SN74CBT16292 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS SCDS053C – MARCH 1998 – REVISED FEBRUARY 1999 D D D D D D DGG, DGV, OR DL PACKAGE (TOP VIEW) 4-Ω Switch Connection Between Two Ports TTL-Compatible Control Input Levels Make-Before-Break Feature Internal 500-Ω Pulldown Resistors to Ground Latch-Up Performance Exceeds 250 mA Per JESD 17 Package Options Include Plastic Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV), and 300-mil Shrink Small-Outline (DL) Packages S 1A NC 2A NC 3A NC GND 4A NC 5A NC 6A NC 7A NC VCC 8A GND NC 9A NC 10A NC 11A NC 12A NC description The SN74CBT16292 is a 12-bit 1-of-2 high-speed TTL-compatible FET multiplexer/ demultiplexer. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. When the select (S) input is low, port A is connected to port B1 and RINT is connected to port B2. When S is high, port A is connected to port B2 and RINT is connected to port B1. The SN74CBT16292 is characterized operation from –40°C to 85°C. for 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 NC NC 1B1 1B2 2B1 2B2 3B1 GND 3B2 4B1 4B2 5B1 5B2 6B1 6B2 7B1 7B2 8B1 GND 8B2 9B1 9B2 10B1 10B2 11B1 11B2 12B1 12B2 NC – No internal connection FUNCTION TABLE INPUT S FUNCTION L A port = B1 port RINT = B2 port H A port = B2 port RINT = B1 port Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74CBT16292 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS SCDS053C – MARCH 1998 – REVISED FEBRUARY 1999 logic diagram (positive logic) 2 54 1A 1B1 RINT RINT 53 27 1B2 30 12A 12B1 RINT RINT 29 12B2 S 1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74CBT16292 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS SCDS053C – MARCH 1998 – REVISED FEBRUARY 1999 recommended operating conditions (see Note 3) MIN MAX VCC VIH Supply voltage 4 5.5 High-level control input voltage 2 VIL TA Low-level control input voltage Operating free-air temperature –40 UNIT V V 0.8 V 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK II ICC ∆ICC‡ Control input Ci Control input Cio TEST CONDITIONS VCC = 4.5 V, VCC = 5.5 V, II = –18 mA VI = VCC or GND VCC = 5.5 V, VCC = 5.5 V, IO = 0, One input at 3.4 V, VI = 3 V or 0 VCC = 0, MIN VI = VCC or GND Other inputs at VCC or GND VO = 3 V or 0 VCC = 4 V, TYP at VCC = 4 V ron§ VCC = 4.5 V TYP† MAX UNIT –1.2 V ±5 µA 3 µA 2.5 mA 3 pF 8 pF VI = 2.4 V, II = 15 mA 10 20 VI = 0 II = 64 mA II = 30 mA 3 7 3 7 Ω VI = 2.4 V, II = 15 mA 5 15 † All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. ‡ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. § Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd¶ ten VCC = 4 V VCC = 5 V ± 0.5 V MIN MIN FROM (INPUT) TO (OUTPUT) A or B B or A 0.5 S A or B 6.8 MAX UNIT MAX 0.25 ns 6 ns 1 tdis S A or B 7 1 6.3 ns ¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER DESCRIPTION VCC = 4 V VCC = 5 V ± 0.5 V MIN MIN MAX tmbb# Make-before-break time 0 2 0 2 # The make-before-break time is the time interval between make and break, during the transition from one selected port to the other. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MAX ns 3 SN74CBT16292 12-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER WITH INTERNAL PULLDOWN RESISTORS SCDS053C – MARCH 1998 – REVISED FEBRUARY 1999 PARAMETER MEASUREMENT INFORMATION 7V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tpd tPZL/tPLZ tPZH/tPHZ Open 7V Open 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPZL 3V 1.5 V Input 1.5 V 0V tPLH 1.5 V 2.3 V 1.2 V tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) tPLZ 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ 2.3 V 1.2 V VOH – 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when connected to the internal 500-Ω pulldown resistor. Waveform 2 is for an output with internal conditions such that the output is high except when connected to the internal 500-Ω pulldown resistor. C. All pulse inputs and DC inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. Z = RINT = 500 Ω F. tPZL and tPZH are the same as ten. Z = RINT = 500 Ω G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 1999, Texas Instruments Incorporated