PHILIPS UDA1351

INTEGRATED CIRCUITS
DATA SHEET
UDA1351TS
96 kHz IEC 958 audio DAC
Preliminary specification
File under Integrated Circuits, IC01
2000 Mar 28
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
CONTENTS
1
FEATURES
1.1
1.2
1.3
1.4
General
Control
IEC 958 input
Digital sound processing and DAC
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.5
8.5.1
8.5.2
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.6.5
8.6.6
8.6.7
8.6.8
8.6.9
Clock regeneration and lock detection
Mute
Auto mute
Data path
IEC 958 input
Audio feature processor
Interpolator
Noise shaper
The Filter Stream DAC (FSDAC)
Control
Static pin control mode
L3 control mode
L3 interface
General
Device addressing
Register addressing
Data write mode
Data read mode
initialization string
Overview of L3 interface registers
Writable registers
Readable registers
2000 Mar 28
9
LIMITING VALUES
10
THERMAL CHARACTERISTICS
11
CHARACTERISTICS
12
TIMING CHARACTERISTICS
13
APPLICATION INFORMATION
14
PACKAGE OUTLINE
15
SOLDERING
15.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
15.2
15.3
15.4
15.5
2
16
DEFINITIONS
17
LIFE SUPPORT APPLICATIONS
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
1
1.1
UDA1351TS
FEATURES
General
• 2.7 to 3.6 V power supply
• Integrated digital filter and Digital-to-Analog Converter
(DAC)
• Master-mode data output and input interface for off-chip
sound processing
• 256fs system clock output
• 20-bit data path in interpolator
2
• High performance
Digital audio systems.
APPLICATIONS
• No analog post filtering required for DAC
• Support sampling frequencies from 28 kHz up
to 100 kHz
3
• The UDA1351TS is fully pin and function compatible
with the UDA1350ATS.
• UDA1351TS:
GENERAL DESCRIPTION
Available in two versions:
– only IEC 958 input to DAC in SSOP28 package.
1.2
• UDA1351H:
Control
– full featured version in QFP44 package.
Controlled either by means of static pins or via the
L3 microcontroller interface.
1.3
The UDA1351TS is a single chip IEC 958 audio decoder
with an integrated stereo DAC employing bitstream
conversion techniques.
IEC 958 input
• On-chip amplifier for converting IEC 958 input to CMOS
levels
A lock indication signal is available on pin LOCK,
indicating that the IEC 958 decoder is locked. This pin is
also used to indicate whether PCM data is applied to the
input or not. When non-PCM data is detected, the device
indicates out-of-lock.
• Lock indication signal available on pin LOCK
• Lock indication signal combined on-chip with the Pulse
Code Modulation (PCM) status bit; when non-PCM is
detected, pin LOCK indicates out-of-lock
By default, the DAC output and the data output interface
are muted when the decoder is out-of-lock. However, this
setting can be overruled in the L3 control mode.
• Key channel-status bits available via L3 interface (lock,
pre-emphasis, audio sample frequency, two channel
PCM indication and clock accuracy).
1.4
Digital sound processing and DAC
• Automatic de-emphasis when using IEC 958 input with
32.0, 44.1 and 48.0 kHz audio sample frequencies
• Soft mute by means of a cosine roll-off circuit selectable
via pin MUTE or the L3 interface
• dB linear volume control with 1 dB steps from 0 dB to
−60 dB and −∞ dB
• Bass boost and treble control in L3 control mode
• Interpolating filter (fs to 128fs) by means of a cascade of
a recursive filter and a FIR filter
• Third order noise shaper operating at 128fs generates
the bitstream for the DAC
• Filter Stream DAC (FSDAC).
2000 Mar 28
3
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
4
UDA1351TS
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
3.6
V
Supplies
VDDD
digital supply voltage
VDDA
analog supply voltage
IDDA(DAC)
analog supply current of DAC
IDDA(PLL)
analog supply current of PLL
IDDD(C)
digital supply current of core
IDDD
P
digital supply current
2.7
3.0
2.7
3.0
3.6
V
power-on
−
8.0
−
mA
power-down
−
750
−
µA
at 48 kHz
−
0.7
−
mA
at 96 kHz
−
1.0
−
mA
at 48 kHz
−
16.0
−
mA
at 96 kHz
−
24.5
−
mA
at 48 kHz
−
2.0
−
mA
at 96 kHz
−
3.0
−
mA
−
80
−
mW
power consumption at 48 kHz DAC in playback mode
DAC in Power-down mode
power consumption at 96 kHz DAC in playback mode
DAC in Power-down mode
−
58
−
mW
−
109
−
mW
−
87
−
mW
General
trst
reset active time
−
250
−
µs
Tamb
ambient temperature
−40
−
+85
°C
−
900
−
mV
at 0 dB
−
−90
−85
dB
at −40 dB; A-weighted
−
−60
−55
dB
at 0 dB
−
−85
−80
dB
at −40 dB; A-weighted
−
−57
−52
dB
100
−
dB
Digital-to-analog converter
Vo(rms)
output voltage (RMS value)
(THD + N)/S total harmonic
distortion-plus-noise to signal
ratio
note 1
fi = 1.0 kHz tone at 48 kHz
fi = 1.0 kHz tone at 96 kHz
S/N
signal-to-noise ratio at 48 kHz fi = 1.0 kHz tone; code = 0; A-weighted 95
100
−
dB
αcs
channel separation
fi = 1.0 kHz tone
−
96
−
dB
∆Vo
unbalance of output voltages
fi = 1.0 kHz tone
−
0.1
0.4
dB
signal-to-noise ratio at 96 kHz fi = 1.0 kHz tone; code = 0; A-weighted 95
Note
1. The output voltage of the DAC is proportional to the DAC power supply voltage.
5
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
UDA1351TS
SSOP28
2000 Mar 28
DESCRIPTION
plastic shrink small outline package; 28 leads; body width 5.3 mm
4
VERSION
SOT341-1
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
6
UDA1351TS
BLOCK DIAGRAM
handbook, full pagewidth
TEST1
TEST4
TEST2
VDDA(PLL)
VSSA(PLL)
18
4
24
VSSA
TEST3
28
21
25
VDDA(DAC)
VDDA
VOUTL
22
15
Vref
VSSA(DAC)
14
20
VOUTR
19
17
23
CLOCK
AND
TIMING CIRCUIT
DAC
DAC
NOISE SHAPER
VDDD(C)
6
UDA1351TS
INTERPOLATOR
L3MODE
L3CLOCK
L3DATA
SELSTATIC
10
9
8
L3
INTERFACE
AUDIO FEATURE PROCESSOR
11
MUTE
26
SLICER
SPDIF
VDDD
VSSD
VSSD(C)
13
5
IEC 958
DECODER
3
7
12
1, 2, 27
16
MGU032
n.c.
LOCK
Fig.1 Block diagram.
2000 Mar 28
5
RESET
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
7
UDA1351TS
PINNING
SYMBOL
TYPE(1)
PIN
DESCRIPTION
n.c.
1
−
not connected
n.c.
2
−
not connected
VDDD
3
DS
digital supply voltage
TEST1
4
DID
test pin 1; must be connected to digital ground (VSSD)
RESET
5
DISD
reset input
VDDD(C)
6
DS
digital supply voltage for core
VSSD
7
DGND
digital ground
L3DATA
8
DIOS
L3 interface data input and output
L3CLOCK
9
DIS
L3 interface clock input
L3MODE
10
DIS
L3 interface mode input
MUTE
11
DID
mute control input
VSSD(C)
12
DGND
digital ground
SPDIF
13
AI
IEC 958 channel input
VDDA(DAC)
14
AS
analog supply voltage for DAC
VOUTL
15
AO
analog DAC left channel output
LOCK
16
DO
SPDIF and PLL lock indicator output
VOUTR
17
AO
analog DAC right channel output
TEST2
18
DID
test pin 2; must be connected to digital ground (VSSD)
Vref
19
A
DAC reference voltage
VSSA(DAC)
20
AGND
analog ground for DAC
VSSA
21
AGND
analog ground
VDDA
22
AS
analog supply voltage
VSSA(PLL)
23
AGND
analog ground for PLL
VDDA(PLL)
24
AS
analog supply voltage for PLL
TEST4
25
DIU
test pin 4; must be connected to the digital supply voltage (VDDD)
SELSTATIC
26
DIU
static pin control selection input
n.c.
27
−
not connected
TEST3
28
DISD
test pin 3; must be connected to digital ground (VSSD)
Note
1. See Table 1.
2000 Mar 28
6
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
Table 1
UDA1351TS
Pin type references
PIN TYPE
DESCRIPTION
DS
digital supply
DGND
digital ground
AS
analog supply
AGND
analog ground
DI
digital input
DIS
digital Schmitt-triggered input
DID
digital input with internal pull-down resistor
DISD
digital Schmitt-triggered input with internal pull-down resistor
DIU
digital input with internal pull-up resistor
DO
digital output
DIO
digital input and output
DIOS
digital Schmitt-triggered input and output
A
analog reference voltage
AI
analog input
AO
analog output
handbook, halfpage
n.c.
1
28 TEST3
n.c.
2
27 n.c.
VDDD
3
26 SELSTATIC
TEST1
4
25 TEST4
RESET
5
24 VDDA(PLL)
VDDD(C)
6
23 VSSA(PLL)
VSSD
7
L3DATA
8
21 VSSA
L3CLOCK
9
20 VSSA(DAC)
UDA1351TS
22 VDDA
19 Vref
L3MODE 10
18 TEST2
MUTE 11
VSSD(C) 12
17 VOUTR
16 LOCK
SPDIF 13
15 VOUTL
VDDA(DAC) 14
MGU033
Fig.2 Pin configuration.
2000 Mar 28
7
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8
UDA1351TS
FUNCTIONAL DESCRIPTION
The UDA1351TS is a low cost audio IEC 958 decoder with
an on-board DAC. The minimum audio input sampling
frequency conforming to the IEC958 standard is 28.0 kHz
and the maximum audio sampling frequency is 100.0 kHz.
8.1
mute
factor
0.8
Clock regeneration and lock detection
0.6
The UDA1351TS contains an on-board PLL for
regenerating a system clock from the IEC 958 input
bitstream.
0.4
Note: If there is no input signal, the PLL generates a
minimum frequency and the output spectrum shifts
accordingly. Since the analog output does not have an
analog mute, this means noise that is out of band under
normal conditions can move into the audio band.
0.2
0
0
When the on-board clock locks to the incoming frequency,
the lock indicator bit is set and can be read via the
L3 interface. Internally, the PLL lock indication is
combined with the PCM status bit of the input data stream.
When both the IEC 958 decoder and the on-board clock
have locked to the incoming signal and the input data
stream is PCM data, pin LOCK will be asserted. However,
when the IC is locked but the PCM status bit reports
non-PCM data, pin LOCK is returned to LOW level.
10
15
20
25
Fig.3 Mute as a function of raised cosine roll-off.
8.3
Auto mute
By default, the DAC outputs will be muted until the IC is
locked, regardless of the level on pin MUTE (in static
mode) or the state of bit MT of the sound feature register
(in L3 mode). In this way, only valid data will be passed to
the outputs. This mute is done in the SPDIF interface and
is a hard mute, not a cosine roll-off mute.
If needed, this muting can be bypassed by setting
bit AutoMT to logic 0 via the L3 interface. As a result, the
IC will no longer mute during out-of-lock situations.
Mute
The UDA1351TS is equipped with a cosine roll-off mute in
the DSP data path of the DAC part. Muting the DAC, by
pin MUTE (in static mode) or via bit MT (in L3 mode), will
result in a soft mute, as shown in Fig.3. The cosine roll-off
soft mute takes 32 x 32 samples = 24 ms at 44.1 kHz
sampling frequency.
8.4
Data path
The UDA1351TS data path consists of the IEC 958
decoder, the audio feature processor, digital interpolator
and noise shaper and the DACs.
When operating in the L3 control mode, the device will
mute on start-up. In L3 mode, it is necessary to explicitly
switch off the mute for audio output by means of the MT bit
in the L3 register.
8.4.1
IEC 958 INPUT
The UDA1351TS IEC 958 decoder features an on-chip
amplifier with hysteresis, which amplifies the IEC 958 input
signal to CMOS level (see Fig.4).
In the L3 mode, pin MUTE does not have any function (the
same holds for several other pins) and can either be left
open circuit (since it has an internal pull-down resistor) or
be connected to ground.
2000 Mar 28
5
t (ms)
The lock indication output can be used, for example, for
muting purposes. The lock signal can be used to drive an
external analog muting circuit to prevent out of band noise
from becoming audible when the PLL runs at its minimum
frequency (e.g. when there is no SPDIF input signal).
8.2
MGU119
1
handbook, halfpage
All 24 bits of data for left and right are extracted from the
input bitstream as well as several of the IEC 958 key
channel-status bits.
8
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
When used in the L3 control mode, it provides the
following additional features:
• Volume control, using 6 bits
• Bass boost control, using 4 bits
• Treble control, using 2 bits
handbook, halfpage
10 nF
• Mode selection of the sound processing bass boost and
treble filters: flat, minimum and maximum
SPDIF 13
• Soft mute control with raised cosine roll-off
75 Ω
180 pF
• De-emphasis selection of the incoming data stream for
fs = 32.0, 44.1 and 48.0 kHz.
UDA1351TS
MGU034
8.4.3
INTERPOLATOR
The UDA1351TS includes an on-board interpolating filter
which converts the incoming data stream from 1fs to 128fs
by cascading a recursive filter and a FIR filter.
Fig.4 IEC 958 input circuit and typical application.
Table 2
Interpolator characteristics
PARAMETER
The extracted key parameters are:
CONDITIONS
VALUE (dB)
Pass-band ripple
0 to 0.45fs
±0.03
Stop band
>0.65fs
−50
• Pre-emphasis
Dynamic range
0 to 0.45fs
115
• Audio sample frequency
DC gain
−
−3.5
• Two-channel PCM indicator
• Clock accuracy.
8.4.4
Both the lock indicator and the key channel status bits are
accessible via the L3 interface.
The third-order noise shaper operates at 128fs. It shifts
in-band quantization noise to frequencies well above the
audio band. This noise shaping technique enables high
signal-to-noise ratios to be achieved. The noise shaper
output is converted to an analog signal using a filter stream
DAC.
The UDA1351TS supports the following sample
frequencies and data bit rates:
fs = 32.0 kHz, resulting in a data rate of 2.048 Mbits/s
fs = 44.1 kHz, resulting in a data rate of 2.8224 Mbits/s
8.4.5
fs = 48.0 kHz, resulting in a data rate of 3.072 Mbits/s
fs = 88.2 kHz, resulting in a data rate of 5.6448 Mbits/s
fs = 96.0 kHz, resulting in a data rate of 6.144 Mbits/s.
The UDA1351TS supports timing levels I, II and III, as
specified by the IEC 958 standard.
AUDIO FEATURE PROCESSOR
The audio feature processor automatically provides
de-emphasis for the IEC 958 data stream in the static pin
control mode and default mute at start-up in the L3 control
mode.
2000 Mar 28
THE FILTER STREAM DAC (FSDAC)
The FSDAC is a semi-digital reconstruction filter that
converts the 1-bit data stream of the noise shaper to an
analog output voltage. The filter coefficients are
implemented as current sources and are summed at
virtual ground of the output operational amplifier. In this
way, very high signal-to-noise performance and low clock
jitter sensitivity is achieved. A post-filter is not needed due
to the inherent filter function of the DAC. On-board
amplifiers convert the FSDAC output current to an output
voltage signal capable of driving a line output.
fs = 64.0 kHz, resulting in a data rate of 4.096 Mbits/s
8.4.2
NOISE SHAPER
The output voltage of the FSDAC is scaled proportionally
with the power supply voltage.
9
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.5
UDA1351TS
Control
control mode, pins L3MODE and L3DATA are used to
select the format for the data output and input interface.
The UDA1351TS can be controlled by means of static pins
or via the L3 interface. For optimum use of the features of
the UDA1351TS, the L3 control mode is recommended
since only basic functions are available in the static pin
control mode.
8.5.1
The default values for all non-pin controlled settings are
identical to the default values at start-up in the L3 control
mode.
It should be noted that the static pin control mode and
L3 control mode are mutually exclusive. In the static pin
Table 3
STATIC PIN CONTROL MODE
Pin description of static pin control mode
PIN
NAME
VALUE
FUNCTION
Mode selection pin
26
SELSTATIC
1
select static pin control mode; must be connected to VDDD
5
RESET
0
normal operation
1
reset
8
L3DATA
0
must be connected to VSSD
9
L3CLOCK
0
must be connected to VSSD
10
L3MODE
0
must be connected to VSSD
11
MUTE
0
normal operation
1
mute active
0
clock regeneration and IEC 958 decoder out-of-lock or non-PCM data
detected
1
clock regeneration and IEC 958 decoder locked and PCM data detected
Input pins
Status pin
16
LOCK
Test pins
4
TEST1
0
must be connected to digital ground (VSSD)
18
TEST2
0
must be connected to digital ground (VSSD)
25
TEST4
1
must be connected to digital supply voltage (VDDD)
28
TEST3
0
must be connected to digital ground (VSSD)
2000 Mar 28
10
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.5.2
UDA1351TS
L3 CONTROL MODE
The L3 control mode allows maximum flexibility in controlling the UDA1351TS.
It should be noted that, in the L3 control mode, several base-line functions are still controlled by pins on the device and
that, on start-up in the L3 control mode, the output is explicitly muted by bit MT via the L3 interface.
Table 4
Pin description in the L3 control mode
PIN
NAME
VALUE
FUNCTION
Mode selection pin
26
SELSTATIC
0
select L3 control mode; must be connected to VSSD
RESET
0
normal operation
1
reset
L3DATA
−
must be connected to the L3-bus
9
L3CLOCK
−
must be connected to the L3-bus
10
L3MODE
−
must be connected to the L3-bus
LOCK
0
clock regeneration and IEC 958 decoder out-of-lock or non-PCM data
detected
1
clock regeneration and IEC 958 decoder locked and PCM data detected
Input pins
5
8
Status pin
16
Test pins
4
TEST1
0
must be connected to ground (VSSD)
18
TEST2
0
must be connected to ground (VSSD)
25
TEST4
1
must be connected to digital supply voltage (VDDD)
28
TEST3
0
must be connected to ground (VSSD)
2000 Mar 28
11
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.6
8.6.1
UDA1351TS
L3 interface
Basically, two types of data transfers can be defined:
• Write action: data transfer to the device
GENERAL
• Read action: data transfer from the device.
The UDA1351TS has an L3 microcontroller interface and
all the digital sound processing features and various
system settings can be controlled by a microcontroller.
Remark: when the device is powered up, at least one
L3CLOCK pulse must be given to the L3 interface to wake
up the interface before starting sending to the device,
see Fig.5. This is only needed once after the device is
powered up.
The controllable settings are:
• Restoring L3 defaults
• Power-on
8.6.2
• Selection of filter mode and settings of treble and bass
boost
DEVICE ADDRESSING
The device address consists of one byte with:
• Volume settings
• Data Operating Mode (DOM) bits 0 and 1 representing
the type of data transfer (see Table 5)
• Selection of soft mute via cosine roll-off and bypass of
auto mute
• Address bits 2 to 7 representing a 6-bit device address.
• Selection of de-emphasis (only effective in L3 control
mode).
Table 5
Selection of data transfer
DOM
The readable settings are:
TRANSFER
• Mute status of interpolator
BIT 0
BIT 1
• PLL locked
0
0
not used
• SPDIF input signal locked
1
0
not used
• Audio Sample Frequency (ASF)
0
1
write data or prepare read
• Valid PCM data detected
1
1
read data
• Pre-emphasis of the IEC 958 input signal
• ACcuracy of the Clock (ACC).
8.6.3
The exchange of data and control information between the
microcontroller and the UDA1351TS is LSB first and is
accomplished through a serial hardware L3 interface
comprising the following pins:
After sending the device address (including DOM bits),
indicating whether the information is to be read or written,
one data byte is sent using bit 0 to indicate whether the
information will be read or written and bits 1 to 7 for the
destination register address.
• L3DATA: data line
REGISTER ADDRESSING
• L3MODE: mode line
Basically, there are three methods for register addressing:
• L3CLK: clock line.
1. Addressing for write data: bit 0 is logic 0 indicating a
write action to the destination register, followed by
bits 1 to 7 indicating the register address (see Fig.5)
The exchange of bytes via the L3 interface is LSB first.
2. Addressing for prepare read: bit 0 is logic 1, indicating
that data will be read from the register (see Fig.6)
The L3 format has two modes of operation:
• Address mode
3. Addressing for data read action. Here, the device
returns a register address prior to sending data from
that register. When bit 0 is logic 0, the register address
is valid; when bit 0 is logic 1, the register address is
invalid.
• Data transfer mode.
The address mode is used to select a device for a
subsequent data transfer. The address mode is
characterized by L3MODE being LOW and a burst of
8 pulses on L3CLOCK, accompanied by eight bits (see
Fig.5). The data transfer mode is characterized by
L3MODE being HIGH and is used to transfer one or more
bytes representing a register address, instruction or data.
2000 Mar 28
12
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L3CLOCK
L3MODE
register address
device address
0
L3DATA
1
data byte 1
data byte 2
0
MGS753
DOM bits
write
Philips Semiconductors
96 kHz IEC 958 audio DAC
2000 Mar 28
L3 wake-up pulse after power-up
Fig.5 Data write mode (for L3 version 2).
13
L3CLOCK
L3MODE
register address
device address
L3DATA
DOM bits
read
1 1
data byte 1
data byte 2
0/1
valid/non-valid
prepare read
send by the device
Fig.6 Data read mode.
MGS754
Preliminary specification
1
register address
UDA1351TS
0 1
device address
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.6.4
UDA1351TS
For reading data from a device, the following six bytes are
involved (see Table 7):
DATA WRITE MODE
The data write mode is explained in the signal diagram of
Fig.5. For writing data to a device, four bytes must be sent
(see Table 6):
1. One byte with the device address, including ‘01’ for
signalling the write action to the device
2. One byte is sent with the register address from which
data needs to be read. This byte starts with a ‘1’, which
indicates that there will be a read action from the
register, followed again by seven bits for the
destination address in binary format, with A6 being the
MSB and A0 being the LSB
1. One byte starting with ‘01’ for signalling the write
action to the device, followed by the device address
(‘011000’ for the UDA1351TS)
2. One byte starting with a ‘0’ for signalling the write
action, followed by seven bits indicating the
destination address in binary format with A6 being the
MSB and A0 being the LSB
3. One byte with the device address, including ‘11’ is sent
to the device. The ‘11’ indicates that the device must
write data to the microcontroller
3. Two data bytes with D15 being the MSB and D0 being
the LSB.
4. One byte, sent by the device to the bus, with the
(requested) register address and a flag bit indicating
whether the requested register was valid (bit is logic 0)
or invalid (bit is logic 1)
It should be noted that each time a new destination register
address needs to be written, the device address must be
sent again.
8.6.5
5. Two bytes, sent by the device to the bus, with the data
information in binary format, with D15 being the MSB
and D0 being the LSB.
DATA READ MODE
To read data from the device, a prepare read must first be
done and then data read. The data read mode is explained
in the signal diagram of Fig.6.
Table 6
L3 write data
BYTE
L3 MODE
FIRST IN TIME
LATEST IN TIME
ACTION
BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7
1
address
device address
0
1
0
1
1
0
0
0
2
data transfer
register address
0
A6
A5
A4
A3
A2
A1
A0
3
data transfer
data byte 1
D15
D14
D13
D12
D11
D10
D9
D8
4
data transfer
data byte 2
D7
D6
D5
D4
D3
D2
D1
D0
Table 7
L3 read data
BYTE
L3 MODE
FIRST IN TIME
LATEST IN TIME
ACTION
BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7
1
address
device address
0
1
0
1
1
0
0
0
2
3
data transfer
register address
1
A6
A5
A4
A3
A2
A1
A0
address
device address
1
1
0
1
1
0
0
0
4
data transfer
register address
0 or 1
A6
A5
A4
A3
A2
A1
A0
5
data transfer
data byte 1
D15
D14
D13
D12
D11
D10
D9
D8
6
data transfer
data byte 2
D7
D6
D5
D4
D3
D2
D1
D0
2000 Mar 28
14
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.6.6
UDA1351TS
INITIALIZATION STRING
For proper and reliable operation, the UDA1351TS must be initialized in the L3 control mode. This is required to have
the PLL start up after powering up of the device under all conditions. The initialization string is given in Table 8.
Table 8
L3 initialization string and set defaults after power-up.
FIRST IN TIME
BYTE
L3 MODE
LATEST IN TIME
ACTION
BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7
1
address
2
3
device address
0
1
0
1
1
0
0
0
data transfer
register address
0
1
0
0
0
0
0
0
data transfer
data byte 1
0
0
0
0
0
0
0
0
4
data transfer
data byte 2
0
0
0
0
0
0
1
1
5
address
0
1
0
1
1
0
0
0
6
data transfer
register address
0
1
1
1
1
1
1
1
7
data transfer
data byte 1
0
0
0
0
0
0
0
0
8
data transfer
data byte 2
0
0
0
0
0
0
0
0
2000 Mar 28
init string
set defaults device address
15
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UDA1351TS register map
BIT
ADDR
FUNCTION
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Writable settings
00H
10H
11H
40H
system
parameters
PON
default
1
sound
features
M1
M0
default
0
0
0(1)
0(1)
1(2)
BB3
BB2
BB1
BB0
0
0
0
0
0(1)
TR1
TR0
DE1
DE0
MT
0
0
0
0
1
volume
control DAC
VC5
VC4
VC3
VC2
VC1
VC0
default
0
0
0
0
0
0
Auto
MT
RST
PLL
1
0
multiplex
parameters
0(1)
16
default
7FH
0(1)
0(1)
0(1)
0(1)
Philips Semiconductors
Table 9
OVERVIEW OF L3 INTERFACE REGISTERS
96 kHz IEC 958 audio DAC
2000 Mar 28
8.6.7
restore
L3 defaults
Readable settings
18H
interpolator
parameters
38H
SPDIF input
and lock
parameters
MT
stat
PLL
lock
SPD
lock
ASF1
ASF0
PCM
stat
PRE
ACC1 ACC0
Notes
1. When writing new settings via the L3 interface, these bits should always remain at logic 0 (default value) to warrant correct operation.
Preliminary specification
UDA1351TS
2. When writing new settings via the L3 interface, these bits should always remain at logic 1 (default value) to warrant correct operation.
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.6.8
UDA1351TS
−3 dB point for maximum setting is 300 Hz. The default
value is ‘0000’.
WRITABLE REGISTERS
8.6.8.1
Restoring L3 defaults
By writing to the 7FH register, all L3 control values are
restored to their default values. Only the L3 interface is
affected: the system will not be reset. Consequently,
readable registers that are not reset can be affected.
8.6.8.2
Table 13 Bass boost settings
LEVEL (dB)
BB3
Power-on
A 1-bit value to switch the DAC on and off.
Table 10 Power-on setting
PON
8.6.8.3
FUNCTION
0
power-down
1
power-on (default setting)
Filter mode selection
A 2-bit value to program the mode for the sound
processing filters of bass boost and treble.
Table 11 Filter mode settings
M1
M0
FUNCTION
BB2
BB0
FLAT
MIN.
MAX.
0
0
0
0
0
0
0
0
0
0
1
0
2
2
0
0
1
0
0
4
4
0
0
1
1
0
6
6
0
1
0
0
0
8
8
0
1
0
1
0
10
10
0
1
1
0
0
12
12
0
1
1
1
0
14
14
1
0
0
0
0
16
16
1
0
0
1
0
18
18
1
0
1
0
0
18
20
1
0
1
1
0
18
22
1
1
0
0
0
18
24
1
1
0
1
0
18
24
1
1
0
0
18
24
1
1
1
0
18
24
0
0
flat (default setting)
1
0
1
minimum
1
1
0
1
1
8.6.8.6
maximum
BB1
De-emphasis
A 2-bit value to enable the digital de-emphasis filter.
8.6.8.4
Treble
Table 14 De-emphasis selection
A 2-bit value to program the treble setting, in combination
with the filter mode settings. At fs = 44.1 kHz, the −3 dB
point for minimum setting is 3.0 kHz and the −3 dB point
for maximum setting is 1.5 kHz. The default value is ‘00’.
Table 12 Treble settings
LEVEL (dB)
TR1
TR0
FLAT
MIN.
MAX.
0
0
0
0
0
0
1
0
2
2
1
0
0
4
4
1
1
0
6
6
8.6.8.5
DE0
0
0
other (default setting)
0
1
fs = 32.0 kHz
1
0
fs = 44.1 kHz
1
1
fs = 48.0 kHz
8.6.8.7
FUNCTION
Soft mute
A 1-bit value to enable the digital mute.
Table 15 Soft mute selection
MT
Bass boost
A 4-bit value to program the bass boost setting, in
combination with the filter mode settings. At fs = 44.1 kHz,
the −3 dB point for minimum setting is 250 Hz and the
2000 Mar 28
DE1
17
FUNCTION
0
no muting
1
muting (default setting)
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.6.8.8
UDA1351TS
Volume control
8.6.8.10
A 6-bit value to program the left and right channel volume
attenuation. The range is from 0 to −∞ dB in steps of 1 dB.
PLL reset
A 1-bit value to reset the PLL. This is the bit which is set in
the initialization string. When this bit is asserted, the PLL
will be reset and the output clock of the PLL will be forced
to its lowest value, which is in the area of a few MHz.
Table 16 Volume settings
VC5
VC4
VC3
VC2
VC1
VC0
VOLUME (dB)
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
0
−1
0
0
0
0
1
1
−2
:
:
:
:
:
:
:
1
1
0
0
1
1
1
1
0
1
0
0
−51
8.6.9.1
1
1
0
1
0
1
1
1
0
1
1
0
−52
A 1-bit value indicating whether the interpolator is muting
or not muting.
1
1
0
1
1
1
1
1
1
0
0
0
1
1
1
0
0
1
1
1
1
0
1
0
1
1
1
0
1
1
1
1
1
1
0
0
1
1
1
1
0
1
1
1
1
1
1
0
1
1
1
1
1
1
Table 18 PLL reset
RST PLL
FUNCTION
0
normal operation (default)
1
PLL is reset
8.6.9
READABLE REGISTERS
Mute status
Table 19 Interpolator mute status
−54
MT stat
−57
0
no muting
1
muting
8.6.9.2
−60
FUNCTION
PLL lock detection
A 1-bit value indicating that the clock regeneration is
locked.
−∞
Table 20 PLL lock indication
8.6.8.9
Auto mute
PLL lock
A 1-bit value to activate mute during out-of-lock. In normal
operation, the output is automatically hard muted when an
out-of-lock situation is detected. Setting this bit to logic 0
will disable that function.
Auto MT
do not mute output during out-of-lock
1
mute output during out-of-lock (default
setting)
2000 Mar 28
out-of-lock
1
locked
SPDIF lock detection
A 1-bit value indicating the IEC 958 decoder is locked and
is decoding correct data.
FUNCTION
0
0
8.6.9.3
Table 17 Auto mute setting
FUNCTION
Table 21 SPDIF lock detection
SPD lock
18
FUNCTION
0
not locked or non-PCM data detected
1
locked and PCM data detected
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
8.6.9.4
UDA1351TS
Audio sample frequency detection
8.6.9.6
Pre-emphasis detection
A 2-bit value indicating the audio sample frequency of the
IEC 958 input signal.
A 1-bit value that indicates whether the pre-emphasis bit
was set on the IEC 958 input signal or not set.
Table 22 Audio sample frequency detection
Table 24 Pre-emphasis detection
ASF1
ASF0
0
0
44.1 kHz
0
no pre-emphasis
0
1
undefined
1
pre-emphasis
1
0
48.0 kHz
1
1
32.0 kHz
8.6.9.5
FUNCTION
PRE
8.6.9.7
Clock accuracy detection
A 2-bit value indicating whether the timing accuracy of the
IEC 958 input signal conforms to the IEC 958
specification.
PCM detection
A 1-bit value which indicates whether the IEC 958 input
contains PCM audio data or other binary data.
Table 25 Input signal accuracy detection
Table 23 Two channel PCM input detection
PCM stat
FUNCTION
FUNCTION
ACC1
ACC0
FUNCTION
0
0
level II
0
input with two channel PCM data
0
1
level I
1
input without two channel PCM data
1
0
level III
1
1
undefined
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
note 1
MIN.
MAX.
UNIT
VDD
supply voltage
2.7
5.0
V
Txtal
crystal temperature
−25
+150
°C
Tstg
storage temperature
−65
+125
°C
Tamb
ambient temperature
−40
+85
°C
Ves
electrostatic handling voltage
Human Body Model (HBM); note 2
−2000 +2000 V
Machine Model (MM); note 3
−200
+200
V
−
200
mA
output short circuited to VSSA(DAC)
−
482
mA
output short circuited to VDDA(DAC)
−
346
mA
Ilu(prot)
latch-up protection current
Tamb = 125 °C; VDD = 3.6 V
Isc(DAC)
short-circuit current of DAC
Tamb = 0 °C; VDD = 3 V; note 4
Notes
1. All VDD and VSS connections must be made to the same power supply.
2. JEDEC class 2 compliant.
3. JEDEC class B compliant, except pin VSSA(PLL), which can withstand ESD pulses of −130 to +130 V.
4. DAC operation after short circuiting cannot be warranted.
2000 Mar 28
19
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
10 THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
85
K/W
in free air
11 CHARACTERISTICS
VDDD = VDDA = 3.0 V; IEC 958 input with fs = 48.0 kHz; Tamb = 25 °C; RL = 5 kΩ; all voltages measured with respect to
ground; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies; note 1
VDDA
analog supply voltage
2.7
3.0
3.6
V
VDDA(DAC)
analog supply voltage for DAC
2.7
3.0
3.6
V
VDDA(PLL)
analog supply voltage for PLL
2.7
3.0
3.6
V
VDDD
digital supply voltage
2.7
3.0
3.6
V
VDDD(C)
digital supply voltage for core
2.7
3.0
3.6
V
IDDA(DAC)
analog supply current of DAC
power-on
−
8.0
−
mA
power-down
−
750
−
µA
IDDA(PLL)
analog supply current of PLL
at 48 kHz
−
0.7
−
mA
at 96 kHz
−
1.0
−
mA
IDDD(C)
digital supply current of core
at 48 kHz
−
16.0
−
mA
at 96 kHz
−
24.5
−
mA
−
2.0
−
mA
IDDD
digital supply current
at 48 kHz
at 96 kHz
−
3.0
−
mA
P
power consumption at 48 kHz
DAC in playback mode
−
80
−
mW
DAC in Power-down mode
−
58
−
mW
DAC in playback mode
−
109
−
mW
DAC in Power-down mode
−
87
−
mW
power consumption at 96 kHz
Digital input pins
VIH
HIGH-level input voltage
0.8VDD
−
VDD + 0.5 V
VIL
LOW-level input voltage
−0.5
−
+0.2VDD
V
Vhys(RESET)
hysteresis voltage on
pin RESET
−
0.8
−
V
ILI
input leakage current
−
−
10
µA
Ci
input capacitance
−
−
10
pF
Rpu(int)
internal pull-up resistance
16
33
78
kΩ
Rpd(int)
internal pull-down resistance
16
33
78
kΩ
0.85VDD
−
−
V
Digital output pins
VOH
HIGH-level output voltage
IOH = −2 mA
VOL
LOW-level output voltage
IOL = 2 mA
IL(max)
maximum load current
2000 Mar 28
20
−
−
0.4
V
−
3
−
mA
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
SYMBOL
PARAMETER
UDA1351TS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Digital-to-analog converter; note 2
Vref
reference voltage
Vo(rms)
output voltage (RMS value)
(THD + N)/S total harmonic
distortion-plus-noise to signal
ratio
measured with respect to
VSSA
0.45VDDA 0.50VDDA 0.55VDDA V
−
900
−
mV
at 0 dB
−
−90
−85
dB
at −40 dB; A-weighted
−
−60
−55
dB
at 0 dB
−
−85
−80
dB
at −40 dB; A-weighted
−
−57
−52
dB
fi = 1.0 kHz tone at 48 kHz
fi = 1.0 kHz tone at 96 kHz
signal-to-noise ratio at 48 kHz
fi = 1.0 kHz tone; code = 0; 95
A-weighted
100
−
dB
signal-to-noise ratio at 96 kHz
fi = 1.0 kHz tone; code = 0; 95
A-weighted
100
−
dB
αcs
channel separation
fi = 1.0 kHz tone
−
96
−
dB
∆Vo
unbalance of output voltages
fi = 1.0 kHz tone
−
0.1
0.4
dB
S/N
IEC 958 input
Vi(p-p)
AC input voltage (peak-to-peak
value)
0.2
0.5
3.3
V
Ri
input resistance
−
6
−
kΩ
Vhys
hysteresis voltage
−
40
−
mV
Notes
1. All supply pins VDD and VSS must be connected to the same external power supply unit.
2. When the DAC must drive a higher capacitive load (above 50 pF), a series resistor of 100 Ω must be used to prevent
oscillations in the output stage of the operational amplifier.
2000 Mar 28
21
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
12 TIMING CHARACTERISTICS
VDDD = VDDA = 2.7 to 3.6 V; Tamb = −40 to +85 °C; RL = 5 kΩ; all voltages measured with respect to ground; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
UNIT
Device reset
trst
−
250
µs
fs = 32.0 kHz
−
85.0
ms
fs = 44.1 kHz
−
63.0
ms
fs = 48.0 kHz
−
60.0
ms
fs = 48.0 kHz
−
40.0
ms
reset active time
PLL lock time
tlock
time to lock
Microcontroller L3 interface timing (see Figs 7 and 8)
Tcy(CLK)(L3)
L3CLOCK cycle time
500
−
ns
tCLK(L3)H
L3CLOCK HIGH time
250
−
ns
tCLK(L3)L
L3CLOCK LOW time
250
−
ns
tsu(L3)A
L3MODE set-up time for address mode
190
−
ns
th(L3)A
L3MODE hold time for address mode
190
−
ns
tsu(L3)D
L3MODE set-up time for data transfer mode
190
−
ns
th(L3)D
L3MODE hold time for data transfer mode
190
−
ns
t(stp)(L3)
L3MODE stop time in data transfer mode
190
−
ns
tsu(L3)DA
L3DATA set-up time in address and data
transfer mode
190
−
ns
th(L3)DA
L3DATA hold time in address and data
transfer mode
30
−
ns
tsu(L3)R
L3DATA set-up time in data transfer mode
read mode
50
−
−
th(L3)R
L3DATA hold time in data transfer mode
read mode
360
−
−
2000 Mar 28
22
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
handbook, full pagewidth
L3MODE
tsu(L3)A
th(L3)A
tCLK(L3)L
tsu(L3)A
tCLK(L3)H
th(L3)A
L3CLOCK
Tcy(CLK)(L3)
tsu(L3)DA
th(L3)DA
BIT 7
BIT 0
L3DATA
MGL723
Fig.7 Timing for address mode.
handbook, full pagewidth
tstp(L3)
tstp(L3)
L3MODE
tCLK(L3)L
Tcy(CLK)L3
tCLK(L3)H
tsu(L3)D
th(L3)D
L3CLOCK
th(L3)DA
L3DATA
write
tsu(L3)DA
th(L3)DA
BIT 7
BIT 0
L3DATA
read
ten(L3)DA
tsu(L3)R
Fig.8 Timing for data transfer mode.
2000 Mar 28
tdis(L3)DA
MGL889
th(L3)R
23
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X1
VDDA
X1
L27
VDDD(C)
X1
BZN32A07
C11
100 µF
(16 V)
X1
L3CLOCK
X1
L3MODE
X1
24
C45
C48
180 pF
(50 V)
R41
75 Ω
VDDD(C)
28
25
14
L3DATA
X1
SELSTATIC
SPDIF
C14
100 µF
(16 V)
VDDA
VSSA(DAC) X1
X1
TEST4
18
VDDA(DAC) X1
X1
TEST3
X1
TEST1
X1
X1
VDDA(PLL)
4
TEST2
X1
VSSA(PLL)
24
20
19
Vref
X1
C44
100 nF
(50 V)
21
6
RESET
X1
C13
10 µF
(16 V)
C40
VDDD(C)
100 nF
(50 V)
9
10
11
8
1
VDDD(C)
X16
X11
VSSA
23
22
C43
100 nF
(50 V)
5
X1
IEC
channel
VDDA
C41
100 nF
(50 V)
L3-bus
J14 3
static
2
1
L3
C42
100 nF
(50 V)
BZN32A07
UDA1351TS
26
2
12
13
10 nF
(50 V)
27
15
MUTE
X1
n.c.
X1
n.c.
X1
VDDD(C)
3
2
1
Philips Semiconductors
C12
100 µF
(16 V)
L29
VDDD
96 kHz IEC 958 audio DAC
BZN32A07
13 APPLICATION INFORMATION
andbook, full pagewidth
2000 Mar 28
L26
VDDA
J26
mute
no mute
VSSD(C) X1
n.c.
X1
VOUTL
X1
C15
47 µF
(16 V)
R44
100 Ω
R43
10 kΩ
X18
output
left
X13
ground
DGND
17
VDDD
LOCK
MGU035
R38
1Ω
C9
100 µF
(16 V)
R39
1 kΩ
C28
100 nF
(50 V)
V5
lock
Fig.9 Test and application diagram.
R46
100 Ω
R45
10 kΩ
X19
output
right
X14
Preliminary specification
AGND DGND
VDDD
C16
UDA1351TS
C5
100 µF
(16 V)
VDDD(C)
VSSD
J2
C3
100 µF
(16 V)
VDDA
VOUTR X1
47 µF
(16 V)
16
X1
J3
7
X1
+3 V
3
VDDD
J1
X1
AGND
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
14 PACKAGE OUTLINE
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
SOT341-1
E
A
X
c
HE
y
v M A
Z
28
15
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
10.4
10.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.1
0.7
8
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT341-1
2000 Mar 28
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
MO-150
25
o
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
UDA1351TS
If wave soldering is used the following conditions must be
observed for optimal results:
15 SOLDERING
15.1
Introduction to soldering surface mount
packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
15.2
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
15.3
15.4
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
2000 Mar 28
Manual soldering
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
26
Philips Semiconductors
Preliminary specification
96 kHz IEC 958 audio DAC
15.5
UDA1351TS
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
16 DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
17 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Mar 28
27
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SCA 69
© Philips Electronics N.V. 2000
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Printed in The Netherlands
753503/25/01/pp28
Date of release: 2000
Mar 28
Document order number:
9397 750 06814