SMDA05C-8 through SMDA24C-8 Bidirectional TVS Array for Protection of Eight Lines PROTECTION PRODUCTS Description Features Transient protection for data lines to The SMDAxxC-8 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDAxxC-8 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO-14 design allows the user to protect up to eight data and I/O lines with one package. They are bidirectional device and may be used on lines where the normal operating voltage is above and below ground (i.e. -12V to +12V). Mechanical Characteristics The SMDAxxC-8 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. 2 3 12 13 JEDEC SO-14 package Molding compound flammability rating: UL 94V-0 Marking : Part Number, Logo, Date Code Packaging : Tape and Reel Pb-Free, Halogen Free, RoHS/WEEE Compliant Applications Circuit Diagram 1 & 14 IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20μs) Small SO-14 surface mount package Protects eight I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology RS-232 and RS-422 Data Lines Microprocessor Based Equipment LAN/WAN Equipment Set-Top Box Notebooks, Desktops, and Servers Portable Instrumentation Peripherals Serial and Parallel Ports Schematic & PIN Configuration 1 14 2 13 3 12 4 11 5 10 6 9 7 8 7&8 5 6 9 10 SO-14 (Top View) Revision 2/25/10 1 www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 300 Watts Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics (T=25oC) SMDA05C-8 Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 μA Clamping Voltage VC IPP = 1A, tp = 8/20μs 9.8 V Peak Pulse Current IP P tp = 8/20μs 17 A Junction Capacitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 350 pF Symbol Conditions Maximum Units 12 V 6 V SMDA12C-8 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 μA Clamping Voltage VC IPP = 1A, tp = 8/20μs 19 V Peak Pulse Current IP P tp = 8/20μs 12 A Junction Capacitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 120 pF © 2010 Semtech Corp. 2 13.3 V www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15C-8 Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 μA Clamp ing Voltage VC IPP = 1A, tp = 8/20μs 24 V Peak Pulse Current IP P tp = 8/20μs 10 A Junction Cap acitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 75 pF Symbol Conditions Maximum Units 24 V 16.7 V SMDA24C-8 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 μA Clamping Voltage VC IPP = 1A, tp = 8/20μs 43 V Peak Pulse Current IP P tp = 8/20μs 5 A Junction Capacitance Cj Between I/O Pins and Ground VR = 0V, f = 1MHz 50 pF © 2010 Semtech Corp. 3 26.7 V www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 90 % of Rated Power or IPP Peak Pulse Power - Ppk (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 1000 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) Pulse Waveform 110 Waveform Parameters: tr = 8µs td = 20µs 100 90 Percent of IPP 80 70 -t e 60 50 40 td = IPP/2 30 20 10 0 0 5 10 15 20 25 30 Time (µs) IEC 61000-4-2 Discharge Parameters ESD Pulse Waveform (IEC 61000-4-2) Level © 2010 Semtech Corp. 4 First Peak Current Peak Current at 30 ns Peak Current at 60 ns Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) (kV) ( kV ) (A ) (A ) (A ) 1 7.5 4 8 2 2 2 15 8 4 4 4 3 22.5 12 6 6 8 4 30 16 8 8 15 www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Eight Data Lines Circuit Diagram The SMDAxxC-8 is designed to protect up to 8 data or I/O lines. They are bidirectional devices and may be used on lines where the signal polarities are above and below ground. The SMDAxxC-8 TVS arrays employ a monolithic structure. Therefore, the working voltage (VRWM) and breakdown voltage (VBR) specifications apply to the differential voltage between any two data line pins. For example, the SMDA24C-8 is designed for a maximum voltage excursion of ±12V between any two data lines. GND 1 14 GND I/O 1 2 13 I/O 8 I/O 2 3 12 I/O 7 N.C. 4 11 N.C. I/O 3 5 10 I/O 6 I/O 4 6 9 I/O 5 GND 7 8 GND The device is connected as follows: Connection Diagram z Pins 2, 3, 5, 6, 9, 10, 12 and 13 are connected to the lines that are to be protected. Pins 1, 7, 8, and 14 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Pins 4 and 11 are not connected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z z z z z z Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. © 2010 Semtech Corp. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 5 www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Outline Drawing - SO-14 A DIM D e N 2X SEE DETAIL E/2 SIDE VIEW E1 E h ccc C 1 2X N/2 TIPS 2 3 B h H aaa C A2 A SEATING PLANE c GAGE PLANE D C 0.25 L (L1) A1 bxN bbb DETAIL A A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .069 .053 .010 .004 .065 .049 .012 .020 .010 .007 .337 .341 .344 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 14 0° 8° .004 .010 .008 1.75 1.35 0.25 0.10 1.65 1.25 0.31 0.51 0.25 0.17 8.55 8.65 8.75 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 14 8° 0° 0.10 0.25 0.20 01 A C A-B D NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AB. Land Pattern - SO-14 X DIM (C) G Z Y C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 P NOTES: © 2010 Semtech Corp. 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 302A. 6 www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Marking Ordering Information SC YYWW SMDAxxC-8 1 Top Mark YYWW = Date Code Part Number Lead Finish Qty per Reel Reel Size SMDA05C-8.TBT Pb Free 500 7 inch SMDA12C-8.TBT Pb Free 500 7 inch SMDA15C-8.TBT Pb Free 500 7 inch SMDA24C-8.TBT Pb Free 500 7 inch SMDA05C-8.T Pb Free 56/Tube N /A SMDA12C-8.T Pb Free 56/Tube N /A SMDA15C-8.T Pb Free 56/Tube N /A SMDA24C-8.T Pb Free 56/Tube N /A Tape and Reel Specification Device Orientation in Tape A0 6.50 +/-0.30 mm B0 K0 9.50 +/-0.30 mm Tap e Width B, (Max) D 16 mm 12.1 mm 1.5 + 0.1 mm - 0.0 mm ) © 2010 Semtech Corp. 2.10 +/-0.15 mm D1 E F K (MAX) P P0 P2 T(MAX) W 0.5 mm ±0.05 1.750±.10 mm 7.5±0.10 mm 6.5 mm 8.0±0.1 mm 4.0±0.1 mm 2.0±0.01 mm 0.4 mm 16.0 mm ± 0.3 mm 7 www.semtech.com SMDA05C-8 through SMDA24C-8 PROTECTION PRODUCTS Contact Information for Semtech International AG Taiw an Branch Korea Branch Tel: 886-2-2748-3380 Fax: 886-2-2748-3390 Semtech Sw itz erland GmbH Japan Branch Tel: 81-3-6408-0950 Fax: 81-3-6408-0951 Tel: 82-2-527-4377 Fax: 82-2-527-4376 Semtech Limited (U.K.) Tel: 44-1794-527-600 Fax: 44-1794-527-601 Tel: 86-21-6391-0830 Fax: 86-21-6391-0831 Semtech France SARL Tel: 33-(0)169-28-22-00 Fax: 33-(0)169-28-12-98 Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Semtech Germany GmbH Tel: 49-(0)8161-140-123 Fax: 49-(0)8161-140-124 © 2010 Semtech Corp. 8 Shanghai Office www.semtech.com