STPSC406 600 V power Schottky silicon carbide diode Features ■ No or negligible reverse recovery ■ Switching behavior independent of temperature ■ Dedicated to PFC boost diode K A K Description TO-220AC STPSC406D The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide bandgap material allows the design of a Schottky diode structure with a 600 V rating. Due to the Schottky construction no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. K A NC DPAK STPSC406B ST SiC diodes will boost the performance of PFC operations in hard switching conditions. Table 1. September 2009 Doc ID 16283 Rev 1 Device summary IF(AV) 4A VRRM 600 V Tj (max) 175 °C QC (typ) 3 nC 1/8 www.st.com 8 Characteristics 1 STPSC406 Characteristics Table 2. Absolute ratings (limiting values at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 11 A 4 A 14 10 40 A 14 A -55 to +175 °C -40 to +175 °C Average forward current IFSM Surge non repetitive forward current IFRM Repetitive peak forward DPAK, Tc = 115 °C, Tj = 150 °C, δ = 0.1 current TO-220AC, Tc = 105 °C, Tj = 150 °C, δ = 0.1 Tstg Storage temperature range Tj 1. DPAK, Tc = 110 °C, δ = 0.5 IF(AV) Operating junction TO-220AC, Tc = 95 °C, δ = 0.5 tp = 10 ms sinusoidal, Tc = 25 °C tp = 10 ms sinusoidal, Tc = 125 °C tp = 10 µs square, Tc = 25 °C temperature(1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol Parameter Value T0-220AC 5.5 DPAK 4.5 Unit Junction to case °C/W Static electrical characteristics Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Tests conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 4 A Min. Typ. Max. - 10 50 - 60 500 - 1.55 1.9 - 1.9 2.4 Unit µA V 1. tp = 10 ms, δ < 2% 2. tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.20x IF(AV) + 0.3 x IF2(RMS) Table 5. Symbol 2/8 Other parameters Parameter Test conditions Qc Total capacitive charge C Total capacitance Vr = 400 V, IF = 4 A dIF/dt = -200 A/µs Tj = 150 °C Typ. Unit 3 nC Vr = 0 V, Tc = 25 °C, F = 1 Mhz 200 Vr = 400 V, Tc = 25 °C, F = 1 Mhz 20 Doc ID 16283 Rev 1 pF STPSC406 Figure 1. Characteristics Forward voltage drop versus forward current (typical values) Figure 2. IFM(A) 8 Reverse leakage current versus reverse voltage applied (maximum values) IR(µA) 1.E+04 Tj=175 °C 7 1.E+03 6 Tj=25 °C 5 4 Tj=150 °C 1.E+02 Tj=150 °C 1.E+01 Tj=175 °C 3 1.E+00 2 Tj=25 °C 1.E-01 VFM(V) 1 VR(V) 1.E-02 0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 3.0 0 3.5 Peak forward current versus case temperature (TO-220AC) 35 T 100 Figure 4. IM(A) 35 50 150 200 250 300 350 400 450 500 550 600 Peak forward current versus case temperature (DPAK) IM(A) δ=0.1 T δ=0.1 30 30 δ=tp/T δ=tp/T tp 25 tp 25 20 20 δ=0.3 15 δ=0.5 δ=0.3 15 δ=0.5 10 10 5 δ=1 d=1 δ=1 d=1 5 δ=0.7 d=0.7 δ=0.7 d=0.7 TC(°C) TC(°C) 0 0 0 25 Figure 5. 50 75 100 125 150 0 175 Junction capacitance versus reverse voltage applied (typical values) Figure 6. C(pF) 1.0 150 F=1 MHz VOSC=30 mVRMS Tj=25 °C 125 25 50 75 100 125 150 175 Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC) Zth(j-c)/Rth(j-c) 0.9 0.8 0.7 100 0.6 0.5 75 0.4 50 0.3 0.2 25 VR(V) 0.1 0 tp(s) Single pulse 0.0 1 10 100 1000 1.E-05 Doc ID 16283 Rev 1 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 3/8 Characteristics Figure 7. STPSC406 Relative variation of thermal impedance junction to case versus pulse duration (DPAK) Figure 8. Zth(j c)/Rth(j c) 1.E+03 1.0 Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) IFSM(A) 0.9 0.8 0.7 1.E+02 0.6 0.5 Tc =25 °C 0.4 1.E+01 0.3 Tc =125 °C 0.2 0.1 tp(s) Single pulse tp(s) 0.0 1.E-05 Figure 9. 1.E+00 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E-05 1.E-04 1.E-03 Total capacitive charges versus dIF/dt (typical values) QC(nC) 7 IF=4 A VR=400 V Tj=150 °C 6 5 4 3 2 1 dIF/dt(A/µs) 0 0 4/8 50 100 150 200 250 300 350 Doc ID 16283 Rev 1 400 450 500 1.E-02 1.E-01 1.E+00 STPSC406 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: convection (C) ● Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-220AC dimensions Dimensions Ref. A H2 ØI C L5 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L7 L6 L2 F1 D L9 L2 L4 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 F M E G M Diam. I Doc ID 16283 Rev 1 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 Package information Table 7. STPSC406 DPAK dimensions Dimensions Ref. E A B2 C2 Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 D R H L4 A1 B G R C A2 0.60 MIN. L2 V2 0.80 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 10. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 6/8 0.031 typ. Doc ID 16283 Rev 1 STPSC406 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPSC406D STPSC406D TO-220AC 1.86 g 50 Tube STPSC406B-TR STPSC406B DPAK 0.3g 2500 Tape and reel Revision history Table 9. Document revision history Date Revision 24-Sep-2009 1 Changes First issue. Doc ID 16283 Rev 1 7/8 STPSC406 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 16283 Rev 1