SMDA05 through SMDA24 Unidirectional TVS Array for Protection of Four Lines PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMDAxx series of TVS arrays are designed to provide undirectional protection for sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect four data or I/O lines. They are available with operating voltages of 5V, 12V, 15V and 24V. TVS diodes are solid-state devices designed specifically for transient suppression. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The low profile SO-8 package allows the user to protect up to four independent lines with one package. The SMDAxx series is suitable protection for sensitive semiconductors components such as microprocessors, ASICs, transceivers, transducers, and CMOS memory. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Undirectional protection Small SO-8 package Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications The SMDAxx series devices may be used to meet the ESD immunity requirements of IEC 61000-4-2, level 4 for air and contact discharge. RS-232 data lines Microprocessor based equipment Notebooks, Desktops, and Servers Instrumentation LAN/WAN equipment Peripherals Serial and Parallel Ports Schematic & PIN Configuration 1 8 2 7 3 6 4 5 SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 300 Watts ESD Voltage (HBM per IEC 61000-4-2) VESD >25 kV Lead Soldering Temperature TL 260 (10 sec.) °C Operating Temperature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temperature Electrical Characteristics (T=25oC) SMDA05 Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 11 V Peak Pulse Current IP P tp = 8/20µs 17 A Junction Cap acitance Cj VR = 0V, f = 1MHz 400 pF Symbol Conditions Maximum Units 12 V 6 V SMDA12 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 24 V Peak Pulse Current IP P tp = 8/20µs 12 A Junction Cap acitance Cj VR = 0V, f = 1MHz 150 pF 2005 Semtech Corp. 2 13.3 V www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15 Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 24 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 30 V Peak Pulse Current IP P tp = 8/20µs 10 A Junction Cap acitance Cj VR = 0V, f = 1MHz 100 pF Symbol Conditions Maximum Units 24 V 16.7 V SMDA24 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 43 V Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 55 V Peak Pulse Current IP P tp = 8/20µs 5 A Junction Cap acitance Cj VR = 0V, f = 1MHz 60 pF 2005 Semtech Corp. 3 26.7 V www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 90 % of Rated Power or IPP Peak Pulse Power - Ppk (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 0 1000 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Pulse Waveform 110 W aveform Parameters: tr = 8µs td = 20µs 100 90 Percent of IPP 80 70 e -t 60 50 40 td = I PP /2 30 20 10 0 0 5 10 15 20 25 30 T im e (µs) IEC 61000-4-2 Discharge Parameters ESD Pulse Waveform (IEC 61000-4-2) Level 2005 Semtech Corp. 4 First Peak Current Peak Current at 30 ns Peak Current at 60 ns Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) (kV) ( kV ) (A ) (A ) (A ) 1 7.5 4 8 2 2 2 15 8 4 4 4 3 22.5 12 6 6 8 4 30 16 8 8 15 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines Circuit Diagram The SMDAxx series of devices are designed to protect up to four data lines. The devices are connected as follows: z The SMDAxx are unidirectional devices and are designed for use on lines where the normal operating voltage is above ground. Pins 1, 2, 3, and 4 are connected to the protected lines. Pins 5, 6, 7, and 8 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. 1 8 2 7 3 6 4 5 I/O Line Protection Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Typical Connection Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. To Protected Device 1 8 2 7 3 6 4 5 Ground From Connector 2005 Semtech Corp. 5 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Outline Drawing - SO-8 A e N h D h H 2X E/2 E1 E 1 c GAGE PLANE 2 0.25 ccc C 2X N/2 TIPS DIM L (L1) e/2 DETAIL B 01 A D aaa C SEATING PLANE A2 A C .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 SIDE VIEW A1 bxN bbb A SEE DETAIL A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z Y C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A. 2005 Semtech Corp. 6 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Ordering Information Part Number Working Voltage Lead Finish Qty per Reel Reel Size SMDA05.TB 5 SnPb 500 7 Inch SMDA12.TB 12 SnPb 500 7 Inch SMDA15.TB 15 SnPb 500 7 Inch SMDA24.TB 24 SnPb 500 7 Inch SMDA05.TBT 5 Pb Free 500 7 Inch SMDA12.TBT 12 Pb Free 500 7 Inch SMDA15.TBT 15 Pb Free 500 7 Inch SMDA24.TBT 24 Pb Free 500 7 Inch SMDA05 5 SnPb 95/Tube N/A SMDA12 12 SnPb 95/Tube N/A SMDA15 15 SnPb 95/Tube N/A SMDA24 24 SnPb 95/Tube N/A SMDA05.T 5 Pb Free 95/Tube N/A SMDA12.T 12 Pb Free 95/Tube N/A SMDA15.T 15 Pb Free 95/Tube N/A SMDA24.T 24 Pb Free 95/Tube N/A Note: Lead-free devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 7 www.semtech.com