SSM9974GP,S N-channel Enhancement-mode Power MOSFET PRODUCT SUMMARY BVDSS 60V R DS(ON) 12mΩ ID 72A DESCRIPTION The SSM9974 acheives fast switching performance with low gate charge without a complex drive circuit. It is suitable for low voltage applications such as DC/DC converters and general load-switching circuits. The SSM9974GS is in a TO-263 package, which is widely used for commercial and industrial surface-mount applications. Pb-free; RoHS-compliant TO-220 and TO-263 (D2PAK) G G The through-hole version, the SSM9974GP in TO-220, is available for vertical mounting, where a small footprint is required on the board, and/or an external heatsink is to be attached. These devices are manufactured with an advanced process, providing improved on-resistance and switching performance. D D S S TO-220 (suffix P) TO-263 (suffix S) ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Units VDS Drain-source voltage 60 V VGS Gate-source voltage ±20 V ID Continuous drain current, TC = 25°C 72 A 46 A 300 A TC = 100°C 1 IDM Pulsed drain current PD Total power dissipation, TC = 25°C 104 W Linear derating factor 0.8 W/°C TSTG Storage temperature range -55 to 150 °C TJ Operating junction temperature range -55 to 150 °C THERMAL CHARACTERISTICS Symbol Parameter Value Units RΘ JC Maximum thermal resistance, junction-case 1.2 °C/W RΘ JA Maximum thermal resistance, junction-ambient 62 °C/W Notes: 1.Pulse width must be limited to avoid exceeding the safe operating area. 2.Pulse width <300us, duty cycle <2%. 5/12/2006 Rev.3.1 www.SiliconStandard.com 1 of 6 SSM9974GP,S ELECTRICAL CHARACTERISTICS Symbol (at Tj = 25°C, unless otherwise specified) Parameter Test Conditions Min. Typ. Max. Units 60 - - V BVDSS Drain-source breakdown voltage VGS=0V, ID=250uA ∆ BV DSS/∆ Tj Breakdown voltage temperature coefficient Reference to 25°C, ID=1mA - 0.07 - V/°C RDS(ON) Static drain-source on-resistance VGS=10V, ID=45A - - 12 mΩ VGS=4.5V, ID=30A - - 15 mΩ VDS=VGS, ID=250uA 1 - 3 V VGS(th) Gate threshold voltage gfs Forward transconductance VDS=10V, ID=30A - 50 - S IDSS Drain-source leakage current VDS=60V, VGS=0V - - 10 uA VDS=48V ,VGS=0V, Tj = 150°C - - 100 uA VGS=±20V - - ±100 nA ID=30A - 43 69 nC IGSS Gate-source leakage current 2 Qg Total gate charge Qgs Gate-source charge VDS=48V - 8 - nC Qgd Gate-drain ("Miller") charge VGS=4.5V - 31 - nC VDS=30V - 14 - ns 48 - ns 2 td(on) Turn-on delay time tr Rise time ID=30A td(off) Turn-off delay time RG=3.3Ω , VGS=10V - 42 - ns tf Fall time RD=1Ω - 67 - ns Ciss Input capacitance VGS=0V - 3180 5100 pF Coss Output capacitance VDS=25V - 495 - pF Crss Reverse transfer capacitance f=1.0MHz - 460 - pF Rg Gate Resistance f=1.0MHz - 1 1.5 Ω Min. Typ. - Source-Drain Diode Symbol Parameter VSD Forward voltage trr Qrr 2 Test Conditions Max. Units IS=45A, VGS=0V - - 1.2 V Reverse-recovery time IS=30A, VGS=0V, - 45 - ns Reverse-recovery charge dI/dt=100A/µs - 40 - nC Notes: 1.Pulse width must be limited to avoid exceeding the maximum junction temperature of 150°C. 2.Pulse width <300us, duty cycle <2%. 5/12/2006 Rev.3.1 www.SiliconStandard.com 2 of 6 SSM9974GP,S 250 125 10V 7.0V o T C =25 C 100 ID , Drain Current (A) ID , Drain Current (A) 200 150 5.0V 4.5V 100 10V 7.0V 5.0V 4.5V T C = 150 o C 75 50 V G =3.0V 25 50 V G =3.0V 0 0 0 2 4 6 0 8 2 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 8 2.0 I D = 30 A T C =25 o C I D =45A V G =10V 1.6 16 Normalized RDS(ON) RDS(ON) (mΩ ) 6 Fig 2. Typical Output Characteristics 20 12 8 1.2 0.8 0.4 2 4 6 8 10 -50 V GS , Gate-to-Source Voltage (V) 0 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance vs. Gate Voltage Fig 4. Normalized On-Resistance vs. Junction Temperature 30 Normalized VGS(th) (V) 1.8 20 T j =25 o C IS(A) T j =150 o C 10 1.2 0.6 0.0 0 0 0.2 0.4 0.6 0.8 1 1.2 -50 Fig 5. Forward Characteristic of Reverse Diode 0 50 100 150 T j , Junction Temperature ( o C) V SD , Source-to-Drain Voltage (V) 5/12/2006 Rev.3.1 4 V DS , Drain-to-Source Voltage (V) Fig 6. Gate Threshold Voltage vs. Junction Temperature www.SiliconStandard.com 3 of 6 SSM9974GP,S f=1.0MHz 16 10000 VGS , Gate to Source Voltage (V) I D = 35 A V DS =48V V DS =38V V DS =30V C iss C (pF) 12 8 1000 C oss C rss 4 0 100 0 20 40 60 1 80 5 9 Q G , Total Gate Charge (nC) 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 Normalized Thermal Response (R thjc) 1000 100 ID (A) 100us 1ms 10 10ms o T C =25 C Single Pulse 100ms DC 1 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthjc + TC Single Pulse 0.01 0.1 1 10 100 1000 0.00001 0.0001 V DS , Drain-to-Source Voltage (V) 0.001 0.01 0.1 1 t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 125 VG V DS =5V T j =25 o C ID , Drain Current (A) 100 T j =150 o C QG 4.5V 75 QGS QGD 50 25 Charge Q 0 0 2 4 6 8 V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics 5/12/2006 Rev.3.1 Fig 12. Gate Charge Waveform www.SiliconStandard.com 4 of 6 SSM9974GP,S PHYSICAL DIMENSIONS - TO-220 E A Millimeters SYMBOLS φ L2 L5 c1 D L4 b1 L3 MIN NOM MAX A 4.25 4.48 4.70 b b1 c c1 0.65 0.80 0.90 1.15 1.38 1.60 0.40 0.50 0.60 1.00 1.20 1.40 E 9.70 10.00 10.40 e ---- 2.54 ---- L 12.70 13.60 14.50 L1 2.60 2.80 3.00 L2 1.00 1.40 1.80 L3 2.6 3.10 3.6 L4 14.70 15.50 16 L5 6.30 6.50 6.70 φ 3.50 3.60 3.70 D 8.40 8.90 9.40 L1 L c b 1.All dimensions are in millimeters. 2.Dimensions do not include mold protrusions. e PART MARKING - TO-220 and TO-263 PART NUMBER: 9974GP or 9974GS XXXXXX DATE/LOT CODE: (YWWSSS) Y = last digit of the year WW = week SSS = lot code sequence YWWSSS PACKING: Moisture sensitivity level MSL3 TO-263: 800 pcs in antistatic tape on a reel packed inside a moisture barrier bag (MBB). TO-220: 1000pcs in tubes packed inside a moisture barrier bag (MBB). 5/12/2006 Rev.3.1 www.SiliconStandard.com 5 of 6 PHYSICAL DIMENSIONS - TO-263 E SYMBOLS D b1 L2 L3 b e L4 Millimeters MIN NOM MAX A 4.25 4.75 5.20 A1 0.00 0.15 0.30 A2 2.20 2.45 2.70 b 0.70 0.90 1.10 b1 1.07 1.27 1.47 c 0.30 0.45 0.60 c1 1.15 1.30 1.45 D 8.30 8.90 9.40 E 9.70 10.10 #### e 2.04 2.54 3.04 L2 ----- 1.50 ----- L3 4.50 4.90 5.30 L4 ----- 1.50 ---- A 1.All dimensions are in millimeters. 2.Dimensions do not include mold protrusions. c1 c A1 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. www.SiliconStandard.com 6 of 6