SMDA05C-8 through SMDA24C-8

SMDA05C-8 through SMDA24C-8
Bidirectional TVS Array
for Protection of Eight Lines
PROTECTION PRODUCTS
Description
Features
‹ Transient protection for data lines to
The SMDAxxC-8 series of transient voltage suppressors are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning.
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TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The SMDAxxC-8 is designed to provide
transient suppression on multiple data lines and I/O
ports. The low profile SO-14 design allows the user to
protect up to eight data and I/O lines with one package. They are bidirectional device and may be used on
lines where the normal operating voltage is above and
below ground (i.e. -12V to +12V).
Mechanical Characteristics
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The SMDAxxC-8 TVS diode array will meet the surge
requirements of IEC 61000-4-2 (Formerly IEC 801-2),
Level 4, “Human Body Model” for air and contact
discharge.
2
3 12 13
JEDEC SO-14 package
Molding compound flammability rating: UL 94V-0
Marking : Part Number, Logo, Date Code
Packaging : Tape and Reel
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Applications
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Circuit Diagram
1 & 14
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20μs)
Small SO-14 surface mount package
Protects eight I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
RS-232 and RS-422 Data Lines
Microprocessor Based Equipment
LAN/WAN Equipment
Set-Top Box
Notebooks, Desktops, and Servers
Portable Instrumentation
Peripherals
Serial and Parallel Ports
Schematic & PIN Configuration
1
14
2
13
3
12
4
11
5
10
6
9
7
8
7&8
5 6
9 10
SO-14 (Top View)
Revision 2/25/10
1
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20μs)
Pp k
300
Watts
Op erating Temp erature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temp erature
Electrical Characteristics (T=25oC)
SMDA05C-8
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
20
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
9.8
V
Peak Pulse Current
IP P
tp = 8/20μs
17
A
Junction Capacitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
350
pF
Symbol
Conditions
Maximum
Units
12
V
6
V
SMDA12C-8
Parameter
Minimum
Typical
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 12V, T=25°C
1
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
19
V
Peak Pulse Current
IP P
tp = 8/20μs
12
A
Junction Capacitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
120
pF
© 2010 Semtech Corp.
2
13.3
V
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SMDA15C-8
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
15
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 15V, T=25°C
1
μA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20μs
24
V
Peak Pulse Current
IP P
tp = 8/20μs
10
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
75
pF
Symbol
Conditions
Maximum
Units
24
V
16.7
V
SMDA24C-8
Parameter
Minimum
Typical
Reverse Stand-Off Voltage
VRWM
Reverse Breakdown Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 24V, T=25°C
1
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
43
V
Peak Pulse Current
IP P
tp = 8/20μs
5
A
Junction Capacitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
50
pF
© 2010 Semtech Corp.
3
26.7
V
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - Ppk (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0.01
0
0.1
1
10
100
1000
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Pulse Waveform
110
Waveform
Parameters:
tr = 8µs
td = 20µs
100
90
Percent of IPP
80
70
-t
e
60
50
40
td = IPP/2
30
20
10
0
0
5
10
15
20
25
30
Time (µs)
IEC 61000-4-2 Discharge Parameters
ESD Pulse Waveform (IEC 61000-4-2)
Level
© 2010 Semtech Corp.
4
First
Peak
Current
Peak
Current
at 30 ns
Peak
Current
at 60 ns
Test
Test
Voltage
Voltage
(Contact
(A ir
Discharge) Discharge)
(kV)
( kV )
(A )
(A )
(A )
1
7.5
4
8
2
2
2
15
8
4
4
4
3
22.5
12
6
6
8
4
30
16
8
8
15
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Eight Data Lines
Circuit Diagram
The SMDAxxC-8 is designed to protect up to 8 data or
I/O lines. They are bidirectional devices and may be
used on lines where the signal polarities are above and
below ground.
The SMDAxxC-8 TVS arrays employ a monolithic structure. Therefore, the working voltage (VRWM) and breakdown voltage (VBR) specifications apply to the differential voltage between any two data line pins. For example, the SMDA24C-8 is designed for a maximum
voltage excursion of ±12V between any two data lines.
GND 1
14
GND
I/O 1
2
13
I/O 8
I/O 2
3
12
I/O 7
N.C.
4
11
N.C.
I/O 3
5
10
I/O 6
I/O 4
6
9
I/O 5
GND 7
8
GND
The device is connected as follows:
Connection Diagram
z
Pins 2, 3, 5, 6, 9, 10, 12 and 13 are connected to
the lines that are to be protected. Pins 1, 7, 8,
and 14 are connected to ground. The ground
connections should be made directly to the ground
plane for best results. The path length is kept as
short as possible to reduce the effects of parasitic
inductance in the board traces. Pins 4 and 11 are
not connected.
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
z
z
Place the TVS near the input terminals or connectors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
© 2010 Semtech Corp.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
5
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Outline Drawing - SO-14
A
DIM
D
e
N
2X
SEE DETAIL
E/2
SIDE VIEW
E1 E
h
ccc C 1
2X N/2 TIPS
2
3
B
h
H
aaa C
A2 A
SEATING
PLANE
c
GAGE
PLANE
D
C
0.25
L
(L1)
A1
bxN
bbb
DETAIL
A
A
A1
A2
b
c
D
E1
E
e
h
L
L1
N
01
aaa
bbb
ccc
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.069
.053
.010
.004
.065
.049
.012
.020
.010
.007
.337 .341 .344
.150 .154 .157
.236 BSC
.050 BSC
.010
.020
.016 .028 .041
(.041)
14
0°
8°
.004
.010
.008
1.75
1.35
0.25
0.10
1.65
1.25
0.31
0.51
0.25
0.17
8.55 8.65 8.75
3.80 3.90 4.00
6.00 BSC
1.27 BSC
0.25
0.50
0.40 0.72 1.04
(1.04)
14
8°
0°
0.10
0.25
0.20
01
A
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION AB.
Land Pattern - SO-14
X
DIM
(C)
G
Z
Y
C
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.205)
.118
.050
.024
.087
.291
(5.20)
3.00
1.27
0.60
2.20
7.40
P
NOTES:
© 2010 Semtech Corp.
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.
REFERENCE IPC-SM-782A, RLP NO. 302A.
6
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Marking
Ordering Information
SC YYWW
SMDAxxC-8
1
Top Mark
YYWW = Date Code
Part Number
Lead Finish
Qty per
Reel
Reel
Size
SMDA05C-8.TBT
Pb Free
500
7 inch
SMDA12C-8.TBT
Pb Free
500
7 inch
SMDA15C-8.TBT
Pb Free
500
7 inch
SMDA24C-8.TBT
Pb Free
500
7 inch
SMDA05C-8.T
Pb Free
56/Tube
N /A
SMDA12C-8.T
Pb Free
56/Tube
N /A
SMDA15C-8.T
Pb Free
56/Tube
N /A
SMDA24C-8.T
Pb Free
56/Tube
N /A
Tape and Reel Specification
Device Orientation in Tape
A0
6.50 +/-0.30 mm
B0
K0
9.50 +/-0.30 mm
Tap e
Width
B, (Max)
D
16 mm
12.1 mm
1.5 + 0.1 mm
- 0.0 mm )
© 2010 Semtech Corp.
2.10 +/-0.15 mm
D1
E
F
K
(MAX)
P
P0
P2
T(MAX)
W
0.5 mm
±0.05
1.750±.10
mm
7.5±0.10 mm
6.5 mm
8.0±0.1
mm
4.0±0.1
mm
2.0±0.01
mm
0.4 mm
16.0 mm
± 0.3 mm
7
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SMDA05C-8 through SMDA24C-8
PROTECTION PRODUCTS
Contact Information for Semtech International AG
Taiw an Branch
Korea Branch
Tel: 886-2-2748-3380
Fax: 886-2-2748-3390
Semtech Sw itz erland GmbH
Japan Branch
Tel: 81-3-6408-0950
Fax: 81-3-6408-0951
Tel: 82-2-527-4377
Fax: 82-2-527-4376
Semtech Limited (U.K.)
Tel: 44-1794-527-600
Fax: 44-1794-527-601
Tel: 86-21-6391-0830
Fax: 86-21-6391-0831
Semtech France SARL
Tel: 33-(0)169-28-22-00
Fax: 33-(0)169-28-12-98
Semtech International AG is a wholly-owned subsidiary of
Semtech Corporation, which has its headquarters in the U.S.A.
Semtech Germany GmbH
Tel: 49-(0)8161-140-123
Fax: 49-(0)8161-140-124
© 2010 Semtech Corp.
8
Shanghai Office
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