SCES478A − AUGUST 2003 − REVISED NOVEMBER 2003 D Available in the Texas Instruments D D D D D D D D DCT OR DCU PACKAGE (TOP VIEW) NanoStar and NanoFree Packages Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub 1-V Operable Max tpd of 1.5 ns at 1.8 V Low Power Consumption, 10 µA at 1.8 V ±8-mA Output Drive at 1.8 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) 1A 1B 2Y GND 1 8 2 7 3 6 4 5 VCC 1Y 2B 2A YEP OR YZP PACKAGE (BOTTOM VIEW) GND 2Y 1B 1A 4 5 3 6 2 7 1 8 2A 2B 1Y VCC description/ordering information This dual 2-input positive-OR gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC2G32 performs the Boolean function Y + A ) B or Y + A • B in positive logic. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE† TA NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP −40°C to 85°C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) TOP-SIDE MARKING‡ SN74AUC2G32YEPR Tape and reel _ _ _UG_ SN74AUC2G32YZPR SSOP − DCT Tape and reel SN74AUC2G32DCTR U32_ _ _ VSSOP − DCU Tape and reel SN74AUC2G32DCUR U32_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. Copyright 2003, Texas Instruments Incorporated ! "#$ %!& % "! "! '! ! !( ! %% )*& % "!+ %! !!$* $%! !+ $$ "!!& POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCES478A − AUGUST 2003 − REVISED NOVEMBER 2003 FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H X H X H H L L L logic diagram (positive logic) 1A 1B 2A 2B 1 7 2 5 6 3 1Y 2Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 2): DCT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C/W DCU package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227°C/W YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 102°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCES478A − AUGUST 2003 − REVISED NOVEMBER 2003 recommended operating conditions (see Note 3) VCC VIH Supply voltage VCC = 0.8 V VCC = 1.1 V to 1.95 V High-level input voltage 0.8 2.7 V 0 0 3.6 V 0 VCC −0.7 V VCC = 0.8 V VCC = 1.1 V IOL Low-level output current ∆t/∆v V 0.7 Output voltage High-level output current V 0.35 × VCC Input voltage IOH UNIT 1.7 VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V Low-level input voltage VI VO MAX VCC 0.65 × VCC VCC = 2.3 V to 2.7 V VCC = 0.8 V VIL MIN −3 VCC = 1.4 V VCC = 1.65 V −5 VCC = 2.3 V VCC = 0.8 V −9 mA −8 0.7 VCC = 1.1 V VCC = 1.4 V 3 VCC = 1.65 V VCC = 2.3 V 8 5 mA 9 Input transition rise or fall rate 20 ns/V TA Operating free-air temperature −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −100 µA IOH = −0.7 mA VOH VOL II Ioff ICC Ci A or B inputs VCC MIN 0.8 V to 2.7 V VCC−0.1 0.8 V MAX 1.1 V 0.8 1.4 V 1 IOH = −8 mA IOH = −9 mA 1.65 V 1.2 2.3 V 1.8 IOL = 100 µA IOL = 0.7 mA 0.8 V to 2.7 V V 0.2 0.25 IOL = 3 mA IOL = 5 mA 1.1 V 0.3 1.4 V 0.4 IOL = 8 mA IOL = 9 mA 1.65 V 0.45 2.3 V 0.6 VI = VCC or GND VI or VO = 2.7 V VI = VCC or GND, VI = VCC or GND IO = 0 UNIT 0.55 IOH = −3 mA IOH = −5 mA 0.8 V TYP† V 0 to 2.7 V ±5 µA 0 ±10 µA 10 µA 0.8 V to 2.7 V 2.5 V 2.5 pF † All typical values are at TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCES478A − AUGUST 2003 − REVISED NOVEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd VCC = 1.2 V ± 0.1 V VCC = 1.5 V ± 0.1 V VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX A or B Y 7.5 0.7 3.3 0.6 1.9 0.5 1 1.5 0.4 1.1 UNIT ns switching characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A or B Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN TYP MAX MIN MAX 1.2 1.6 2.1 1 1.7 UNIT ns operating characteristics, TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 0.8 V TYP 13 POST OFFICE BOX 655303 VCC = 1.2 V TYP VCC = 1.5 V TYP 13 • DALLAS, TEXAS 75265 13 VCC = 1.8 V TYP 13 VCC = 2.5 V TYP 14 UNIT pF SCES478A − AUGUST 2003 − REVISED NOVEMBER 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test Open GND CL (see Note A) RL VCC 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V LOAD CIRCUIT TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND CL RL 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω V∆ 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VCC Timing Input VCC/2 0V tw tsu VCC VCC/2 Input th VCC VCC/2 VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC VCC/2 Input 0V tPHL tPLH VOH VCC/2 Output VCC/2 VOL Output Waveform 1 S1 at 2 × VCC (see Note B) VOH Output VCC/2 VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VCC/2 0V tPLZ tPZL VCC VCC/2 Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ tPZH tPLH tPHL VCC Output Control VCC/2 VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ ÇÇÇÇÇ 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0° – 8° 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion Falls within JEDEC MO-187 variation DA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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