STMICROELECTRONICS STGB19NC60KD

STGB19NC60KD
STGF19NC60KD - STGP19NC60KD
20 A - 600 V - short circuit rugged IGBT
Features
■
Low on-voltage drop (VCE(sat))
■
Low Cres / Cies ratio (no cross conduction
susceptibility)
■
Short circuit withstand time 10 µs
■
IGBT co-packaged with ultra fast free-wheeling
diode
3
3
1
1
2
D2PAK
TO-220
Applications
3
■
High frequency inverters
■
Motor drivers
2
1
TO-220FP
Description
This IGBT utilizes the advanced PowerMESH™
process resulting in an excellent trade-off
between switching performance and low on-state
behavior.
Table 1.
Figure 1.
Internal schematic diagram
Device summary
Order codes
Marking
Package
Packaging
STGB19NC60KDT4
GB19NC60KD
D2PAK
Tape and reel
STGF19NC60KD
GF19NC60KD
TO-220FP
Tube
STGP19NC60KD
GP19NC60KD
TO-220
Tube
May 2008
Rev 2
1/17
www.st.com
17
Contents
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 7
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/17
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Value
Symbol
Parameter
D2PAK
TO-220FP
TO-220
VCES
Collector-emitter voltage (VGE = 0)
IC(1)
Collector current (continuous) at TC = 25 °C
35
16
A
IC(1)
Collector current (continuous) at TC = 100 °C
20
10
A
600
V
ICL
(2)
Turn-off latching current
75
A
ICP
(3)
Pulsed collector current
75
A
Gate-emitter voltage
±20
V
Diode RMS forward current at TC = 25 °C
20
A
IFSM
Surge non repetitive forward current tp = 10 ms
sinusoidal
50
A
PTOT
Total dissipation at TC = 25 °C
tscw
Short circuit withstand time, VCE = 0.5 V(BR)CES
Tj = 125 °C, RG = 10 Ω, VGE = 12 V
VGE
IF
Tj
1.
Unit
125
Operating junction temperature
32
W
10
µs
– 55 to 150
°C
Calculated according to the iterative formula:
T J ( MAX ) – T c
I c ( T c ) = ------------------------------------------------------------------------------------R thj – c × V CE ( sat ) ( MAX ) ⋅ ( T c ,I c )
2. Vclamp = 80%,(VCES), Tj =150°C, RG = 10 Ω, VGE = 15 V
3. Pulse width limited by max. junction temperature allowed
Table 3.
Thermal resistance
Value
Symbol
Parameter
D2PAK
TO-220FP
TO-220
Rthj-case
Unit
Thermal resistance junction-case IGBT max.
0.95
3.9
°C/W
Thermal resistance junction-case diode max.
3
5.6
°C/W
Rthj-amb Thermal resistance junction-ambient max.
62.5
°C/W
3/17
Electrical characteristics
2
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4.
Symbol
Static
Parameter
Test conditions
V(BR)CES
Collector-emitter breakdown
IC = 1 mA
voltage (VGE= 0)
VCE(sat)
Collector-emitter saturation
voltage
VGE = 15 V, IC = 12 A
VGE = 15 V, IC = 12 A,
Tc = 125 °C
ICES
Collector cut-off current
(VGE = 0)
VCE = 600 V
VCE = 600 V, TC = 125 °C
VGE(th)
Gate threshold voltage
VCE = VGE, IC = 250 µA
IGES
Gate-emitter leakage
current (VCE = 0)
VGE = ±20 V
gfs (1)
Forward transconductance
VCE = 15 V , IC = 12 A
Min.
Typ.
Max. Unit
600
V
2.0
2.75
1.8
4.5
V
V
150
1
µA
mA
6.5
V
±100
nA
15
S
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Table 5.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Cres
Input capacitance
Output capacitance
Reverse transfer
capacitance
VCE = 25 V, f = 1 MHz,
VGE = 0
1170
127
28
pF
pF
pF
Qg
Qge
Qgc
Total gate charge
Gate-emitter charge
Gate-collector charge
VCE = 480 V, IC = 12 A,
VGE = 15 V
(see Figure 19)
55
11
26
nC
nC
nC
Cies
Coes
4/17
Dynamic
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Table 6.
Electrical characteristics
Switching on/off (inductive load)
Symbol
Parameter
td(on)
tr
(di/dt)on
Turn-on delay time
Current rise time
Turn-on current slope
td(on)
tr
(di/dt)on
Typ.
Max. Unit
VCC = 480 V, IC = 12 A
RG = 10 Ω, VGE = 15 V,
(see Figure 18)
30
8
1450
ns
ns
A/µs
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 480 V, IC = 12 A
RG = 10 Ω, VGE = 15 V,
Tc = 125 °C
(see Figure 18)
30
8
1380
ns
ns
A/µs
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
VCC = 480 V, IC = 12 A
RG = 10 Ω, VGE = 15 V,
(see Figure 18)
35
105
85
ns
ns
ns
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
Vcc = 480 V, IC = 12 A,
RG = 10 Ω, VGE = 15 V
Tc = 125 °C
(see Figure 18)
65
145
125
ns
ns
ns
Table 7.
Symbol
Test conditions
Min.
Switching energy (inductive load)
Parameter
Test conditions
Min
Typ.
Max
Unit
Eon
Eoff (1)
Ets
Turn-on switching losses
Turn-off switching losses
Total switching losses
VCC = 480 V, IC = 12 A
RG = 10 Ω, VGE = 15 V,
(see Figure 18)
165
255
420
µJ
µJ
µJ
Eon
Eoff (1)
Ets
Turn-on switching losses
Turn-off switching losses
Total switching losses
VCC = 480 V, IC = 12 A
RG = 10 Ω, VGE = 15 V,
TC = 125 °C
(see Figure 18)
250
445
695
µJ
µJ
µJ
1. Turn-off losses include also the tail of the collector current.
5/17
Electrical characteristics
Table 8.
Symbol
Collector-emitter diode
Parameter
Test conditions
IF = 12 A
VF
Forward on-voltage
trr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
IF = 12 A,VR = 40 V,
Reverse recovery time
Reverse recovery charge
Reverse recovery current
IF = 12 A,VR = 40 V,
Qrr
Irrm
trr
Qrr
Irrm
6/17
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
IF = 12 A, Tc = 125 °C
di/dt = 100 A/µs
(see Figure 21)
Tc =125 °C, di/dt = 100 A/µs
(see Figure 21)
Min.
Typ.
Max.
Unit
1.9
1.6
V
V
31
30
2
ns
nC
A
50
70
4
ns
nC
A
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Electrical characteristics
2.1
Electrical characteristics (curves)
Figure 2.
Output characteristics
Figure 3.
HV43020
IC(A)
Transfer characteristics
HV43025
IC(A)
VCE = 15 V
VGE=15V
100
100
14V
80
80
13V
60
60
12V
40
40
11V
10V
20
20
9V
8V
0
0
5
Figure 4.
10
15
20
25
30
0
VCE(V)
Transconductance
Figure 5.
HV43110
Gfs(S)
8
0
TJ=-50°C
7.5
3
5
8
10
13
Collector-emitter on voltage vs
temperature
HV43100_b
VCE(sat)
(V)
2.4
7
VGE(V)
15
25A
2.3
6.5
6
2.1
TJ=25°C
5.5
2.0
5
12A
1.8
4.5
4
TJ=125°C
1.7
3.5
1.5
3
2.5
6A
1.4
2
1.2
1.5
2
Figure 6.
4
6
8
10
-75
12 IC(A)
Gate charge vs gate-source voltage Figure 7.
-50 -25
0
25
50
75 100 125 150 TJ(°C)
Capacitance variations
HV43000
C(pF)
2000
1500
Cies
1000
500
Coes
Cres
0
0
10
20
30
40
VCE(V)
7/17
Electrical characteristics
Figure 8.
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Normalized gate threshold voltage
vs temperature
HV43070
VGE(th)
(norm)
Figure 9.
Collector-emitter on voltage vs
collector current
HV43090
VCE(sat)
(V)
IC=250µA
1.15
1.10
2.55
1.05
2.3
1.00
2.05
0.95
-50°C
1.8
0.90
25°C
1.55
0.85
1.3
0.80
1.05
0.75
-100
125°C
0.8
0.70
-50
0
50
100
150
TJ(°C)
Figure 10. Normalized breakdown voltage vs
temperature
0
5
10
15
20
25
30
35
40 IC(A)
Figure 11. Switching losses vs temperature
HV43080
BVCES
(norm)
1.10
IC=250µA
1.08
1.06
1.04
1.02
1.00
0.98
0.96
0.94
-100
-50
0
50
100
150
TJ(°C)
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
8/17
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Electrical characteristics
Figure 14. Turn-off SOA
Figure 15. Emitter-collector diode
characteristics
Figure 16. Thermal impedance for TO-220,
D²PAK
Figure 17. Thermal impedance for TO-220FP
9/17
Test circuits
3
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Test circuits
Figure 18. Test circuit for inductive load
switching
Figure 19. Gate charge test circuit
Figure 20. Switching waveforms
Figure 21. Diode recovery times waveform
10/17
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
11/17
Package mechanical data
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
TO-220 mechanical data
mm
inch
Dim
Min
A
b
b1
c
D
D1
E
e
e1
F
H1
J1
L
L1
L20
L30
∅P
Q
12/17
Typ
4.40
0.61
1.14
0.48
15.25
Max
Min
4.60
0.88
1.70
0.70
15.75
0.173
0.024
0.044
0.019
0.6
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
1.27
10
2.40
4.95
1.23
6.20
2.40
13
3.50
Max
0.181
0.034
0.066
0.027
0.62
0.050
16.40
28.90
3.75
2.65
Typ
0.409
0.106
0.202
0.051
0.256
0.107
0.551
0.154
0.645
1.137
3.85
2.95
0.147
0.104
0.151
0.116
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Package mechanical data
TO-220FP mechanical data
mm.
Dim.
Min.
A
4.40
inch
Typ
Max.
Min.
4.60
0.173
Typ.
0.181
Max.
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.017
0.027
F
0.75
1.00
0.030
0.039
F1
1.15
1.50
0.045
0.067
F2
1.15
1.50
0.045
0.067
G
4.95
5.20
0.195
0.204
G1
2.40
2.70
0.094
0.106
H
10
10.40
0.393
L2
16
0.409
0.630
28.6
30.6
1.126
L4
9.80
10.60
0.385
1.204
0.417
L5
2.9
3.6
0.114
0.141
L6
15.90
16.40
0.626
0.645
L7
9
9.30
0.354
0.366
Dia
3
3.2
0.118
0.126
B
D
A
E
L3
L3
L6
F2
H
G
G1
Dia
F
F1
L7
L2
L5
1 2 3
L4
7012510-I
13/17
Package mechanical data
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
D²PAK (TO-263) mechanical data
mm
inch
Dim
Min
A
A1
b
b2
c
c2
D
D1
E
E1
e
e1
H
J1
L
L1
L2
R
V2
4.40
0.03
0.70
1.14
0.45
1.23
8.95
7.50
10
8.50
Max
Min
4.60
0.23
0.93
1.70
0.60
1.36
9.35
0.173
0.001
0.027
0.045
0.017
0.048
0.352
0.295
0.394
0.334
10.40
2.54
4.88
15
2.49
2.29
1.27
1.30
Typ
Max
0.181
0.009
0.037
0.067
0.024
0.053
0.368
0.409
0.1
5.28
15.85
2.69
2.79
1.40
1.75
0.192
0.590
0.099
0.090
0.05
0.051
8°
0°
0.4
0°
0079457_M
14/17
Typ
0.208
0.624
0.106
0.110
0.055
0.069
0.016
8°
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
5
Packing mechanical data
Packing mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
mm
MIN.
A
B
1.5
C
12.8
D
20.2
G
24.4
N
100
T
TAPE MECHANICAL DATA
DIM.
mm
inch
MIN.
MAX.
MIN.
A0
10.5
10.7
0.413 0.421
B0
15.7
15.9
0.618 0.626
D
1.5
1.6
0.059 0.063
D1
1.59
1.61
0.062 0.063
E
1.65
1.85
0.065 0.073
F
11.4
11.6
0.449 0.456
inch
MAX.
MIN.
MAX.
330
12.992
13.2
0.504 0.520
26.4
0.960 1.039
0.059
0795
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
1000
MAX.
K0
4.8
5.0
0.189 0.197
P0
3.9
4.1
0.153 0.161
P1
11.9
12.1
0.468 0.476
P2
1.9
2.1
0.075 0.082
R
50
1.574
T
0.25
0.35 0.0098 0.0137
W
23.7
24.3
0.933 0.956
* on sales type
15/17
Revision history
6
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
Revision history
Table 9.
16/17
Document revision history
Date
Revision
Changes
08-May-2008
1
Initial release
28-May-2008
2
– Value on Table 3: Thermal resistance has been changed.
– Inserted Figure 16: Thermal impedance for TO-220, D²PAK
and Figure 17: Thermal impedance for TO-220FP
STGB19NC60KD - STGF19NC60KD - STGP19NC60KD
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17/17