PLASTIC INFRARED LIGHT EMITTING DIODE QED123UL PACKAGE DIMENSIONS 0.195 (4.95) REFERENCE SURFACE 0.305 (7.75) 0.040 (1.02) NOM 0.800 (20.3) MIN 0.050 (1.25) CATHODE 0.100 (2.54) NOM SCHEMATIC 0.240 (6.10) 0.215 (5.45) 0.020 (0.51) SQ. (2X) ANODE NOTES: 1. Dimensions for all drawings are in inches (mm). 2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless otherwise specified. CATHODE FEATURES • • • • • • • • UL217 Approved λ = 880 nm Chip material = AlGaAs Package type: T-1 3/4 (5mm lens diameter) Matched Photosensor: QSB34 Narrow Emission Angle, 18° High Output Power Package material and color: Clear, peach © 2004 Fairchild Semiconductor Corporation Page 1 of 4 4/2/04 PLASTIC INFRARED LIGHT EMITTING DIODE QED123UL ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter Symbol Rating Unit TOPR -40 to + 100 °C TSTG -40 to + 100 °C Operating Temperature Storage Temperature (Iron)(2,3,4) TSOL-I 240 for 5 sec °C Soldering Temperature (Flow)(2,3) TSOL-F 260 for 10 sec °C Continuous Forward Current IF 100 mA Reverse Voltage VR 5 V PD 200 mW Soldering Temperature Power Dissipation(1) NOTES: 1. Derate power dissipation linearly 2.67 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. .4. Soldering iron 1/16" (1.6 mm) minimum from housing ELECTRICAL / OPTICAL CHARACTERISTICS (TA =25°C) Parameter Test Conditions Symbol Min Typ Max Units IF = 20 mA λPE — 880 — nm Emission Angle IF = 100 mA 2Θ1/2 — 18 — Deg. Forward Voltage IF = 100 mA, tp = 20 ms VF — — 1.7 V VR = 5 V IR — — 10 µA IF = 100 mA, tp = 20 ms IE 16 — 40 mW/sr tr — 800 — ns tf — 800 — ns Peak Emission Wavelength Reverse Current Radiant Intensity QED121 Rise Time Fall Time © 2004 Fairchild Semiconductor Corporation IF = 100 mA Page 2 of 4 4/2/04 PLASTIC INFRARED LIGHT EMITTING DIODE QED123UL Typical Performance Characteristics NORMALIZED COLLECTOR CURRENT NORMALIZED RADIANT INTENSITY 10 Normalized to: IF= 100 mA, TA = 25˚C Pulse Width = 100 µs 1 0.1 0.01 0.001 1 10 100 1 Normalized to: Pulse Width = 100 µs Duty Cycle = 0.1% VCC = 5 V RL = 100Ω TA = 25˚C IF = 100 mA 0.8 0.6 IF = 20 mA 0.4 0.2 0 1000 0 1 IF - INPUT CURRENT (mA) 2 3 4 5 6 LENS TIP SEPERATION (INCHES) Fig. 1 Normalized Radiant Intensity vs. Input Current Fig. 2 Coupling Characteristics of QED12X and QSD12X NORMALIZED RADIANT INTENSITY 1.0 VF - FORWARD VOLTAGE (V) 2.5 IF = 100 mA IF = 50 mA 2 1.5 1 IF = 10 mA IF = 20 mA Pulse Width = 100 µs Duty Cycle = 0.1% 0.5 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 775 90 100 800 825 850 875 900 925 950 λ (nm) TA - TEMPERATURE (˚C) Fig. 3 Forward Voltage vs. Temperature Fig. 4 Normalized Radiant Intensity vs. Wavelength Fig. 5 Radiation Pattern 20 10 0˚ -10 -20 30 -30 40 -40 50 -50 60 -60 70 -70 80 -80 90 -90 100 © 2004 Fairchild Semiconductor Corporation 80 60 40 20 0 Page 3 of 4 20 40 60 80 100 4/2/04 PLASTIC INFRARED LIGHT EMITTING DIODE QED123UL DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. © 2004 Fairchild Semiconductor Corporation 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 4 of 4 4/2/04