STB19NF20 - STF19NF20 STP19NF20 N-channel 200V - 0.15Ω - 15A - TO-220 - D2PAK - TO-220FP MESH OVERLAY™ Power MOSFET General features Type VDSS RDS(on) ID pw STB19NF20 200V <0.16Ω 15A 90W STF19NF20 200V <0.16Ω 15A 25W STP19NF20 200V <0.16Ω 15A 90W ■ Extremely high dv/dt capability ■ Gate charge minimized ■ Very low intrinsic capacitances 3 3 1 2 1 D²PAK TO-220 3 1 2 TO-220FP Description This Power MOSFET is designed using the company’s consolidated strip layout-based MESH OVERLAY™ process. This technology matches and improves the performances compared with standard parts from various sources. Internal schematic diagram Applications ■ Switching application Order codes Part number Marking Package Packaging STB19NF20 19NF20 D²PAK Tape & reel STF19NF20 19NF20 TO-220FP Tube STP19NF20 19NF20 TO-220 Tube February 2007 Rev 4 1/16 www.st.com 16 Contents STB19NF20 - STF9NF20 - STP19NF20 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2/16 ................................................ 9 STB19NF20 - STF9NF20 - STP19NF20 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Value Symbol Parameter Unit TO-220 / D²PAK TO-220FP VDS Drain-source voltage (VGS = 0) 200 V VGS Gate-source voltage ± 20 V ID Drain current (continuous) at TC = 25°C 15 15(1) A ID Drain current (continuous) at TC=100°C 9.45 9.45(1) A IDM(2) Drain current (pulsed) 60 60 (1) A PTOT Total dissipation at TC = 25°C 90 25 W 0.72 0.2 W/°C -- 2500 V Derating factor VISO dv/dt(3) TJ Tstg Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1s;TC=25°C) Peak diode recovery voltage slope Operating junction temperature Storage temperature 15 V/ns -55 to 150 °C 1. Limited by package 2. Pulse width limited by safe operating area 3. ISD ≤15A, di/dt ≤300A/µs, VDD = 80%V(BR)DSS Table 2. Thermal data Value Symbol Parameter Unit TO-220 Rthj-case Thermal resistance junction-case max Rthj-pcb Thermal resistance junction-pcb max D²PAK 1.39 -- TO-220FP 5 50 °C/W -- Rthj-a Thermal resistance junction-ambient max 62.5 °C/W Tl Maximum lead temperature for soldering purpose 300 °C Table 3. Avalanche data Symbol Parameter Value Unit IAR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) 15 A EAS Single pulse avalanche energy (starting Tj=25°C, Id=Iar, Vdd=50V) 110 mJ 3/16 Electrical characteristics 2 STB19NF20 - STF9NF20 - STP19NF20 Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol V(BR)DSS On/off states Parameter Drain-source breakdown voltage Test conditions ID = 1mA, VGS= 0 Zero gate voltage drain current (VGS = 0) IGSS Gate body leakage current (VDS = 0) VGS = ±20V VGS(th) Gate threshold voltage VDS= VGS, ID = 250µA RDS(on) Static drain-source on resistance VGS= 10V, ID= 7.5A Symbol gfs (1) Ciss Coss Crss Qg Qgs Qgd Max. 200 2 Unit V 1 10 µA µA ±100 nA 3 4 V 0.15 0.16 Ω Typ. Max. Unit VDS = Max rating @125°C Dynamic Parameter Test conditions Min. Forward transconductance VDS =8V, ID = 7.5A 12 S Input capacitance Output capacitance Reverse transfer capacitance VDS =25V, f=1 MHz, VGS=0 800 165 26 pF pF pF 24 4.4 11.6 nC nC nC Total gate charge Gate-source charge Gate-drain charge VDD=160V, ID = 15A VGS =10V (see Figure 16) 1. Pulsed: pulse duration=300µs, duty cycle 1.5% 4/16 Typ. VDS = Max rating, IDSS Table 5. Min. STB19NF20 - STF9NF20 - STP19NF20 Table 6. Symbol td(on) tr td(off) tf Table 7. Symbol Electrical characteristics Switching times Parameter Turn-on delay time Rise time Turn-off delay time Fall time Test conditions Min. VDD=100 V, ID= 7.5A, RG=4.7Ω, VGS=10V (see Figure 15) VDD = 100 V, ID = 7.5A, RG = 4.7Ω, VGS = 10V (see Figure 15) Typ. Max. Unit 11.5 22 ns ns 19 11 ns ns Source drain diode Max Unit Source-drain current 15 A ISDM(1) Source-drain current (pulsed) 60 A VSD(2) Forward on voltage ISD=15A, VGS=0 1.6 V Reverse recovery time Reverse recovery charge Reverse recovery current ISD=15A, VDD=50V Reverse recovery time Reverse recovery charge Reverse recovery current ISD=15A, VDD=50V ISD trr Qrr IRRM trr Qrr IRRM Parameter Test conditions di/dt = 100A/µs, (see Figure 20) di/dt = 100A/µs, Tj=150°C (see Figure 20) Min Typ. 125 0.55 8.8 ns µC A 148 0.73 9.9 ns µC A 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration = 300µs, duty cycle 1.5% 5/16 Electrical characteristics STB19NF20 - STF9NF20 - STP19NF20 2.1 Electrical characteristics (curves) Figure 1. Safe operating area for TO-220 / D²PAK Figure 2. Thermal impedance for TO-220 / D²PAK Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP Figure 5. Output characteristics Figure 6. Transfer characteristics 6/16 STB19NF20 - STF9NF20 - STP19NF20 Electrical characteristics Figure 7. Static drain-source on resistance Figure 9. Gate charge vs gate-source voltage Figure 10. Capacitance variations Figure 11. Normalized gate threshold voltage vs temperature Figure 8. Normalized BVDSS vs temperature Figure 12. Normalized on resistance vs temperature 7/16 Electrical characteristics Figure 13. Source-drain forward characteristics 8/16 STB19NF20 - STF9NF20 - STP19NF20 Figure 14. Maximum avalanche energy vs temperature STB19NF20 - STF9NF20 - STP19NF20 3 Test circuit Test circuit Figure 15. Switching times test circuit for resistive load Figure 16. Gate charge test circuit Figure 17. Test circuit for inductive load Figure 18. Unclamped Inductive load test switching and diode recovery times circuit Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform 9/16 Package mechanical data 4 STB19NF20 - STF9NF20 - STP19NF20 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/16 STB19NF20 - STF9NF20 - STP19NF20 Package mechanical data TO-220 MECHANICAL DATA DIM. mm. MIN. TYP inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 11/16 Package mechanical data STB19NF20 - STF9NF20 - STP19NF20 TO-220FP MECHANICAL DATA mm. DIM. MIN. A 4.4 inch TYP MAX. MIN. TYP. 4.6 0.173 0.181 MAX. 0.106 B 2.5 2.7 0.098 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L7 L3 L6 F2 H G G1 F F1 L7 L2 12/16 L5 1 2 3 L4 STB19NF20 - STF9NF20 - STP19NF20 Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 D1 E 8 10 E1 0.315 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 R 0º 0.126 0.015 4º 3 V2 0.4 1 13/16 Packaging mechanical data 5 STB19NF20 - STF9NF20 - STP19NF20 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 14/16 inch 0.933 0.956 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STB19NF20 - STF9NF20 - STP19NF20 6 Revision history Revision history Table 8. Revision history Date Revision Changes 13-Oct-2006 1 First release 17-Nov-2006 2 Part number has been modified 02-Feb-2007 3 Preliminary version 16-Feb-2007 4 TO-220FP package has been added 15/16 STB19NF20 - STF9NF20 - STP19NF20 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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