STMICROELECTRONICS TDA2170

TDA2170
TV VERTICAL DEFLECTION OUTPUT CIRCUIT
..
..
The functions incorporated are :
POWER AMPLIFIER
FLYBACK GENERATOR
REFERENCE VOLTAGE
THERMAL PROTECTION
MULTIWATT 11
(Plastic Package)
DESCRIPTION
The TDA2170 is a monolithic integrated circuit in
11-lead Multiwatt package. It is a high efficiency
power booster for direct driving of vertical windings
of TV yokes. It is intended for use in Colour are B
& W television receivers as well as in monitors and
displays.
ORDER CODE : TDA2170
PIN CONNECTIONS
11
10
9
8
7
6
5
4
3
2
1
NC
GND
REFERENCE VOLTAGE
OUTPUT STAGE SUPPLY
OUTPUT
GND
FLYBACK GENERATOR
SUPPLY VOLTAGE
NON INVERTING INPUT
INVERTING INPUT
NC
2170-01.EPS
Tab connected to Pin 6
December 1992
1/7
TDA2170
BLOCK DIAGRAM
+VS
4
8
5
Fly back
Generator
2
Power
Amplif ier
7
3
Thermal
Protect ion
Reference
Volt age
6
10
2170-02.EPS
9
YOKE
SCHEMATIC DIAGRAM
7
4
D4
Q11
Q10
D3
3
Q1
R4
Q20
D8
Q6
Q2
8
D5
R5
Q7
2
R12
Q12
C1
D6
Q9
D9
Q21
D7
Q13
5
Q8
Q4
R6
D1
R11
Q14
Q18
Q5
Q15
Q17
Q22
Q3
Q16
Q19
R1
D2
R3
R2
R7
R8
R9
C2
R12
Q23
Q26
Q24
R14
Z1
R13
Z2
Q27
Q28
Q25
R16
6
10
9
2/7
R17
R18
2170-03.EPS
R15
Q29
TDA2170
ABSOLUTE MAXIMUM RATINGS
Parameter
Value
Unit
Vs
Supply Voltage (pin 4)
35
V
V7 , V8
Flyback Peak Voltage
60
V
V5
V2 , V3
Voltage at Pin 5
+ Vs
Amplifier Input Voltage
Io
Output Peak Current (non repetitive, t = 2 msec)
Io
Output Peak Current at f = 50 Hz, t ≤ 10 µsec
Io
Output Peak Current at f = 50 Hz, t > 10 µsec
I5
Pin 5 DC Current at V7 < V4
I5
Pin 5 Peak to Peak Flyback Current at f = 50 Hz, tfly ≤ 1.5 msec
Ptot
Tstg, Tj
Total Power Dissipation at Tcase = 60 °C
Storage and Junction Temperature
+ Vs – 0.5
V
2.5
A
3
A
2
A
100
mA
3
A
30
W
– 40 to 150
°C
Value
Unit
2170-01.TBL
Symbol
Symbol
Parameter
Rth (j-c)
Thermal Resistance Junction-case
Max
3
°C/W
R th (j-a)
Thermal Resistance Junction–ambient
Max
40
°C/W
2170-02.TBL
THERMAL DATA
ELECTRICAL CHARACTERISTICS
(refer to the test circuits, VS = 35 V, Tamb = 25 °C unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ. Max.
Unit
Fig.
I4
Pin 4 Quiescent Current
I5 = 0 ; I7 = 0 ; V3 = 3 V
8
16
mA
1a
I8
Pin 8 Quiescent Current
I5 = 0 ; I7 = 0 ; V3 = 3 V
16
36
mA
1a
I3
Amplifier Input Bias Current
V3 = 1 V
– 0.1
–1
µA
1a
I2
Amplifier Input Bias Current
V2 = 1 V
– 0.1
–1
µA
1a
V9
V
1a
2
mV/V
1a
Reference Voltage
I9 = 0
∆V9
∆VS
Reference Voltage Drift vs. Supply Voltage
VS = 15 to 30 V
V5L
Pin 5 Saturation Voltage to GND
I5 = 20 mA
1
V
1c
V7
Quiescent Output Voltage
VS = 35 V ; Ra = 13 kΩ
18
V
1d
VS = 15 V ; Ra = 13 kΩ
7.5
V
1d
V7L
Output Saturation Voltage to GND
V
1c
V7H
Output Saturation Voltage to Supply
I7 = 1.2 A
2.2
1
1
1.4
0.7
1
V
1c
– I7 = 1.2 A
1.6
2.2
V
1b
– I7 = 0.7 A
1.3
1.8
V
1b
R9
Reference Voltage Output Resistance
2.1
kΩ
Tj
Junction Temperature for Thermal Shut
Down
140
°C
2170-03.TBL
I7 = 0.7 A
3/7
TDA2170
Figure 1 : DC Test Circuits
2170-05.EPS
Figure 1b : Measurement of V7H
2170-04.EPS
Figure 1a : Measurement of I2 ; I3 ; I4 ; I8 ; I9 ;
∆V9/∆VS ; R9
S1 : (a) I2 ; (b) I3, I4 and I8.
S2 : (a) I4 and I8 ; (b) I3 ; (c) I2.
S3 : (a) I2, I3, I4, I8, I9 and V9 ; (b) R9.
2170-07.EPS
Figure 1d : Measurement of V7.
2170-06.EPS
Figure 1c : Measurement of V5L, V7.L.
S1 : (a) V5L ; (b) V7L.
2170-08.EPS
Figure 2 : Application Circuit
4/7
TDA2170
2170-09.TIF
Figure 3 : PC Board and Component Layout (1:1 scale)
COMPONENTS LIST FOR TYPICAL APPLICATIONS
110° TVC
9.6 Ω / 24.6 mH
1.2 App
90° TVC
15 Ω / 30 mH
0.82 App
Unit
RT1
10
R1
12
4.7
10
kΩ
10
12
kΩ
R2
R3
10
5.6
5.6
kΩ
27
12
18
kΩ
R4
12
8.2
5.6
kΩ
R5
0.82
1
1
Ω
R6
270
330
330
Ω
R7
1.5
1.5
1.5
Ω
D1
1N 4001
1N 4001
1N 4001
–
C1
0.1
0.1
0.1
µF
C2 el.
1000/25 V
470/25 V
470/25 V
µF
C3 el.
220/25 V
220/25 V
220/25 V
µF
C4
0.22
0.22
0.22
µF
C5 el.
2200/25 V
2200/25 V
1000/16 V
µF
C6 el.
4.7/16 V
4.7/16 V
10/16 V
µF
2170-04.TBL
110° TVC
5.9 Ω / 10 mH
1.95 App
Component
5/7
TDA2170
TYPICAL PERFORMANCES
Vs – Supply Voltage
Is – Current
tfly – Flyback Time
* Ptot – Power Dissipation
* Rth c–a – Heatsink
Tamb
Tj max
to
Vi
V7
110° TVC
5.9 Ω / 10 mH
24
280
0.6
4.2
7
60
110° TVC
9.6 Ω / 27 mH
22.5
175
1
2.5
13
60
90° TVC
15 Ω / 30 mH
25
125
0.7
2.05
16
60
V
mA
ms
W
°C/W
°C
110
20
2.5
50
110
20
2.5
47
110
20
2.5
52
°C
ms
VPP
VP
Unit
2170-05.TBL
Parameter
* Worst case condition.
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be removed by adding an external heatsink.
Thanks to the MULTIWATT package attaching
the heatsink is very simple, a screw or a compres-
sion spring (clip) being sufficient. Between the
heatsink and the package it is better to insert a layer
of silicon grease, to optimize the thermal contact ;
no electrical isolation is needed between the two
surfaces.
2170-10.EPS / 2170-11.EPS
Figure 2 : Application Circuit
2170-12.EPS
Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature
6/7
TDA2170
PACKAGE MECHANICAL DATA
11 PINS - PLASTIC MULTIWATT
H1
A
C
S
L7
S1
Dia. 1
L2
L3
L4
D
L
L1
H2
PMMUL11V.EPS
B
E
G
F
Dimensions
A
B
C
E
F
G
G1
H1
H2
L
L1
L2
L3
L4
L7
M
M1
S
S1
Dia. 1
Min.
0.49
0.88
1.57
16.87
19.6
21.5
21.4
17.4
17.25
10.3
2.65
4.1
4.88
1.9
1.9
3.65
M
G1
Millimeters
Typ.
1.7
17
17.5
10.7
4.3
5.08
Max.
5
2.65
1.6
0.55
0.95
1.83
17.13
20.2
22.3
22.2
18.1
17.75
10.9
2.9
4.5
5.3
2.6
2.6
3.85
Min.
0.019
0.035
0.062
0.664
0.772
0.846
0.843
0.685
0.679
0.406
0.104
0.161
0.192
0.075
0.075
0.144
Inches
Typ.
0.067
0.669
0.689
0.421
0.169
0.200
Max.
0.197
0.104
0.063
0.022
0.037
0.072
0.674
0.795
0.878
0.874
0.713
0.699
0.429
0.114
0.177
0.209
0.102
0.102
0.152
MUL11V.TBL
M1
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
7/7