SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 D D D D D D D DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus Family EPIC (Enhanced-Performance Implanted CMOS) Submicron Process Output Ports Have Equivalent 26-Ω Series Resistors, So No External Resistors Are Required ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages 1OE 1Q1 1Q2 GND 2Q1 2Q2 VCC 3Q1 3Q2 4Q1 GND 4Q2 5Q1 5Q2 6Q1 6Q2 7Q1 GND 7Q2 8Q1 8Q2 VCC 9Q1 9Q2 GND 10Q1 10Q2 2OE NOTE: For tape and reel order entry: The DGGR package is abbreviated to GR. description This 10-bit flip-flop is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH162820 flip-flops are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs. A buffered output-enable (OE) input can be used to place the ten outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 CLK D1 NC GND D2 NC VCC D3 NC D4 GND NC D5 NC D6 NC D7 GND NC D8 NC VCC D9 NC GND D10 NC NC NC – No internal connection OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. The outputs, which are designed to sink up to 12 mA, include equivalent 26-Ω resistors to reduce overshoot and undershoot. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 description (continued) Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH162820 is characterized for operation from –40°C to 85°C. FUNCTION TABLE (each flip-flop) INPUTS OEn† CLK D OUTPUT Q L ↑ H H L ↑ L L L L X Q0 H X X Z † n = 1, 2 logic diagram (positive logic) 1OE 2OE CLK 1 28 56 2 1Q1 C1 D1 55 3 1D 1Q2 To Nine Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 recommended operating conditions (see Note 4) VCC Supply voltage VIH High-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 1.65 V to 1.95 V MIN MAX 1.65 3.6 2 0.35 × VCC VI VO Input voltage 0 Output voltage 0 IOL ∆t/∆v 0.7 VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V Low level output current Low-level V 1.7 Low-level input voltage High level output current High-level V 0.8 VCC VCC VCC = 1.65 V VCC = 2.3 V –2 VCC = 2.7 V VCC = 3 V –8 –6 V V mA –12 VCC = 1.65 V VCC = 2.3 V 2 VCC = 2.7 V VCC = 3 V 8 Input transition rise or fall rate V 0.65 × VCC VIL IOH UNIT 6 mA 12 10 ns/V TA Operating free-air temperature –40 85 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 1.65 V to 3.6 V IOH = –100 µA IOH = –2 mA IOH = –4 mA VOH 6 mA IOH = –6 3V 2 1.65 V to 3.6 V 0.2 1.65 V 0.45 2.3 V 0.4 2.3 V 0.55 3V 0.55 2.7 V 0.6 3V 0.8 ±5 3.6 V 1.65 V 25 VI = 1.07 V VI = 0.7 V 1.65 V –25 2.3 V 45 VI = 1.7 V VI = 0.8 V 2.3 V –45 3V 75 3V –75 VO = VCC or GND VI = VCC or GND, ∆ICC One input at VCC – 0.6 V, IO = 0 Other inputs at VCC or GND VI = VCC or GND UNIT V IOL = 100 µA IOL = 2 mA IOZ ICC Data inputs 1.7 2 VI = VCC or GND VI = 0.58 V Control inputs 1.9 2.3 V 2.4 VI = 2 V VI = 0 to 3.6 V‡ Ci 2.3 V MAX 3V IOL = 8 mA IOL = 12 mA II(hold) ( ) 1.65 V VCC–0.2 1.2 2.7 V IOL = 6 mA II TYP† IOH = –8 mA IOH = –12 mA IOL = 4 mA VOL MIN V µA µA 3.6 V ±500 3.6 V ±10 µA 3.6 V 40 µA 3 V to 3.6 V 750 µA 3.5 33V 3.3 pF 6 Co Outputs VO = VCC or GND 3.3 V 7 pF † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figures 1 through 3) VCC = 1.8 V MIN MAX § VCC = 2.5 V ± 0.2 V MIN MAX VCC = 2.7 V MIN MIN 150 UNIT MAX fclock tw Clock frequency Pulse duration, CLK high or low § 3.3 3.3 3.3 ns tsu th Setup time, data before CLK↑ § 1.7 1.8 1.4 ns Hold time, data after CLK↑ § This information was not available at the time of publication. § 1.1 1.1 1 ns 4 • DALLAS, TEXAS 75265 POST OFFICE BOX 655303 150 MAX VCC = 3.3 V ± 0.3 V 150 MHz SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figures 1 through 3) FROM (INPUT) PARAMETER fmax tpd ten tdis VCC = 1.8 V TO (OUTPUT) MIN † TYP VCC = 2.5 V ± 0.2 V MIN MAX 150 VCC = 2.7 V MIN MAX 150 VCC = 3.3 V ± 0.3 V MIN UNIT MAX 150 MHz CLK Q † 1 6.4 6.2 1 5.4 ns OE Q † 1 6.9 6.8 1 5.6 ns OE Q † 1 6.2 5.5 1 5 ns † This information was not available at the time of publication. operating characteristics, TA = 25°C PARAMETER Cpd d Power dissipation capacitance ca acitance per flip-flop TEST CONDITIONS VCC = 1.8 V TYP All outputs enabled All outputs disabled CL = 50 pF, pF f = 10 MHz VCC = 2.5 V TYP VCC = 3.3 V TYP † 68 66 † 39 47 UNIT pF † This information was not available at the time of publication. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V 2 × VCC S1 1 kΩ From Output Under Test Open GND CL = 30 pF (see Note A) 1 kΩ TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 tPZH VOH VCC/2 VOL VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH – 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open GND CL = 30 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 tPZH VOH VCC/2 VOL VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH – 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN74ALVCH162820 3.3-V 10-BIT FLIP-FLOP WITH DUAL OUTPUTS AND 3-STATE OUTPUTS SCES012G – JULY 1995 – REVISED NOVEMBER 1999 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND LOAD CIRCUIT tw 2.7 V 2.7 V Timing Input 0V 0V 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Output Control (low-level enabling) 2.7 V 1.5 V 1.5 V 0V tPLZ tPZL 2.7 V 1.5 V VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 0V tPLH Output 1.5 V 1.5 V tsu Input 1.5 V Input Output Waveform 1 S1 at 6 V (see Note B) VOL + 0.3 V VOH 1.5 V VOL Output Waveform 2 S1 at GND (see Note B) VOL tPHZ tPZH tPHL 1.5 V 3V 1.5 V 1.5 V VOH VOH – 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1999, Texas Instruments Incorporated