STGB7NB60HD ® N-CHANNEL 7A - 600V DPAK PowerMESH IGBT TYPE V CES V CE(sat) IC STGB7NB60HD 600 V < 2.8 V 7A ■ ■ ■ ■ ■ ■ ■ ■ HIGH INPUT IMPEDANCE (VOLTAGE DRIVEN) LOW ON-VOLTAGE DROP (Vcesat) LOW GATE CHARGE HIGH CURRENT CAPABILITY VERY HIGH FREQUENCY OPERATION OFF LOSSES INCLUDE TAIL CURRENT CO-PACKAGED WITH TURBOSWITCH ANTIPARALLEL DIODE SURFACE-MOUNTING D2PAK (TO-263) POWER PACKAGE IN TAPE & REEL (SUFFIX "T4") 3 1 D2PAK TO-263 (Suffix "T4") DESCRIPTION Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH IGBTs, with outstanding perfomances. The suffix "H" identifies a family optimized to achieve very low switching times for high frequency applications (<120kHz). INTERNAL SCHEMATIC DIAGRAM APPLICATIONS HIGH FREQUENCY MOTOR CONTROLS ■ SMPS AND PFC IN BOTH HARD SWITCH AND RESONANT TOPOLOGIES ■ ABSOLUTE MAXIMUM RATINGS Symbol Parameter V CES Collector-Emitter Voltage (V GS = 0) V GE Gate-Emitter Voltage o IC Collector Current (continuous) at T c = 25 C IC Collector Current (continuous) at T c = 100 o C ICM (•) P tot Collector Current (pulsed) o Total Dissipation at T c = 25 C Derating Factor T stg Tj Storage Temperature Max. Operating Junction Temperature Value Unit 600 V ± 20 V 14 A 7 A 56 A 80 W 0.64 W/ o C -65 to 150 o C 150 o C (•) Pulse width limited by safe operating area June 1999 1/8 STGB7NB60HD THERMAL DATA R thj-case R thj-amb R thc-sink Thermal Resistance Junction-case Thermal Resistance Junction-ambient Thermal Resistance Case-sink o 1.56 62.5 0.5 Max Max Typ C/W C/W o C/W o ELECTRICAL CHARACTERISTICS (Tj = 25 oC unless otherwise specified) OFF Symbol Parameter Test Conditions Collector-Emitter Breakdown Voltage I C = 250 µA I CES Collector cut-off (V GE = 0) V CE = Max Rating V CE = Max Rating IGES Gate-Emitter Leakage Current (V CE = 0) V GE = ± 20 V V BR(CES) V GE = 0 Min. Typ. Max. 600 Unit V 250 2000 µA µA ± 100 nA Max. Unit 5 V 2.3 1.9 2.8 V V Min. Typ. Max. Unit 3.5 5 390 45 10 560 68 15 730 90 20 pF pF pF 42 7.9 17.6 55 nC nC nC T j = 25 o C T j = 125 o C V CE = 0 ON (∗) Symbol V GE(th) V CE(SAT) Parameter Test Conditions Gate Threshold Voltage V CE = V GE I C = 250 µA Collector-Emitter Saturation Voltage V GE = 15 V V GE = 15 V IC = 7 A IC = 7 A Min. Typ. 3 T j = 125 o C DYNAMIC Symbol Parameter Test Conditions Forward Transconductance V CE =25 V IC = 7 A C ies C oes C res Input Capacitance Output Capacitance Reverse Transfer Capacitance V CE = 25 V f = 1 MHz QG Q GE Q GC Total Gate Charge Gate-Emitter Charge Gate-Collector Charge V CE = 480 V Latching Current V clamp = 480 V T j = 150 o C gf s I CL IC = 7 A V GE = 0 V GE = 15 V R G =10Ω S 28 A SWITCHING ON Symbol t d(on) tr (di/dt) on Eon (❍ ) 2/8 Parameter Test Conditions Min. Typ. Max. Unit Delay Time Rise Time V CC = 480 V V GE = 15 V IC = 7 A R G = 10Ω 15 48 ns ns Turn-on Current Slope V CC = 480 V R G = 10 Ω T j = 125 o C IC = 7 A V GE = 15 V 160 A/µs 185 µJ Turn-on Switching Losses STGB7NB60HD ELECTRICAL CHARACTERISTICS (continued) SWITCHING OFF Symbol Parameter Test Conditions Min. Typ. Max. Unit tc t r (v off ) t d (off) tf E off (**) E ts( ❍ ) VCC = 480 V Cross-Over Time Off Voltage Rise Time R GE = 10 Ω Delay Time Fall Time Turn-off Switching Loss Total Switching Loss IC = 7 A V GE = 15 V 85 20 75 70 85 235 ns ns ns ns µJ µJ tc t r (v off ) t d (off) tf E off (**) E ts( ❍ ) VCC = 480 V Cross-Over Time Off Voltage Rise Time R GE = 10 Ω Delay Time T j = 125 o C Fall Time Turn-off Switching Loss Total Switching Loss IC = 7 A V GE = 15 V 150 50 110 110 220 405 ns ns ns ns µJ µJ COLLECTOR-EMITTER DIODE Symbol If Parameter I fm Forward Current Forward Current pulsed Vf Forward On-Voltage t rr Q rr I rrm Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current Test Conditions If = 7 A If = 7 A If = 7 A dI/dt = 100 A/µS T j = 125 o C V R =200 V T j = 125 o C Min. Typ. 1.6 1.4 100 180 3.6 Max. Unit 7 56 A A 2.0 V V ns nC A (•) Pulse width limited by max. junction temperature (❍) Include recovery losses on the STTA506 freewheeling diode (∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (**)Losses Include Also The Tail (Jedec Standardization) Thermal Impedance 3/8 STGB7NB60HD Output Characteristics Transfer Characteristics Transconductance Collector-Emitter On Voltage vs Temperature Collector-Emitter On Voltage vs Collector Current Gate Threshold vs Temperature 4/8 STGB7NB60HD Normalized Breakdown Voltage vs Temperature Capacitance Variations Gate Charge vs Gate-Emitter Voltage Total Switching Losses vs Gate Resistance Total Switching Losses vs Temperature Total Switching Losses vs Collector Current 5/8 STGB7NB60HD Switching Off Safe Operating Area Diode Forward Voltage Fig. 1: Gate Charge test Circuit Fig. 2: Test Circuit For Inductive Load Switching Fig. 3: Switching Waveforms 6/8 STGB7NB60HD TO-263 (D2PAK) MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.21 1.36 0.047 0.053 D 8.95 9.35 0.352 0.368 E 10 10.4 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.624 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 D A2 A C C2 DET AIL "A" DET AIL "A" A1 B2 E B G L2 L L3 P011P6/E 7/8 STGB7NB60HD Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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