STMICROELECTRONICS TDA2824

TDA2824
DUAL POWER AMPLIFIER
..
..
.
SUPPLY VOLTAGE DOWN TO 3 V
HIGH SVR
LOW CROSSOVER DISTORTION
LOW QUIESCENT CURRENT
BRIDGE OR STEREO CONFIGURATION
Powerd ip (12+2+2)
DESCRIPTION
The TDA2824 is a monolithic integrated circuit in
12+2+2 powerdip, intended for use as dual audio
power amplifier in portable radios and TV sets.
ORDERING NUMBER : TDA2824
TYPICAL APPLICATION CIRCUIT (Stereo)
R2
January 1995
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TDA2824
PIN CONNECTION
SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
16
V
VS
Supply Voltage
IO
Output Peak Current
1.5
A
Total Power Dissipation at Tamb = 50°C
Tamb = 70°C
1.25
4
W
W
-40 to 150
°C
Ptot
Tstg, Tj
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Storage and Junction Temperature
TDA2824
THERMAL DATA
Symbol
Parameter
Value
Un it
R th j-amb
Thermal Resistance Junction-ambient
Max.
80
°C/W
Rth j-case
Thermal Resistance Junction-case
Max.
20
°C/W
ELECTRICAL CHARACTERISTICS (VS = 6V, Tamb = 25°C, unless otherwise specified)
Symbol
Parameter
Test Co nditi ons
Min.
Typ .
Max.
Un it
15
V
STEREO (test circuit of fig. 1)
VS
Supply Voltage
VO
Quiescent Output Voltage
Id
Quiescent Drain Current
Ib
Input Bias Current
PO
Output Power
(each channel)
d = 10%
VS = 9V
VS = 6V
VS = 4.5V
Distortion
VS = 9V, f = 1KHz
R L = 8Ω, PO = 0.5W
GV
Closed Loop Voltage
Gain
f = 1KHz
Ri
Input Resistance
f = 1KHz
eN
Total Input Noise
R S = 10KΩ
Supply Voltage Rejection
f = 100Hz
Channel Separation
R S = 10KΩ
d
3
VS = 9V
VS = 9V
4
2.7
6
f = 1KHz
RL = 4Ω
RL = 4Ω
R L = 4Ω
1.3
0.45
36
CS
12
40
f = 1KHz
mA
100
nA
1.7
0.65
0.32
W
W
W
0.2
%
39
41
100
B = 22Hz to 22KHz
Curve A
SVR
V
V
dB
KΩ
2.5
µV
2
µV
50
dB
50
dB
BRIDGE (test circuit of fig. 2)
VS
Supply Voltage
VOS
Output Offset Voltage
Ib
Imput Bias Current
PO
Output Power
3
R L = 8Ω
d = 10%
VS = 9V
VS = 6V
VS = 4.5V
f = 1KHz
R L = 8Ω
R L = 8Ω
R L = 4Ω
PO = 0.5W
d
Distortion (f = 1KHz)
R L = 8Ω
GV
Closed Loop Voltage
Gain
f = 1KHz
eN
Total Input Noise
R S = 10KΩ
2.5
0.9
B = 22Hz to 22KHz
Curve A
SVR
Supply Voltage Rejection
f = 100Hz
48
15
V
60
mV
100
nA
3.2
1.35
1
W
W
W
0.2
%
39
dB
3
mV
2.5
µV
60
dB
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TDA2824
Figure 1 : Test Circuit (stereo).
R2
Figure 2: P.C. Board and Component Layout of the Circuit of Figure 1. (1:1 scale)
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TDA2824
Figure 3 : Test Circuit (bridge).
Figure 4: P.C. Board and Component Layout of the Circuit of Figure 3. (1:1 scale)
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TDA2824
Figure 3 : Output Power vs. Supply Voltage
(Stereo).
Figure 4 : Output Power vs. Supply Voltage
(Bridge).
Figure 5 : Distortion vs. Output Power (Bridge).
Figure 6 : Distortion vs. Output Power (Bridge).
Figure 7 : Supply Voltage Rejection vs.
Frequency (Stereo)
Figure 8 : Quiescent Current vs. Supply
Voltage.
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TDA2824
Figure 9 : Quiescent Current vs. Supply Voltage.
Figure 10 : Total Power Dissipation vs. Output
Power (Stereo).
Figure 11 : Total Power Dissipation vs. Output
Power (Bridge).
Figure 12 : Total Power Dissipation vs. Output
Power (Bridge).
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TDA2824
MOUNTING INSTRUCTION
The Rth j-amb of the TDA2824 can be reduced by soldering the GND pins to a suitable copperarea of the
printed circuit board (Figure 13) or to an external
heatsink (Figure 14).
The diagram of Figure 15 shows the maximum dissipable power Ptot and the Rth j-amb as a function of
the side”∂” oftwo equalsquare copper areas having
a thickness of 35 µ (1.4 mils).
During soldering the pins temperature must not exceed 260 °C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 13 : Example of P.C. Board Copper Area
which is used as Heatsink.
Figure 14 : External Heatsink Mounting Example.
Figure 15 : Maximum Dissipable Power and
Junction to Ambient Thermal
Resistance vs. Side ”∂”.
Figure 16 : Maximum Allowable Power Dissipation vs. Ambient Temperature.
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TDA2824
POWERDIP 12+2+2 PACKAGE MECHANICAL DATA
DIM.
mm
MIN.
a1
0.51
B
0.85
b
b1
TYP.
inch
MAX.
MIN.
TYP.
MAX.
0.020
1.40
0.033
0.50
0.38
0.020
0.50
D
0.055
0.015
0.020
20.0
0.787
E
8.80
0.346
e
2.54
0.100
e3
17.78
0.700
F
7.10
0.280
I
5.10
0.201
L
Z
3.30
0.130
1.27
0.050
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TDA2824
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously
supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems
without express written approval of SGS-THOMSON Microelectronics.
 1995 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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