TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03-6 Series SP03-6 Series 6V 150A Rail Clamp Array RoHS Pb GREEN This new broadband protection device from Littelfuse provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. This new protector combines the TVS diode element with a diode rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution. The application schematic provides the connection information. Agency Approvals - Pending Features Agency Agency File Number t $MBNQJOHTQFFEPG nanoseconds t 3P)4DPNQMJBOU E128662 t .4TVSGBDFNPVOU package (JEDEC SO-8) Pinout 1 8 2 7 3 6 4 5 t 6-7FQPYZNPMEJOH t -PXJOTFSUJPOMPTTMPH linear capacitance t 1FOEJOH6-SFDPHOJ[FE component t $PNCJOFEMPOHJUVEJOBM and metallic protection t -PXDMBNQJOHWPMUBHF Applications t 5&-JOFDBSET t #BTF5 Ethernet t 5&BOE%4*OUFSGBDFT t 454*OUFSGBDFT SO-8 (Top View) Functional Block Diagram Line in Pin 1 and 8 Application Example Line out TeleLink (0461 1.25) SP03-6 TIP 1 8 Pin 2, 3, 6, and 7 2 7 Ground 3 6 4 5 Line out Line in Pin 4 and 5 to chipset (Ethernet PHY, T3/E3 PHY, etc.) RING This schematic shows a high-speed data interface protection solution. The SP03-6 provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events. Its surge rating is compatible with the intra-building surge requirements of Telcordia’s GR-1089-CORE, and the Basic Level Recommendations of ITU K.20 and .21. This device protects against both positive and negative induced surge events. The TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 117 Revision: April 14, 2011 SP03-6 Series SP03-6 Description TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03-6 Series Thermal Information Absolute Maximum Ratings Parameter Rating Parameter Units Rating Units Peak Pulse Current (8/20μs) 150 A SOIC Package 170 °C/W Peak Pulse Power (8/20μs) 2800 W Operating Temperature Range -55 to 125 °C -65 to 150 °C IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV Storage Temperature Range IEC 61000-4-2, Air Discharge, (Level 4) 30 kV Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 10s) (SOIC - Lead Tips Only) 260 °C IEC 61000-4-5 (8/20μs) 100 A Telcordia GR 1089 (Intra-Building) (2/10μs) 100 A ITU K.20 (5/310μs) 40 A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM - - - 6 V VBR IT= 1mA 6.8 - - V Reverse Leakage Current IR VRWM= 6V, T= 25°C - - 25 μA Clamping Voltage, Line-Ground VC IPP= 50A, tp=8/20 μs - - 15 V Clamping Voltage, Line-Ground VC IPP= 100A, tp=8/20 μs - - 20 V - 16 25 pF - 8 12 pF Reverse Stand-Off Voltage Reverse Breakdown Voltage Cj (Line-Ground) Junction Capacitance Cj (Line-Line) Between I/O Pins and Ground VR=0V, f= 1MHz Between I/O Pins VR=0V, f= 1MHz Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time Figure 2: Current Derating Curve 120 Percentage of Rated Current (%IP) Peak Pulse Current (A) 1000 100 10 1 100 80 60 40 20 0 1 10 100 1000 0 SP03-6 Series 20 40 60 80 100 120 140 160 Ambient Temperature (C) Pulse decay time (μs) 118 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03-6 Series Figure 3: Pulse Waveform Figure 4: Clamping Voltage vs. Peak Pulse Current 25 100 80 60 40 15 Line-to-Ground 10 5 20 0 0 0 5 10 15 20 25 30 35 40 0 20 40 60 100 80 IP Peak Impulse Current (A) Time, μs Figure 5: Capacitance vs. Reverse Voltage Figure 6: Forward Voltage vs. Forward Current 7 20 18 Line-to-Ground 6 Ground-to-Line Forward Voltage (V) 16 Capacitance (pF) SP03-6 VC Clamping Voltage (V) Percentage of IPP (%) Line-to-Line 20 14 12 10 8 Line-to-Line 6 5 4 3 2 4 1 2 0 0 0 1 2 3 4 5 6 7 0 10 20 30 Reverse Voltage (V) 40 50 60 70 80 90 100 Forward Current (A) Soldering Parameters Reflow Condition Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds +0/-5 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 250 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Temperature TP time to peak temperature Time °C 119 Revision: April 14, 2011 SP03-6 Series TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP03-6 Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package MS-012 (SO-8) Pins 8 JEDEC MO-223 Issue A Millimetres LF o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.049 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e L 1.27 BSC 0.050 BSC 1.27 0.40 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres E 1.85 0.065 0.073 5.4 5.6 0.213 0.22 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 1.50 Min 3.9 4.1 40.0 +/- 0.20 0.059 Min 0.154 0.161 1.574 +/- 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 G= Green K0 2 2.2 0.079 0.087 T= Tape & Reel t SP 03 - 6 B T G Package B - SOIC Working Voltage Max 1.65 1.95 10P0 Series Min F P0 Silicon Protection Array (SPATM) Family of TVS Diode Arrays Max P2 D1 Part Numbering System Inches Min 0.30 +/- 0.05 0.012 +/- 0.002 Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 Part Marking System LF SP03-6 XXXXXXXX First Line: Part number Second Line: Date code Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. SP03-6BTG SOIC Tape & Reel SP03-6 2500 SP03-6 Series 120 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.