SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 • • • • • • State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Drive Outputs (– 32-mA IOH, 64-mA IOL ) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPs SN54ABT646 . . . JT PACKAGE SN74ABT646 . . . DB, DW, NT, OR PW PACKAGE (TOP VIEW) CLKAB SAB DIR A1 A2 A3 A4 A5 A6 A7 A8 GND 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC CLKBA SBA OE B1 B2 B3 B4 B5 B6 B7 B8 DIR SAB CLKAB NC VCC CLKBA SBA A1 A2 A3 NC A4 A5 A6 5 4 3 2 1 28 27 26 25 6 24 7 23 8 22 9 21 10 20 19 11 12 13 14 15 16 17 18 OE B1 B2 NC B3 B4 B5 A7 A8 GND NC B8 B7 B6 Output-enable (OE) and direction-control (DIR) inputs are provided to control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either register or in both. 24 2 SN54ABT646 . . . FK PACKAGE (TOP VIEW) description These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers on the low-to-high transition of the appropriate clock (CLKAB or CLKBA) input. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ′ABT646. 1 NC – No internal connection The select-control (SAB and SBA) inputs can multiplex stored and real-time (transparent mode) data. The direction control (DIR) determines which bus will receive data when OE is low. In the isolation mode (OE high), A data may be stored in one register and/or B data may be stored in the other register. When an output function is disabled, the input function is still enabled and may be used to store and transmit data. Only one of the two buses, A or B, may be driven at a time. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74ABT646 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN54ABT646 is characterized for operation over the full military temperature range of – 55°C to 125°C. The SN74ABT646 is characterized for operation from – 40°C to 85°C. EPIC-ΙΙB is a trademark of Texas Instruments Incorporated. Copyright 1994, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–1 SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS 21 OE L 3 DIR L 23 1 CLKAB CLKBA X X 22 SBA L 2 SAB X BUS B BUS A BUS A BUS B SCBS068E – JULY 1991 – REVISED JULY 1994 21 OE L 1 23 CLKAB CLKBA X ↑ X ↑ ↑ ↑ 2 SAB X X X 22 SBA X X X STORAGE FROM A, B, OR A AND B 21 OE L L 22 SBA X BUS B 3 DIR L H 1 CLKAB X L 23 CLKBA L X 2 SAB X H TRANSFER STORED DATA TO A AND/OR B Figure 1. Bus-Management Functions Pin numbers shown are for DB, DW, JT, NT, and PW packages. 2–2 2 SAB L BUS A BUS B BUS A 3 DIR X X X 23 CLKBA X REAL-TIME TRANSFER BUS A TO BUS B REAL-TIME TRANSFER BUS B TO BUS A 21 OE X X H 1 CLKAB X 3 DIR H POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 22 SBA H X SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 FUNCTION TABLE INPUTS DATA I/Os OE DIR CLKAB CLKBA SAB SBA A1 THRU A8 X X ↑ X X X Input B1 THRU B8 Unspecified† Input OPERATION OR FUNCTION Store A, B unspecified† Store B, A unspecified† X X X ↑ X X Unspecified† H X ↑ ↑ X X Input Input Store A and B data H X H or L H or L X X Input disabled Input disabled Isolation, hold storage L L X X X L Output Input Real-time B data to A bus L L X H or L X H Output Input Stored B data to A bus L H X X L X Input Output Real-time A data to B bus L H H or L X H X Input Output Stored A data to B bus † The data output functions may be enabled or disabled by various signals at the OE and DIR inputs. Data input functions are always enabled; i.e., data at the bus pins will be stored on every low-to-high transition of the clock inputs. logic symbol‡ 21 OE DIR CLKBA SBA CLKAB SAB A1 3 23 22 1 2 G3 3 EN1 [BA] 3 EN2 [AB] C4 G5 C6 G7 ≥1 4 1 5 6D 5 7 1 4D 5 A4 A5 A6 A7 A8 B1 1 ≥1 2 7 19 A2 A3 20 6 18 7 17 8 16 9 15 10 14 11 13 B2 B3 B4 B5 B6 B7 B8 ‡ This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for the DB, DW, JT, NT, and PW packages. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–3 SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 logic diagram (positive logic) OE DIR CLKBA SBA CLKAB SAB 21 3 23 22 1 2 One of Eight Channels 1D C1 A1 4 20 1D C1 To Seven Other Channels Pin numbers shown are for the DB, DW, JT, NT, and PW packages. 2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 B1 SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Voltage range applied to any output in the high state or power-off state, VO . . . . . . . . . . . . . – 0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT646 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 50 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . . 0.65 W DW package . . . . . . . . . . . . . . . . . . . 1.7 W NT package . . . . . . . . . . . . . . . . . . . . 1.3 W PW package . . . . . . . . . . . . . . . . . . . 0.7 W Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils, except for the NT package, which has a trace length of zero. For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B. recommended operating conditions (see Note 3) SN54ABT646 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC – 24 Low-level output current 48 ∆t /∆v Input transition rise or fall rate High-level input voltage SN74ABT646 MIN 2 2 0.8 Input voltage 0 5 TA Operating free-air temperature NOTE 3: Unused or floating pins (input or I/O) must be held high or low. – 55 125 – 40 V V 0.8 0 UNIT V VCC – 32 mA V 64 mA 5 ns / V 85 °C PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–5 SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = – 3 mA VCC = 5 V, VCC = 4 4.5 5V SN54ABT646 MIN –1.2 MAX SN74ABT646 MIN –1.2 2.5 IOH = – 3 mA IOH = – 24 mA 3 3 3 2 2 IOH = – 32 mA IOL = 48 mA 2* VCC = 5.5 V,, VI = VCC or GND IOZH‡ IOZL‡ VCC = 5.5 V, VCC = 5.5 V, VO = 2.7 V VO = 0.5 V Ioff ICEX IO¶ VCC = 0, VCC = 5.5 V, VI or VO ≤ 4.5 V VO = 5.5 V Outputs high VCC = 5.5 V, VO = 2.5 V IOL = 64 mA 0.55 V ±1 ±1 ±1 ±100 10§ ±100 50 ±100 10§ – 10§ – 50 – 10§ µA ±100 µA Control inputs A or B ports 5 5 V, V 0 VCC = 5.5 IO = 0, VI = VCC or GND V V 0.55 0.55* ±100 50 – 50 UNIT 2 0.55 II MAX –1.2 2.5 VCC = 4 4.5 5V –100 –180 50 – 50 –180 – 50 µA µA 50 µA –180 mA Outputs high 250 250 250 µA Outputs low 30 30 30 mA 250 250 250 µA 1.5 1.5 1.5 mA Outputs disabled ∆ICC# VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND Ci VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V Cio TA = 25°C TYP† MAX 2.5 VOL ICC MIN Control inputs A or B ports 7 pF 12 pF * On products compliant to MIL-STD-883, Class B, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ The parameters IOZH and IOZL include the input leakage current. § This data sheet limit may vary among suppliers. ¶ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. # This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 2) VCC = 5 V, TA = 25°C fclock tw Clock frequency Pulse duration, CLK high or low tsu Setup time, time A or B before CLKAB↑ or CLKBA↑ th Hold time, A or B after CLKAB↑ or CLKBA↑ POST OFFICE BOX 655303 SN74ABT646 MIN MAX MIN MAX MIN MAX 0 125 0 125 0 125 4 4 4 High 3.5 3.5 3.5 Low 3 3 3 0 0 0 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 2–6 SN54ABT646 • DALLAS, TEXAS 75265 UNIT MHz ns ns ns SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 2) PARAMETER fmax tPLH tPHL tPLH tPHL tPLH tPHL tPZH FROM (INPUT) TO (OUTPUT) VCC = 5 V, TA = 25°C MIN TYP SN54ABT646 MAX 125 CLKBA or CLKAB A or B A or B B or A SAB or SBA† B or A OE A or B OE A or B DIR A or B MIN MAX SN74ABT646 MIN 125 MHz 2.2 4 6.8 2.2 7.8 1.7 4 7.4 1.7 8.4 1.5 3 5.9 1.5 6.9 1.5 3.3 5.9 1.5 6.9 1.5 4 6.1 1.5 7.1 1.5 3.6 6.9 1.5 7.9 1 4.3 5.3 1 6.3 2.1 5.8 7.4 2.1 8.8 1.5 3.5 7.3 1.5 8.3 1.5 3 7 1.5 7.5 1.2 4.5 5.7 1.2 6.7 2.5 6.5 9 2.5 9.5 1.5 3.8 6.7 1.5 DIR A or B tPLZ 1.5 3.8 7.2 1.5 † These parameters are measured with the internal output state of the storage register opposite to that of the bus input. 7.7 tPZL tPHZ tPLZ tPZH tPZL tPHZ UNIT MAX 8.2 ns ns ns ns ns ns ns PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–7 SN54ABT646, SN74ABT646 OCTAL BUS TRANSCEIVERS AND REGISTERS WITH 3-STATE OUTPUTS SCBS068E – JULY 1991 – REVISED JULY 1994 PARAMETER MEASUREMENT INFORMATION 7V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open LOAD CIRCUIT FOR OUTPUTS 3V Timing Input 1.5 V 0V tw tsu 3V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V Input (see Note B) 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH Output 1.5 V 1.5 V VOL 1.5 V 0V tPLZ Output Waveform 1 S1 at 7 V (see Note C) tPLH tPHL 1.5 V tPZL tPHL tPLH 3V Output Control 1.5 V Output Waveform 2 S1 at Open (see Note C) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V tPZH 3.5 V VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH [0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. D. The outputs are measured one at a time with one transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 2–8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 21-Nov-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74ABT646DBLE OBSOLETE SSOP DB 24 SN74ABT646DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DGVR ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DGVRE4 ACTIVE TVSOP DGV 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646NT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74ABT646NTE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74ABT646PW ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646PWLE OBSOLETE TSSOP PW 24 TBD Call TI SN74ABT646PWR ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT646PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-Nov-2005 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDI004 – OCTOBER 1994 NT (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN PINS ** A 24 28 A MAX 1.260 (32,04) 1.425 (36,20) A MIN 1.230 (31,24) 1.385 (35,18) B MAX 0.310 (7,87) 0.315 (8,00) B MIN 0.290 (7,37) 0.295 (7,49) DIM 24 13 0.280 (7,11) 0.250 (6,35) 1 12 0.070 (1,78) MAX B 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0°– 15° 0.010 (0,25) M 0.010 (0,25) NOM 4040050 / B 04/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated