved and should not be used.
18
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
6.5.10
PCF26100
OSCILLATOR TRIM REGISTER (XO_TRIM)
The Oscillator Trim Register is used to control the frequency of the 13 MHz oscillator. This is achieved by controlling the
capacitive load on the XIN and XOUT pins.
Table 31 Oscillator Trim Register
ADDRESS
7
6
5
4
3
2
1
0
19 (decimal)
−
XO_trim.
6
XO_trim.
5
XO_trim.
4
XO_trim.
3
XO_trim.
2
XO_trim.
1
XO_trim.
0
Table 32 Description of XO_trim bits
BIT
SYMBOL
DESCRIPTION
7
−
6
XO_trim.6
add 6 pF to XIN and XOUT
5
XO_trim.5
add 3 pF to XIN and XOUT
4
XO_trim.4
add 1.5 pF to XIN and XOUT
3
XO_trim.3
add 0.75 pF to XIN and XOUT
2
XO_trim.2
add 0.375 pF to XIN and XOUT
1
XO_trim.1
add 0.1875 pF to XIN and XOUT
0
XO_trim.0
add 0.09375 pF to XIN and XOUT
This bit is reserved and should not be used.
IDENTIFICATION REGISTER (ID)
6.5.11
The Identification Register is used to identify the radio chip set from the baseband controller. This is a read only register.
Table 33 Identification Register
ADDRESS
7
6
5
4
3
2
1
0
19 (decimal)
ID.7
ID.6
ID.5
ID.4
ID.3
ID.2
ID.1
ID.0
Table 34 Description of ID bits
7
BIT
SYMBOL
7 to 0
ID.[7:0]
DESCRIPTION
These 8 bits determine the radio chip set identification (value = A1H).
REFERENCE DOCUMENTS
1. UAA3558 Bluetooth RF Transceiver (Philips data sheet).
2. PCF26002 Bluetooth baseband controller (Philips data sheet).
3. BlueRF specification (ARM Ltd).
2001 Jun 19
19
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
DESCRIPTION
MIN.
MAX.
UNIT
VDD
core supply voltage
VSS − 0.5
VSS + 3.6
V
VDDA
analog supply voltage
VSS − 0.5
VSS + 3.6
V
VDD(I/O)
I/O supply voltage
VSS − 0.5
VSS + 3.6
V
VDD(osc)
oscillator supply voltage
VSS − 0.5
VSS + 3.6
V
Vin
input voltage
VSS − 0.5
VDD + 0.3
V
Tstg
storage temperature
−50
+150
°C
Toper
operating temperature
0
+70
°C
TYP.
MAX.
UNIT
9
DC CHARACTERISTICS
SYMBOL
DESCRIPTION
MIN.
VDD
core supply voltage
2.7
3.0 to 3.3
3.6
V
VDDA
analog supply voltage for ADC and DAC; note 1 2.7
3.0 to 3.3
3.6
V
VDD(I/O)
I/O supply voltage
2.7
3.0 to 3.3
3.6
V
VDD(osc)
oscillator supply voltage
2.7
3.0 to 3.3
3.6
V
Ptx
transmit power consumption
−
22
−
mW
Prx
receive power consumption
−
14
−
mW
Pstb
standby power consumption; note 2
−
3
−
mW
VIL
LOW-level input voltage
−0.5
−
+0.3VDD(I/O)
V
VIH
HIGH-level input voltage
0.7VDD(I/O)
−
VDD + 0.3
V
VOL
LOW-level output voltage
−
−
0.5
V
VOH
HIGH-level output voltage
2.4
−
−
V
ILI
input leakage current
−10
−
+10
µA
Notes
1. VDDA should be supplied from a stable source.
2. Standby power consumption is measured when SYS_CLK_REQ = 0.
2001 Jun 19
20
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
10 AC CHARACTERISTICS
SYMBOL
DESCRIPTION
MIN.
TYP.
MAX.
UNIT
Frequency
fsys
system clock frequency
−
13
−
MHz
fclk(LP)
low power clock frequency
−
3.2
−
MHz
fs-bus
3-wire S-bus frequency
−
6.5
−
MHz
fJTAG
JTAG clock frequency
1
−
5
MHz
fclock
2.048 MHz clock output
−
2.048
−
MHz
Dclock
duty cycle 2.048 MHz clock output
−
40/60
−
%
RES(ADC)
RSSI ADC resolution
−
8
−
bit
LE(ADC)
RSSI ADC linearity error
−0.5
0
+0.5
LSB
Eoffset(ADC)
RSSI ADC offset error
−50
0
+50
mV
EFS(ADC)
RSSI ADC full-scale error
−50
0
+50
mV
Vi(ADC)
RSSI ADC signal input voltage range
0
−
VDDA
V
Zi(ADC)
RSSI ADC input impedance
−
10
−
MΩ
RES(DAC)
DAC resolution
−
8
−
bit
LEDAC(i)
DAC integral linearity error
−1.0
−
+1.0
LSB
LEDAC(diff)
DAC differential linearity error
−0.5
−
+0.5
LSB
Eoffset(DAC)
DAC offset error
−50
−
+50
mV
EFS(DAC)
DAC full-scale error
−50
−
+50
mV
RSSI ADC
GFSK DAC
Vo(DAC)
DAC signal output voltage range
0
−
VDDA
V
RL(DAC)
DAC load resistance
600
−
−
LSB
CL(DAC)
DAC load capacitance
−
−
20
pF
2001 Jun 19
21
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VDD(I/O)
VDDA
LPO_CLK
SYS_CLK
BXTLEN
BRCLK
SYS_CLK_REQ
TX_DATA
BRXD
RX_DATA
VREGO
VCC(SYN)
VCOA
SYNGND
VSS(osc)
BUFGND
VSSA
VCOGND
VSS(I/O)
VCOB
REGGND
VDD
GND
VREGI
VCC(BUF)
VCC
VCC(TX)
VCC
VCC
CP_TUNE
UAA3558
T_SW
PCF26100 T_GFSK
22
BPKTCTL
VCC(REG)
VSS
TX_CLK
BTXD
VCC
Philips Semiconductors
XIN
13 MHz
VCC
Bluetooth Adapter IC
VDD(osc)
11 APPLICATIONS
book, full pagewidth
2001 Jun 19
XOUT
T_GFSK
TXB
TXA
TXGND
PX_ON
T_ON
BSEN
SYNTH_ON
R_DATA
R_DATA
BnDEN
SI_CMS
SLCCTR
SLCCTR
BDCLK
SI_CLK
RSSI
BMISO
SI_CDO
REF_CLK
BMOSI
SI_CDI
S_EN
POR
BnPWR
VCC
S_DATA
S_CLK
POR_EXT
VIO_POWER
RSSI
REFCLK
S_EN
S_DATA
S_CLK
BPF
R_ON
VCC(RX)
VCC
RXA
RXB
RXGND
PACNTL
MGT753
UBMODE
Preliminary specification
PCF26100
Fig.5 Application diagram BlueRF JTAG Unidirectional RxMode 2.
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VDD(I/O)
XIN
LPO_CLK
LPO_CLK
SYS_CLK
SYS_CLK
TX_CLK
SYS_CLK_REQ
TX_CLK
TX_DATA
TX_DATA
RX_DATA
RX_DATA
PX_ON
VCC
VCC(REG)
VREGO
VCC(SYN)
VCOA
SYNGND
VSS(osc)
BUFGND
VSSA
VCOGND
VSS(I/O)
VCOB
REGGND
VDD
GND
VREGI
VCC(BUF)
VCC
VCC(TX)
VCC
VSS
VCC
CP_TUNE
UAA3558
T_SW
PCF26100 T_GFSK
VWS2600x
VCC
Philips Semiconductors
VDDA
13 MHz
SYS_CLK_REQ
VDD(osc)
Bluetooth Adapter IC
k, full pagewidth
2001 Jun 19
XOUT
T_GFSK
TXB
TXA
TXGND
PX_ON
T_ON
23
SYNTH_ON
R_DATA
R_DATA
CMS
SI_CMS
SLCCTR
SLCCTR
CLK
SI_CLK
CDI
SI_CDO
CDO
SI_CDI
POR
POR
SYNTH_ON
POR_EXT
VCC
VIO_POWER
RSSI
REF_CLK
S_EN
S_DATA
S_CLK
RSSI
REFCLK
S_EN
S_DATA
S_CLK
PACNTL
BPF
R_ON
VCC(RX)
VCC
RXA
RXB
RXGND
MGT754
UBMODE
Preliminary specification
PCF26100
Fig.6 Application diagram VWS2600x.
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
12 PACKAGE OUTLINE
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 5 x 5 x 0.8 mm
D
SOT641-1
A
B
ball A1
index area
A
A2
E
A1
detail X
C
e1
v M B
y
y1 C
∅w M
b
e
v M A
H
e
G
F
E
e1
D
C
B
A
1
2
3
4
5
6
7
8
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
E
e
e1
v
w
y
y1
mm
1.12
0.28
0.16
0.84
0.76
0.37
0.27
5.1
4.9
5.1
4.9
0.5
3.5
0.15
0.1
0.12
0.1
OUTLINE
VERSION
SOT641-1
2001 Jun 19
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
00-10-10
MO-211
24
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
If wave soldering is used the following conditions must be
observed for optimal results:
13 SOLDERING
13.1
Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
13.2
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
13.3
13.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2001 Jun 19
Manual soldering
25
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
13.5
PCF26100
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Jun 19
26
Philips Semiconductors
Preliminary specification
Bluetooth Adapter IC
PCF26100
14 DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
15 DEFINITIONS
16 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2001 Jun 19
27
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Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
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220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
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Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 7 - 9 Rue du Mont Valérien, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4728 6600, Fax. +33 1 4728 6638
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,
Tel: +36 1 382 1700, Fax: +36 1 382 1800
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 72
© Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
403506/01/pp28
Date of release: 2001
Jun 19
Document order number:
9397 750 08036