4X .051±.003 1.30±.08 .004 M A B REV DESCRIPTION B REVISED PER ER042473 CHANGE T & R QTY FROM 500 TO 350, CE MATERIAL UPDATED TO LCP, ADD LEAD FREE NOTE BY APPD DATE L.L 2. FINISH SPECIFICATIONS: CONTACT: .000030 MIN GOLD PER ASTM B488 OVER .000080 MIN NICKEL PER AMS-QQ-N-290. NUT AND FRONT BODY: .000100 MIN NICKEL PER AMS-QQ-N-290 OVER COPPER FLASH PER ASTM B734. REAR BODY AND BOARD LOCKS: .000050 MIN PURE TIN OVER .000080 MIN NICKEL PER AMS-QQ-N-290 QTY 360 350 CY 06/19/12 P/N DESCRIPTION 034B-060-00402TK TRAY PACK 034B-060-00402TKU TAPE & REEL PACK NOTES: UNLESS OTHERWISE SPECIFIED 1. MATERIAL SPECIFICATIONS: BODYS & NUT: BRASS PER ASTM B16. CONTACT: COPPER ALLOY INSULATOR: TEFLON PER ASTM D1710. BOARD LOCKS: PHOSPHOR BRONZE PER ASTM B139 INSULATOR: LCP PER ZENITE 6130LX BK010 A .039 1.00 3. ELECTRICAL SPECIFICATIONS: IMPEDANCE: 75 OHMS. FREQUENCY RANGE: DC-4.5GHz. RETURN LOSS (ON MID-LAYER OF 1.6mm PCB): <-15dB UP TO 3.0GHz, <-10dB UP TO 4.5 GHz. 2 X .100 2.54 4. COMPLIANT TO SMPTE 424M (3G-SDI) STANDARD. B 5 STUB RESISTANT INTERFACE 6. LEAD FREE SOLDER 260 C FOR 90 SECONDS. .808 20.52 2 X .100 .256 6.50 .533 13.54 TO C.G. ON C.L. 2.54 RECOMMENDED PCB LAYOUT .063[1.6] THICKNESS .289 7.34 M5.5 X 0.5-6g .236 5.99 MIN 5 .292 7.42 .146 3.71 4 X .118 3.00 .254 6.45 4 X .025 .64 .220 5.59 +.05 .028+-.002 .001 .71 - .03 RECOMMENDED PANEL MOUNTING HOLE .670 17.02 2X .032 .81 CATALOG P/N: 034B-060-00402TK 4X .140 3.56 .096 MAX. PANEL DMF026 B 2X BOARD LOCKS .278 7.06 PER ASME Y14.5M-1994 UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN INCHES [MM] TOLERANCES: DECIMAL: .XX [X.X] ± .01 [0.3] .XXX [X.XX] ± .005 [0.13] .XXXX [X.XXX] ± .XXXX ANGLES: ± 2° SCALE: 3.5:1 THIRD ANGLE Winchester Electronics Corporation 62 Barnes Industrial Road North Wallingford, Connecticut 06492 DIN 1.0/2.3 75 OHM JACK RIGHT ANGLE PCB MOUNT WITH BOARD LOCKS & STUB RESISTANT INTERFACE (RoHS) CUSTOMER DRAWING DRAWN BB APPROVED XXX DATE APPROVED 05/03/12 CY DATE APPROVED XX/XX/XX XXX DATE 05/03/12 DATE XX/XX/XX A SD034B-060-00402TK SHT 1 OF 1 REV B