SMB139 Programmable Linear Battery Charger in 1.3 x 2.1 uCSPTM FEATURES & APPLICATIONS INTRODUCTION • World’s smallest linear charger • Linear charging for reduced board space • • • • o o The SMB139 is a programmable single-cell lithium-ion/lithium-polymer battery charger for a variety of portable applications. The device provides a simple way to charge low-capacity Li-Ion or Li-Polymer batteries via a USB port or an AC port. Unlike conventional devices, the SMB139’s very small package and high level of configurability simplify design in a wide range of handheld equipment. Up to 210mA charge current * Stable with small ceramic capacitors 4.35 to 6.5V input voltage range Small 1.3 x 2.1 uCSPTM package (0.4mm pitch) High-accuracy output voltage regulation: 1% Low reverse leakage current • Digital programming of all major parameters via I2C interface and lockable non-volatile memory o o o o o Battery voltage set point Pre-charge, fast charge, termination current Fast charge voltage threshold Temperature limits Charge safety timers Automatic restart threshold o o Thermal regulation Input/output over-voltage lockout Charge control includes qualification, trickle-charge, pre-charge, constant current/constant voltage, and termination/safety settings that are fully programmable via a serial I2C/SMBus making the device truly a flexible solution. Pre-charge, fast charge and termination current levels can be set via I2C commands. The Enable (EN) pin is used for suspending or re-staring the charging process. The SMB139 offers a wide variety of features that protect the battery pack as well as the charger and input circuitry: over-current, under/over-voltage and thermal protection. Ultra-precise, 1% accurate, float voltage control improves battery capacity utilization. Status can be monitored via the serial port for charge state and fault conditions. In addition, one LED driver output can be used to signal charge status. As a protection mechanism, when the junction temperature approaches approximately 110°C, the SMB139 will start to reduce charge current to ensure device and system reliability, while charging the battery cell as fast as possible. o • Fault/Status indicator • Wide range of protection features Applications • • • • • • Bluetooth & Stereo Headsets Noise Cancellation Headphones MP3 Players Wrist PDA/Watches Toys Handheld Equipment TM The SMB139 is available in a space-saving 1.3mm x 2.1mm uCSP package with lead-free balls and is rated over the –30°C to +85°C temperature range. SIMPLIFIED APPLICATIONS DRAWING 4.35V to 6.5V 10V Tolerance IN SMB139 2.2µF TRICKLE VDDCAP 1µF SENSE Optional OUT I2C Communication (Optional) SDA Up to 210mA Charge Current 2.2µF SCL EN THERM CHGSET STAT Battery OVLO BATT GND 1-cell Li+ Battery RLIM RED LED Figure 1 – Applications block diagram featuring the SMB139 programmable linear battery charger. * Contact factory for higher current version © SUMMIT Microelectronics, Inc. 2005 • 757 N. Mary Avenue • Sunnyvale CA 94085 • Phone 408 523-1000 • FAX 408 523-1266 http://www.summitmicro.com/ 2121 3.0 6/19/2008 1 SMB139 Preliminary Information GENERAL DESCRIPTION The SMB139 is a fully programmable, linear battery charger for single-cell Li-Ion and Li-Polymer battery packs. The device’s simple, linear-mode operation and ultra-small package significantly reduce component count and required board space. The SMB139 provides four main charging phases: trickle-charge, preconditioning (pre-charge), constant current and constant voltage. The overall system accuracy of the SMB139 is 1%, allowing for a higher capacity utilization versus other conventional solutions. When a battery or an external supply is inserted and the ENABLE input is asserted, the SMB139 performs the pre-qualification checks before initiating a charging cycle. The input voltage needs to be higher than the UVLO threshold and the cell temperature needs to be within the temperature limits for the charging cycle to start. As soon as the input supply is removed, the SMB139 enters a shutdown mode, thereby saving battery power. A programmable option also exists that allows the user to prevent battery charging until an I2C command has been issued. If the battery voltage is below 2.0V (trickle-charge to precharge threshold), the device will apply a trickle-charge current of 3mA (typical). This allows the SMB139 to reset the protection circuit in the battery pack and bring the battery voltage to a higher level without compromising safety. Once the battery voltage crosses the 2.0V threshold, the SMB139 enters the pre-charge mode. This mode replenishes deeply depleted cells and minimizes heat dissipation during the initial charge cycle. The preconditioning current is programmable, with the default value at C/10. If the battery voltage does not reach the preconditioning voltage level (programmable) within a specified amount of time (pre-charge timeout), the safety timer expires and the charge cycle is terminated. When the battery voltage reaches the pre-charge to fastcharge voltage level, the SMB139 enters the constant current (fast charge) mode. The fast charge current level is programmable via the corresponding register. Summit Microelectronics, Inc Once the final float voltage (programmable) has been reached, the battery charger will enter a constant voltage mode in which the battery voltage is kept constant, allowing the charge current to gradually taper off. The constant-voltage charging mode will continue until the charge current drops below the termination current threshold, or until the fast charge timer has expires. The termination current threshold is programmable. After the charge cycle has terminated, the SMB139 continues to monitor the battery voltage. If the battery voltage falls below the recharge threshold (typically 125mV below float voltage), the SMB139 can automatically top-off the battery. A wide range of protection features is also included in the SMB139. These include input and output (battery) over-voltage protection, battery missing detector and thermal monitor for continuous cell temperature monitoring and pre-qualification. The following charging parameters can be adjusted dynamically via the I2C interface, for optimizing battery management real-time. These parameters can also be programmed statically via a user-friendly GUI interface: • • • • • • • Battery (float) voltage Fast charge current Pre-conditioning voltage threshold Pre-conditioning charge current Termination current Safety charge timers Temperature window. 2121 3.0 6/19/2008 2 SMB139 INTERNAL BLOCK DIAGRAM EEPROM SDA Registers Inte rface SCL CHGSET Inte rnal VDD Regulator VDDCAP Charge Control EN IN TRICKLE SENSE BATT WELL Control Control Prog. Float Voltage Inte rnal Temperature Limit OUT VDDCAP Prog. Cold Limit Programmable Curre nt THERM Prog. Hot Limit Figure 2 – Internal block diagram of the SMB139 programmable linear battery charger. Summit Microelectronics, Inc 2121 3.0 6/19/2008 3 SMB139 PIN DESCRIPTIONS Pin/Ball Number A1 Pin Name Pin Type BATT Input B1 C1 D1 E1 A2 B2 TRICKLE SENSE NC STAT THERM VDDCAP Input Input NC Output Input Power C2 D2 E2 AGND GND IN Ground Ground Input A3 EN Input B3 CHGSET Input C3 D3 E3 SDA SCL OUT Input/Output Input Output Pin Description Battery Voltage Sense – Connect directly to positive terminal of battery and bypass with a 2.2uF or greater capacitor. Trickle Charge – Connect directly to positive terminal of battery. Charge Current Sense – Connect directly to positive terminal of battery. No Connect (may be connected to GND for easier routing of Ball D2). Status Indicator. Battery Thermistor Sense. VDD Bypass – Connect to VDD bypass capacitor with 1uF or greater capacitor. Analog Ground – Connect to isolated PCB ground. Ground – Connect to isolated PCB ground. Voltage Input (+4.35V to +6.5V) – Bypass with a 2.2uF or greater capacitor. Enable Input – Apply a logic-high voltage to enable and/or resume charging. After assertion of the EN signal, the safety timers start counting from the beginning. When unused, this pin should be tied to GND (do not leave floating). Two-level charge current adjustment. Connect to VDDCAP for full charge current. Connect to GND for 40mA. When unused, this pin should be tied to VDDCAP (do not leave floating). I2C Bus Data. I2C Bus Clock. Charge Current Output. PACKAGE AND PIN CONFIGURATION A1 A2 A3 SMB139 B1 B2 B3 lead-free C1 C2 C3 uCSPTM-15 D1 D2 D3 1.3mm x 2.1mm E1 E2 E3 Bottom View (Balls facing up) Summit Microelectronics, Inc 2121 3.0 6/19/2008 4 SMB139 ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS Temperature Under Bias ....................... -55°C to 155°C Storage Temperature............................. -55°C to 125°C Terminal Voltage with Respect to GND: VIN ................................................... -0.3V to +10V All Others ..............................................-0.3V to 6V Output Short Circuit Current ............................... 100mA Lead Solder Temperature (10 s)...........................300°C Junction Temperature.......................…….....…...150°C ESD Rating per JEDEC…………………....……..2000V Latch-Up testing per JEDEC………..…....……±100mA Note: The device is not guaranteed to function outside its operating rating. Stresses listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions outside those listed in the operational sections of the specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Devices are ESD sensitive. Handling precautions are recommended. Temperature Range …………….…… …-30°C to +85°C VIN ..........................................................+4.35V to +6.5V Package Thermal Resistance (θJA) uCSPTM-15…………………………..………..…....55°C/W Note: measured on a 1.5” x 1.1”, 4-layer PCB with a copper weight of 1oz and a single via attaching the two ground balls to the internal ground plane. RELIABILITY CHARACTERISTICS Data Retention…………………………..…..100 Years Endurance…………………….……….100,000 Cycles DC OPERATING CHARACTERISTICS TA= 0°C to +70°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Conditions Min VFLT = 4.2V VFLT = 4.2V +4.35 VASHDN Input supply voltage Under-voltage lockout voltage Under-voltage lockout hysteresis Input over-voltage lockout voltage Battery over-voltage lockout voltage Automatic shutdown threshold voltage IDD-ACTIVE Active supply current Typ Max Unit +6.5 +3.5 V V 10 mV +7.0 V VFLT+0.1 V 130 mV 700 µA General VIN VUVLO VUVLO-HYS VOVLO VVOB ILK Reverse leakage current TREG Thermal regulation temperature Summit Microelectronics, Inc VFLT = 4.2V VIN – VBATT o o VIN < VBATT, T=0 C to +70 C 2 110 2121 3.0 6/19/2008 µA o C 5 SMB139 DC OPERATING CHARACTERISTICS (CONTINUED) TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Conditions Min Typ Max Unit 600 300 mV V mV 1 µA Logic Inputs/Output VIL VIH VOL IBIAS ISINK Input Low Level Input High Level SDA/STAT Output Low Level 1.4 ISINK=3mA Enable/CHGSET Input bias current STAT sink current 5 mA 2.0 V 3 mA Battery Charger IPRECHG Trickle-charge to pre-charge voltage threshold Nominal trickle-charge current Pre-charge to fast-charge voltage threshold Nominal pre-charge current ∆IPRECHG Pre-charge current tolerance ICHG Nominal Fast charge current ∆ICHG VFLT Fast charge current tolerance ∆VFLT Float voltage tolerance VDO ITERM Dropout voltage Charge termination current 20mV steps T=+10oC to +50oC, VFLT = 4.2V ICHG=100mA 16 steps ∆ITERM Termination current tolerance ITERM=10mA, T=0oC to +70oC VRECH Recharge threshold voltage ITHERM Thermistor current VTRICKLECHG ITRICKLECHG VPRECHG Float voltage range ∆ITHERM Thermistor current tolerance THI Charge cutoff temp (high) TLO Charge cutoff temp (low) 100mV steps 16 steps IPRECHG=45mA, T=0oC to +70oC 16 steps ICHG=212mA, T=0oC to +70oC 2.400 3.100 V 23 90 mA 65 mA 212 mA 237 mA 4.020 4.400 V -1 +1 % 89 mV mA 16 mA 25 45 33 185 212 55 10 4 10 125 3 settings 10 o ITHERM=100µA, T=0 C to +70oC Adjustable, conditions per typical application Adjustable, conditions per typical application 90 100 mV 100 µA 110 µA 30 65 o -20 15 o C C Note 1: Voltage and current accuracies are only guaranteed for factory-programmed settings. Changing the output voltage from that reflected in the customer specific CSIR code will result in inaccuracies exceeding those specified above. Note 2: The SMB139 device is not intended to function as a battery pack protector. Battery packs used in conjunction with this device need to provide adequate internal protection and to comply with the corresponding battery pack specifications. Summit Microelectronics, Inc 2121 3.0 6/19/2008 6 SMB139 AC OPERATING CHARACTERISTICS TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter tSTART Start-up time tGLITCH Glitch filter tHOLDOFF Hold-off time tFCTO Fast-charge Timeout Conditions Disabled Enabled Short Long tFCTO = 350min tFCTO = 699min Min Typ Max 20 0 250 0 1 256 Unit ms msec msec msec msec -15 tFCTO +15 % -15 tPCTO +15 % tFCTO = 1398min tPCTO = 44min tPCTO Pre-charge Timeout tPCTO = 87min tPCTO = 175min Summit Microelectronics, Inc 2121 3.0 6/19/2008 7 SMB139 CHARGING ALGORITHM (200mA) SMB139 Programmable Charging Algorithm 0.4 Charge Current (A) 0.35 Fast-charge Vbat<Vfloat Ichg (prog) 0.3 Pre-charge Vbat<Vprechg Iprechg (prog) 0.25 0.2 0.15 0.1 Charge termination Iterm (prog) Trickle charge Vbat<2.00V Itrickle = 3mA Taper-charge Vbat=Vfloat (prog) 0.05 4. 20 4. 20 4. 19 4. 14 4. 01 3. 82 3. 59 3. 32 3. 00 2. 60 2. 15 2. 00 1. 80 1. 60 0 Battery Voltage (V) Figure 3 – Charging Algorithm (200mA)) Summit Microelectronics, Inc 2121 3.0 6/19/2008 8 SMB139 I2C-2 WIRE SERIAL INTERFACE AC OPERATING CHARACTERISTICS – 400 kHz TA= 0°C to +70°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. 400kHz Symbol Description fSCL SCL clock frequency TLOW Clock low period 1.3 µs THIGH Clock high period 0.6 µs tBUF Bus free time between a STOP and a START condition 1.3 µs tSU:STA Start condition setup time 0.6 µs tHD:STA Start condition hold time 0.6 µs tSU:STO Stop condition setup time 0.6 tAA Clock edge to data valid SCL low to valid SDA (cycle n) 0.2 tRDH Data output hold time SCL low (cycle n+1) to SDA change 0.2 tR SCL and SDA rise time Note 3 20 + 0.1Cb 300 ns tF SCL and SDA fall time Note 3 20 + 0.1Cb 300 ns tSU:DAT Data in setup time 100 tHD:DAT Data in hold time 0 TI Noise filter SCL and SDA Noise suppression tWR_CONFIG Write cycle time config Configuration registers 10 ms tWR_EE Write cycle time EE Memory array 5 ms Conditions Min Typ 0 Before new transmission – Note 3 Max Units 400 kHz µs 0.9 µs µs ns 0.9 140 µs ns Note 3: Guaranteed by Design. I2C TIMING DIAGRAMS tR tF tSU:STA tHD:STA tHIGH tWR (For Write Operation Only) tLOW SCL tHD:DAT tSU:DAT tSU:STO tBUF SDA (IN) tAA tDH SDA (OUT) Figure 4 – I2C Timing Diagrams Summit Microelectronics, Inc 2121 3.0 6/19/2008 9 SMB139 APPLICATIONS INFORMATION DEVICE OPERATION The SMB139 is a fully programmable battery charger for single-cell Li-Ion and Li-Polymer battery packs. The device’s simple, linear-mode operation and ultra-small package significantly reduce component count and required board space. The SMB139 provides four main charging phases: trickle-charge, pre-conditioning (precharge), constant (fast-charge) current and constant voltage. The overall system accuracy of the SMB139 is 1%, allowing for a higher capacity utilization versus other conventional solutions. The main battery charging parameters are programmable, allowing for high design flexibility and sophisticated battery management. Furthermore, the SMB139 offers many advanced protection features, allowing applications to meet strict safety standards without the need for additional cost and components. Power Supply The SMB139 can be powered from an input voltage between +4.35 and +6.5 Volts applied between the IN pin and ground. The voltage on the IN pin is monitored by an Under-Voltage (UVLO) circuit, which prevents the charger from turning on when the voltage at this node is less than the UVLO threshold (+3.5V). The IN pin also supplies an internal +2.5V VDD regulator, filtered by an external capacitor attached between the VDDCAP pin and ground; this filtered voltage is then used as an internal VDD supply. When the input supply is removed, the SMB139 enters a low-power shutdown mode, exhibiting a very low discharge leakage current (2µA), thereby extending battery life. Pre-qualification Mode When an external wall adaptor or another type of power source is connected, the SMB139 performs a series of pre-qualification tests before initiating the first charge cycle. The input voltage level needs to be higher than the UVLO threshold, and 130mV greater than the battery voltage; the ENABLE input needs to be asserted or the appropriate I2C command needs to be asserted; and the cell temperature needs to be within the specified temperature limits for the charging cycle to start. The pre-qualification parameters are continuously monitored and charge cycle is suspended when one of them is outside the limits. Trickle-charge Mode Once all pre-qualification conditions are met, the device checks the battery voltage to decide if trickle-charging is required. If the battery voltage is below approximately 2.0V, a charging current of 3mA (typical) is applied on the battery cell. This allows the SMB139 to reset the protection circuit in the battery pack and bring the Summit Microelectronics, Inc battery voltage to a higher level without compromising safety. Pre-charge Mode Once the battery voltage crosses the 2.0V level, the SMB139 pre-charges the battery to safely charge the deeply discharged cells (Figure 3). The pre-charge (pre-conditioning) current is programmable from 23mA to 90mA (Register 00h). The SMB139 remains in this mode until the battery voltage reaches the pre-charge to fast-charge voltage threshold (programmable from +2.4V to +3.1V in 100mV steps). If the pre-charge to fast-charge voltage threshold is not exceeded before the pre-charge timer expires, the charge cycle is terminated and a corresponding timeout fault signal is asserted (“Pre-charge Timeout” in register 36h). Constant Current Mode When the battery voltage exceeds the pre-charge to fast-charge voltage threshold, the device enters the constant current (fast charge) mode. During this mode, the fast charge current level is set by the corresponding register. The fast charge current is programmable from 33mA to 212mA (Register 00h). Constant Voltage Mode When the battery voltage reaches the pre-defined float voltage, the fast-charge current starts diminishing. The float voltage is programmable from +4.020V to +4.40V in 20mV steps and is ±1% accurate over the +10°C to +50°C temperature range. The higher float voltage settings of the SMB139 enable the charging of modern battery packs with a required float voltage of 4.3V, and 4.4V. Furthermore, the ability to dynamically adjust the float voltage allows the implementation of sophisticated battery charging and control algorithms. Charge Completion The charge cycle is considered complete when the charge current reaches the programmed termination current threshold. The termination current is programmable from 10mA to 89mA (Register 01h). If the termination current threshold is not met before the fast-charge timer expires, the charge cycle is terminated and a corresponding timeout fault signal is asserted (“Fast-charge Timeout” in register 36h). 2121 3.0 6/19/2008 10 SMB139 APPLICATIONS INFORMATION (CONTINUED) EN (ENABLE) EN is a logic input pin for enabling/disabling the device and/or restarting a charge cycle. The EN pin can be configured for different polarity (logic high or logic low). When the EN is at the correct state, the charger is enabled for normal operation. When the EN is at the wrong state, the charger is disabled. A programmable option also exists that allows the user to initiate battery charging only when an I2C command has been issued. Automatic Battery Recharge The SMB139 allows the battery to be automatically recharged (topped off) when the battery voltage falls by a value of VRECH (125mV typical) below the programmed float voltage. Provided that the input power supply is still present, charging remains enabled (ENABLE input or I2C command) and all the prequalification parameters are still met, a new charging cycle will be initiated. This ensures that the battery capacity remains high, without the need to manually restart a charging cycle. The automatic battery recharging can be disabled if not required by the application (Register 03h). Safety Timers The integrated safety timers provide protection in case of a defective battery pack. The pre-charge timer starts after the pre-qualification check is completed and resets when the transition to the constant current mode happens. At that point, the fast charge timer is initiated. The fast charge timer expires and charge cycle is terminated if the termination current level is not reached within the pre-determined duration. Each safety timer has three programmable timeout periods, which eliminates the need for external timing capacitors and allows for maximum design flexibility. In addition, each timer can be disabled by the appropriate bit selection in Register 05h. Thermal Monitor A temperature sensing I/O (THERM) is provided to prevent excessive battery temperatures during charging. The battery temperature is measured by sensing the voltage between the THERM pin and ground. The voltage is created by injecting a current into the parallel combination of Negative Temperature Coefficient (NTC) thermistor and a resistor. This voltage is then compared to two predetermined voltages representing the maximum and minimum temperature settings of the battery. The purpose of the resistor in parallel to the NTC thermistor is to linearize the resistance of the thermistor. Table 1, shows the 1% resistor that should be placed in parallel with the corresponding thermistor. Summit Microelectronics, Inc If the temperature limits are exceeded, battery charging will be suspended until the temperature level has fallen within the safe operating range. The over-temperature limit is programmable from 30°C to 65°C, and the under-temperature limit is programmable from −20°C to 15°C, each in 5°C increments using Register 04h. In addition, the user can easily select the required bias current, based on the value of the negative temperature coefficient (NTC) thermistor located in the battery pack: 10k, 25k, 100k (Register 04h). Disabling the thermal monitor is also possible by selecting the appropriate bits in Register 04h. As the temperature changes, the resistance of the thermistor changes creating a voltage proportional to temperature. The temperature coefficient or Beta (Β) of the thermistor must be as close to 4400 as possible to achieve the maximum temperature accuracy. NTC THERMISTOR RESISTANCE 10K 24.9K 25K 61.9K 100K 249K Table 1: NTC values and associated parallel resistances. STAT Output The STAT is an open-drain output that indicates battery charge status. STAT has two modes of operation, as determined by Register 05h[7]: in Mode 0, STAT is asserted low whenever the battery is charging and deasserted at all other times; in Mode 1, STAT is deasserted when the charger is disabled, blinks during charging, and remains continuously asserted when the charge cycle has completed. A pull-up resistor should be applied on this pin for interfacing to a microcontroller or other logic IC. Programmable Battery Charging A unique feature of the SMB139 is the ability to modify all of the important charger parameters via internally programmable EEPROM, found in Registers 00-07. Once the device has been configured correctly, the EEPROM may be locked, preventing any further changes. Additionally, these registers may also be configured so that they may be updated in RAM (volatile), even if the underlying EEPROM is locked. This feature is useful if it is desired to actively manage the charging profile without making changes to the nonvolatile defaults. Use Register 0E to control locking and volatile access. Before writing to Registers 00-07 2121 3.0 6/19/2008 11 SMB139 APPLICATIONS INFORMATION (CONTINUED) in a volatile manner, Register 31[7] must first be set high. FAULT and STATUS Indicators A large number of battery charging conditions and parameters are monitored and corresponding fault and status indications are available to the user via the I2C compatible registers. These include the following: • Charging status • Safety timer timeout • Over-temperature alarm • Under-temperature alarm • Over-voltage alarm • Under-voltage alarm • Missing battery detection Internal Thermal Protection When the die temperature of the SMB139 reaches approximately 110°C, charge current will be reduced to prevent further die heating. This internal thermal protection circuit helps to improve device (and consequently, system) reliability. Summit Microelectronics, Inc 2121 3.0 6/19/2008 12 SMB139 APPLICATIONS INFORMATION (CONTINUED) EXTERNAL COMPONENTS Input and Output Capacitors The SMB139 allows for the use of low-cost ceramic capacitors on both the input and the output. The minimum input capacitance value is 2.2µF. The minimum output capacitance of 2.2µF is desired in parallel with the battery installed on the BATT pin. A 1µF ceramic capacitor is recommended on the VDDCAP pin to bypass the internal band-gap voltage. Taking account of the temperature and DC bias degrading characteristics of ceramic capacitors, one is encouraged to select X5R or X7R rated ceramic capacitors. BOARD LAYOUT RECOMMENDATIONS The most critical components for the reliable operations of the SMB139 are the output capacitor, the input capacitor, and the bypass capacitor for VDDCAP. Place those as close as possible to the SMB139. Pour sufficient copper along the power delivery path, namely, from the power source to the IN pin and from the OUT pin to the battery. This minimizes the distribution loss, therefore buys an additional margin for the IN-to-OUT drop-out voltage. Route the TRICKLE pin, the SENSE pin, and the BATT pin to the positive terminal of the battery by traces wider than 10mils. To increase ease of layout and future manufacturing, GND from C2 and D2 can be routed through NC, D1 and a GND via placed just outside the balls, connecting the GND balls to the GND plane. A via under the CSP part can cause solder to wick up and push up on the CSP, preventing a good solder connection to the board. Additionally VDDCAP (B2) may be run through B3 CHGSET to prevent the need for pad shaving, if minimum trace widths will not fit between a 0.4mm pitch. POWER DISSIPATION The SMB139 incorporates a thermal regulation circuit that reduces charge current when die temperature rises to high levels (greater than 110oC). The conditions under which this charge current reduction finds place can be determined by calculating device power dissipation. Most of the SMB139 power dissipation is generated in the internal power MOSFET. The worstcase scenario occurs when the input voltage is at its highest level and the device has transitioned from the pre-charge to the fast-charge phase. In this case, both the input-to-output differential and the charge current level are large, resulting in high thermal dissipation. Summit Microelectronics, Inc Actual power dissipation can be calculated by using the following formula: PDACTUAL = (VIN – VBATT) x IOUT Where: VIN = input (adapter or USB port) voltage VBATT = battery voltage IOUT = charge current Assuming the SMB139 operates from a 5V±10% (worst case: 5.5V) supply and is configured to deliver a charge current of 120mA to a discharged Li-Ion battery with a voltage of 3.6V, the power dissipation can be calculated as follows: PDACTUAL = (5.5V – 3.6V) x 0.12A = 228mW The maximum allowable power dissipation for a specific package and board layout can be calculate by using the following formula: PDMAXIMUM = (TJ – TA) / ThetaJA Where: TJ = maximum allowable junction (silicon) temperature TA = maximum ambient temperature ThetaJA = package thermal resistance (depends highly on board layout) Combining the two formulas (actual and maximum allowable power dissipation) allows the user to calculate the ambient temperature at which the SMB139 will start reducing charge current for safe operation. By using our example above and an estimated ThetaJA of 60oC/W, the ambient temperature can be calculated as follows: TA = TJ – (PDMAXIMUM x ThetaJA) = TJ – (VIN – VBATT) x IOUT x ThetaJA = 110 oC – (5.5V – 3.6V) x 0.12A x 60oC/W = 96.32 oC 2121 3.0 6/19/2008 13 SMB139 APPLICATIONS INFORMATION (CONTINUED) POR Set I(charge-max) Standby Mode (Pause Charge) NO YES Vin > Vbat+130mV ? (Always Monitored) YES Vbat>2.0V? T(hi)>T>T(lo)? (Always Monitored) NO 3mA trickle charge (timers off) NO YES Vbat <Vprechg? Regulate Current to I(precharge) (<Icharge-max) Precharge Mode Reset t(precharge) YES NO NO Fast Charge Mode Reset t(charge) Vbat <Vprechg? NO YES t(precharge) expired? NO NO Vbat < Vfloat? Regulate Voltage to Vfloat YES YES YES Regulate Current to I(charge) <(Icharge-max) YES I(charge) < I(terrm)? Battery Fault NO NO t(charge) expired? YES Terminate Charge Standby Mode t(charge) expired? NO Vbat <Vprechg? NO Terminate Charge Standby Mode YES Vbat < Vfloat115mV? YES Summit Microelectronics, Inc 2121 3.0 6/19/2008 14 SMB139 APPLICATIONS INFORMATION (CONTINUED) Figure 6 – Typical applications schematic. Table 2: Recommended Bill of Material. Item Description Vendor / Part Number Qty Ref. Des. Vishay# CRCW04021K00FKED 1 R1 Murata# GRM188R61C225KE15D Murata# GRM155R60J105KE19D 2 1 C1, C3 C2 Summit Microelectronics Lite-On# LTST-C190CKT 1 1 U1 D1 Resistors 1 Resistor, 1k, 0402, 1% Capacitors 2 3 Ceramic, 2.2uF, X5R, 16V, 0603 Ceramic, 1.0uF, X5R, 6.3V, 0402 Semiconductors 4 5 SMB139E (CSP), Linear Charger LED, Red, SMD, 0805 Summit Microelectronics, Inc 2121 3.0 6/19/2008 15 SMB139 DEVELOPMENT HARDWARE & SOFTWARE The SMX3202 system consists of a USB programming Dongle, cable and WindowsTM GUI software. It can be ordered on the website or from a local representative. The latest revisions of all software and an application brief describing the SMX3202 is available from the website (www.summitmicro.com). The Windows GUI software will generate the data and send it in I2C serial bus format so that it can be directly downloaded to the SMB139 via the programming Dongle and cable. An example of the connection interface is shown in Figure 9. When design prototyping is complete, the software can generate a HEX data file that should be transmitted to Summit for approval. Summit will then assign a unique customer ID to the HEX code and program production devices before the final electrical test operations. This will ensure proper device operation in the end application. The SMX3202 programming Dongle/cable interfaces directly between a PC’s USB port and the target application. The device is then configured on-screen via an intuitive graphical user interface employing dropdown menus. Top view of straight 0.1" x 0.1" closed-side connector. SMX3202 interface cable connector. Pin 10, CHGSET Pin 8, EN Pin 6, MR# Pin 4, SDA Pin 2, SCL IN SMB139 SDA SCL 10 8 6 4 2 9 7 5 3 1 Pin 9, 5.0V Pin 7, 10V Pin 5, Reserved Pin 3, GND Pin 1, GND 0.1µF GND Summit Microelectronics, Inc 2121 3.0 6/19/2008 16 SMB139 I2C PROGRAMMING INFORMATION SERIAL INTERFACE Access to the configuration registers, command and status registers is carried out over an industry standard 2-wire serial interface (I2C). SDA is a bidirectional data line and SCL is a clock input (Figure4). Data is clocked in on the rising edge of SCL and clocked out on the falling edge of SCL. All data transfers begin with the MSB. During data transfers, SDA must remain stable while SCL is high. Data is transferred in 8-bit packets with an intervening clock period in which an Acknowledge is provided by the device receiving data. The SCL high period (tHIGH) is used for generating Start and Stop conditions that precede and end most transactions on the serial bus. A high-to-low transition of SDA while SCL is high is considered a Start condition while a low-to-high transition of SDA while SCL is high is considered a Stop condition. The interface protocol allows operation of multiple devices and types of devices on a single bus through unique device addressing. The address byte is comprised of a 7-bit device type identifier (slave address). The remaining bit indicates either a read or a write operation. Refer to Table 1 for a description of the address bytes used by the SMB139. The device type identifier for the configuration registers and the command and status registers are accessible with the same slave address. The slave address can be can be programmed to any seven bit number 0000000BIN through 1111111BIN. Table 3. WRITE Writing to a configuration register is illustrated in Figures 10 and 11. A Start condition followed by the slave address byte is provided by the host; the SMB139 responds with an Acknowledge; the host then responds by sending the memory address pointer or configuration register address pointer; the SMB139 responds with an acknowledge; the host then clocks in one byte of data. For configuration register writes, up to 15 additional bytes of data can be clocked in by the host to write to consecutive addresses within the same page. Slave Address ANY After the last byte is clocked in and the host receives an Acknowledge, a Stop condition must be issued to initiate the nonvolatile write operation. READ The address pointer for the non-volatile configuration registers and memory registers as well as the volatile command and status registers must be set before data can be read from the SMB139. This is accomplished by issuing a dummy write command, which is a write command that is not followed by a Stop condition. A dummy write command sets the address from which data is read. After the dummy write command is issued, a Start command followed by the address byte is sent from the host. The host then waits for an Acknowledge and then begins clocking data out of the slave device. The first byte read is data from the address pointer set during the dummy write command. Additional bytes can be clocked out of consecutive addresses with the host providing an Acknowledge after each byte. After the data is read from the desired registers, the read operation is terminated by the host holding SDA high during the Acknowledge clock cycle and then issuing a Stop condition. Refer to Figure 12 for an illustration of the read sequence. CONFIGURATION REGISTERS Writing and reading the configuration registers is shown in Figures 10, 11 and 12. A description of the configuration registers is shown in Table 4 through Table 15. GRAPHICAL USER INTERFACE (GUI) Device configuration utilizing the Windows based SMB139 graphical user interface (GUI) is highly recommended. The software is available from the Summit website (www.summitmicro.com). Using the GUI in conjunction with this datasheet, simplifies the process of device prototyping and the interaction of the various functional blocks. A programming Dongle (SMX3202) is available from Summit to communicate with the SMB139. The Dongle connects directly to the USB port of a PC and programs the device through a cable using the I2C bus protocol. See Figure 9 and the SMX3202 Data Sheet. Register Type Configuration Registers are located in 00 HEX thru 05 HEX , 08 HEX and 0F HEX Table 3 – Address bytes used by the SMB139. Summit Microelectronics, Inc 2121 3.0 6/19/2008 17 SMB139 I2C PROGRAMMING INFORMATION (CONTINUED) M aster S T A R T Configuration Register Address Bus Address S A 3 S A 2 S A 1 S A 0 A 2 A 1 A 0 C 6 C 7 W C 5 C 4 C 3 Data C 2 C 1 C 0 D 7 A C K Slave S T O P D 6 D 5 D 4 D 3 D 2 D 1 D 0 A C K A C K Figure 10 – Configuration Register Byte Write S T A R T M aster Configuration Register Address Bus Address S A 3 S A 2 S A 1 S A 0 A 2 A 1 A 0 C 6 C 7 W C 5 C 4 C 3 Data (1) C 2 C 1 C 0 D 7 A C K Slave D 6 D 7 D 6 D 5 D 4 D 4 D 3 D 2 D 1 D 0 A C K A C K S T O P Data (16) Data (2) M aster D 5 D 3 D 2 D 1 D 0 D 7 D 6 D 5 D 2 D 1 D 0 D 7 A C K Slave D 6 D 5 D 4 D 3 D 2 D 1 D 0 A C K A C K Figure 11 – Configuration Register Page Write M aster S T A R T Configuration Register Address Bus Address S A 3 S A 2 S A 1 S A 0 A 2 A 1 A 0 S T A R T C 7 W C 6 C 5 C 4 C 3 C 2 C 1 M aster D 7 D 6 D 5 D 4 D 3 D 2 D 1 D 0 S A 1 S A 0 A 2 A 1 A 0 R A C K A C K D 7 S A 2 A C K A C K Data (1) S A 3 C 0 A C K Slave Bus Address D 6 D 5 D 2 D 1 D 0 N A C K Data (n) D 7 D 6 D 5 D 4 D 3 D 2 D 1 S T O P D 0 Slave Figure 12 – Configuration Register Read Summit Microelectronics, Inc 2121 3.0 6/19/2008 18 SMB139 CONFIGURATION REGISTERS The following tables describe the user-programmable registers of the SMB139 programmable battery charger. Locations 00-0F are non-volatile, EEPROM registers; however, registers 00-07, which contain the battery charging parameters, may also be configured to be programmable in RAM. Locations 31-3F contain volatile status and command registers. To lock all of the configuration registers, set 0E[2]=1; please note that this operation cannot be undone. To allow volatile access to locations 00-07, set 0E[0]=1; then after every power-on, 31[7] must also be set high. It is prohibited to write to any location, not specifically mentioned in the tables below4. Table 4 – Charge current – 8-bit (address: 00h) – Non-Volatile & Volatile (mirror) Bit7 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Bit7 X X X X X X X X X X X X X X X X Bit6 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Bit6 X X X X X X X X X X X X X X X X Bit5 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Bit5 X X X X X X X X X X X X X X X X Bit4 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Bit4 X X X X X X X X X X X X X X X X Bit3 X X X X X X X X X X X X X X X X Bit3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Bit2 X X X X X X X X X X X X X X X X Bit2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Bit1 X X X X X X X X X X X X X X X X Bit1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Bit0 X X X X X X X X X X X X X X X X Bit0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Fast Charge Current 33mA 37mA 38mA 39mA 80mA 92mA 104mA 116mA 128mA 140mA 152mA 164mA 176mA 188mA 200mA 212mA Pre-charge current 23mA 27mA 32mA 36mA 41mA 45mA 50mA 54mA 59mA 63mA 68mA 72mA 77mA 81mA 86mA 90mA Note 4: Never Write to Reserved bits. Note 5: Charge current can be limited by internal current limit under certain conditions. Summit Microelectronics, Inc 2121 3.0 6/19/2008 19 SMB139 CONFIGURATION REGISTERS (CONT.) Table 5 – Termination current – 8-bit (address: 01h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Termination Current X X X X 0 0 0 0 10mA X X X X 0 0 0 1 15mA X X X X 0 0 1 0 20mA X X X X 0 0 1 1 25mA X X X X 0 1 0 0 30mA X X X X 0 1 0 1 35mA X X X X 0 1 1 0 40mA X X X X 0 1 1 1 45mA X X X X 1 0 0 0 51mA X X X X 1 0 0 1 56mA X X X X 1 0 1 0 61mA X X X X 1 0 1 1 67mA X X X X 1 1 0 0 73mA X X X X 1 1 0 1 78mA X X X X 1 1 1 0 84mA X X X X 1 1 1 1 89mA Note 4: Never Write to Reserved bits. Summit Microelectronics, Inc 2121 3.0 6/19/2008 20 SMB139 CONFIGURATION REGISTERS (CONT.) Table 6 – Float Voltage – 8-bit (address: 02h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Float Voltage X X X 0 0 0 0 0 3.850V X X X 0 0 0 0 1 4.020V X X X 0 0 0 1 0 4.040V X X X 0 0 0 1 1 4.060V X X X 0 0 1 0 0 4.080V X X X 0 0 1 0 1 4.100V X X X 0 0 1 1 0 4.120V X X X 0 0 1 1 1 4.140V X X X 0 1 0 0 0 4.160V X X X 0 1 0 0 1 4.180V X X X 0 1 0 1 0 4.200V X X X 0 1 0 1 1 4.220V X X X 0 1 1 0 0 4.240V X X X 0 1 1 0 1 4.260V X X X 0 1 1 1 0 4.280V X X X 0 1 1 1 1 4.300V X X X 1 0 0 0 0 4.320V X X X 1 0 0 0 1 4.340V X X X 1 0 0 1 0 4.360V X X X 1 0 0 1 1 4.380V X X X 1 0 1 0 0 4.400V Note 4: Never Write to Reserved bits. Summit Microelectronics, Inc 2121 3.0 6/19/2008 21 SMB139 CONFIGURATION REGISTERS (CONT.) Table 7 – Other Charging Parameters – 8-bit (address: 03h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Automatic Recharge 0 X X X X X X X Enabled 1 X X X X X X X Disabled Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Current Termination X 0 X X X X X X Enabled X 1 X X X X X X Disabled Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Pre-charge to Fast-charge Voltage Threshold X X 0 0 0 X X X 2.4V X X 0 0 1 X X X 2.5V X X 0 1 0 X X X 2.6V X X 0 1 1 X X X 2.7V X X 1 0 0 X X X 2.8V X X 1 0 1 X X X 2.9V X X 1 1 0 X X X 3.0V X X 1 1 1 X X X 3.1V Bit7 X X Bit6 X X Bit5 X X Bit4 X X Bit3 X X Bit2 X X Bit1 0 1 Bit0 X X Hold-off Timer <1msec (short) 256msec (long) Table 8 – Cell temperature monitor – 8-bit (address: 04h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Thermistor Current 0 0 X X X X X X 100µA (10k NTC) 0 1 X X X X X X 40µA (25k NTC) 1 0 X X X X X X 10µA (100k NTC) 1 1 X X X X X X 0µA (Disabled) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Low Temperature Alarm Trip Point X X 0 0 0 X X X -20°C X X 0 0 1 X X X -15°C X X 0 1 0 X X X -10°C X X 0 1 1 X X X -5°C X X 1 0 0 X X X 0°C X X 1 0 1 X X X +5°C X X 1 1 0 X X X +10°C X X 1 1 1 X X X +15°C Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 High Temperature Alarm Trip Point X X X X X 0 0 0 +30°C X X X X X 0 0 1 +35°C X X X X X 0 1 0 +40°C X X X X X 0 1 1 +45°C X X X X X 1 0 0 +50°C X X X X X 1 0 1 +55°C X X X X X 1 1 0 +60°C X X X X X 1 1 1 +65°C Note 4: Never Write to Reserved bits. Summit Microelectronics, Inc 2121 3.0 6/19/2008 22 SMB139 CONFIGURATION REGISTERS (CONT.) Table 9 – Battery charging control – 8-bit (address: 05h) – Non-Volatile & Volatile (mirror) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 X X X X X X X 1 X X X X X X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X 0 X X X X X X X 1 X X X X X X Bit7 X X Bit7 X X X X Bit7 X X X X Bit6 X X Bit6 X X X X Bit6 X X X X Bit5 0 1 Bit5 X X X X Bit5 X X X X Bit4 X X Bit4 X X X X Bit4 X X X X Bit3 X X Bit3 0 0 1 1 Bit3 X X X X Bit2 X X Bit2 0 1 0 1 Bit2 X X X X Bit1 X X Bit1 X X X X Bit1 0 0 1 1 Bit0 X X Bit0 X X X X Bit0 0 1 0 1 Status Output STAT is active low while charging, active high all other times STAT blinks while charging, is active low when finished, active high when disabled Charging Initiation 2 Requires I C command – EN pin has no effect 2 Controlled by EN pin – I C command has no effect Glitch Filter Glitch filter enabled Glitch filter disabled Fast-charge Timeout 350 min 699 min 1398 min Disabled Pre-charge Timeout 44 min 87 min 175 min Disabled Bit0 X X Bit0 X X Bit0 0 1 STAT Output Indicator Battery charge status Input over-voltage or input under-voltage Battery over-voltage Behavior Charger is shutdown Charger is not shutdown CHGSET Control CHGSET input pin CHGSET register (address 31h) Table 10 – STAT Output – 8-bit (address: 07h) – Non-Volatile Bit7 X X Bit7 X X Bit7 X X Bit6 X X Bit6 X X Bit6 X X Bit5 X X Bit5 X X Bit5 X X Bit4 X X Bit4 X X Bit4 X X Bit3 X X Bit3 X X Bit3 X X Bit2 0 1 Bit2 X X Bit2 X X Bit1 X X Bit1 0 1 Bit1 X X Table 11 – Configuration and User Memory Lock – 8-bit (address: 0Eh) – Non-Volatile Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X 0 X X X X X X X 1 X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X X 0 X X X X X X X 1 X Bit7 X Bit6 X Bit5 X Bit4 X Bit3 X Bit2 X Bit1 X Bit0 0 X X X X X X X 1 Summit Microelectronics, Inc 2121 3.0 6/19/2008 Configuration Lock Unlocked – user can write to non-volatile Configuration bits Locked – user cannot write to non-volatile Configuration bits User-Memory Lock Unlocked – user can write to general purpose EE bits (h20-h2F) Locked – user cannot write to general purpose EE bits (h20-h2F) Volatile Writes Permission No volatile writes to registers h00-h07 Allow volatile writes to registers h00-h07 (even if h0E[2]=1) 23 SMB139 CONFIGURATION REGISTERS (CONT.) Table 12 – EN Polarity & I2C Bus/Slave Address – 8-bit (address: 0Fh) – Non-Volatile Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 0 X X X X X X X EN (Enable) Polarity Active Low 1 X X X X X X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Active High 2 I C Bus Address X 0 0 0 X X X X 000 X 0 0 1 X X X X 001 X 0 1 0 X X X X 010 X 0 1 1 X X X X 011 X 1 0 0 X X X X 100 X 1 0 1 X X X X 101 X 1 1 0 X X X X 110 X 1 1 1 X X X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 111 2 I C Slave Address X X X X 0 0 0 0 0000 X X X X 0 0 0 1 0001 X X X X 0 0 1 0 0010 X X X X 0 0 1 1 0011 X X X X 0 1 0 0 0100 X X X X 0 1 0 1 0101 X X X X 0 1 1 0 0110 X X X X 0 1 1 1 0111 X X X X 1 0 0 0 1000 X X X X 1 0 0 1 1001 X X X X 1 0 1 0 1010 X X X X 1 0 1 1 1011 X X X X 1 1 0 0 1100 X X X X 1 1 0 1 1101 X X X X 1 1 1 0 1110 X X X X 1 1 1 1 1111 Table 13 – Volatile Configuration & Charger Enable – 8-bit (address: 31h) – Non-Volatile Bit7 0 Bit6 X Bit5 X Bit4 X Bit3 X Bit2 X Bit1 X Bit0 X 1 X X X X X X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X X X X X 0 1 X X X X X X X X Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 X X 0 1 X X X X X X X X X X X X Note 4: Never Write to Reserved bits. Summit Microelectronics, Inc 2121 3.0 6/19/2008 Volatile Configuration Volatile writes to h00-h07 are disabled Volatile writes to h00-h07 are enabled (if CFG h0E[0]=1) Charger Enable (if CFG 05[6]=0; else this bit has no effect) Charging Disabled Charging Enabled CHGSET Select (This bit only has an effect when 07[0]=1) 40mA 210mA 24 SMB139 CONFIGURATION STATUS REGISTERS Table 14 – Battery status register – 8-bit (address: 36h) – Volatile (read only) Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 1 X X X X X X X X 1 X X X X X X Bit7 X X X Bit7 X Bit7 X X X X Bit7 X Bit6 X X X Bit6 X Bit6 X X X X Bit6 X Bit5 0 0 1 Bit5 X Bit5 X X X X Bit5 X Bit4 0 1 0 Bit4 X Bit4 X X X X Bit4 X Bit3 X X X Bit3 1 Bit3 X X X X Bit3 X Bit2 X X X Bit2 X Bit2 0 0 1 1 Bit2 X Bit1 X X X Bit1 X Bit1 0 1 0 1 Bit1 X Bit0 X X X Bit0 X Bit0 X X X X Bit0 1 Charging Status Charger has completed at least 1 successful charge since being enabled Charger has completed at least 1 re-charge cycle since being enabled Timeout Status No timeouts have occurred Pre-charge timeout Fast-charge timeout Temperature Fault Charger paused – temperature fault Charging Status Idle Pre-charging Fast-charging Taper charging Charging Status Charger is enabled Table 15 – Battery fault register – 8-bit (address: 37h) – Volatile (read only) Bit7 1 X X X X X X Bit6 X 1 X X X X X Bit5 X X 1 X X X X Bit4 X X X 1 X X X Bit3 X X X X 1 X X Bit2 X X X X X 1 X Bit1 X X X X X X 1 Bit0 X X X X X X X X X X X X X X 1 Fault Output Battery missing Charging error Battery over-voltage condition Charger over-voltage condition Charger under-voltage condition Over-temperature alarm Under-temperature alarm Termination Detect Current Threshold has been hit Note 4: Never Write to Reserved bits. Summit Microelectronics, Inc 2121 3.0 6/19/2008 25 SMB139 PACKAGE DRAWING 15-Ball Ultra CSPTM Summit Microelectronics, Inc 2121 3.0 6/19/2008 26 SMB139 PART MARKING Summit Part Number Note: Marking is subject to change – contact factory for more information Ball A1 Identifier Lead-free Status Tracking Code (Summit Use) 139VSS 01AYWW Date Code (YWW) Multiple Lot Designator X is the sequential number per wafer (1 for first wafer, 2 for second wafer, etc.) Drawing not to scale ORDERING INFORMATION SMB139 Summit Part Number Package E T nnn V Lead Free Part Number Suffix E = 15 Ball Ultra CSPTM Specific requirements are contained in the suffix Default part-number is: SMB139ET-732V Tape & Reel NOTICE NOTE 2 – This is a Final data sheet that describes a Summit that is in production. SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or omission. SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances. Revision 3.0 – This document supersedes all previous versions. www.summitmicro.com for data sheet updates. © Copyright 2005 SUMMIT MICROELECTRONICS, Inc. Please check the Summit Microelectronics Inc. web site at PROGRAMMABLE POWER FOR A GREEN PLANET™ I2C is a trademark of Philips Corporation Summit Microelectronics, Inc 2121 3.0 6/19/2008 27