SMS05 through SMS24 TVS Diode Array For ESD and Latch-Up Protection PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMS series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. Each device will protect up to four lines. They are available with operating voltages of 5V, 12V, 15V and 24V. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large crosssectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The SMS series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The low cost SOT23-6L package makes them ideal for use in portable electronics such as cell phones, PDA’s, and notebook computers. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small package for use in portable electronics Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics EIAJ SOT23-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Circuit Diagram Cell phone Handsets and Accessories Microprocessor Based Equipment Personal Digital Assistants (PDA’s) and Pagers Desktops PC and Servers Notebook, Laptop, and Palmtop Computers Portable Instrumentation Peripherals MP3 Players Cordless Phones Schematic & PIN Configuration SOT23-6L (Top View) Revision 08/11/04 1 www.semtech.com SMS05 through SMS24 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 350 Watts ESD Voltage (HBM p er IEC 61000-4-2) VESD >25 kV Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics SMS05 Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 24A, tp = 8/20µs 14.5 V Peak Pulse Current IP P tp = 8/20µs 24 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 325 400 pF Symbol Conditions Typical Maximum Units 12 V 6 V SMS12 Parameter Minimum Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 15A, tp = 8/20µs 23 V Peak Pulse Current IP P tp = 8/20µs 15 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 150 pF 2004 Semtech Corp. 2 13.3 V 135 www.semtech.com SMS05 through SMS24 PROTECTION PRODUCTS Electrical Characteristics (Continued) SMS15 Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 24 V Clamp ing Voltage VC IPP = 12A, tp = 8/20µs 29 V Peak Pulse Current IP P tp = 8/20µs 12 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 100 125 pF Symbol Conditions Typical Maximum Units 24 V 16.7 V SMS24 Parameter Minimum Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 40 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µs 44 V Peak Pulse Current IP P tp = 8/20µs 8 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 75 pF 2004 Semtech Corp. 3 26.7 V 60 www.semtech.com SMS05 through SMS24 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 % of Rated Power or IPP Peak Pulse Power - Ppk (kW) 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 75 100 125 150 o Ambient Temperature - TA ( C) Pulse Duration - tp (µs) Pulse Waveform Clamping Voltage vs. Peak Pulse Current 110 45 Waveform Parameters: tr = 8µs td = 20µs 90 80 70 40 Clamping Voltage - VC (V) 100 Percent of IPP 50 -t e 60 50 40 td = IPP/2 30 20 Waveform Parameters: tr = 8µs td = 20µs SMS24 35 30 SMS15 25 20 SMS12 15 SMS05 10 5 10 0 0 0 5 10 15 20 25 0 30 5 10 15 20 25 30 Peak Pulse Current - IPP (A) Time (µs) Forward Voltage vs. Forward Current 5 Forward Voltage - VF (V) 4.5 4 3.5 3 2.5 2 1.5 Waveform Parameters: tr = 8µs td = 20µs 1 0.5 0 0 5 10 15 20 25 30 35 40 45 Forward Current - IF (A) 2004 Semtech Corp. 4 www.semtech.com SMS05 through SMS24 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines SMSxx Circuit Diagram The SMSxx is designed to protect up to four unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4 and 6 to the data lines. Pin 2 and 5 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD Protection of Four Unidirectional Lines Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Place the SMSxx near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SMSxx and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 5 www.semtech.com SMS05 through SMS24 PROTECTION PRODUCTS Outline Drawing Drawing -SOT23 - SO-8 6L Outline A e1 2X E/2 D DIM N EI 1 H H E ccc C 2X N/2 TIPS c GAGE PLANE 2 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc 0.25 L e 01 (L1) B DETAIL A D aaa C A2 SEATING PLANE C A SEE DETAIL A1 bxN bbb A DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .057 .035 .000 .006 .035 .045 .051 .010 .020 .003 .009 .110 .114 .118 .060 .063 .069 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 6 0° 10° .004 .008 .008 1.45 0.90 0.00 0.15 .90 1.15 1.30 0.25 0.50 0.08 0.22 2.80 2.90 3.00 1.50 1.60 1.75 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 6 0° 10° 0.10 0.20 0.20 SIDE VIEW C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern -SOT23 6L X DIM (C) G C G P X Y Z Z Y DIMENSIONS MILLIMETERS INCHES (.098) .055 .037 .024 .043 .141 (2.50) 1.40 0.95 0.60 1.10 3.60 P NOTES: 1. 2004 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com SMS05 through SMS24 PROTECTION PRODUCTS Marking Codes Part Number Marking Code SMS05 05/05 SMS12 12/12 SMS15 15/15 SMS24 24/24 Ordering Information Part Number Lead Finish Qty per Reel R eel Size SMS05.TC SnPb 3,000 7 Inch SMS12.TC SnPb 3,000 7 Inch SMS15.TC SnPb 3,000 7 Inch SMS24.TC SnPb 3,000 7 Inch SMS05.TCT Pb Free 3,000 7 Inch SMS12.TCT Pb Free 3,000 7 Inch SMS15.TCT Pb Free 3,000 7 Inch SMS24.TCT Pb Free 3,000 7 Inch Note: (1) No suffix indicates tube pack. Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 7 www.semtech.com