QL4009 QuickRAM Data Sheet • • • • • • 9,000 Usable PLD Gate QuickRAM ESP Combining Performance, Density and Embedded RAM Device Highlights Advanced I/O Capabilities • Interfaces with both 3.3 V and 5.0 V devices High Performance & High Density • 9,000 Usable PLD Gates with 82 I/Os • 300 MHz 16-bit Counters, 400 MHz Datapaths, 160+ MHz FIFOs • 0.35 µm four-layer metal non-volatile CMOS process for smallest die sizes • PCI compliant with 3.3 V and 5.0 V busses for -1/-2/-3/-4 speed grades • Full JTAG boundary scan • I/O Cells with individually controlled Registered Input Path and Output Enables High Speed Embedded SRAM • 8 dual-port RAM modules, organized in user-configurable 1,152 bit blocks • 5 ns access times, each port independently accessible • Fast and efficient for FIFO, RAM, and ROM functions 8 RAM Blocks 160 High Speed Logic Cells Easy to Use / Fast Development Cycles • 100% routable with 100% utilization and complete pin-out stability • Variable-grain logic cells provide high performance and 100% utilization • Comprehensive design tools include high quality Verilog/VHDL synthesis © 2002 QuickLogic Corporation Interface Figure 1: QuickRAM Block Diagram www.quicklogic.com • • • • • • 1 QL4009 QuickRAM Data Sheet Rev B Architecture Overview The QuickRAMTM family of ESPs (Embedded Standard Products) offers FPGA logic in combination with Dual-Port SRAM modules. The QL4009 is a 9,000 usable PLD gate member of the QuickRAM family of ESPs. QuickRAM ESPs are fabricated on a 0.35µm four-layer metal process using QuickLogic's patented ViaLinkTM technology to provide a unique combination of high performance, high density, low cost, and extreme ease-of-use. The QL4009 contains 160 logic cells and 8 Dual Port RAM modules (see Figure 1). Each RAM module has 1,152 RAM bits, for a total of 9,216 bits. RAM Modules are Dual Port (one read port, one write port) and can be configured into one of four modes: 64 (deep) x18 (wide), 128x9, 256x4, or 512x2 (see Figure 4). With a maximum of 82 I/Os, the QL4009 is available in 68-pin PLCC, 84-pin PLCC and 100-pin TQFP packages. Designers can cascade multiple RAM modules to increase the depth or width allowed in single modules by connecting corresponding address lines together and dividing the words between modules (see Figure 2). This approach allows up to 512-deep configurations as large as 16 bits wide in the smallest QuickRAM device and 44 bits wide in the largest device. Software support for the complete QuickRAM family, including the QL4009, is available through two basic packages. The turnkey QuickWorksTM package provides the most complete ESP software solution from design entry to logic synthesis, to place and route, to simulation. The QuickToolsTM packages provides a solution for designers who use Cadence, Exemplar, Mentor, Synopsys, Synplicity, Viewlogic, Aldec, or other third-party tools for design entry, synthesis, or simulation. The QuickLogic variable grain logic cell features up to 16 simultaneous inputs and 5 outputs within a cell that can be fragmented into 5 independent cells. Each cell has a fan-in of 29 including register and control lines (see Figure 3). WDATA RAM Module (1,152 bits) WADDR RDATA RADDR RAM Module (1,152 bits) WDATA RDATA Figure 2: QuickRAM Module Bits 2 • • • www.quicklogic.com • • • © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B Product Summary Total of 82 I/O Pins • 74 bi-directional input/output pins, PCI-compliant for 5.0 V and 3.3 V buses for -1/-2/-3/-4 speed grades • 8 high-drive input/distributed network pins Eight Low-Skew Distributed Networks • Two array clock/control networks available to the logic cell flip-flop clock, set and reset inputs - each driven by an input-only pin • Six global clock/control networks available to the logic cell F1, clock, set and reset inputs and the input and I/O register clock, reset and enable inputs as well as the output enable control - each driven by an input-only or I/O pin, or any logic cell output or I/O cell feedback High Performance Silicon • Input + logic cell + output total delays under 6 ns • Data path speeds over 400 MHz • Counter speeds over 300 MHz • FIFO speeds over 160+ MHz • © 2002 QuickLogic Corporation www.quicklogic.com •• • • • 3 QL4009 QuickRAM Data Sheet Rev B AC Characteristics at VCC = 3.3 V, TA = 25° C (K = 1.00) To calculate delays, multiply the appropriate K factor from Table 10: Operating Range by the following numbers in the tables provided. QS A1 A2 A3 A4 A5 A6 AZ QS OP B1 B2 C1 C2 MP MS OZ QZ D1 D2 E1 E2 NP NS NZ F1 F2 F3 F4 F5 F6 FZ QC QR Figure 3: QuickRAM Logic Cell Table 1: Logic Cell Symbol tPD Propagation Delays (ns) Fanout (5) Parameter Combinatorial Delaya a 1 2 3 4 5 1.4 1.7 1.9 2.2 3.2 1.7 1.7 1.7 1.7 1.7 tSU Setup Time tH Hold Time 0.0 0.0 0.0 0.0 0.0 tCLK Clock to Q Delay 0.7 1.0 1.2 1.5 2.5 tCWHI Clock High Time 1.2 1.2 1.2 1.2 1.2 tCWLO Clock Low Time 1.2 1.2 1.2 1.2 1.2 tSET Set Delay 1.0 1.3 1.5 1.8 2.8 tRESET Reset Delay 0.8 1.1 1.3 1.6 2.6 tSW Set Width 1.9 1.9 1.9 1.9 1.9 tRW Reset Width 1.8 1.8 1.8 1.8 1.8 a. These limits are derived from a representative selection of the slowest paths through the QuickRAM logic cell including typical net delays. Worst case delay values for specific paths should be determined from timing analysis of your particular design. 4 • • • www.quicklogic.com • • • © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B [8:0] WA [17:0] RE RCLK WD WE WCLK [1:0] [8:0] RA MODE [17:0] RD ASYNCRD Figure 4: QuickRAM Module Table 2: RAM Cell Synchronous Write Timing Symbol Propagation Delays (ns) Fanout Parameter 1 2 3 4 5 tSWA WA Setup Time to WCLK 1.0 1.0 1.0 1.0 1.0 tHWA WA Hold Time to WCLK 0.0 0.0 0.0 0.0 0.0 tSWD WD Setup Time to WCLK 1.0 1.0 1.0 1.0 1.0 tHWD WD Hold Time to WCLK 0.0 0.0 0.0 0.0 0.0 tSWE WE Setup Time to WCLK 1.0 1.0 1.0 1.0 1.0 tHWE WE Hold Time to WCLK 0.0 0.0 0.0 0.0 0.0 5.0 5.3 5.6 5.9 7.1 WCLK to RD (WA=RA) tWCRD a a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and TA = 25° C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range. Table 3: RAM Cell Synchronous Read Timing Symbol Propagation Delays (ns) Fanout Parameter Logic Cells 1 2 3 4 5 tSRA RA Setup Time to RCLK 1.0 1.0 1.0 1.0 1.0 tHRA RA Hold Time to RCLK 0.0 0.0 0.0 0.0 0.0 tSRE RE Setup Time to RCLK 1.0 1.0 1.0 1.0 1.0 tHRE RE Hold Time to RCLK 0.0 0.0 0.0 0.0 0.0 tRCRD RCLK to RDa 4.0 4.3 4.6 4.9 6.1 a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and TA = 25° C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range. • © 2002 QuickLogic Corporation www.quicklogic.com •• • • • 5 QL4009 QuickRAM Data Sheet Rev B Table 4: RAM Cell Asynchronous Read Timing Symbol RPDRD Propagation Delays (ns) Fanout Parameter RA to RDa 1 2 3 4 5 3.0 3.3 3.6 3.9 5.1 a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and TA = 25° C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range. Table 5: Input-Only / Clock Cells Symbol Propagation Delays (ns) Fanout Parameter 1 2 3 4 8 12 24 tIN High Drive Input Delay 1.5 1.6 1.8 1.9 2.4 2.9 4.4 tINI High Drive Input, Inverting Delay 1.6 1.7 .19 2.0 2.5 3.0 4.5 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 tICLK Input Register Clock To Q 0.7 0.8 1.0 1.1 1.6 2.1 3.6 tIRST Input Register Reset Delay 0.6 0.7 0.9 1.0 1.5 2.0 3.5 tIESU Input Register Clock Enable Setup Time 2.3 2.3 2.3 2.3 2.3 2.3 2.3 tIEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 0.0 Table 6: Clock Cells Symbol Propagation Delays (ns) Fanouta Parameter 1 2 3 4 8 10 11 tACK Array Clock Delay 1.2 1.2 1.3 1.3 1.5 1.6 1.7 tGCKP Global Clock Pin Delay 0.7 0.7 0.7 0.7 0.7 0.7 0.7 tGCKB Global Clock Buffer Delay 0.8 0.8 0.9 0.9 1.1 1.2 1.3 a. The array distributed networks consist of 40 half columns and the global distributed networks consist of 44 half columns, each driven by an independent buffer. The number of half columns used does not affect clock buffer delay. The array clock has up to 8 loads per half column. The global clock has up to 11 loads per half column. 6 • • • www.quicklogic.com • • • © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B Table 7: I/O Cell Input Delays Symbol Propagation Delays (ns) Fanouta Parameter 1 2 3 4 8 10 tI/O Input Delay (bidirectional pad) 1.3 1.6 1.8 2.1 3.1 3.6 tISU Input Register Set-Up Time 3.1 3.1 3.1 3.1 3.1 3.1 tIH Input Register Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 tIOCLK Input Register Clock to Q 0.7 1.0 1.2 1.5 2.5 3.0 tIORST Input Register Reset Delay 0.6 0.9 1.1 1.4 2.4 2.9 tIESU Input Register Clock Enable Set-Up Time 2.3 2.3 2.3 2.3 2.3 2.3 tIEH Input Register Clock Enable Hold Time 0.0 0.0 0.0 0.0 0.0 0.0 a. Stated timing for worst case Propagation Delay over process variation at VCC = 3.3 V and TA = 25° C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified in the Operating Range. Table 8: I/O Cell Output Delays Symbol Propagation Delays (ns) Output Load Capacitance (pF) Parameter 3 50 75 100 150 tOUTLH Output Delay Low to High 2.1 2.5 3.1 3.6 4.7 tOUTHL Output Delay High to Low 2.2 2.6 3.2 3.7 4.8 tPZH Output Delay Tri-state to High 1.2 1.7 2.2 2.8 3.9 tPZL Output Delay Tri-state to Low 1.6 2.0 2.6 3.1 4.2 tPHZ Output Delay High to Tri-state a 2.0 - - - - tPLZ Output Delay High to Tri-statea 1.2 - - - - a. The following loads are used for tPXZ tPHZ 1ΚΩ 5 pF 1ΚΩ tPLZ 5 pF • © 2002 QuickLogic Corporation www.quicklogic.com •• • • • 7 QL4009 QuickRAM Data Sheet Rev B DC Characteristics The DC specifications are provided in the tables below. Table 9: Absolute Maximum Ratings Parameter Value Parameter Value VCC Voltage -0.5 to 4.6 V DC Input Current ±20 mA VCCIO Voltage -0.5 to 7.0 V ESD Pad Protection ±2000V Input Voltage -0.5 V to VCCIO +0.5 V Storage Temperature -65° C to +150° C Latch-up Immunity ±200 mA Lead Temperature 300° C Table 10: Operating Range Symbol Military Industrial Commercial Unit Min Max Min Max Min Max Supply Voltage 3.0 3.6 3.0 3.6 3.0 3.6 V I/O Input Tolerance Voltage 3.0 5.5 3.0 5.5 3.0 5.25 V TA Ambient Temperature -55 - -40 85 0 70 °C TC Case Temperature - 125 - - - - °C -0 Speed Grade 0.42 2.03 0.43 1.90 0.46 1.85 n/a -1 Speed Grade 0.42 1.64 0.43 1.54 0.46 1.50 n/a -2 Speed Grade 0.42 1.37 0.43 1.28 0.46 1.25 n/a -3 Speed Grade 0.43 0.90 0.46 0.88 n/a -4 Speed Grade 0.43 0.82 0.46 0.80 n/a VCC VCCIO K 8 Parameter • • • www.quicklogic.com • • • Delay Factor © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B Table 11: DC Characteristics Symbol Parameter Conditions Min Max Units VIH Input HIGH Voltage 0.5VCC VCCIO+0.5 V VIL Input LOW Voltage -0.5 0.3VCC V VOH Output HIGH Voltage VOL Output LOW Voltage IOH = -12 mA 2.4 V IOH = -500 µA 0.9VCC V IOL = 16 mAa 0.45 V IOL = 1.5 mA 0.1VCC V II I or I/O Input Leakage Current VI = VCCIO or GND -10 10 µA IOZ 3-State Output Leakage Current VI = VCCIO or GND -10 10 µA CI Input Capacitanceb 10 pF IOS Output Short Circuit Currentc ICC ICCIO d D.C. Supply Current D.C. Supply Current on VCCIO VO = GND -15 -180 mA VO = VCC 40 210 mA VI, VIO = VCCIO or GND 0.50 (typ) 2 mA 0 100 µA a. Applies only to -1/-2/-3/-4 commercial grade devices. These speed grades are also PCI-compliant. All other devices have 8 mA IOL specifications. b. Capacitance is sample tested only. Clock pins are 12 pF maximum. c. Only one output at a time. Duration should not exceed 30 seconds. d. For -1/-2/-3/-4 commercial grade devices only. Maximum ICC is 3 mA for -0 commercial grade and all industrial grade devices. and 5 mA for all military grade devices. For AC conditions, contact QuickLogic customer applications group. • © 2002 QuickLogic Corporation www.quicklogic.com •• • • • 9 QL4009 QuickRAM Data Sheet Rev B Kv and Kt Graphs Voltage Factor vs. Supply Voltage 1.1000 1.0800 1.0600 Kv 1.0400 1.0200 1.0000 0.9800 0.9600 0.9400 0.9200 3 3.1 3.2 3.3 3.4 3.5 3.6 Supply Voltage (V) Figure 5: Voltage Factor vs. Supply Voltage Temperature Factor vs. Operating Temperature 1.15 1.10 1.05 Kt 1.00 0.95 0.90 0.85 -60 -40 -20 0 20 40 60 80 Junction Temperature C Figure 6: Temperature Factor vs. Operating Temperature 10 • • • www.quicklogic.com • • • © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B Power-up Sequencing Voltage VCCIO VCC (VCCIO -VCC)MAX VCC 400 us Time Figure 7: Power-up Requirements The following requirements must be met when powering up the device: (Refer to Figure 7 above) • When ramping up the power supplies keep (VCCIO -VCC)MAX ≤ 500 mV. Deviation from this recommendation can cause permanent damage to the device. • VCCIO must lead VCC when ramping the device. • The power supply must take greater than or equal to 400 µs to reach VCC. Ramping to VCC/VCCIO earlier than 400 µs can cause the device to behave improperly. An internal diode is present in-between VCC and VCCIO, as shown in Figure 8. V CC Internal Logic Cells, RAM blocks, etc V CCIO IO Cells Figure 8: Internal Diode Between VCC and VCCIO • © 2002 QuickLogic Corporation www.quicklogic.com •• 11 • • • QL4009 QuickRAM Data Sheet Rev B JTAG TCK TMS TRSTB TAp Controller State Machine (16 States) Instruction Decode & Control Logic Instruction Register RDI Mux Mux TDO Boundary-Scan Register (Data Register) Bypass Register Internal Register I/O Registers User Defined Data Register Figure 9: JTAG Block Diagram Microprocessors and Application Specific Integrated Circuits (ASICs) pose many design challenges, not the least of which concerns the accessibility of test points. The Joint Test Access Group (JTAG) formed in response to this challenge, resulting in IEEE standard 1149.1, the Standard Test Access Port and Boundary Scan Architecture. The JTAG boundary scan test methodology allows complete observation and control of the boundary pins of a JTAG-compatible device through JTAG software. A Test Access Port (TAP) controller works in concert with the Instruction Register (IR); these allow users to run three required tests, along with several user-defined tests. JTAG tests allow users to reduce system debug time, reuse test platforms and tools, and reuse subsystem tests for fuller verification of higher level system elements. 12 • • • www.quicklogic.com • • • © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B The 1149.1 standard requires the following three tests: • Extest Instruction. The Extest instruction performs a PCB interconnect test. This test places a device into an external boundary test mode, selecting the boundary scan register to be connected between the TAP's Test Data In (TDI) and Test Data Out (TDO) pins. Boundary scan cells are preloaded with test patterns (via the Sample/Preload Instruction), and input boundary cells capture the input data for analysis. • Sample/Preload Instruction. This instruction allows a device to remain in its functional mode, while selecting the boundary scan register to be connected between the TDI and TDO pins. For this test, the boundary scan register can be accessed via a data scan operation, allowing users to sample the functional data entering and leaving the device. • Bypass Instruction. The Bypass instruction allows data to skip a device's boundary scan entirely, so the data passes through the bypass register. The Bypass instruction allows users to test a device without passing through other devices. The bypass register is connected between the TDI and TDO pins, allowing serial data to be transferred through a device without affecting the operation of the device. • © 2002 QuickLogic Corporation www.quicklogic.com •• 13 • • • QL4009 QuickRAM Data Sheet Rev B Pin Descriptions Table 12: Pin Descriptions Pin Function Description TDI/RSI Hold HIGH during normal operation. Connects to serial Test Data In for JTAG /RAM init. PROM data in for RAM initialization. Connect to VCC if Serial Data In unused. TRSTB/RRO Hold LOW during normal operation. Connects to serial Active low Reset for JTAG /RAM PROM reset for RAM initialization. Connect to GND if init. reset out unused. TMS Test Mode Select for JTAG Hold HIGH during normal operation. Connect to VCC if not used for JTAG. TCK Test Clock for JTAG Hold HIGH or LOW during normal operation. Connect to VCC or ground if not used for JTAG. TDO/RCO STM Connect to serial PROM clock for RAM initialization. Must Test data out for JTAG /RAM init. be left unconnected if not used for JTAG or RAM clock out initialization. Special Test Mode Must be grounded during normal operation. I/ACLK High-drive input and/or array network driver Can be configured as either or both. I/GCLK High-drive input and/or global network driver Can be configured as either or both. I High-drive input Use for input signals with high fanout. I/O Input/Output pin Can be configured as an input and/or output. VCC Power supply pin Connect to 3.3 V supply. VCCIO Input voltage tolerance pin Connect to 5.0 V supply if 5 V input tolerance is required, otherwise connect to 3.3 V supply. GND Ground pin Connect to ground. GND/THERM Ground/Thermal pin Available on 456-PBGA only. Connect to ground plane on PCB if heat sinking desired. Otherwise may be left unconnected. Ordering Information QL 4009 - 1 PF100 C QuickLogic device QuickRAM device part number Speed Grade 0 = Quick 1 = Fast 2 = Faster 3 = Faster *4 = Wow Operating Range C = Commercial I = Industrial M = Military Package Code PL68 = 68-pin PLCC PF84 = 84-pin PLCC PF100 = 100-pin TQFP * Contact QuickLogic regarding availabliity 14 • • • www.quicklogic.com • • • © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B 68 PLCC Pinout Diagram 4 3 2 1 68 67 66 65 64 63 62 61 IO IO IO IO GND IO GCLK/I ACLK/I VCC GCLK/I GCLK/I IO IO IO IO IO IO 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 IO IO IO IO IO IO GCLK/I GCLK/I VCC ACLK/I GCLK/I IO GND IO IO IO IO QuickRAM QL4009-1PL68C TDI IO IO IO IO IO IO IO GND IO IO IO VCCIO IO IO TRSTB TMS 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 6 5 TDO IO IO IO IO VCCIO IO IO GND IO IO IO IO IO IO STM TCK 9 8 7 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 Figure 10: Top View of 68 Pin PLCC 68 PLCC Pinout Table Table 13: 68 PLCC Pinout Table 68 PLCC Function 68 PLCC Function 68 PLCC Function 68 PLCC Function 1 GND 18 35 GND 52 2 I/O 19 VCC GCLK/I 36 I/O 53 VCC GCLK/I 3 I/O 20 GCLK/I 37 I/O 54 GCLK/I 4 21 I/O 38 I/O 55 I/O 5 VCCIO I/O 22 I/O 39 VCCIO 56 I/O 6 I/O 23 I/O 40 I/O 57 I/O 7 I/O 24 I/O 41 I/O 58 I/O 8 I/O 25 I/O 42 TRSTB 58 I/O 9 TDO 26 I/O 43 TMS 60 I/O 10 I/O 27 TDI 44 I/O 61 TCK 11 I/O 28 I/O 45 I/O 62 STM 12 I/O 29 I/O 46 I/O 63 I/O 13 I/O 30 I/O 47 I/O 64 I/O 14 GND 31 I/O 48 GND 65 I/O 15 I/O 32 I/O 49 I/O 66 I/O 16 GCLK/I 33 I/O 50 GCLK/I 67 I/O 17 ACLK/I 34 I/O 51 ACLK/I 68 I/O • © 2002 QuickLogic Corporation www.quicklogic.com •• 15 • • • QL4009 QuickRAM Data Sheet Rev B 84 PLCC Pinout Diagram 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 IO IO IO IO IO IO IO GND IO GCLK/I ACLK/I GCLK/I GCLK/I VCC IO IO IO IO IO IO IO 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 IO IO IO IO IO IO IO VCC GCLK/I GCLK/I ACLK/I GCLK/I IO GND IO IO IO IO IO IO IO QuickRAM QL4009-1PL84C TDI IO IO VCC IO IO IO GND IO IO IO IO IO VCCIO IO IO IO IO IO TRSTB TMS 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 8 7 TDO IO IO IO IO IO IO VCCIO IO IO IO IO IO GND IO IO VCC IO IO STM TCK 11 10 9 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 Figure 11: Top View of 84 Pin PLCC 84 PLCC Pinout Table Table 14: 84 PLCC Pinout Table 16 84 PLCC Function 84 PLCC Function 84 PLCC Function 84 PLCC 1 I/O 22 ACLK/I 43 I/O 64 ACLK/I 2 I/O 23 GCLK/I 44 I/O 65 GCLK/I 3 I/O 24 GCLK/I 45 I/O 66 GCLK/I 4 25 VCCIO 67 26 VCC I/O 46 5 VCCIO I/O 47 I/O 68 VCC I/O 6 I/O 27 I/O 48 I/O 69 I/O 7 I/O 28 I/O 49 I/O 70 I/O 8 I/O 29 I/O 50 I/O 71 I/O 9 I/O 30 I/O 51 I/O 72 I/O 10 I/O 31 I/O 52 TRSTB 73 I/O 11 TDO 32 I/O 53 TMS 74 I/O 12 I/O 33 TDI 54 I/O 75 TCK 13 I/O 34 I/O 55 I/O 76 STM 14 I/O 35 I/O 56 I/O 77 I/O 15 I/O 36 57 I/O 78 I/O 16 I/O 37 VCC I/O 58 I/O 79 17 I/O 38 I/O 59 I/O 80 VCC I/O 18 I/O 39 I/O 60 I/O 81 I/O 19 GND 40 GND 61 GND 82 GND 20 I/O 41 I/O 62 I/O 83 I/O 21 GCLK/I 42 I/O 63 GCLK/I 84 I/O • • • www.quicklogic.com • • • Function © 2002 QuickLogic Corporation QL4009 QuickRAM Data Sheet Rev B 100 TQFP Pinout Diagram Pin 76 Pin 1 QuickRAM QL4009-1PF100C Pin 26 Pin 51 Figure 12: Top View of 100 Pin TQFP 100 TQFP Pinout Table Table 15: 100 TQFP Pinout Table 100TQFP Function 100TQFP Function 100TQFP Function 100TQFP 1 I/O 26 TDI 51 I/O 76 Function TCK 2 I/O 27 I/O 52 I/O 77 STM 3 I/O 28 I/O 53 I/O 78 I/O 4 I/O 29 I/O 54 I/O 79 I/O 5 I/O 30 I/O 55 I/O 80 I/O 6 I/O 31 I/O 56 I/O 81 I/O 7 I/O 32 I/O 57 I/O 82 I/O 8 I/O 33 I/O 58 I/O 83 I/O 9 GND 34 I/O 59 GND 84 I/O 10 I/O 35 GND 60 I/O 85 GND 11 I 36 I/O 61 I 86 I/O 12 ACLK / I 37 I/O 62 ACLK / I 87 I/O 13 VCC 38 GND 63 88 GND 14 I 39 I/O 64 VCC I 89 I/O 15 GCLK / I 40 I/O 65 GCLK / I 90 I/O 16 VCC 41 I/O 66 91 I/O 17 I/O 42 67 92 18 I/O 43 VCCIO I/O VCC I/O 68 I/O 93 VCCIO I/O 19 I/O 44 I/O 69 I/O 94 I/O 20 I/O 45 I/O 70 I/O 95 I/O 21 I/O 46 I/O 71 I/O 96 I/O 22 I/O 47 I/O 72 I/O 97 I/O 23 I/O 48 I/O 73 I/O 98 I/O 24 I/O 49 TRSTB 74 I/O 99 I/O 25 I/O 50 TMS 75 I/O 100 TDO • © 2002 QuickLogic Corporation www.quicklogic.com •• 17 • • • QL4009 QuickRAM Data Sheet Rev B Contact Information Telephone: 408 990 4000 (US) 416 497 8884 (Canada) 44 1932 57 9011 (Europe) 49 89 930 86 170 (Germany) 852 8106 9091 (Asia) 81 45 470 5525 (Japan) E-mail: [email protected] Support: [email protected] Web site: http://www.quicklogic.com/ Revision History Table 16: Revision History Revision Date Comments A 5/2000 First release. B 5/2002 Added Kfactor, Power-up, JTAG and mechanical drawing information. Reformatted. Copyright Information Copyright © 2002 QuickLogic Corporation. All Rights Reserved. The information contained in this product brief, and the accompanying software programs are protected by copyright. All rights are reserved by QuickLogic Corporation. QuickLogic Corporation reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision. Copying, duplicating, selling, or otherwise distributing any part of this product without the prior written consent of an authorized representative of QuickLogic is prohibited. QuickLogic, pASIC, and ViaLink are registered trademarks, and SpDE and QuickWorks are trademarks of QuickLogic Corporation. Verilog is a registered trademark of Cadence Design Systems, Inc. • © 2002 QuickLogic Corporation www.quicklogic.com •• 18 • • •