TDA2170 TV VERTICAL DEFLECTION OUTPUT CIRCUIT .. .. The functions incorporated are : POWER AMPLIFIER FLYBACK GENERATOR REFERENCE VOLTAGE THERMAL PROTECTION MULTIWATT 11 (Plastic Package) DESCRIPTION The TDA2170 is a monolithic integrated circuit in 11-lead Multiwatt package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Colour are B & W television receivers as well as in monitors and displays. ORDER CODE : TDA2170 PIN CONNECTIONS 11 10 9 8 7 6 5 4 3 2 1 NC GND REFERENCE VOLTAGE OUTPUT STAGE SUPPLY OUTPUT GND FLYBACK GENERATOR SUPPLY VOLTAGE NON INVERTING INPUT INVERTING INPUT NC 2170-01.EPS Tab connected to Pin 6 December 1992 1/7 TDA2170 BLOCK DIAGRAM +VS 4 8 5 Fly back Generator 2 Power Amplif ier 7 3 Thermal Protect ion Reference Volt age 6 10 2170-02.EPS 9 YOKE SCHEMATIC DIAGRAM 7 4 D4 Q11 Q10 D3 3 Q1 R4 Q20 D8 Q6 Q2 8 D5 R5 Q7 2 R12 Q12 C1 D6 Q9 D9 Q21 D7 Q13 5 Q8 Q4 R6 D1 R11 Q14 Q18 Q5 Q15 Q17 Q22 Q3 Q16 Q19 R1 D2 R3 R2 R7 R8 R9 C2 R12 Q23 Q26 Q24 R14 Z1 R13 Z2 Q27 Q28 Q25 R16 6 10 9 2/7 R17 R18 2170-03.EPS R15 Q29 TDA2170 ABSOLUTE MAXIMUM RATINGS Parameter Value Unit Vs Supply Voltage (pin 4) 35 V V7 , V8 Flyback Peak Voltage 60 V V5 V2 , V3 Voltage at Pin 5 + Vs Amplifier Input Voltage Io Output Peak Current (non repetitive, t = 2 msec) Io Output Peak Current at f = 50 Hz, t ≤ 10 µsec Io Output Peak Current at f = 50 Hz, t > 10 µsec I5 Pin 5 DC Current at V7 < V4 I5 Pin 5 Peak to Peak Flyback Current at f = 50 Hz, tfly ≤ 1.5 msec Ptot Tstg, Tj Total Power Dissipation at Tcase = 60 °C Storage and Junction Temperature + Vs – 0.5 V 2.5 A 3 A 2 A 100 mA 3 A 30 W – 40 to 150 °C Value Unit 2170-01.TBL Symbol Symbol Parameter Rth (j-c) Thermal Resistance Junction-case Max 3 °C/W R th (j-a) Thermal Resistance Junction–ambient Max 40 °C/W 2170-02.TBL THERMAL DATA ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35 V, Tamb = 25 °C unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. I4 Pin 4 Quiescent Current I5 = 0 ; I7 = 0 ; V3 = 3 V 8 16 mA 1a I8 Pin 8 Quiescent Current I5 = 0 ; I7 = 0 ; V3 = 3 V 16 36 mA 1a I3 Amplifier Input Bias Current V3 = 1 V – 0.1 –1 µA 1a I2 Amplifier Input Bias Current V2 = 1 V – 0.1 –1 µA 1a V9 V 1a 2 mV/V 1a Reference Voltage I9 = 0 ∆V9 ∆VS Reference Voltage Drift vs. Supply Voltage VS = 15 to 30 V V5L Pin 5 Saturation Voltage to GND I5 = 20 mA 1 V 1c V7 Quiescent Output Voltage VS = 35 V ; Ra = 13 kΩ 18 V 1d VS = 15 V ; Ra = 13 kΩ 7.5 V 1d V7L Output Saturation Voltage to GND V 1c V7H Output Saturation Voltage to Supply I7 = 1.2 A 2.2 1 1 1.4 0.7 1 V 1c – I7 = 1.2 A 1.6 2.2 V 1b – I7 = 0.7 A 1.3 1.8 V 1b R9 Reference Voltage Output Resistance 2.1 kΩ Tj Junction Temperature for Thermal Shut Down 140 °C 2170-03.TBL I7 = 0.7 A 3/7 TDA2170 Figure 1 : DC Test Circuits 2170-05.EPS Figure 1b : Measurement of V7H 2170-04.EPS Figure 1a : Measurement of I2 ; I3 ; I4 ; I8 ; I9 ; ∆V9/∆VS ; R9 S1 : (a) I2 ; (b) I3, I4 and I8. S2 : (a) I4 and I8 ; (b) I3 ; (c) I2. S3 : (a) I2, I3, I4, I8, I9 and V9 ; (b) R9. 2170-07.EPS Figure 1d : Measurement of V7. 2170-06.EPS Figure 1c : Measurement of V5L, V7.L. S1 : (a) V5L ; (b) V7L. 2170-08.EPS Figure 2 : Application Circuit 4/7 TDA2170 2170-09.TIF Figure 3 : PC Board and Component Layout (1:1 scale) COMPONENTS LIST FOR TYPICAL APPLICATIONS 110° TVC 9.6 Ω / 24.6 mH 1.2 App 90° TVC 15 Ω / 30 mH 0.82 App Unit RT1 10 R1 12 4.7 10 kΩ 10 12 kΩ R2 R3 10 5.6 5.6 kΩ 27 12 18 kΩ R4 12 8.2 5.6 kΩ R5 0.82 1 1 Ω R6 270 330 330 Ω R7 1.5 1.5 1.5 Ω D1 1N 4001 1N 4001 1N 4001 – C1 0.1 0.1 0.1 µF C2 el. 1000/25 V 470/25 V 470/25 V µF C3 el. 220/25 V 220/25 V 220/25 V µF C4 0.22 0.22 0.22 µF C5 el. 2200/25 V 2200/25 V 1000/16 V µF C6 el. 4.7/16 V 4.7/16 V 10/16 V µF 2170-04.TBL 110° TVC 5.9 Ω / 10 mH 1.95 App Component 5/7 TDA2170 TYPICAL PERFORMANCES Vs – Supply Voltage Is – Current tfly – Flyback Time * Ptot – Power Dissipation * Rth c–a – Heatsink Tamb Tj max to Vi V7 110° TVC 5.9 Ω / 10 mH 24 280 0.6 4.2 7 60 110° TVC 9.6 Ω / 27 mH 22.5 175 1 2.5 13 60 90° TVC 15 Ω / 30 mH 25 125 0.7 2.05 16 60 V mA ms W °C/W °C 110 20 2.5 50 110 20 2.5 47 110 20 2.5 52 °C ms VPP VP Unit 2170-05.TBL Parameter * Worst case condition. MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the MULTIWATT package attaching the heatsink is very simple, a screw or a compres- sion spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces. 2170-10.EPS / 2170-11.EPS Figure 2 : Application Circuit 2170-12.EPS Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature 6/7 TDA2170 PACKAGE MECHANICAL DATA 11 PINS - PLASTIC MULTIWATT H1 A C S L7 S1 Dia. 1 L2 L3 L4 D L L1 H2 PMMUL11V.EPS B E G F Dimensions A B C E F G G1 H1 H2 L L1 L2 L3 L4 L7 M M1 S S1 Dia. 1 Min. 0.49 0.88 1.57 16.87 19.6 21.5 21.4 17.4 17.25 10.3 2.65 4.1 4.88 1.9 1.9 3.65 M G1 Millimeters Typ. 1.7 17 17.5 10.7 4.3 5.08 Max. 5 2.65 1.6 0.55 0.95 1.83 17.13 20.2 22.3 22.2 18.1 17.75 10.9 2.9 4.5 5.3 2.6 2.6 3.85 Min. 0.019 0.035 0.062 0.664 0.772 0.846 0.843 0.685 0.679 0.406 0.104 0.161 0.192 0.075 0.075 0.144 Inches Typ. 0.067 0.669 0.689 0.421 0.169 0.200 Max. 0.197 0.104 0.063 0.022 0.037 0.072 0.674 0.795 0.878 0.874 0.713 0.699 0.429 0.114 0.177 0.209 0.102 0.102 0.152 MUL11V.TBL M1 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. 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