TI SN74LVC2GU04DCKR

SN74LVC2GU04
DUAL INVERTER GATE
SCES197J – APRIL 1999 – REVISED FEBRUARY 2003
D
D
D
D
D
D
D
D
D
D
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 3.7 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Unbuffered Outputs
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
1A
GND
2A
1
6
2
5
3
4
1Y
VCC
2Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
2A
GND
1A
3 4
2 5
1 6
2Y
VCC
1Y
description/ordering information
This dual inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2GU04 contains two inverters with unbuffered outputs and performs the Boolean function Y = A.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C
SN74LVC2GU04YEAR
SN74LVC2GU04YZAR
Reel of 3000
_ _ _CD_
CD
SN74LVC2GU04YEPR
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
23) – DBV
SOT (SOT
(SOT-23)
TOP-SIDE
MARKING‡
SN74LVC2GU04YZPR
Reel of 3000
SN74LVC2GU04DBVR
Reel of 250
SN74LVC2GU04DBVT
CU4
CU4_
SN74LVC2GU04DCKR
SOT (SC-70)
(SC 70) – DCK
Reel of 3000
SN74LVC2GU04DCKT
CD
CD_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
SN74LVC2GU04
DUAL INVERTER GATE
SCES197J – APRIL 1999 – REVISED FEBRUARY 2003
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram (positive logic)
1A
2A
1
6
3
4
1Y
2Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165°C/W
DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259°C/W
YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . 143°C/W
YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 123°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The value of VCC is provided in the recommended operating conditions table.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SN74LVC2GU04
DUAL INVERTER GATE
SCES197J – APRIL 1999 – REVISED FEBRUARY 2003
recommended operating conditions (see Note 4)
MIN
MAX
1.65
5.5
UNIT
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
–4
V
IO = –100 mA
IO = 100 mA
High-level input voltage
0.75 × VCC
V
0.25 × VCC
VCC = 1.65 V
VCC = 2.3 V
IOH
High-level output current
VCC = 3 V
mA
–24
–32
4
VCC = 2.3 V
Low-level output current
V
–8
–16
VCC = 4.5 V
VCC = 1.65 V
IOL
V
8
mA
16
VCC = 3 V
24
VCC = 4.5 V
32
TA
Operating free-air temperature
–40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V to 5.5 V
IOH = –100 mA
IOH = –4 mA
VOH
1.65 V
VCC–0.1
1.2
2.3 V
1.9
IOH = –8 mA
IOH = –16 mA
VIL = 0 V
VIH= VCC
A inputs
VI = 5.5 V or GND
VI = 5.5 V or GND,
MAX
V
3.8
IOL = 100 mA
IOL = 4 mA
1.65 V to 5.5 V
0.1
1.65 V
0.45
IOL = 8 mA
IOL = 16 mA
2.3 V
0.3
0.4
3V
V
0.55
4.5 V
IO = 0
UNIT
2.3
4.5 V
IOL = 24 mA
IOL = 32 mA
II
ICC
TYP†
2.4
3V
IOH = –24 mA
IOH = –32 mA
VOL
MIN
0.55
0 to 5.5 V
±5
mA
1.65 V to 5.5 V
10
mA
Ci
VI = VCC or GND
† All typical values are at VCC = 3.3 V, TA = 25°C.
3.3 V
7
pF
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.2
5.5
1
4
1.1
3.7
1
3
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ns
3
SN74LVC2GU04
DUAL INVERTER GATE
SCES197J – APRIL 1999 – REVISED FEBRUARY 2003
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance
TEST CONDITIONS
VCC = 1.8 V
TYP
VCC = 2.5 V
TYP
f = 10 MHz
7
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7
VCC = 3.3 V
TYP
8
VCC = 5 V
TYP
23
UNIT
pF
SN74LVC2GU04
DUAL INVERTER GATE
SCES197J – APRIL 1999 – REVISED FEBRUARY 2003
PARAMETER MEASUREMENT INFORMATION
RL
From Output
Under Test
CL
(see Note A)
VLOAD
Open
S1
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
tPHL
VOH
VM
Output
VM
VOL
tPHL
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VM
VM
VM
0V
tPZL
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH – V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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5
MECHANICAL DATA
MPDS026D – FEBRUARY 1997 – REVISED FEBRUARY 2002
DBV (R-PDSO-G6)
PLASTIC SMALL-OUTLINE
0,95
6X
6
0,50
0,25
0,20 M
4
1,70
1,50
1
0,15 NOM
3,00
2,60
3
Gage Plane
3,00
2,80
0,25
0°–8°
0,55
0,35
Seating Plane
1,45
0,95
0,05 MIN
0,10
4073253-5/G 01/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
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1
MECHANICAL DATA
MPDS114 – FEBRUARY 2002
DCK (R-PDSO-G6)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
6
0,10 M
4
1,40
1,10
1
0,13 NOM
2,40
1,80
3
Gage Plane
2,15
1,85
0,15
0°–8°
0,46
0,26
Seating Plane
1,10
0,80
0,10
0,00
0,10
4093553-3/D 01/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-203
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1
MECHANICAL DATA
MXBG003A NOVEMBER 2001 – REVISED MAY 2002
YEA (R–XBGA–N6)
DIE–SIZE BALL GRID ARRAY
0,50
A
0,95
0,85
B
0,25
C
1,45
1,35
1,00
B
ÉÉ
ÉÉ
0,50
A
1
2
PIN A1 INDEX AREA
6X
0,19
0,15
0,05 M C A B
0,05 M C
0,35 MAX
0,05 C
0,50 MAX
SEATING PLANE
0,15
0,10
C
4203167–3/C 04/2002
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
NanoStar package configuration.
Package complies to JEDEC MO–211 variation EA.
This package is tin–lead (SnPb). Refer to the 6 YZA package (drawing 4204151) for lead–free.
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MXBG005A – JANUARY 2002 – REVISED APRIL 2002
YZA (R-XBGA-N6)
DIE-SIZE BALL GRID ARRAY
0,50
A
0,95
0,85
B
0,25
C
1,00
1,45
1,35
B
0,50
A
1
2
Pin A1 Index Area
6X
0,19
0,15
0,05 M C A B
0,05 M C
0,35 MAX
0,05 C
0,50 MAX
Seating Plane
0,15
0,10
C
4204151-3/B 03/2002
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
NanoFree package configuration.
Package complies to JEDEC MO-211 variation EA.
This package is lead-free. Refer to the 6 YEA package (drawing 4203167) for tin-lead (SnPb).
NanoFree is a trademark of Texas Instruments.
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MECHANICAL DATA
MXBG019 – OCTOBER 2002
YZP (R-XBGA-N6)
DIE-SIZE BALL GRID ARRAY
0,50
A
0,95
0,85
B
0,25
C
1,00
1,45
1,35
B
0,50
A
1
2
Pin A1 Index Area
6X
0,25
0,20
0,05 M C A B
0,05 M C
0,05 C
0,50 Max
Seating Plane
0,20
0,15
C
4204741-3/A 10/2002
NOTES: A.
B.
C.
NOTES: D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
NanoFree package configuration.
This package is lead-free. Refer to the 6 YEP package (drawing 4204725) for tin-lead (SnPb).
NanoFree is a trademark of Texas Instruments.
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1
MECHANICAL DATA
MXBG022 – OCTOBER 2002
YEP (R-XBGA-N6)
DIE-SIZE BALL GRID ARRAY
0,50
A
0,95
0,85
B
0,25
C
1,00
1,45
1,35
B
0,50
A
1
2
Pin A1 Index Area
6X
0,25
0,20
0,05 M C A B
0,05 M C
0,05 C
0,50 Max
Seating Plane
0,20
0,15
C
4204725-3/A 10/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
NanoFree package configuration.
This package is tin-lead (SnPb). Refer to the 6 YZP package (drawing 420741) for lead-free.
NanoFree is a trademark of Texas Instruments.
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Copyright  2003, Texas Instruments Incorporated