TI SN74BCT573DW

SN54BCT573, SN74BCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS071B – AUGUST 1990 – REVISED MARCH 2003
D
D
Operating Voltage Range of 4.5 V to 5.5 V
State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
Full Parallel Access for Loading
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN54BCT573 . . . J OR W PACKAGE
SN74BCT573 . . . DW, N, OR NS PACKAGE
(TOP VIEW)
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
2D
1D
OE
VCC
1
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
LE
3D
4D
5D
6D
7D
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
2Q
3Q
4Q
5Q
6Q
8D
GND
LE
8Q
7Q
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
SN54BCT573 . . . FK PACKAGE
(TOP VIEW)
1Q
D
D
description/ordering information
These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively
low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
The eight latches of the ’BCT573 devices are transparent D-type latches. While the latch-enable (LE) input is
high, the Q outputs follow the data (D) inputs. When the latch enable is taken low, the Q outputs are latched
at the logic levels that were set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without interface or pullup components.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
OE does not affect internal operations of the latches. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
ORDERING INFORMATION
PDIP – N
0°C to 70°C
–55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TOP-SIDE
MARKING
Tube
SN74BCT573N
Tube
SN74BCT573DW
Tape and reel
SN74BCT573DWR
SOP – NS
Tape and reel
SN74BCT573NSR
BCT573
CDIP – J
Tube
SNJ54BCT573J
SNJ54BCT573J
CFP – W
Tube
SNJ54BCT573W
SNJ54BCT573W
LCCC – FK
Tube
SNJ54BCT573FK
SOIC – DW
SN74BCT573N
BCT573
SNJ54BCT573FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54BCT573, SN74BCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS071B – AUGUST 1990 – REVISED MARCH 2003
FUNCTION TABLE
(each latch)
INPUTS
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
LE
1
11
C1
1D
2
19
1Q
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the disabled or power-off state, VO . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Voltage range applied to any output in the high state, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA
Current into any output in the low state: SN54BCT573 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74BCT573 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54BCT573, SN74BCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS071B – AUGUST 1990 – REVISED MARCH 2003
recommended operating conditions (see Note 3)
SN54BCT573
SN74BCT573
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
0.8
V
Input clamp current
–18
–18
mA
IOH
IOL
High-level output current
–12
–15
mA
Low-level output current
48
64
mA
High-level input voltage
2
2
V
V
TA
Operating free-air temperature
–55
125
0
70
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
SN54BCT573
TYP†
MAX
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V
MIN
II = –18 mA
IOH = –3 mA
–1.2
IOH = –12 mA
IOH = –15 mA
VOL
VCC = 4
4.5
5V
IOL = 48 mA
IOL = 64 mA
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
VI = 5.5 V
VI = 2.7 V
IIL
IOS‡
VCC = 5.5 V,
VCC = 5.5 V,
VI = 0.5 V
VO = 0
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.5 V
ICCL
ICCH
VCC = 5.5 V,
VCC = 5.5 V,
Outputs open
ICCZ
Ci
VCC = 5.5 V,
VCC = 5 V,
SN74BCT573
TYP†
MAX
MIN
2.4
3.3
2
3.2
–1.2
2.4
V
3.3
V
2
0.38
UNIT
3.1
0.55
0.42
0.55
V
0.4
0.4
mA
20
20
µA
–0.6
–0.6
mA
–225
mA
50
50
µA
–50
–50
µA
62
62
mA
Outputs open
8
8
mA
Outputs open
8
8
mA
–100
–225
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
–100
5.5
Co
VCC = 5 V,
7.5
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
5.5
pF
7.5
pF
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
VCC = 5 V,
TA = 25°C
MIN
MAX
SN54BCT573
MIN
MAX
SN74BCT573
MIN
UNIT
MAX
tw
tsu
Pulse duration, LE high
4
4
4
ns
Setup time, data before LE↓
1
2.5
1
ns
th
Hold time, data after LE↓
4
4
4
ns
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54BCT573, SN74BCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS071B – AUGUST 1990 – REVISED MARCH 2003
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
Q
tPLH
tPHL
LE
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
PARAMETER
4
POST OFFICE BOX 655303
VCC = 5 V,
TA = 25°C
SN54BCT573
SN74BCT573
MIN
TYP
MAX
MIN
MAX
MIN
MAX
2
5
7.2
1
9.8
2
8.4
2.8
5.9
8.2
1.5
10.3
2.8
9.6
2.4
6.1
7.2
2
9.7
2.4
8.1
2.9
5.2
7.1
2
8.8
2.9
7.8
3
6.2
8.5
2.5
11
3
10.4
4.3
7.1
9.3
3.5
11.5
4.3
11
2.2
3.9
5.6
1.5
7.2
2.2
6
1.7
3.6
5.2
1
7
1.7
6
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
SN54BCT573, SN74BCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS071B – AUGUST 1990 – REVISED MARCH 2003
PARAMETER MEASUREMENT INFORMATION
7 V (tPZL, tPLZ, O.C.)
S1
Open
(all others)
From Output
Under Test
Test
Point
CL
(see Note A)
R1
From Output
Under Test
R1
Test
Point
CL
(see Note A)
R2
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
RL = R1 = R2
LOAD CIRCUIT FOR
3-STATE AND OPEN-COLLECTOR OUTPUTS
High-Level
Pulse
(see Note B)
3V
Timing Input
(see Note B)
3V
1.5 V
1.5 V
0V
1.5 V
tw
0V
Data Input
(see Note B)
3V
th
tsu
Low-Level
Pulse
3V
1.5 V
1.5 V
0V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
3V
Input
(see Note B)
1.5 V
1.5 V
0V
tPLH
In-Phase
Output
(see Note D)
VOH
1.5 V
1.5 V
VOL
VOH
1.5 V
1.5 V
0V
tPLZ
1.5 V
Waveform 1
(see Notes C and D)
3.5 V
VOL
tPHZ
tPLH
1.5 V
1.5 V
tPZL
tPHL
tPHL
Out-of-Phase
Output
(see Note D)
Output
Control
(low-level enable)
0.3 V
tPZH
Waveform 2
(see Notes C and D)
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (see Note D)
VOH
1.5 V
0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, tr = tf ≤ 2.5 ns, duty cycle = 50%.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
E. When measuring propagation delay times of 3-state outputs, switch S1 is open.
F. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
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5
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9583501Q2A
ACTIVE
LCCC
FK
20
1
TBD
5962-9583501QRA
ACTIVE
CDIP
J
20
1
TBD
5962-9583501QSA
ACTIVE
CFP
W
20
1
SN74BCT573DW
ACTIVE
SOIC
DW
20
25
SN74BCT573DWE4
ACTIVE
SOIC
DW
20
25
SN74BCT573DWG4
ACTIVE
SOIC
DW
20
25
SN74BCT573DWR
ACTIVE
SOIC
DW
SN74BCT573DWRE4
ACTIVE
SOIC
SN74BCT573DWRG4
ACTIVE
SN74BCT573N
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
TBD
Call TI
N / A for Pkg Type
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT573NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74BCT573NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT573NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74BCT573NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54BCT573FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54BCT573J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54BCT573W
ACTIVE
CFP
W
20
1
TBD
Call TI
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2008
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74BCT573DWR
Package Package Pins
Type Drawing
SOIC
DW
20
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.8
13.0
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74BCT573DWR
SOIC
DW
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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