TDA2270 TV VERTICAL DEFLECTION OUTPUT CIRCUIT . .. .. .. DRIVES VERTICAL DEFLECTION WINDINGS DIRECTLY HIGH EFFICIENCY INTERNAL FLYBACK GENERATOR THERMAL PROTECTION ON-CHIP VOLTAGE REFERENCE HIGH OUTPUT CURRENT (2.2 A peak) 16-LEAD POWERDIP PLASTIC PACKAGE DIP16 (Plastic package) ORDER CODE : TDA2270 PIN CONNECTIONS 15 NC 3 14 NC GND 4 13 GND GND 5 12 GND NC 6 11 NC OUTPUT OUTPUT STAGE SUPPLY 7 10 8 9 GND REFERENCE VOLTAGE 1 16 2270-01.EPS 2 NON-INVERTING INPUT INVERTING INPUT SUPPLY VOLTAGE FLYBACK GENERATOR DESCRIPTION The TDA2270 is a high efficiency monolithic output stage for vertical deflection circuits in TVs and monitors. Driving the vertical windings directly, the device contains a power amplifier, flyback generator, voltage reference and thermal protection circuit. The TDA2270 is supplied in a 16-pin DIP with the four center pins connected together and used for heatsinking. BLOCK DIAGRAM +VS 1 8 2 FLYBACK GENERATOR 15 POWER AMP. 7 16 YOKE REFERENCE VOLTAGE 12 13 10 4 5 2270-02.EPS 9 THERMAL PROTECTION September 1992 1/7 TDA2270 ABSOLUTE MAXIMUM RATINGS Parameter Value Unit Vs Supply Voltage (pin 1) 35 V V7 , V8 Flyback Peak Voltage 60 V V2 V15, V16 Voltage at Pin 2 + Vs Amplifier Input Voltage + Vs, – 0.5 Io Output Peak Current (non repetitive, t = 2 ms) Io V 2 A Output Peak Current at f = 50 Hz, t ≤ 10 µs 2.2 A Io Output Peak Current at f = 50 Hz, t > 10 µs 1.2 A I2 Pin 2 DC Current at V7 < V1 50 mA I2 Pin 2 Peak to Peak Flyback Current at f = 50 Hz, tfly ≤ 1.5 ms 2 A 4.3 1 W W – 40 to 150 °C Ptot Tstg, Tj Tpins ≤ 90 °C Tamb = 70 °C Total Power Dissipation at Storage and Junction Temperature 2270-01.TBL Symbol Symbol Value Unit Rth j–case Thermal Resistance Junction-case Parameter Max 14 °C/W R th j–amb Thermal Resistance Junction–ambient Max 80 °C/W 2270-02.TBL THERMAL DATA * Obtained with the GND pins soldered to printed circuit with minimized copper area. ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35 V, Tamb = 25oC unless otherwise specified) 2/7 Parameter Test Conditions Min. Typ. Max. Unit Fig. I1 Pin 1 Quiescent Current I2 = o, I7 = 0, V16 = 3 V 8 16 mA 1a I8 Pin 8 Quiescent Current I2 = 0, I7 = 0, V16 = 3 V 16 36 mA 1a I15 Amplifier Input Bias Current V15 = 1 V – 0.1 –1 µA 1a – 0.1 –1 µA 1a 1 V 1c Vs = 35 V, Ra = 39 kΩ Vs = 15 V, Ra = 13 kΩ 18 7.5 V V 1d 1d I16 Amplifier Input Bias Current V16 = 1 V V2L Pin 2 Saturation Voltage to GND I2 = 20 mA V7 Quiescent Output Voltage V7L Output Saturation Voltage to GND I7 = 0.7 A 0.7 1 V 1c V7H Output Saturation Voltage to Supply – I7 = 0.7 A 1.3 1.8 V 1b V9 2.2 V 1a 2 mV/V 1a Reference Voltage I9 = 0 ∆V9 ∆VS Reference Voltage Drift versus Supply Voltage Vs = 15 to 30 V R9 Reference Voltage Output Resistance 2.1 kΩ Tj Junction Temperature for Thermal Shut Down 140 °C 1 2270-03.TBL Symbol TDA2270 Figure 1 : DC Test Circuits 2270-04.EPS Figure 1b : Measurement of V7H 2270-03.EPS Figure 1a : Measurement of I1 ; I8 ; I15 ; I16 ; V9 ; ∆V9/∆VS ; R9 S1 : (a) I15 ; (b) I16, I7 and I8. S2 : (a) I7 and I8 ; (b) I16, (c) I15. S3 : (a) I15, I16, I7, I8, I9 and V9 ; (b) R9 2270-06.EPS Figure 1d : Measurement of V7 2270-05.EPS Figure 1c : Measurement of V2L ; V7L S1 : (a) V2L ; (b) V7L 3/7 TDA2270 2270-07.EPS Figure 2 : Application Circuit 2270-08.TIF Figure 3 : PC Board and Component Layout (1 : 1 scale) 4/7 TDA2270 COMPONENTS LIST FOR TYPICAL APPLICATIONS (refer to the fig. 2) B/W TV 10 Ω / 20 mH / 1 App 90° TVC 15 Ω / 30 mH / 0.82 App Unit RT1 10 10 kΩ R1 10 12 kΩ R2 5.6 5.6 kΩ R3 15 18 kΩ R4 6.8 5.6 kΩ R5 1 1 Ω R6 330 330 Ω R7 1.5 1.5 Ω D1 1N 4001 1N 4001 – C1 0.1 0.1 µF C2 el. 470/25 V 470/25 V µF C3 el. 220/25 V 220/25 V µF C4 0.22 0.22 µF C5 el. 1000/25 V 1000/16 V µF C6 el. 10/16 V 10/16 V µF 2270-04.TBL Component Parameter B/W TV 10 Ω / 20 mH / 1 App 90° TVC 15 Ω / 30 mH Unit Vs – Supply Voltage 20 25 V Is – Current 145 125 mA tfly – Flyback Time 0.75 0.7 ms * Ptot – Power Dissipation 1.8 2.05 W * Rth c– a – Heatsink 14 12 °C/W Tamb 60 60 °C Tj max 130 130 °C to 20 20 ms Vi 2.5 2.5 Vpp V7 – Flyback Voltage 42 52 Vp 5/7 2270-05.TBL TYPICAL PERFORMANCE TDA2270 MOUNTING INSTRUCTIONS The Rth j-amb of the TDA 2270 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (fig. 4) or to an external heatsink (fig. 5). The diagram of figure 6 shows the maximum dissipable power P tot and the Rth j-amb as a function of the side”l” of two equal square copper areas having a thickness of 35 µ (1.4 mils). Figure 4 : Example of P.C. Board Copper Area which is Used as Heatsink Figure 5 : External Heatsink Mounting Example Figure 6 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance versus Side ”l” Figure 7 : Maximum Allowable Power Dissipation versus Ambient Temperature During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. 6/7 2270-10.EPS 2270-12.EPS 2270-11.EPS 2270-09.EPS The external heatsink or printed circuit copper area must be connected to electrical ground. TDA2270 I b1 L a1 PACKAGE MECHANICAL DATA 16 PINS - PLASTIC DIP b B e E Z e3 D 9 1 8 a1 B b b1 D E e e3 F i L Z Min. 0.51 0.77 Millimeters Typ. Max. 1.65 Min. 0.020 0.030 0.5 0.25 Inches Typ. Max. 0.065 0.020 0.010 20 8.5 2.54 17.78 0.787 0.335 0.100 0.700 7.1 5.1 3.3 0.280 0.201 DIP16.TBL Dimensions PM-DIP16.EPS F 16 0.130 1.27 0.050 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 7/7