SUMMIT SMB239

SMB239
Programmable Linear Battery Charger in 1.3 x 2.1 uCSPTM
FEATURES & APPLICATIONS
INTRODUCTION
• World’s smallest linear charger
• Linear charging for reduced board space
•
•
•
•
o
o
The SMB239 is a programmable single-cell lithium-ion/lithium-polymer
battery charger for a variety of portable applications. The device
provides a simple way to charge low- and medium-capacity Li-Ion or
Li-Polymer batteries via a USB port or an AC port. Unlike conventional
devices, the SMB239’s very small package and high level of
configurability simplify design in a wide range of handheld equipment.
Up to 525mA charge current
Stable with small ceramic capacitors
4.35 to 6.5V input voltage range
Small 1.3 x 2.1 uCSPTM package (0.5mm pitch)
High-accuracy output voltage regulation: 1%
Low reverse leakage current
• Digital programming of all major parameters via I2C
interface and lockable non-volatile memory
o
o
o
o
o
Charge control includes qualification, trickle-charge, pre-charge,
constant current/constant voltage, and termination/safety settings that
are fully programmable via a serial I2C/SMBus making the device truly
a flexible solution. Pre-charge, fast charge and termination current
levels can be set via I2C commands. The SMB239 offers the option to
automatically recharge the battery upon power cycling, only when
battery voltage falls 220/390/550mV below the selectable float voltage.
This allows for a reduced number of charge/discharge cycles, thereby
extending battery life.
Battery voltage set point
Pre-charge, fast charge, termination current
Fast charge voltage threshold
Temperature limits
Charge safety timers
Automatic restart threshold
o
• Fault/Status indicator
• Wide range of protection features
o
o
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The SMB239 offers a wide variety of features that protect the battery
pack as well as the charger and input circuitry: over-current, underand over-voltage, and thermal protection. Ultra-precise, 1% accurate,
float voltage control improves battery capacity utilization. Status can
be monitored via the serial port for charge state and fault conditions.
In addition, one LED driver output can be used to signal charge status.
As a protection mechanism, when the junction temperature
approaches approximately 110°C, the SMB239 will start to reduce
charge current to ensure device and system reliability, while charging
the battery cell as fast as possible.
Thermal regulation
Battery pack temperature monitor
Input/output over-voltage lockout
Applications
•
•
•
•
•
•
Bluetooth & Stereo Headsets
Noise Cancellation Headphones
Wireless Handsets
MP3 Players
Wrist PDA/Watches
Handheld Equipment
The SMB239 is available in a space-saving, 1.3mm x 2.1mm uCSPTM
package with lead-free balls and is rated over the –30°C to +85°C
temperature range.
SIMPLIFIED APPLICATIONS DRAWING
4.35V to 6.5V
10V Tolerance
IN
SMB239 OUT
4.7uF
Up to 525mA
Charge Current
Battery
OVLO
BATT
4.7uF
I2C Communication
THERM
SCL
1-cell
Li+ Battery
RLIM
RED
LED
SDA
GND
STAT
Figure 1 – Applications block diagram featuring the SMB239 programmable linear battery charger.
© SUMMIT Microelectronics, Inc. 2005 • 757 N. Mary Avenue • Sunnyvale CA 94085 • Phone 408 523-1000 • FAX 408 523-1266
http://www.summitmicro.com/
2129 3.0 2/23/2009
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SMB239
GENERAL DESCRIPTION
The SMB239 is a fully programmable, linear battery
charger for single-cell Li-Ion and Li-Polymer battery
packs. The device’s simple, linear-mode operation and
ultra-small package significantly reduce component
count and required board space. The SMB239 provides
four main charging phases: trickle-charge, preconditioning (pre-charge), constant current and constant
voltage. The overall system accuracy of the SMB239 is
1%, allowing for a higher capacity utilization versus other
conventional solutions.
When a battery or an external supply is inserted the
SMB239 performs the pre-qualification checks before
initiating a charging cycle. The input voltage needs to be
higher than the UVLO threshold for the charging cycle to
start. As soon as the input supply is removed, the
SMB239 enters a shutdown mode, thereby saving
battery power. A programmable option also exists that
2
allows the user to prevent battery charging until an I C
command has been issued.
If the battery voltage is below 2.0V (trickle-charge to precharge threshold), the device will apply a trickle-charge
current of 10mA (typical). This allows the SMB239 to
reset the protection circuit in the battery pack and bring
the battery voltage to a higher level without
compromising safety.
Once the battery voltage crosses the 2.0V threshold, the
SMB239 enters the pre-charge mode. This mode
replenishes deeply depleted cells and minimizes heat
dissipation during the initial charge cycle.
The
preconditioning current is programmable, with the default
value at C/10. If the battery voltage does not reach the
preconditioning voltage level (programmable) within a
specified amount of time (pre-charge timeout), the safety
timer expires and the charge cycle is terminated.
When the battery voltage reaches the pre-charge to fastcharge voltage level, the SMB239 enters the constant
current (fast charge) mode. The fast charge current
level is programmable via the corresponding register.
Summit Microelectronics, Inc
Once the final float voltage (programmable) has been
reached, the battery charger will enter a constant voltage
mode in which the battery voltage is kept constant,
allowing the charge current to gradually taper off. The
constant-voltage charging mode will continue until the
charge current drops below the termination current
threshold, or until the fast charge timer has expires. The
termination current threshold is programmable.
After the charge cycle has terminated, the SMB239
continues to monitor the battery voltage. If the battery
voltage falls below the recharge threshold (typically
115mV below float voltage), the SMB239 can
automatically top-off the battery.
An option exists for preventing charging initiation upon
power cycling unless the battery voltage is 220mV,
390mV or 550mV (VCH) below the float voltage level.
This prevents over-stressing of the battery via
continuous charging cycles in systems with short run
times and frequent power cycling (IN power
connect/disconnect).
A wide range of protection features is also included in
the SMB239. These include input and output (battery)
over-voltage protection, battery missing detector and
thermal monitor for continuous cell temperature
monitoring and pre-qualification.
The following charging parameters can be adjusted
dynamically via the I2C interface, for optimizing battery
management real-time. These parameters can also be
programmed statically via a user-friendly GUI interface:
•
•
•
•
•
•
•
Battery (float) voltage
Fast charge current
Pre-conditioning voltage threshold
Pre-conditioning charge current
Termination current
Temperature window
Safety charge timers.
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SMB239
INTERNAL BLOCK DIAGRAM
EEPROM
SDA
Registers
Interface
SCL
Charge
Control
IN
BATT
Prog.
Float
Voltage
WELL
Control
Control
Internal
Temperature Limit
OUT
VDDCAP
Prog. Cold Limit
Programmable
Current
THERM
Prog. Hot Limit
Figure 2 – Internal block diagram of the SMB239 programmable linear battery charger.
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SMB239
PRODUCTION PACKAGE AND PIN DESCRIPTIONS
Pin/Ball
Number
A1
Pin Name
Pin Type
BATT
Input
B1
C1
D1
GND
STAT
IN
Ground
Output
Input
A2
B2
C2
D2
THERM
SDA
SCL
OUT
Input
Input/Output
Input
Output
Pin Description
Battery Voltage Sense – Connect directly to positive terminal of battery
and bypass with a 4.7uF or greater capacitor.
Ground – Connect to isolated PCB ground.
Status Indicator.
Voltage Input (+4.35V to +6.5V) – Bypass with a 4.7uF or greater
capacitor.
Battery Thermistor Sense.
I2C Bus Data.
I2C Bus Clock.
Charge Current Output.
A1
A2
SMB239
B1
B2
lead-free CSP-8
C1
C2
1.3mm x 2.1mm
D1
D2
0.5mm pitch
Bottom View
(Balls facing up)
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SMB239
ENGINEERING PACKAGE AND PIN DESCRIPTIONS
Pin Number
Pin Name
Pin Type
1
BATT
Input
Pin Description
Battery Voltage Sense – Connect directly to positive terminal of
battery and bypass with a 4.7uF or greater capacitor.
3, 8, 18, 20,
22, 30, 32, 33
10
GND
Ground
Ground – Connect to isolated PCB ground.
STAT
Output
12
IN
Input
29
21
19
14
THERM
SDA
SCL
OUT
Input
Input/Output
Input
Output
Status Indicator.
Voltage Input (+4.35V to +6.5V) – Bypass with a 4.7uF or greater
capacitor.
Battery Thermistor Sense.
I2C Bus Data.
I2C Bus Clock.
Charge Current Output.
32
30
29
28
27
26
25
1
24
2
23
3
4
5
6
SMB239
5mm x 5mm QFN-32
22
FOR ENGINEERING
SAMPLES ONLY
20
21
19
7
18
8
17
9
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31
10
11
12
13
14
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16
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SMB239
RECOMMENDED OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS
Temperature Under Bias ....................... -55°C to 155°C
Storage Temperature............................. -55°C to 125°C
Terminal Voltage with Respect to GND:
VIN ................................................... -0.3V to +10V
All Others ..............................................-0.3V to 6V
Output Short Circuit Current ............................... 100mA
Lead Solder Temperature (10 s)...........................300°C
Junction Temperature.......................…….....…...150°C
HBM ESD Rating per JEDEC…………………..…4000V
MM ESD Rating per JEDEC………………….….…200V
CDM ESD Rating per JEDEC……………………..1000V
Latch-Up testing per JEDEC………..…....……±100mA
Note: The device is not guaranteed to function outside its
operating rating. Stresses listed under Absolute Maximum
Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions outside those listed in the
operational sections of the specification is not implied.
Exposure to any absolute maximum rating for extended
periods may affect device performance and reliability.
Devices are ESD sensitive. Handling precautions are
recommended.
Industrial Temperature Range ……… …-30°C to +85°C
VIN ..........................................................+4.35V to +6.5V
Package Thermal Resistance (θJA)
uCSPTM-8…………………………..………..….…68°C/W
Note: measured on a 2” x 2”, 4-layer PCB with a copper
weight of 1oz for each of the top, PWR, GND, and bottom
layer.
RELIABILITY CHARACTERISTICS
Data Retention…………………………..…..100 Years
Endurance…………………….……….100,000 Cycles
DC OPERATING CHARACTERISTICS
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Parameter
Conditions
Min
VFLT = 4.2V
VFLT = 4.2V
+4.35
IIN-ACTIVE
IIN-DISABLE
Input supply voltage
Under-voltage lockout voltage
Under-voltage lockout
hysteresis
Input over-voltage lockout
voltage
Battery over-voltage lockout
voltage
Automatic shutdown
threshold voltage
Active supply current
Disable supply current
ILK
Reverse leakage current
VIN < VBATT, T=0oC to +70oC
TREG
Thermal regulation
temperature
Typ
Max
Unit
+6.5
+3.5
V
V
10
mV
+7.0
V
VFLT+0.1
V
VIN – VBATT
130
mV
Input voltage present
0.7
0.7
mA
mA
General
VIN
VUVLO
VUVLO-HYS
VOVLO
VVOB
VASHDN
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VFLT = 4.2V
2
110
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µA
o
C
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SMB239
DC OPERATING CHARACTERISTICS (CONTINUED)
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
600
5
mV
V
mV
mA
2.0
V
10
mA
Logic Inputs/Output
VIL
VIH
VOL
ISINK
Input Low Level
Input High Level
SDA/STAT Output Low Level
STAT sink current
1.4
ISINK=3mA
VOL = 0.4V
300
Battery Charger
IPRECHG
Trickle-charge to pre-charge
voltage threshold
Nominal trickle-charge
current
Pre-charge to fast-charge
voltage threshold
Nominal pre-charge current
range
∆IPRECHG
Pre-charge current tolerance
ICHG
Nominal Fast charge current
range
∆ICHG
Fast charge current tolerance
VFLT
Float voltage range
∆VFLT
Float voltage tolerance
VDO
Dropout voltage
Charge termination current
range
VTRICKLECHG
ITRICKLECHG
VPRECHG
ITERM
∆ITERM
VRECH
Termination current tolerance
VBATT = 1.5V
100mV steps
16 steps
IPRECHG = 100mA,
T=0oC to +70oC
16 steps
2.400
3.100
V
25
212.5
mA
125
mA
525
mA
560
mA
4.020
4.400
V
-1
+1
%
75
100
47.5
ICHG = 525mA,
T=0oC to +70oC
20mV steps
T=+10oC to +50oC, VFLT =
4.2V
ICHG =100mA
16 steps
ITERM =55mA, T=0oC to +70oC
495
525
55
25
35
55
mV
250
mA
70
mA
VCH
Recharge threshold voltage
Charge threshold voltage
range after power applied
3 steps, VBATT < VFLT - VCH
220
550
mV
ITHERM
Thermistor current
3 settings
10
100
µA
110
µA
∆ITHERM
Thermistor current tolerance
THI
Charge cutoff temp (high)
TLO
Charge cutoff temp (low)
115
o
ITHERM=100µA, T=0 C to
+70oC
Adjustable, conditions per
typical application
Adjustable, conditions per
typical application
90
100
mV
30
65
o
-20
15
o
C
C
Note 1: Voltage and current accuracies are only guaranteed for factory-programmed settings. Changing the output voltage from that reflected in the
customer specific CSIR code will result in inaccuracies exceeding those specified above.
Note 2: The SMB239 device is not intended to function as a battery pack protector. Battery packs used in conjunction with this device need to provide
adequate internal protection and to comply with the corresponding battery pack specifications.
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SMB239
AC OPERATING CHARACTERISTICS
TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
Symbol
Parameter
tSTART
Start-up time
tGLITCH
Glitch filter
tHOLDOFF
Hold-off time
tFCTO
Fast-charge Timeout
Conditions
Disabled
Enabled
Short
Long
tFCTO = 350min
tFCTO = 699min
Min
Typ
Max
20
0
250
0
1
256
Unit
msec
msec
msec
msec
msec
-15
tFCTO
+15
%
-15
tPCTO
+15
%
tFCTO = 2398min
tPCTO = 44min
tPCTO
Pre-charge Timeout
tPCTO = 87min
tPCTO = 175min
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2129 3.0 2/23/2009
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SMB239
CHARGING ALGORITHM
SMB239 Programmable Charging Algorithm
0.7
Charge Current (A)
0.6
Charge
termination
Iterm (prog)
0.5
0.4
0.3
0.2
Fast-charge
Vbat<Vfloat
Ichg (prog)
Pre-charge
Vbat<Vprechg
Iprechg (prog)
Trickle charge
Vbat<2.00V
Itrickle = 10mA
Taper-charge
Vbat=Vfloat
(prog)
0.1
4.
20
4.
20
4.
19
4.
14
4.
01
3.
82
3.
59
3.
32
3.
00
2.
60
2.
15
2.
00
1.
80
1.
60
0
Battery Voltage (V)
Figure 3 – SMB239 Programmable Charging Algorithm)
Summit Microelectronics, Inc
2129 3.0 2/23/2009
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SMB239
I2C-2 WIRE SERIAL INTERFACE AC OPERATING CHARACTERISTICS – 400 kHz
TA= 0°C to +70°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND.
400kHz
Symbol
Description
fSCL
SCL clock frequency
TLOW
Clock low period
1.3
µs
THIGH
Clock high period
0.6
µs
tBUF
Bus free time between a STOP
and a START condition
1.3
µs
tSU:STA
Start condition setup time
0.6
µs
tHD:STA
Start condition hold time
0.6
µs
tSU:STO
Stop condition setup time
0.6
tAA
Clock edge to data valid
SCL low to valid SDA (cycle n)
0.2
tRDH
Data output hold time
SCL low (cycle n+1) to SDA
change
0.2
tR
SCL and SDA rise time
Note 3
20 +
0.1Cb
300
ns
tF
SCL and SDA fall time
Note 3
20 +
0.1Cb
300
ns
tSU:DAT
Data in setup time
100
tHD:DAT
Data in hold time
0
TI
Noise filter SCL and SDA
Noise suppression
tWR_CONFIG
Write cycle time config
Configuration registers
10
ms
tWR_EE
Write cycle time EE
Memory array
5
ms
Conditions
Min
Typ
0
Before new transmission – Note
3
Max
Units
400
kHz
µs
0.9
µs
µs
ns
0.9
140
µs
ns
Note 3: Guaranteed by Design.
I2C TIMING DIAGRAMS
tR
tF
tSU:STA
tHD:STA
tHIGH
tWR (For Write Operation Only)
tLOW
SCL
tHD:DAT
tSU:DAT
tSU:STO
tBUF
SDA (IN)
tAA
tDH
SDA (OUT)
Figure 4 – I2C Timing Diagrams
Summit Microelectronics, Inc
2129 3.0 2/23/2009
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SMB239
APPLICATIONS INFORMATION
DEVICE OPERATION
The SMB239 is a fully programmable battery charger
for single-cell Li-Ion and Li-Polymer battery packs. The
device’s simple, linear-mode operation and ultra-small
package significantly reduce component count and
required board space. The SMB239 provides four main
charging phases: trickle-charge, pre-conditioning (precharge), constant (fast-charge) current and constant
voltage. The overall system accuracy of the SMB239 is
1%, allowing for a higher capacity utilization versus
other conventional solutions.
The main battery
charging parameters are programmable, allowing for
high design flexibility and sophisticated battery
management. Furthermore, the SMB239 offers many
advanced protection features, allowing applications to
meet strict safety standards without the need for
additional cost and components.
Power Supply
The SMB239 can be powered from an input voltage
between +4.35 and +6.5 Volts applied between the IN
pin and ground. The voltage on the IN pin is monitored
by an Under-Voltage (UVLO) circuit, which prevents the
charger from turning on when the voltage at this node is
less than the UVLO threshold (+3.5V). The IN pin also
supplies an internal +2.5V VDD regulator, which is used
as an internal VDD supply. When the input supply is
removed, the SMB239 enters a low-power shutdown
mode, exhibiting a very low discharge leakage current
(2µA), thereby extending battery life.
Pre-qualification Mode
When an external wall adaptor or another type of power
source is connected, the SMB239 performs a series of
pre-qualification tests before initiating the first charge
cycle. The input voltage level needs to be higher than
the UVLO threshold, and 130mV greater than the
battery voltage; and the appropriate I2C command
(enable/disable) needs to be asserted. The prequalification parameters are continuously monitored
and charge cycle is suspended when one of them is
outside the limits.
A device option exists (controlled by register 08h[5]) for
preventing charging initiation upon power cycling
unless the battery voltage is 200mV, 390mV or 550mV
(VCH) below the float voltage level. This prevents overstressing of the battery via continuous charging cycles
in systems with short run times and frequent power
cycling (IN power connect/disconnect).
Trickle-charge Mode
Once all pre-qualification conditions are met, the device
checks the battery voltage to decide if trickle-charging
is required. If the battery voltage is below approximately
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2.0V, a charging current of 10mA (typical) is applied on
the battery cell. This allows the SMB239 to reset the
protection circuit in the battery pack and bring the
battery voltage to a higher level without compromising
safety.
Pre-charge Mode
Once the battery voltage crosses the 2.0V level, the
SMB239 pre-charges the battery to safely charge the
deeply discharged cells (Figure 3). The pre-charge
(pre-conditioning) current is programmable from 25mA
to 212.5mA (Register 00h). The SMB239 remains in
this mode until the battery voltage reaches the precharge to fast-charge voltage threshold (programmable
from +2.4V to +3.1V in 100mV steps). If the pre-charge
to fast-charge voltage threshold is not exceeded before
the pre-charge timer expires, the charge cycle is
terminated and a corresponding timeout fault signal is
asserted (“Pre-charge Timeout” in register 36h).
Constant Current Mode
When the battery voltage exceeds the pre-charge to
fast-charge voltage threshold, the device enters the
constant current (fast charge) mode. During this mode,
the fast charge current level is set by the corresponding
register. The fast charge current is programmable from
47.5mA to 525mA (Register 00h).
Constant Voltage Mode
When the battery voltage reaches the pre-defined float
voltage, the fast-charge current starts diminishing. The
float voltage is programmable from +4.020V to +4.40V
in 20mV steps and is ±1% accurate over the +10°C to
+50°C temperature range. The higher float voltage
settings of the SMB239 enable the charging of modern
battery packs with a required float voltage of 4.3V, and
4.4V. Furthermore, the ability to dynamically adjust the
float voltage allows the implementation of sophisticated
battery charging and control algorithms.
Charge Completion
The charge cycle is considered complete when the
charge current reaches the programmed termination
current threshold. The termination current is
programmable from 25mA to 250mA (Register 01h). If
the termination current threshold is not met before the
fast-charge timer expires, the charge cycle is
terminated and a corresponding timeout fault signal is
asserted (“Fast-charge Timeout” in register 36h).
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SMB239
APPLICATIONS INFORMATION (CONTINUED)
Automatic Battery Recharge
The SMB239 allows the battery to be automatically
recharged (topped off) when the battery voltage falls by
a value of VRECH (115mV typical) below the
programmed float voltage. Provided that the input
power supply is still present, charging remains enabled
(I2C command) and all the pre-qualification parameters
are still met, a new charging cycle will be initiated. This
ensures that the battery capacity remains high, without
the need to manually re-start a charging cycle. The
automatic battery recharging can be disabled if not
required by the application (Register 03h).
programmable EEPROM, found in Registers 00-07.
Once the device has been configured correctly, the
EEPROM may be locked, preventing any further
changes. Additionally, these registers may also be
configured so that they may be updated in RAM
(volatile), even if the underlying EEPROM is locked.
This feature is useful if it is desired to actively manage
the charging profile without making changes to the nonvolatile defaults. Use Register 0E to control locking
and volatile access. Before writing to Registers 00-07
in a volatile manner, Register 31[7] must first be set
high.
USB500/100
USB500/100 allows the user to select a maximum fast
charge current of 87mA or 525mA. The USB500/100
functionality is controlled over the I2C interface,
allowing for full software control of charge current
levels. This function is accomplished via register 31 bit
3, when Register 7 bit 0 is programmed high.
FAULT and STATUS Indicators
A large number of battery charging conditions and
parameters are monitored and corresponding fault and
2
status indications are available to the user via the I C
compatible registers. These include the following:
When the USB500 mode is selected, the charge
current level may be as high as 525mA. When the
USB100 mode is selected, the charge current level is
limited to 87mA. In all cases, a lower register value
setting will impose an overriding current limit.
Safety Timers
The integrated safety timers provide protection in case
of a defective battery pack. The pre-charge timer starts
after the pre-qualification check is completed and
resets when the transition to the constant current mode
happens. At that point, the fast charge timer is initiated.
The fast charge timer expires and charge cycle is
terminated if the termination current level is not reached
within the pre-determined duration. Each safety timer
has three programmable timeout periods, which
eliminates the need for external timing capacitors and
allows for maximum design flexibility. In addition, each
timer can be disabled by the appropriate bit selection in
Register 05h.
STAT Output
The STAT is an open-drain output that indicates battery
charge status. STAT has two modes of operation, as
determined by Register 05h[7]: in Mode 0, STAT is
asserted low whenever the battery is charging and deasserted at all other times; in Mode 1, STAT is deasserted when the charger is disabled, blinks during
charging, and remains continuously asserted when the
charge cycle has completed. A pull-up resistor should
be applied on this pin for interfacing to a microcontroller
or other logic IC.
Programmable Battery Charging
A unique feature of the SMB239 is the ability to modify
all of the important charger parameters via internally
Summit Microelectronics, Inc
•
Charging status
•
Safety timer timeout
•
Over-temperature alarm
•
Under-temperature alarm
•
Over-voltage alarm
•
Under-voltage alarm
• Missing battery detection
Thermal Monitor
A temperature sensing I/O (THERM) is provided to
prevent excessive battery temperatures during
charging. The battery temperature is measured by
sensing the voltage between the THERM pin and
ground. The voltage is created by injecting a current
into the parallel combination of Negative Temperature
Coefficient (NTC) thermistor and a resistor. This
voltage is then compared to two predetermined
voltages representing the maximum and minimum
temperature settings of the battery. The purpose of the
resistor in parallel to the NTC thermistor is to linearize
the resistance of the thermistor. Table 1, shows the 1%
resistor that should be placed in parallel with the
corresponding thermistor.
If the temperature limits are exceeded, battery charging
will be suspended until the temperature level has fallen
within the safe operating range. The over-temperature
limit is programmable from 30°C to 65°C, and the
under-temperature limit is programmable from −20°C to
15°C, each in 5°C increments using Register 04h. In
addition, the user can easily select the required bias
current, based on the value of the negative temperature
coefficient (NTC) thermistor located in the battery pack:
10k, 25k, 100k (Register 04h). Disabling the thermal
monitor is also possible by selecting the appropriate
bits in Register 04h.
2129 3.0 2/23/2009
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SMB239
APPLICATIONS INFORMATION (CONTINUED)
As the temperature changes, the resistance of the
thermistor changes creating a voltage proportional to
temperature. The temperature coefficient or Beta (Β) of
the thermistor must be as close to 4400 as possible to
achieve the maximum temperature accuracy.
NTC THERMISTOR
RESISTANCE
10K
24.9K
25K
61.9K
100K
249K
Table 1: NTC values and associated parallel
resistances.
Internal Thermal Protection
When the die temperature of the SMB239 reaches
approximately 110°C, charge current will be reduced to
prevent further die heating. This internal thermal
protection circuit helps to improve device (and
consequently, system) reliability.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
13
SMB239
APPLICATIONS INFORMATION (CONTINUED)
EXTERNAL COMPONENTS
Input and Output Capacitors
The SMB239 allows for the use of low-cost ceramic
capacitors on both the input and the output. The
minimum input capacitance value is 4.7µF. The
minimum output capacitance of 4.7µF is desired in
parallel with the battery installed on the BATT pin.
Taking account of the temperature degrading
characteristics of ceramic capacitors, one is
encouraged to select X5R or X7R rated ceramic
capacitors.
BOARD LAYOUT RECOMMENDATIONS
The most critical components for the reliable operations
of the SMB239 are the output capacitor and the input
capacitor. Place those as close as possible to the
SMB239. Pour sufficient copper along the power
delivery path, namely, from the power source to the IN
pin and from the OUT pin to the battery. This minimizes
the distribution loss, therefore buys an additional
margin for the IN-to-OUT drop-out voltage. Route the
BATT pin to the positive terminal of the battery by
traces wider than 10mils.
Actual power dissipation can be calculated by using the
following formula:
PDACTUAL = (VIN – VBATT) x IOUT
Where:
VIN = input (adapter or USB port) voltage
VBATT = battery voltage
IOUT = charge current
Assuming the SMB239 operates from a 5V±10% (worst
case: 5.5V) supply and is configured to deliver a charge
current of 200mA to a discharged Li-Ion battery with a
voltage of 3.6V, the power dissipation can be calculated
as follows:
PDACTUAL = (5.5V – 3.5V) x 0.3A = 600mW
The maximum allowable power dissipation for a specific
package and board layout can be calculate by using the
following formula:
PDMAXIMUM = (TJ – TA) / ThetaJA
POWER DISSIPATION
The SMB239 incorporates a thermal regulation circuit
that reduces charge current when die temperature rises
o
to high levels (greater than 110 C). The conditions
under which this charge current reduction finds place
can be determined by calculating device power
dissipation. Most of the SMB239 power dissipation is
generated in the internal power MOSFET. The worstcase scenario occurs when the input voltage is at its
highest level and the device has transitioned from the
pre-charge to the fast-charge phase. In this case, both
the input-to-output differential and the charge current
level are large, resulting in high thermal dissipation.
Where:
TJ = maximum allowable junction (silicon) temperature
TA = maximum ambient temperature
ThetaJA = package thermal resistance (depends highly
on board layout)
Combining the two formulas (actual and maximum
allowable power dissipation) allows the user to
calculate the ambient temperature at which the
SMB239 will start reducing charge current for safe
operation. By using our example above and an
estimated ThetaJA of 60oC/W, the ambient temperature
can be calculated as follows:
TA = TJ – (PDMAXIMUM x ThetaJA)
= TJ – (VIN – VBATT) x IOUT x ThetaJA
= 110 oC – (5.5V – 3.5V) x 0.30A x 60oC/W
= 74 oC
Summit Microelectronics, Inc
2129 3.0 2/23/2009
14
SMB239
APPLICATIONS INFORMATION (CONTINUED)
POR
Set I(charge-max)
Standby Mode
(Pause Charge)
NO
YES
Vin >
Vbat+130mV ?
(Always
Monitored)
YES
NO
Optional Operation
(controlled by register)
Vbat>2.0V?
Vbatt <
Vfloat - 200mV ?
(Always
Monitored)
10mA trickle charge
(timers off)
NO
YES
Vbat <Vprechg?
Regulate Current to
I(precharge)
(<Icharge-max)
Precharge Mode
Reset t(precharge)
YES
NO
NO
Fast Charge Mode
Reset t(charge)
Vbat <Vprechg?
NO
YES
t(precharge)
expired?
NO
NO
Vbat < Vfloat?
Regulate Voltage to
Vfloat
YES
YES
YES
Regulate Current to
I(charge)
<(Icharge-max)
YES
I(charge) <
I(terrm)?
Battery Fault
NO
NO
t(charge) expired?
YES
Terminate Charge
Standby Mode
t(charge) expired?
NO
Vbat <Vprechg?
NO
Terminate Charge
Standby Mode
YES
Vbat < Vfloat115mV?
YES
Figure 5 – Functional flow chart.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
15
SMB239
APPLICATIONS INFORMATION (CONTINUED)
D1
C1
4.7uF, 0805, 16V
0.1uF, 0603, 16V
C2
IN
C2
B2
U1
SMB239 CSP
SCL
SDA
OUT
B1
D2
GND
THERM
A1
A2
C1
STAT
BATT
C3
4.7uF, 0805, 16V
24.9k, 0402
R1
D1
SM LED
RT1
10K, 0402
t
R2
10k 0603
Figure 6 – Typical applications schematic.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
16
SMB239
APPLICATIONS INFORMATION (CONTINUED)
Table 2: Recommended Bill of Material.
Item Description
Vendor / Part Number
Qty
Ref. Des.
Resistors
1
Resistor, 24.9k, 0402, 1%
Vishay# CRCW04022492F
1
R1
2
Resistor, 10k, 0603, 1%
Vishay# CRCW06031002F
1
R2
3
Thermistor, 10k, 0402
TDK# NTCG103JF103FT
1
RT
Murata# GRM40X5R475K16D520
Kemet # C0603C104K4RACTU
2
1
C1, C3
C2
Summit Microelectronics
Lite-On# LTST-C190CKT
1
1
U1
D1
Capacitors
4
5
Ceramic, 4.7uF, X5R, 16V, 0805
Ceramic, 0.1uF, X7R, 16V, 0603
Semiconductors
6
7
SMB239E (CSP), Linear Charger
LED, Red, SMD, 0805
Summit Microelectronics, Inc
2129 3.0 2/23/2009
17
SMB239
DEVELOPMENT HARDWARE & SOFTWARE
The SMX3202 system consists of a USB programming
Dongle, cable and WindowsTM GUI software. It can be
ordered on the website or from a local representative.
The latest revisions of all software and an application
brief describing the SMX3202 is available from the
website (www.summitmicro.com).
The Windows GUI software will generate the data and
send it in I2C serial bus format so that it can be directly
downloaded to the SMB239 via the programming
Dongle and cable. An example of the connection
interface is shown in Figure 9.
When design prototyping is complete, the software can
generate a HEX data file that should be transmitted to
Summit for approval. Summit will then assign a unique
customer ID to the HEX code and program production
devices before the final electrical test operations. This
will ensure proper device operation in the end
application.
The SMX3202 programming Dongle/cable interfaces
directly between a PC’s USB port and the target
application. The device is then configured on-screen via
an intuitive graphical user interface employing dropdown menus.
Top view of straight 0.1" x 0.1" closed-side
connector. SMX3202 interface cable connector.
Pin 10, NC
Pin 8, SHDN
Pin 6, MR#
Pin 4, SDA
Pin 2, SCL
IN
SMB239
SDA
SCL
10
8
6
4
2
9
7
5
3
1
Pin 9, 5.0V
Pin 7, 10V
Pin 5, Reserved
Pin 3, GND
Pin 1, GND
0.1µF
GND
Summit Microelectronics, Inc
2129 3.0 2/23/2009
18
SMB239
I2C PROGRAMMING INFORMATION
SERIAL INTERFACE
Access to the configuration registers, command and
status registers is carried out over an industry
standard 2-wire serial interface (I2C). SDA is a bidirectional data line and SCL is a clock input (Figure4).
Data is clocked in on the rising edge of SCL and
clocked out on the falling edge of SCL. All data
transfers begin with the MSB. During data transfers,
SDA must remain stable while SCL is high. Data is
transferred in 8-bit packets with an intervening clock
period in which an Acknowledge is provided by the
device receiving data. The SCL high period (tHIGH) is
used for generating Start and Stop conditions that
precede and end most transactions on the serial bus.
A high-to-low transition of SDA while SCL is high is
considered a Start condition while a low-to-high
transition of SDA while SCL is high is considered a
Stop condition.
The interface protocol allows operation of multiple
devices and types of devices on a single bus through
unique device addressing.
The address byte is
comprised of a 7-bit device type identifier (slave
address). The remaining bit indicates either a read or
a write operation. Refer to Table 1 for a description of
the address bytes used by the SMB239.
The device type identifier for the configuration
registers and the command and status registers are
accessible with the same slave address. The slave
address can be can be programmed to any seven bit
number 0000000BIN through 1111111BIN. Table 3.
WRITE
Writing to a configuration register is illustrated in
Figures 10 and 11. A Start condition followed by the
slave address byte is provided by the host; the
SMB239 responds with an Acknowledge; the host then
responds by sending the memory address pointer or
configuration register address pointer; the SMB239
responds with an acknowledge; the host then clocks in
one byte of data. For configuration register writes, up
to 15 additional bytes of data can be clocked in by the
host to write to consecutive addresses within the same
page.
Slave Address
ALL
After the last byte is clocked in and the host receives
an Acknowledge, a Stop condition must be issued to
initiate the nonvolatile write operation.
READ
The address pointer for the non-volatile configuration
registers and memory registers as well as the volatile
command and status registers must be set before data
can be read from the SMB239. This is accomplished
by issuing a dummy write command, which is a write
command that is not followed by a Stop condition. A
dummy write command sets the address from which
data is read. After the dummy write command is
issued, a Start command followed by the address byte
is sent from the host. The host then waits for an
Acknowledge and then begins clocking data out of the
slave device. The first byte read is data from the
address pointer set during the dummy write command.
Additional bytes can be clocked out of consecutive
addresses with the host providing an Acknowledge
after each byte. After the data is read from the desired
registers, the read operation is terminated by the host
holding SDA high during the Acknowledge clock cycle
and then issuing a Stop condition. Refer to Figure 12
for an illustration of the read sequence.
CONFIGURATION REGISTERS
Writing and reading the configuration registers is
shown in Figures 10, 11 and 12. A description of the
configuration registers is shown in Table 3 through
Table 12.
GRAPHICAL USER INTERFACE (GUI)
Device configuration utilizing the Windows based
SMB239 graphical user interface (GUI) is highly
recommended. The software is available from the
Summit website (www.summitmicro.com). Using the
GUI in conjunction with this datasheet, simplifies the
process of device prototyping and the interaction of
the various functional blocks. A programming Dongle
(SMX3202) is available from Summit to communicate
with the SMB239. The Dongle connects directly to the
USB port of a PC and programs the device through a
cable using the I2C bus protocol. See Figure 9 and the
SMX3202 Data Sheet.
Register Type
Configuration Registers are located in 00 HEX thru
05 HEX , 07HEX, 0CHEX, 0EHEX and 0FHEX
Table 3 – Address bytes used by the SMB239.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
19
SMB239
I2C PROGRAMMING INFORMATION (CONTINUED)
M aster
S
T
A
R
T
Configuration
Register Address
Bus Address
S
A
3
S
A
2
S
A
1
S
A
0
A
2
A
1
A
0
C
6
C
7
W
C
5
C
4
C
3
Data
C
2
C
1
C
0
D
7
A
C
K
Slave
S
T
O
P
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 10 – Configuration Register Byte Write
S
T
A
R
T
M aster
Configuration
Register Address
Bus Address
S
A
0
S
A
1
S
A
2
S
A
3
A
2
A
1
A
0
C
7
W
C
6
C
5
C
4
C
3
Data (1)
C
2
C
1
C
0
D
7
A
C
K
Slave
D
6
D
7
D
6
D
5
D
4
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Data (2)
M aster
D
5
S
T
O
P
Data (16)
D
3
D
2
D
1
D
0
D
7
D
6
D
5
D
2
D
1
D
0
D
7
A
C
K
Slave
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
C
K
A
C
K
Figure 11 – Configuration Register Page Write
M aster
S
T
A
R
T
Configuration
Register Address
Bus Address
S
A
3
S
A
2
S
A
1
S
A
0
A
2
A
1
A
0
S
T
A
R
T
C
7
W
C
6
C
5
C
4
C
3
C
2
C
1
M aster
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
A
1
S
A
0
A
2
A
1
A
0
R
A
C
K
A
C
K
D
7
S
A
2
A
C
K
A
C
K
Data (1)
S
A
3
C
0
A
C
K
Slave
Bus Address
D
6
D
5
D
2
D
1
D
0
N
A
C
K
Data (n)
D
7
D
6
D
5
D
4
D
3
D
2
D
1
S
T
O
P
D
0
Slave
Figure 12 – Configuration Register Read
Summit Microelectronics, Inc
2129 3.0 2/23/2009
20
SMB239
CONFIGURATION REGISTERS
The following tables describe the user-programmable registers of the SMB239 programmable battery charger.
Locations 00-0F are non-volatile, EEPROM registers; however, registers 00-07, which contain the battery charging
parameters, may also be configured to be programmable in RAM. Locations 31-3F contain volatile status and
command registers. To lock all of the configuration registers, set 0E[2]=1; please note that this operation cannot be
undone. To allow volatile access to locations 00-07, set 0E[0]=1; then after every power-on, 31[7] must also be set
high. It is prohibited to write to any location, not specifically mentioned in the tables below4.
Table 4 – Charge current – 8-bit (address: 00h) – Non-Volatile & Volatile (mirror)
Bit7
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Bit7
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit6
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Bit6
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit5
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Bit5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit4
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Bit4
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit3
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
Bit2
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Bit1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Bit0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Bit0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Fast Charge Current
47.5mA
62.5mA
65.0mA
67.5mA
195mA
225mA
255mA
285mA
315mA
345mA
375mA
405mA
435mA
465mA
495mA
525mA
Pre-charge current
CONFIDENTIAL
DO NOT COPY
25mA
37.5mA
50mA
62.5mA
75mA
87.5mA
100mA
112.5mA
125mA
137.5mA
150mA
162.5mA
175mA
187.5mA
200mA
212.5mA
Note 4: Never Write to Reserved bits.
Note 5: Charge current can be limited by internal current limit under certain conditions.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
21
SMB239
CONFIGURATION REGISTERS (CONT.)
Table 5 – Termination current – 8-bit (address: 01h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Termination Current
X
X
X
X
0
0
0
0
25mA
X
X
X
X
0
0
0
1
40mA
X
X
X
X
0
0
1
0
55mA
X
X
X
X
0
0
1
1
70mA
X
X
X
X
0
1
0
0
85mA
X
X
X
X
0
1
0
1
100mA
X
X
X
X
0
1
1
0
115mA
X
X
X
X
0
1
1
1
130mA
X
X
X
X
1
0
0
0
145mA
X
X
X
X
1
0
0
1
160mA
X
X
X
X
1
0
1
0
175mA
X
X
X
X
1
0
1
1
190mA
X
X
X
X
1
1
0
0
205mA
X
X
X
X
1
1
0
1
220mA
X
X
X
X
1
1
1
0
235mA
X
X
X
X
1
1
1
1
250mA
Table 6 – Float Voltage – 8-bit (address: 02h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Float Voltage
X
X
X
0
0
0
0
0
3.850V
X
X
X
0
0
0
0
1
4.020V
X
X
X
0
0
0
1
0
4.040V
X
X
X
0
0
0
1
1
4.060V
X
X
X
0
0
1
0
0
4.080V
X
X
X
0
0
1
0
1
4.100V
X
X
X
0
0
1
1
0
4.120V
X
X
X
0
0
1
1
1
4.140V
X
X
X
0
1
0
0
0
4.160V
X
X
X
0
1
0
0
1
4.180V
X
X
X
0
1
0
1
0
4.200V
X
X
X
0
1
0
1
1
4.220V
X
X
X
0
1
1
0
0
4.240V
X
X
X
0
1
1
0
1
4.260V
X
X
X
0
1
1
1
0
4.280V
X
X
X
0
1
1
1
1
4.300V
X
X
X
1
0
0
0
0
4.320V
X
X
X
1
0
0
0
1
4.340V
X
X
X
1
0
0
1
0
4.360V
X
X
X
1
0
0
1
1
4.380V
X
X
X
1
0
1
0
0
4.400V
Note 4: Never Write to Reserved bits.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
22
SMB239
CONFIGURATION REGISTERS (CONT.)
Table 7 – Other Charging Parameters – 8-bit (address: 03h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Automatic Recharge
0
X
X
X
X
X
X
X
Enabled
1
X
X
X
X
X
X
X
Disabled
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Current Termination
X
0
X
X
X
X
X
X
Enabled
X
1
X
X
X
X
X
X
Disabled
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Pre-charge to Fast-charge Voltage
Threshold
X
X
0
0
0
X
X
X
2.4V
X
X
0
0
1
X
X
X
2.5V
X
X
0
1
0
X
X
X
2.6V
X
X
0
1
1
X
X
X
2.7V
X
X
1
0
0
X
X
X
2.8V
X
X
1
0
1
X
X
X
2.9V
X
X
1
1
0
X
X
X
3.0V
X
X
1
1
1
X
X
X
3.1V
Bit7
X
X
Bit7
X
X
Bit6
X
X
Bit6
X
X
Bit5
X
X
Bit5
X
X
Bit4
X
X
Bit4
X
X
Bit3
X
X
Bit3
X
X
Bit2
X
X
Bit2
X
X
Bit1
0
1
Bit1
X
X
Bit0
X
X
Bit0
0
1
Hold-off Timer
<1msec (short)
256msec (long)
Charger Error
Charger Error disallows re-charge cycles
Charger Errors are blocked
Table 8 – Cell temperature monitor – 8-bit (address: 04h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Thermistor Current
0
0
X
X
X
X
X
X
100µA (10k NTC)
0
1
X
X
X
X
X
X
40µA (25k NTC)
1
0
X
X
X
X
X
X
10µA (100k NTC)
1
1
X
X
X
X
X
X
0µA (Disabled)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Low Temperature Alarm Trip Point
X
X
0
0
0
X
X
X
-20°C
X
X
0
0
1
X
X
X
-15°C
X
X
0
1
0
X
X
X
-10°C
X
X
0
1
1
X
X
X
-5°C
X
X
1
0
0
X
X
X
0°C
X
X
1
0
1
X
X
X
+5°C
X
X
1
1
0
X
X
X
+10°C
X
X
1
1
1
X
X
X
+15°C
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
High Temperature Alarm Trip Point
X
X
X
X
X
0
0
0
+30°C
X
X
X
X
X
0
0
1
+35°C
X
X
X
X
X
0
1
0
+40°C
X
X
X
X
X
0
1
1
+45°C
X
X
X
X
X
1
0
0
+50°C
X
X
X
X
X
1
0
1
+55°C
X
X
X
X
X
1
1
0
+60°C
X
X
X
X
X
1
1
1
+65°C
Summit Microelectronics, Inc
2129 3.0 2/23/2009
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SMB239
CONFIGURATION REGISTERS (CONT.)
Table 9 – Battery charging control – 8-bit (address: 05h) – Non-Volatile & Volatile (mirror)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
0
X
X
X
X
X
X
X
1
X
X
X
X
X
X
X
Bit7
X
X
Bit7
X
X
X
X
Bit7
X
X
X
X
Bit6
X
X
Bit6
X
X
X
X
Bit6
X
X
X
X
Bit5
0
1
Bit5
X
X
X
X
Bit5
X
X
X
X
Bit4
X
X
Bit4
X
X
X
X
Bit4
X
X
X
X
Bit3
X
X
Bit3
0
0
1
1
Bit3
X
X
X
X
Bit2
X
X
Bit2
0
1
0
1
Bit2
X
X
X
X
Bit1
X
X
Bit1
X
X
X
X
Bit1
0
0
1
1
Bit0
X
X
Bit0
X
X
X
X
Bit0
0
1
0
1
Status Output
STAT is active low while charging, active
high all other times
STAT blinks while charging, is active low
when finished, active high when disabled
Glitch Filter
Glitch filter enabled
Glitch filter disabled
Fast-charge Timeout
350 min
699 min
1398 min
Disabled
Pre-charge Timeout
44 min
87 min
175 min
Disabled
Table 10 – STAT Output – 8-bit (address: 07h) – Non-Volatile & Volatile (mirror)
Bit7
X
X
Bit7
X
X
Bit7
Bit6
X
X
Bit6
X
X
Bit6
Bit5
X
X
Bit5
X
X
Bit5
Bit4
X
X
Bit4
X
X
Bit4
Bit3
X
X
Bit3
X
X
Bit3
Bit2
0
1
Bit2
X
X
Bit2
Bit1
X
X
Bit1
0
1
Bit1
Bit0
X
X
Bit0
X
X
Bit0
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
1
STAT Output Indicator
Battery charge status
Input over-voltage or input under-voltage
Battery over-voltage Behavior
Charger is shutdown
Charger is not shutdown
USB500/100 Control
Device is always limited to USB100 charge
levels
USB100/500 mode is determined by
Register 31[3]
Table 11 – Charging Mode – 8-bit (address: 0Ch) – Non-Volatile
Bit7
X
Bit6
X
Bit5
X
Bit4
X
Bit3
X
Bit2
0
Bit1
0
Bit0
X
X
X
X
X
X
0
1
X
X
X
X
X
X
1
0
X
X
X
X
X
X
1
1
X
Summit Microelectronics, Inc
2129 3.0 2/23/2009
Charging Mode
Power cycle initiates charging
Power cycle initiates charging only when
VBATT < VFLT – 220mV
Power cycle initiates charging only when
VBATT < VFLT – 390mV
Power cycle initiates charging only when
VBATT < VFLT – 550mV
24
SMB239
CONFIGURATION REGISTERS (CONT.)
Table 12 – Configuration and User Memory Lock – 8-bit (address: 0Eh) – Non-Volatile
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
0
X
X
X
X
X
X
X
1
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
X
0
X
X
X
X
X
X
X
1
X
Bit7
X
Bit6
X
Bit5
X
Bit4
X
Bit3
X
Bit2
X
Bit1
X
Bit0
0
X
X
X
X
X
X
X
1
Configuration Lock
Unlocked – user can write to non-volatile
Configuration bits
Locked – user cannot write to non-volatile
Configuration bits
User-Memory Lock
Unlocked – user can write to general
purpose EE bits (h20-h2F)
Locked – user cannot write to general
purpose EE bits (h20-h2F)
Volatile Writes Permission
No volatile writes to registers h00-h07
Allow volatile writes to registers h00-h07
(even if h0E[2]=1)
Table 13 – EN Polarity & I2C Bus/Slave Address – 8-bit (address: 0Fh) – Non-Volatile
2
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
I C EN Polarity (Register 31[4])
0
X
X
X
X
X
X
X
Active low – i.e. when R31[4]=0, charging is
enabled
1
X
X
X
X
X
X
X
Active high – i.e. when R31[4]=1, charging is
enabled
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
I C Bus Address
X
0
0
0
X
X
X
X
000
X
0
0
1
X
X
X
X
001
X
0
1
0
X
X
X
X
010
X
0
1
1
X
X
X
X
011
X
1
0
0
X
X
X
X
100
X
1
0
1
X
X
X
X
101
X
1
1
0
X
X
X
X
110
X
1
1
1
X
X
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
111
2
I C Slave Address
X
X
X
X
0
0
0
0
0000
X
X
X
X
0
0
0
1
0001
X
X
X
X
0
0
1
0
0010
X
X
X
X
0
0
1
1
0011
X
X
X
X
0
1
0
0
0100
X
X
X
X
0
1
0
1
0101
X
X
X
X
0
1
1
0
0110
X
X
X
X
0
1
1
1
0111
X
X
X
X
1
0
0
0
1000
X
X
X
X
1
0
0
1
1001
X
X
X
X
1
0
1
0
1010
X
X
X
X
1
0
1
1
1011
X
X
X
X
1
1
0
0
1100
X
X
X
X
1
1
0
1
1101
X
X
X
X
1
1
1
0
1110
X
X
X
X
1
1
1
1
1111
2
Note 4: Never Write to Reserved bits.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
25
SMB239
CONFIGURATION STATUS REGISTERS
Table 14 – Volatile Configuration & Charger Enable – 8-bit (address: 31h) – Volatile
Bit7
0
Bit6
X
Bit5
X
Bit4
X
Bit3
X
Bit2
X
Bit1
X
Bit0
X
1
X
X
X
X
X
X
X
Bit7
X
X
Bit6
X
X
Bit5
X
X
Bit4
0
1
Bit3
X
X
Bit2
X
X
Bit1
X
X
Bit0
X
X
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
X
X
X
X
X
X
X
X
0
1
X
X
X
X
X
X
Volatile Configuration
Volatile writes to h00-h07 are disabled
Volatile writes to h00-h07 are enabled
(if CFG h0E[0]=1)
Charger Enable
Enabled if 0F[7]=0; Disabled if 0F[7]=1
Disabled if 0F[7]=0; Enabled if 0F[7]=1
USB500/100 Select
(This bit only has an effect when CFG
07[0]=1)
USB 100mA current level
USB 500mA current level
Table 15 – Battery status register – 8-bit (address: 36h) – Volatile (read only)
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
1
X
X
X
X
X
X
X
X
1
X
X
X
X
X
X
Bit7
X
X
X
Bit7
X
X
X
X
Bit7
X
Bit6
X
X
X
Bit6
X
X
X
X
Bit6
X
Bit5
0
0
1
Bit5
X
X
X
X
Bit5
X
Bit4
0
1
0
Bit4
X
X
X
X
Bit4
X
Bit3
X
X
X
Bit3
X
X
X
X
Bit3
X
Bit2
X
X
X
Bit2
0
0
1
1
Bit2
X
Bit1
X
X
X
Bit1
0
1
0
1
Bit1
X
Bit0
X
X
X
Bit0
X
X
X
X
Bit0
1
Charging Status
Charger has completed at least 1 successful
charge since being enabled
Charger has completed at least 1 re-charge
cycle since being enabled
Timeout Status
No timeouts have occurred
Pre-charge timeout
Fast-charge timeout
Charging Status
Idle
Pre-charging
Fast-charging
Charge termination
Charging Status
Charger is enabled
Table 16 – Battery fault register – 8-bit (address: 37h) – Volatile (read only)
Bit7
1
X
X
X
X
Bit6
X
1
X
X
X
Bit5
X
X
1
X
X
Bit4
X
X
X
1
X
Bit3
X
X
X
X
1
Bit2
X
X
X
X
X
Bit1
X
X
X
X
X
Bit0
X
X
X
X
X
X
X
X
X
X
X
X
1
Fault Output
Battery missing
Charging error
Battery over-voltage condition
Charger over-voltage condition
Charger under-voltage condition
Termination Detect Current Threshold has
been hit
Note 4: Never Write to Reserved bits.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
26
SMB239
DEFAULT CONFIGURATION REGISTER SETTINGS
Table 17 – Default Configuration Register Settings
Register
00
01
02
03
Contents
D2
02
0A
30
Register
04
05
07
0C
Contents
24
05
03
00
Register
0E
0F
Contents
01
A4
The default device ordering number is SMB239E-989. It is programmed with the register contents as shown
above.
Summit Microelectronics, Inc
2129 3.0 2/23/2009
27
SMB239
PRODUCTION PACKAGE DRAWING
0.5 (Typical)
2.04 +/- 0.04
1.24 +/- 0.04
TOP VIEW
A1
A2
B1
B2
C1
C2
D1
D2
0.28 (Typical)
BOTTOM VIEW
0.20 +/- 0.02
0.28 +/- 0.02
Notes:
1) All Dimensions in [mm]
2) Drawing not to scale
0.40 REF
0.60 +/- 0.03
SIDE VIEW
8-Ball Ultra CSPTM
Summit Microelectronics, Inc
2129 3.0 2/23/2009
28
SMB239
ENGINEERING PACKAGE DRAWING
Note: QFN package type is
available for engineering
samples only
Summit Microelectronics, Inc
2129 3.0 2/23/2009
29
SMB239
PART MARKING
Summit
Part Number
Note: Marking is
subject to change –
contact factory for
more information
Lead-free
Status Tracking
Code (Summit Use)
239VSS
Ball A1
Identifier
01AYWW
Date Code (YWW)
Multiple Lot Disignator
X is the sequential number per wafer
(1 for first wafer, 2 for second wafer, etc.)
Drawing
not
to scale
ORDERING INFORMATION
SMB239
Summit
Part
Number Package
E
T
nnn
V
Lead Free
Part Number Suffix
E = 8-Ball Ultra CSPTM
Specific requirements are contained in the suffix
Default part-number is: SMB239ET-1008V
Tape & Reel
NOTICE
NOTE - This is a Final data sheet that describes a Summit product currently in production.
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve
design, performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described
herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent
infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a
user’s specific application. While the information in this publication has been carefully checked, SUMMIT Microelectronics, Inc. shall
not be liable for any damages arising as a result of any error or omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the
failure or malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their
safety or effectiveness. Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives
written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks;
and (c) potential liability of SUMMIT Microelectronics, Inc. is adequately protected under the circumstances.
Revision 3.0 – This document supersedes all previous versions.
www.summitmicro.com for data sheet updates.
© Copyright 2007 SUMMIT MICROELECTRONICS, Inc.
Please check the Summit Microelectronics Inc. web site at
PROGRAMMABLE POWER FOR A GREEN PLANET™
I2C is a trademark of Philips Corporation
Summit Microelectronics, Inc
2129 3.0 2/23/2009
30