uClamp0504A

uClamp0504A
µClampTM
4-Line ESD protection Array
PROTECTION PRODUCTS - MicroClampTM
Description
Features
The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.9mm2 of PCB area and will protect up to four
lines. They are unidirectional devices and may be used
on lines where the signal polarities are above ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The uClampTM0504A may be used to meet the immunity
requirements of IEC 61000-4-2, level 4. The small SC89 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. These devices feature a leadfree, matte tin lead finish. They are compatible with both
lead free and SnPb assembly techniques.
‹ Transient protection for data lines to
TM
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IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects four I/O lines
1.7 x 1.7 x 0.6mm
Ultra-small SC-89 package (1.7
0.6mm)
2
requires less than 2.9mm of PCB area
Working voltage: 5V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
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‹
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SC-89 (SOT-666) package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Weight: 2.9mg (typical)
Lead Finish: Matte Tin
Packaging : Tape and Reel per EIA 481
Applications
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Dimensions
Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Schematic & PIN Configuration
1.70
0.50
1.25
1.70
0.30
0.60
Maximum Dimensions (mm)
Revision 11/30/2004
SC-89 (Top View)
1
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uClamp0504A
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Pp k
100
Watts
Maximum Peak Pulse Current ( tp = 8/20µs)
Ip p
7
Amps
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
V PP
+/- 20
+/- 12
kV
Lead Soldering Temperature
TL
260 (10 sec.)
°C
Operating Temperature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
1
µA
Reverse Leakage Current
IR
VRWM = 3V, T=25°C
0.500
µA
Forward Voltage
VF
IF = 10mA
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
9
V
Clamping Voltage
VC
IPP = 7A, tp = 8/20µs
12
V
Junction Capacitance
Cj
Between I/O Pins and
Gnd
VR = 0V, f = 1MHz
75
pF
 2004 Semtech Corp.
2
6
V
0.80
60
V
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uClamp0504A
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
100
% of Rated Power or I PP
Peak Pulse Power - P PP (kW)
90
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
Pulse Duration - tp (µs)
Clamping Voltage vs. Peak Pulse Current
75
100
125
150
Forward Voltage vs. Forward Current
12
8
10
Forward Voltage - VF (V)
Clamping Voltage - Vc (V)
50
Ambient Temperature - TA (oC)
8
6
4
Waveform
Parameters:
tr = 8us
td = 20us
2
6
4
Waveform
Parameters:
tr = 8us
td = 20us
2
0
0
0
1
2
3
4
5
6
7
0
8
5
Junction Capacitance vs. Reverse Voltage
15
Insertion Loss S21
CH1 S21
60
Capacitance - Cj (pF)
10
Forward Current - IF (A)
Peak Pulse Current - Ipp (A)
LOG
6 dB / REF 0 dB
50
40
30
20
0
1
2
3
Reverse Voltage - VR (V)
4
5
START . 030 MHz
 2004 Semtech Corp.
3
STOP 3000. 000000 MHz
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uClamp0504A
PROTECTION PRODUCTS
Typical Characteristics (Con’t.)
ESD Clamping
(8kV Contact per IEC 61000-4-2)
ESD Clamping
(-8kV Contact per IEC 61000-4-2)
ESD Clamping
(15kV air per IEC 61000-4-2)
ESD Clamping
(-15kV air per IEC 61000-4-2)
 2004 Semtech Corp.
4
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uClamp0504A
PROTECTION PRODUCTS
Applications Information
Circuit Diagram
Device Connection for Protection of Four Data Lines
These devices are designed to protect up to four
unidirectional data lines. The device is connected as
follows:
1
3
4
6
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4, and 6 to the
data lines. Pins 2 and 5 are connected to ground.
The ground connection should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
2, 5
Circuit Board Layout Recommendations for Suppression of ESD.
Protection of Four Unidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
 2004 Semtech Corp.
5
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uClamp0504A
PROTECTION PRODUCTS
Typical Applications
uClamp0504A
 2004 Semtech Corp.
6
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uClamp0504A
PROTECTION PRODUCTS
Outline Drawing - SC-89 (SOT-666)
D
A
D
N
E/2
E1
E
L
2
1
e
c
Nxb
B
aaa
C A-B D
A
DIM
A
b
c
D
E
E1
e
L
L1
N
aaa
C
L1
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.019
.024
.005
.012
.003
.007
.059 .063 .067
.061 .063 .067
.043 .047 .049
.020 BSC
.003 .008 .012
.003 .006 .008
6
.004
0.50
0.60
0.15
0.30
0.10
0.18
1.50 1.60 1.70
1.55 1.60 1.70
1.10 1.20 1.25
0.50 BSC
0.10 0.20 0.30
0.10 0.15 0.20
6
0.10
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern - SC-89 (SOT-666)
X
Y
Z
C
DIM
C
P
G
X
Y
Z
G
Y
DIMENSIONS
INCHES
MILLIMETERS
(.057)
.020
.024
.012
.033
.090
(1.45)
0.50
0.60
0.30
0.85
2.30
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
 2004 Semtech Corp.
7
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uClamp0504A
PROTECTION PRODUCTS
Marking Code
Ordering Information
H
Part Number
Working
Voltage
uClamp 0504A.TCT
5V
Device Qty per
Marking
Reel
H
3,000
Reel
Size
7 Inch
MicroClamp, uClamp and µClamp are marks of
Semtech Corporation
Note:
(1) Device is symmetrical so there is no pin 1 identifier.
Tape and Reel Specification
H
H
H
Tape Specification and Device Orientation
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2004 Semtech Corp.
8
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