STGB19NC60KD STGF19NC60KD - STGP19NC60KD 20 A - 600 V - short circuit rugged IGBT Features ■ Low on-voltage drop (VCE(sat)) ■ Low Cres / Cies ratio (no cross conduction susceptibility) ■ Short circuit withstand time 10 µs ■ IGBT co-packaged with ultra fast free-wheeling diode 3 3 1 1 2 D2PAK TO-220 Applications 3 ■ High frequency inverters ■ Motor drivers 2 1 TO-220FP Description This IGBT utilizes the advanced PowerMESH™ process resulting in an excellent trade-off between switching performance and low on-state behavior. Table 1. Figure 1. Internal schematic diagram Device summary Order codes Marking Package Packaging STGB19NC60KDT4 GB19NC60KD D2PAK Tape and reel STGF19NC60KD GF19NC60KD TO-220FP Tube STGP19NC60KD GP19NC60KD TO-220 Tube May 2008 Rev 2 1/17 www.st.com 17 Contents STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 7 3 Test circuits 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter D2PAK TO-220FP TO-220 VCES Collector-emitter voltage (VGE = 0) IC(1) Collector current (continuous) at TC = 25 °C 35 16 A IC(1) Collector current (continuous) at TC = 100 °C 20 10 A 600 V ICL (2) Turn-off latching current 75 A ICP (3) Pulsed collector current 75 A Gate-emitter voltage ±20 V Diode RMS forward current at TC = 25 °C 20 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PTOT Total dissipation at TC = 25 °C tscw Short circuit withstand time, VCE = 0.5 V(BR)CES Tj = 125 °C, RG = 10 Ω, VGE = 12 V VGE IF Tj 1. Unit 125 Operating junction temperature 32 W 10 µs – 55 to 150 °C Calculated according to the iterative formula: T J ( MAX ) – T c I c ( T c ) = ------------------------------------------------------------------------------------R thj – c × V CE ( sat ) ( MAX ) ⋅ ( T c ,I c ) 2. Vclamp = 80%,(VCES), Tj =150°C, RG = 10 Ω, VGE = 15 V 3. Pulse width limited by max. junction temperature allowed Table 3. Thermal resistance Value Symbol Parameter D2PAK TO-220FP TO-220 Rthj-case Unit Thermal resistance junction-case IGBT max. 0.95 3.9 °C/W Thermal resistance junction-case diode max. 3 5.6 °C/W Rthj-amb Thermal resistance junction-ambient max. 62.5 °C/W 3/17 Electrical characteristics 2 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Electrical characteristics (TCASE = 25 °C unless otherwise specified) Table 4. Symbol Static Parameter Test conditions V(BR)CES Collector-emitter breakdown IC = 1 mA voltage (VGE= 0) VCE(sat) Collector-emitter saturation voltage VGE = 15 V, IC = 12 A VGE = 15 V, IC = 12 A, Tc = 125 °C ICES Collector cut-off current (VGE = 0) VCE = 600 V VCE = 600 V, TC = 125 °C VGE(th) Gate threshold voltage VCE = VGE, IC = 250 µA IGES Gate-emitter leakage current (VCE = 0) VGE = ±20 V gfs (1) Forward transconductance VCE = 15 V , IC = 12 A Min. Typ. Max. Unit 600 V 2.0 2.75 1.8 4.5 V V 150 1 µA mA 6.5 V ±100 nA 15 S 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5% Table 5. Symbol Parameter Test conditions Min. Typ. Max. Unit Cres Input capacitance Output capacitance Reverse transfer capacitance VCE = 25 V, f = 1 MHz, VGE = 0 1170 127 28 pF pF pF Qg Qge Qgc Total gate charge Gate-emitter charge Gate-collector charge VCE = 480 V, IC = 12 A, VGE = 15 V (see Figure 19) 55 11 26 nC nC nC Cies Coes 4/17 Dynamic STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Table 6. Electrical characteristics Switching on/off (inductive load) Symbol Parameter td(on) tr (di/dt)on Turn-on delay time Current rise time Turn-on current slope td(on) tr (di/dt)on Typ. Max. Unit VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, (see Figure 18) 30 8 1450 ns ns A/µs Turn-on delay time Current rise time Turn-on current slope VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, Tc = 125 °C (see Figure 18) 30 8 1380 ns ns A/µs tr(Voff) td(off) tf Off voltage rise time Turn-off delay time Current fall time VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, (see Figure 18) 35 105 85 ns ns ns tr(Voff) td(off) tf Off voltage rise time Turn-off delay time Current fall time Vcc = 480 V, IC = 12 A, RG = 10 Ω, VGE = 15 V Tc = 125 °C (see Figure 18) 65 145 125 ns ns ns Table 7. Symbol Test conditions Min. Switching energy (inductive load) Parameter Test conditions Min Typ. Max Unit Eon Eoff (1) Ets Turn-on switching losses Turn-off switching losses Total switching losses VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, (see Figure 18) 165 255 420 µJ µJ µJ Eon Eoff (1) Ets Turn-on switching losses Turn-off switching losses Total switching losses VCC = 480 V, IC = 12 A RG = 10 Ω, VGE = 15 V, TC = 125 °C (see Figure 18) 250 445 695 µJ µJ µJ 1. Turn-off losses include also the tail of the collector current. 5/17 Electrical characteristics Table 8. Symbol Collector-emitter diode Parameter Test conditions IF = 12 A VF Forward on-voltage trr Reverse recovery time Reverse recovery charge Reverse recovery current IF = 12 A,VR = 40 V, Reverse recovery time Reverse recovery charge Reverse recovery current IF = 12 A,VR = 40 V, Qrr Irrm trr Qrr Irrm 6/17 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD IF = 12 A, Tc = 125 °C di/dt = 100 A/µs (see Figure 21) Tc =125 °C, di/dt = 100 A/µs (see Figure 21) Min. Typ. Max. Unit 1.9 1.6 V V 31 30 2 ns nC A 50 70 4 ns nC A STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2. Output characteristics Figure 3. HV43020 IC(A) Transfer characteristics HV43025 IC(A) VCE = 15 V VGE=15V 100 100 14V 80 80 13V 60 60 12V 40 40 11V 10V 20 20 9V 8V 0 0 5 Figure 4. 10 15 20 25 30 0 VCE(V) Transconductance Figure 5. HV43110 Gfs(S) 8 0 TJ=-50°C 7.5 3 5 8 10 13 Collector-emitter on voltage vs temperature HV43100_b VCE(sat) (V) 2.4 7 VGE(V) 15 25A 2.3 6.5 6 2.1 TJ=25°C 5.5 2.0 5 12A 1.8 4.5 4 TJ=125°C 1.7 3.5 1.5 3 2.5 6A 1.4 2 1.2 1.5 2 Figure 6. 4 6 8 10 -75 12 IC(A) Gate charge vs gate-source voltage Figure 7. -50 -25 0 25 50 75 100 125 150 TJ(°C) Capacitance variations HV43000 C(pF) 2000 1500 Cies 1000 500 Coes Cres 0 0 10 20 30 40 VCE(V) 7/17 Electrical characteristics Figure 8. STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Normalized gate threshold voltage vs temperature HV43070 VGE(th) (norm) Figure 9. Collector-emitter on voltage vs collector current HV43090 VCE(sat) (V) IC=250µA 1.15 1.10 2.55 1.05 2.3 1.00 2.05 0.95 -50°C 1.8 0.90 25°C 1.55 0.85 1.3 0.80 1.05 0.75 -100 125°C 0.8 0.70 -50 0 50 100 150 TJ(°C) Figure 10. Normalized breakdown voltage vs temperature 0 5 10 15 20 25 30 35 40 IC(A) Figure 11. Switching losses vs temperature HV43080 BVCES (norm) 1.10 IC=250µA 1.08 1.06 1.04 1.02 1.00 0.98 0.96 0.94 -100 -50 0 50 100 150 TJ(°C) Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current 8/17 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Electrical characteristics Figure 14. Turn-off SOA Figure 15. Emitter-collector diode characteristics Figure 16. Thermal impedance for TO-220, D²PAK Figure 17. Thermal impedance for TO-220FP 9/17 Test circuits 3 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Test circuits Figure 18. Test circuit for inductive load switching Figure 19. Gate charge test circuit Figure 20. Switching waveforms Figure 21. Diode recovery times waveform 10/17 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD 4 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 11/17 Package mechanical data STGB19NC60KD - STGF19NC60KD - STGP19NC60KD TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q 12/17 Typ 4.40 0.61 1.14 0.48 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 Max 0.181 0.034 0.066 0.027 0.62 0.050 16.40 28.90 3.75 2.65 Typ 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 3.85 2.95 0.147 0.104 0.151 0.116 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Package mechanical data TO-220FP mechanical data mm. Dim. Min. A 4.40 inch Typ Max. Min. 4.60 0.173 Typ. 0.181 Max. B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.017 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.50 0.045 0.067 F2 1.15 1.50 0.045 0.067 G 4.95 5.20 0.195 0.204 G1 2.40 2.70 0.094 0.106 H 10 10.40 0.393 L2 16 0.409 0.630 28.6 30.6 1.126 L4 9.80 10.60 0.385 1.204 0.417 L5 2.9 3.6 0.114 0.141 L6 15.90 16.40 0.626 0.645 L7 9 9.30 0.354 0.366 Dia 3 3.2 0.118 0.126 B D A E L3 L3 L6 F2 H G G1 Dia F F1 L7 L2 L5 1 2 3 L4 7012510-I 13/17 Package mechanical data STGB19NC60KD - STGF19NC60KD - STGP19NC60KD D²PAK (TO-263) mechanical data mm inch Dim Min A A1 b b2 c c2 D D1 E E1 e e1 H J1 L L1 L2 R V2 4.40 0.03 0.70 1.14 0.45 1.23 8.95 7.50 10 8.50 Max Min 4.60 0.23 0.93 1.70 0.60 1.36 9.35 0.173 0.001 0.027 0.045 0.017 0.048 0.352 0.295 0.394 0.334 10.40 2.54 4.88 15 2.49 2.29 1.27 1.30 Typ Max 0.181 0.009 0.037 0.067 0.024 0.053 0.368 0.409 0.1 5.28 15.85 2.69 2.79 1.40 1.75 0.192 0.590 0.099 0.090 0.05 0.051 8° 0° 0.4 0° 0079457_M 14/17 Typ 0.208 0.624 0.106 0.110 0.055 0.069 0.016 8° STGB19NC60KD - STGF19NC60KD - STGP19NC60KD 5 Packing mechanical data Packing mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 MAX. K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 * on sales type 15/17 Revision history 6 STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Revision history Table 9. 16/17 Document revision history Date Revision Changes 08-May-2008 1 Initial release 28-May-2008 2 – Value on Table 3: Thermal resistance has been changed. – Inserted Figure 16: Thermal impedance for TO-220, D²PAK and Figure 17: Thermal impedance for TO-220FP STGB19NC60KD - STGF19NC60KD - STGP19NC60KD Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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